Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
  • B08B3/04—Cleaning involving contact with liquid
  • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
  • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
  • B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
  • B06B3/04—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency involving focusing or reflecting
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
  • B08B7/026—Using sound waves
  • B08B7/028—Using ultrasounds
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
  • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
  • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Definitions

• the present invention relates to an ultrasonic actuator for cleaning objects, which has a propagation volume for ultrasound and one or more ultrasonic transducers for coupling ultrasound into the propagation volume.
• a particular problem is the cleaning of finely structured components, for example of etched wafers from microsystems technology.
• the increasingly smaller structures mean that particularly small particles pose a major threat to the functionality of the components.
• the adhesion forces of a surface on a near-surface particle increase sharply with decreasing particle size, so that these particles are very difficult to remove from the surface.
• Ultrasonic cleaning has been a common method in industrial cleaning technology for a long time. While ultrasonic frequencies in the range of up to 100 kHz are used to clean surfaces of larger particles, ultrasound frequencies in the range of 1 MHz are required for very small particles. The cleaning with these high Ultrasonic frequencies are also known by the term Megaschal1 purification.
• the object of the present invention is to provide an ultrasonic actuator for cleaning objects, in particular for cleaning components with small structures, which allows gentle cleaning with little use of cleaning fluid.
• the present ultrasonic actuator comprises a propagation volume for ultrasound and one or more ultrasound transducers arranged at the propagation volume for coupling ultrasound waves into the propagation volume during operation.
• the propagation volume is limited by an acoustic coupling-out window with a coupling surface for the acoustic coupling of an object to be cleaned and by one or more reflection surfaces for coupled-in ultrasound.
• the one or more ultrasonic transducers are arranged on the propagation volume such that the coupled-in ultrasound does not arrive until after one or more reflections the reflection surfaces via the coupling window from the propagation volume exits. The ultrasonic transducers thus direct the ultrasound not directly to the coupling-out window, but to the one or more reflection surfaces.
• the one or more reflection surfaces are designed such that a predeterminable distribution of the ultrasound energy without intensity peaks results at the coupling-out window. This may be a uniform distribution or even another predefinable distribution, for example with a maximum in the central region of the coupling-out window for more intensive cleaning of the object in this area.
• a uniform distribution may u.U. already be achieved by a multiple reflection on plan reflection surfaces.
• the reflection surfaces can also be curved, for example concave.
• a cleaning device with the present ultrasonic actuator can, for example, be configured as described in WO 2004/114372 A1, the disclosure content of which with regard to the design of the cleaning device is included in the present patent application.
• the present ultrasonic actuator replaces the second plate with the ultrasonic elements, as can be seen for example in Figures 1 and 2 of WO 2004/114372 Al.
• Fig. 2 schematically shows a second example of an embodiment of the present ultrasonic actuator
• FIG. 4 shows an example of a cleaning device with the ultrasonic actuator in a highly schematic representation
• Fig. 5 shows schematically an example of the outer
• FIG. 1 schematically shows a first example of an embodiment of the present ultrasound actuator.
• the ultrasonic actuator consists in this example of a metal body 3, which forms the propagation volume for ultrasound.
• Coupling surface of the acoustic decoupling window 8 is formed hemispherical. Between the ball and the coupling surface of the coupling-out window 8, a coupling liquid 2 is introduced.
• This coupling fluid for acoustic coupling can be supplied either from the outside or via a channel 10 optionally provided in the metal body 3, as indicated in FIG.
• a plurality of ultrasonic transducers 5 are attached to the metal body 3 in such a way that they do not direct the ultrasound to the coupling-out window 8, but rather to a reflector surface 6 of the metal body 3 formed on the rear side.
• This reflector surface 6 is formed by structuring the back surface of the
• the ultrasonic transducers 5 are formed in this example as piezo actuators for a high frequency range (megasonic), which introduce the required sound energy into the metal body 3.
• the introduced energy is distributed due to the reflections on the reflector surface 6 and other boundary surfaces in the metal body 3 and can only emerge in the region of the coupling window 8 by the production of an acoustically conductive contact, for example by the cleaning or coupling liquid 2, and on the object 1 to be cleaned impinge. Due to the diffuse reflections, a uniform distribution of the energy in the region of the decoupling window and thus a gentle and uniform cleaning of the surface of the object 1 is achieved.
• the metal body 3 is in this example still embedded in a foam material 11 with flat outer surfaces to facilitate its handling.
• FIG 2 shows another example of an ultrasonic actuator according to the present invention, in which a cubic object 1 is to be cleaned.
• the coupling surface of the acoustic decoupling window 8 is adapted to the shape of the surface of the object 1.
• the propagation volume is filled by a gas 4 and is limited in the front region by the coupling-out window 8 and in the rear region by a flexible membrane 7.
• the remaining boundary walls 9 are made of a plastic material to which the ultrasonic transducers 5 are attached.
• the reflector surface is formed in this example by the membrane 7, which is set in motion due to the coupling of the ultrasound and thus causes a diffuse reflection of the incident ultrasonic waves due to the constant movement. Even with such a configuration, the coupled-in ultrasonic energy is thus distributed approximately uniformly by the diffuse reflection, so that no intensity peaks occur at the coupling-out window 8.
• the ultrasonic actuator can also be used advantageously for the cleaning of disc-shaped objects, as indicated in FIG.
• the coupling surface of the acoustic decoupling window 8 is executed in this case to adapt to the disc-shaped object 12 plan.
• a coupling liquid 2 is also conducted in this example, which, for example, can also assume an additional cleaning function as a cleaning fluid.
• FIG. 4 shows an example of a cleaning device with the ultrasound actuator 16 in a highly schematic representation.
• the device has a holder 14 for the disc-shaped objects 12 to be cleaned, for example wafers, and a rotary drive 15 for this holder 14.
• the holder 14 is in this case formed with corresponding not shown in the figure gripping elements.
• the ultrasonic actuator 16, which is opposite the holder 14, is formed in this example according to FIG. This device allows the rotation of the object 12 to be cleaned during cleaning.
• FIG. 5 schematically shows an example of the external shape of the ultrasound actuator 16 or of the body forming the propagation volume in perspective view, as it can also be used, for example, in the device according to FIG. 4.
• This polyhedral body has a first 17 and a second surface 18 which are parallel to each other, as well as a plurality of side surfaces 19 which each form an acute angle to the first surface 17.
• the ultrasonic vibrators are acoustically coupled to the side surfaces 19 of the polyhedral body, which may, for example, be a prismatic stump.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Mechanical Engineering (AREA)
• Cleaning By Liquid Or Steam (AREA)
• Cleaning Or Drying Semiconductors (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=38197770

Family Applications (1)

Country Status (7)

Families Citing this family (5)

Family Cites Families (26)

• 2006
  • 2006-07-19 DE DE102006033372A patent/DE102006033372B4/de not_active Expired - Fee Related
• 2007
  • 2007-01-25 TW TW096102887A patent/TW200800425A/zh unknown
  • 2007-02-09 JP JP2008554589A patent/JP2009526637A/ja not_active Abandoned
  • 2007-02-09 KR KR1020087022566A patent/KR20080098422A/ko not_active Application Discontinuation
  • 2007-02-09 EP EP07721911A patent/EP1984125A1/de not_active Withdrawn
  • 2007-02-09 WO PCT/DE2007/000243 patent/WO2007093153A1/de active Application Filing
  • 2007-02-09 US US12/224,041 patent/US20090165830A1/en not_active Abandoned

Non-Patent Citations (1)

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