EP2038903A1 - Boitier pour loger un composant electronique et arrangement de composants electroniques - Google Patents

Boitier pour loger un composant electronique et arrangement de composants electroniques

Info

Publication number
EP2038903A1
EP2038903A1 EP07785535A EP07785535A EP2038903A1 EP 2038903 A1 EP2038903 A1 EP 2038903A1 EP 07785535 A EP07785535 A EP 07785535A EP 07785535 A EP07785535 A EP 07785535A EP 2038903 A1 EP2038903 A1 EP 2038903A1
Authority
EP
European Patent Office
Prior art keywords
housing
electronic component
wall
contact
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07785535A
Other languages
German (de)
English (en)
Inventor
Günter FEIST
Jürgen Frey
Herbert Baschke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP2038903A1 publication Critical patent/EP2038903A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Definitions

  • Housing for receiving an electronic component and electronic component assembly
  • the invention relates to a housing for receiving an electronic component and an electronic component arrangement having a housing and an electronic component arranged therein.
  • DE 198 15 852 A1 discloses a carrier body made of a ceramic for electronic components having at least two mutually electrically insulated contact surfaces, wherein the contact surfaces are arranged on a common plane of the carrier body. On at least one surface of the carrier body which does not run parallel to the common plane of the contact surfaces, there are further metallized surfaces, wherein in each case a metallized surface is conductively connected to one of the contact surfaces.
  • An object to be solved is to provide a material and space-saving housing for receiving an electronic component that can be easily contacted on a circuit board and is inexpensive to produce.
  • a housing for receiving an electronic component wherein an outer wall of the housing is a planar Contact wall forms, are arranged in the contact surface areas for contacting the housing on a circuit carrier, and the housing has a plurality of housing parts which are mechanically coupled to each other.
  • the housing has coupling regions for coupling the electronic component to the housing, wherein the coupling regions are electrically connected to the contact surface regions. This makes it possible that electronic components of any shape can be securely arranged on a flat circuit board.
  • first housing parts have a material made of a first plastic and second housing parts a material of a different second plastic. This makes it possible that the housing is made electrically insulating.
  • the first and / or the second plastic is selected from the group of liquid-crystalline polymers.
  • the housing in a solder bath, since liquid-crystalline polymers have a high strength and a high modulus of elasticity even with ty- european may have temperatures of a solder bath of greater than 200 0 C.
  • the first plastic is doped with palladium.
  • Palladium-doped plastics can be used well for the application of metal layers.
  • the contact surface areas to a layer of an electrically conductive material which is mechanically coupled to one of the first housing parts. This makes it possible to apply a thin, electrically conductive layer on the mechanically bearing first housing part, so as to form parts of the housing electrically conductive.
  • the layer is produced by electroplating. This allows a simple application of thin, electrically conductive layers on housing parts.
  • the housing is cuboidal. This allows easy production of the housing with flat outer sides.
  • the housing has a recess in which a closure element for closing the recess and for forming a closed cavity is arranged in the housing. This is particularly advantageous because such a closed cavity can be formed for receiving the electronic component.
  • the closure element couples the intended use in the tion arranged electronic component mechanically fixed to the housing.
  • closure element is produced by casting. Casting can be a simple and quick method of forming the closure element.
  • the housing has a counter wall opposite the contact wall, which forms a closed, flat outer surface. This is particularly advantageous, since the planar contact wall region and the opposing wall region can be used in a simple manner for receiving and soldering the electronic component assembly of housing and electronic component.
  • the housing has side walls which are arranged between the contact wall and the counter wall, wherein one of the side walls has an opening.
  • the opening in one of the side walls allows for easy insertion of the electronic component in the opening.
  • the invention comprises an electronic component arrangement with a housing and an electronic component arranged therein.
  • the electronic component is an inductive component.
  • Inductive components can be contacted particularly well on the circuit carrier by a housing with a planar contact plane in which they are arranged.
  • FIG. 1 shows a perspective view of an electronic component arrangement with a housing for receiving an electronic component
  • Figure 2 is a sectional view of the electronic component assembly with the housing for receiving the electronic component.
  • FIG. 1 shows an electronic component arrangement 10 with a housing 12 and an electronic component 14 accommodated in the housing 12.
  • the housing 12 has a recess 16 in which the electronic component 14 is arranged.
  • the housing 12 has a first housing part 18 and a second housing part 20.
  • the first housing part 18 and the second housing part 20 are formed by integral connecting elements not shown as an integral housing 12.
  • the connecting elements may preferably be pins and holes corresponding to these, which are formed in or with the first housing part 18 and the second housing part 20.
  • the first housing part 18 is preferably designed in several parts.
  • the first housing parts 18 each comprise a support section 21, on which coupling areas 22 and Kon- arranged clock areas 24 whose meaning will be explained below.
  • the carrier sections 21 have a material made of a first plastic
  • the second housing parts 20 have a material made of a second plastic.
  • the first and / or the second plastic are selected from the group of liquid-crystalline polymers. Liquid crystalline polymers have the property that they can have a high strength and a high elastic modulus even at temperatures of about 200 0 C, as are usual in soldering baths.
  • the coupling regions 22 and the contact surface regions 24 of the first housing parts 18 are applied to the carrier sections 21 as layers 25 of an electrically conductive material, preferably a metal. It is particularly preferred if the coupling regions 22 and the contact surface regions 24 comprise materials from the group of gold, copper and nickel. These have good conductivity and good solderability.
  • the first plastic, of which the carrier sections 21 consist is doped with palladium.
  • a doping of plastics with palladium makes it possible for the coupling regions 22 and contact surface regions 24 constructed from the layers 25 to be readily connectable to the carrier sections 21.
  • the contact surface regions 24 are arranged on a contact wall 26 of the cuboid housing 12.
  • the contact wall 26 has an outer side 28, wherein in the outer side 28 of the contact wall 26, the Whyflä- chen regions 24 are arranged, which in turn are electrically coupled to the coupling regions 22.
  • a counter wall 30 is arranged in the housing 12, which forms a closed, flat outer surface 31.
  • the housing 12 further has side walls 32, which are arranged between the contact wall 26 and the counter wall 30 opposite the contact wall 26.
  • One of the side walls 32 has an opening 33, which allows insertion of the electronic building element 14 into the recess 16.
  • the electronic component 14 is designed as an inductive component with two coils 37a, 37b arranged on a coil core 36, together with four connecting wires 38.
  • a closure element 34 is arranged in the recess 16, by means of which the electronic component 14 is mechanically fixedly coupled to the housing 12. It is particularly preferred if the closure element 34 is made by casting, since this is a particularly simple way of closing the recess 16 of the housing 12 is possible.
  • FIG. 2 shows the electronic component arrangement 10 with the housing 12, in which the electronic component 14 is arranged, and a circuit carrier 42.
  • the circuit carrier 42 has a contact plane 44, wherein the contact wall 26 of the housing 12 is mechanically fixedly coupled to the contact plane 44 of the circuit substrate 42. It can be made as a very good solder or adhesive connection between the housing 12 and the circuit substrate 42.
  • the contact wall 26 By forming the contact wall 26 as a planar contact wall with planar contact surface regions 24, very good coplanarity values are achieved between the housing 12 and the circuit carrier 42.
  • the electronic component 14 and the housing 12 are provided. Then, the electronic component 14 is inserted into the recess 16 of the housing 12 and the connecting wires 38 are electrically coupled to the coupling regions 22 of the housing 12. Finally, the closure element 34 is introduced into the recess 16 of the housing 12, wherein the introduction of the closure element 34 in the recess 16 of the housing 12 is preferably carried out by casting.
  • the electronic component arrangement 10 After the manufacture of the electronic component arrangement 10, this can be applied to the circuit carrier 42.
  • the electronic component arrangement 10 is received on the flat outer surface 31 of the opposing wall 30 by a gripper device which is known to the person skilled in the art and is preferably designed as a suction device, onto the contact plane 44 of the circuit carrier 42 put on and there preferably by soldering or gluing the entire surface coupled to the contact plane 44.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne un boîtier (12) pour loger un composant (14) électronique. Selon l'invention, une paroi extérieure du boîtier (16) forme une paroi (26) de contact plane dans laquelle sont disposées des zones (24) de surface de contact destinées à venir en contact avec le boîtier (12) sur un support de circuit.
EP07785535A 2006-06-30 2007-06-12 Boitier pour loger un composant electronique et arrangement de composants electroniques Withdrawn EP2038903A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006030248A DE102006030248A1 (de) 2006-06-30 2006-06-30 Gehäuse zur Aufnahme eines elektronische Bauelements und elektronische Bauelementtaranordnung
PCT/DE2007/001034 WO2008000215A1 (fr) 2006-06-30 2007-06-12 Boîtier pour loger un composant électronique et arrangement de composants électroniques

Publications (1)

Publication Number Publication Date
EP2038903A1 true EP2038903A1 (fr) 2009-03-25

Family

ID=38577505

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07785535A Withdrawn EP2038903A1 (fr) 2006-06-30 2007-06-12 Boitier pour loger un composant electronique et arrangement de composants electroniques

Country Status (6)

Country Link
US (1) US7820921B2 (fr)
EP (1) EP2038903A1 (fr)
JP (1) JP2009542015A (fr)
CN (1) CN101479816A (fr)
DE (1) DE102006030248A1 (fr)
WO (1) WO2008000215A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004039230A1 (de) * 2004-08-12 2006-02-23 Epcos Ag Induktives Bauelement für hohe Ströme und Verfahren zu dessen Herstellung
DE102005006344A1 (de) * 2005-02-11 2006-08-17 Epcos Ag Isolierteil und Ringkerndrossel
DE102005010342A1 (de) * 2005-03-07 2006-09-14 Epcos Ag Induktives Bauelement
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor
JP5563170B2 (ja) 2011-03-07 2014-07-30 エンパイア テクノロジー ディベロップメント エルエルシー ナノ粒子を単離するためのシステム、材料および方法
TWM503638U (zh) * 2014-12-22 2015-06-21 Wistron Corp 電感元件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE6948181U (de) * 1969-12-12 1970-09-03 Frako Kondensatoren Und Appbau Kleintransformator.
DE3238557A1 (de) * 1982-10-18 1984-04-19 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit kunststoffkapsel
JPH0665756B2 (ja) 1986-06-24 1994-08-24 三共化成株式会社 部分メツキプラスチツク成形品及びその製法
IN167760B (fr) 1986-08-15 1990-12-15 Kollmorgen Tech Corp
JPH0258310U (fr) * 1988-10-22 1990-04-26
DE4008077A1 (de) * 1990-03-14 1991-09-19 Standard Elektrik Lorenz Ag In einem gehaeuse angeordneter uebertrager
JP3323958B2 (ja) * 1993-06-14 2002-09-09 ポリプラスチックス株式会社 モールド形電気部品の製造方法
DE4427893A1 (de) * 1993-08-19 1995-03-30 Georg Baersch Kraftangetriebenes Drehschlagwerkzeug
DE4427983A1 (de) 1994-08-08 1996-02-15 Hoechst Ag Thermoplastisches Material
US5805431A (en) * 1996-01-17 1998-09-08 Synergy Microwave Corporation Surface Mountable transformer
JP2002501986A (ja) * 1998-01-30 2002-01-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 液晶ポリマーのめっき方法およびそれに関連する組成物
DE19815852A1 (de) 1998-04-08 1999-10-21 Vacuumschmelze Gmbh Trägerkörper für elektronische Bauelemente
DE19822095A1 (de) * 1998-05-16 1999-12-02 Braun Gmbh Kunststoffgehäuse, insbesondere für ein elektrisches Zahnreinigungsgerät, einen Rasierapparat o. dgl.
DE10124117C2 (de) * 2001-05-17 2003-10-23 Kathrein Werke Kg Leiterplatine mit kontaktiertem SMD-Baustein sowie zugehöriger SMD-Baustein
US7142083B2 (en) * 2002-09-17 2006-11-28 Lindsey Raymond A Electronics component and method for fabricating same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2008000215A1 *

Also Published As

Publication number Publication date
WO2008000215A1 (fr) 2008-01-03
CN101479816A (zh) 2009-07-08
US7820921B2 (en) 2010-10-26
US20090152003A1 (en) 2009-06-18
JP2009542015A (ja) 2009-11-26
DE102006030248A1 (de) 2008-01-03

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