EP1974844A1 - Appareil de refusion - Google Patents

Appareil de refusion Download PDF

Info

Publication number
EP1974844A1
EP1974844A1 EP06842867A EP06842867A EP1974844A1 EP 1974844 A1 EP1974844 A1 EP 1974844A1 EP 06842867 A EP06842867 A EP 06842867A EP 06842867 A EP06842867 A EP 06842867A EP 1974844 A1 EP1974844 A1 EP 1974844A1
Authority
EP
European Patent Office
Prior art keywords
reflow
work
zones
temperature
preheating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06842867A
Other languages
German (de)
English (en)
Other versions
EP1974844A4 (fr
Inventor
Fumihiro Yamashita
Shoichiro Matsuhisa
Takehiko Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Tamura FA System Corp
Original Assignee
Tamura Corp
Tamura FA System Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp, Tamura FA System Corp filed Critical Tamura Corp
Publication of EP1974844A1 publication Critical patent/EP1974844A1/fr
Publication of EP1974844A4 publication Critical patent/EP1974844A4/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a reflow apparatus used in heating for reflow.
  • a reflow apparatus has a preheating area 3 including a plurality of preheating zones 3a, 3b, 3c, 3d and 3e for preheating a work W, a reflow area 4 including a plurality of reflow zones 4a and 4b for heating the work W for reflow, and a cooling zone 5 for cooling the work W, all of which are successively arranged in a furnace body 1 along a work transfer conveyor 2 for transferring a work W into the furnace body 1.
  • the lengths of individual preheating zones 3a, 3b, 3c, 3d, and 3e of the preheating area 3 and those of the reflow zones 4a and 4b of the reflow area 4 are formed to be the same in the work transfer direction (For example, refer to Patent Documents 1, 2 and 3).
  • lead-free solder which does not use any lead, has been used in view of the earth's environment, wherein it is necessary to heat lead-free solder at a higher temperature than lead-contained solder because it has a higher melting point.
  • lead-free solder which does not use any lead
  • the control is difficult by conventional reflow apparatuses, wherein particularly there is a problem that it is not easy to precisely adjust the reflow peak time.
  • the present invention has been made in view of such a point, and it is therefore an object of the present invention to provide a reflow apparatus capable of precisely adjusting a temperature profile such as a reflow peak time when heating a work for reflow.
  • a reflow apparatus includes a furnace body, a work transfer conveyor for transferring a work into the furnace body, a preheating area having a plurality of preheating zones, which is provided in the furnace body along the work transfer conveyor and preheats the work, and a reflow area having a plurality of reflow zones for heating the work for reflow, which is provided in the furnace body along the work transfer conveyor, wherein the lengths of individual reflow zones of the reflow area are formed shorter than the lengths of individual preheating zones of the preheating area in the work transfer direction.
  • a reflow apparatus according to Claim 2 of the invention provides three reflow zones in the reflow area in the reflow apparatus according to Claim 1, and is capable of setting a temperature profile of the reflow area based on respective set temperatures.
  • Claim 1 of the invention since a plurality of reflow zones that are formed shorter in length than the individual preheating zones of the preheating area in the work transfer direction are provided in the reflow area, it becomes possible to more precisely adjust the temperature profile, such as reflow peak time, etc., of a work that is subjected to heating in these reflow zones for reflow than in the conventional art, wherein components having weak heat resistance can be processed with the reflow peak time shortened by a compact temperature profile, on the other hand, it is possible to secure a reflow peak time necessary and sufficient to obtain a sufficient soldering connection, and various temperature profiles can be set. Further, various temperature profiles can be set without making a conventional apparatus large-sized, wherein a wide range of work characteristics can be processed.
  • Fig. 1 shows a reflow apparatus.
  • Awork transfer conveyor 12 for transferring a work W into the furnace body 11 is disposed.
  • a preheating area 13 having a plurality of preheating zones 13a, 13b, 13c, 13d, and 13e (hereinafter, these reference numerals are described to be 13a through 13e) for preheating a work W
  • a reflow area 14 having a plurality of reflow zones 14a, 14b and 14c for heating the work W for reflow
  • a cooling area 15 having a plurality of cooling zones 15a and 15b for cooling the work W are successively arranged along the work transfer conveyor 12 in the furnace body 11.
  • a heating unit consisting of a blower and a structure, which circulate the atmospheric air, a heater for heating the atmospheric air, a nozzle for jetting hot air, and a temperature sensor for detecting a hot air temperature is disposed at the respective preheating zones 13a through 13e of the preheating area 13 and the respective reflow zones 14a, 14b and 14c of the reflow area 14 at the upper side and the lower side of the work transfer conveyor 12, respectively, so that the conveyor 12 is placed therebetween, and the temperature of the heating unit is controlled by a process controller.
  • the zone means an area where the heating temperature of a work W can be individually controlled as in the heating unit, and five preheating zones 13a through 13e are provided in the preheating area 13, three reflow zones 14a, 14b and 14c are provided in the reflow area 14, and two cooling zones 15a and 15b are provided in the cooling area 15, wherein respective temperature profiles of the respective areas 13, 14 and 15 can be established based on respective set temperatures of the respective zones.
  • the individual reflow zones 14a, 14b and 14c of the reflow area 14 are formed shorter in the work transfer direction than the preheating zones 13a through 13e of the preheating area 13.
  • the size of the individual reflow zones 14a, 14b and 14c in the work transfer direction is shortened to approximately 65% to 85% with respect to the sizes of the individual preheating zones 13a through 13e or the conventional individual reflow zones 4a and 4b shown in Fig. 5 .
  • the reflow area 14 can be prevented from being made large-sized.
  • a work W is transferred into the furnace body 11 by the work transfer conveyor 12 driven at a fixed speed, the work is heated to a preheating temperature in a plurality of preheating zones 13a through 13e of the preheating area 13 and maintained at the temperature, next, the work W is heated to more than a solder paste melting temperature in a plurality of reflow zones 14a, 14b and 14c of the reflow area 14, the solder paste of the work W is melted and the work W is subjected toreflowsoldering, and finally, the work temperature is lowered by a plurality of cooling zones 15a and 15b of the cooling area 15. After that, the work W is taken out from the furnace body 11 by means of the work transfer conveyor 12 with the strength of the soldering joints secured.
  • the work temperature is raised to a fixed preheating temperature Tp in the preheating zones 13a through 13e by the process controller, and at the same time, the preheating temperature Tp is controlled so as to be maintained, and, in the reflow zones 14a, 14b and 14c, the preheating temperature Tp is controlled so as to be maintained in, for example, the first reflow zone 14a, and the temperature is raised from the preheating temperature Tp to the reflow temperature Tr in the intermediate reflow zone 14b, and the reflow temperature Tr is controlled so as to be maintained in the final reflow zone 14c.
  • the work temperature is forcibly lowered in the cooling zones 15a and 15b.
  • the process controller ideally models respective object blocks, the temperature of which is controlled, of the respective preheating zones 13a through 13e, reflow zones 14a, 14b and 14c and cooling zones 15a and 15b, and controls a temperature adjustment process, whereby temperature stability is improved when successively inputting works W.
  • Fig. 3 (a) through (g) show temperature profiles of work W heated in the reflow zones 14a, 14b and 14c according to the present invention
  • Fig. 3(h) shows a temperature profile of work W heated in the conventional reflow zones 4a and 4b.
  • Sn-Ag-Cu based solder that is the mainstream of lead-free solder is used as a solder paste.
  • the melting temperature of the solder paste is approximately 220°C.
  • Fig. 3(a) is similar to the temperature profile shown in Fig. 2 .
  • the preheating temperature is controlled so as to be maintained at 180°C in the first reflow zone 14a, the preheating temperature is raised from 180°C to the reflow temperature of 240°C in the intermediate reflow zone 14b, and the temperature is controlled so as to be maintained at the reflow temperature of 240°C in the final reflow zone 14c, wherein the heating time for reflow can be easily shortened in comparison with the conventional example (h).
  • the work temperature is raised at a constant slope from the preheating temperature 180°C to the reflow temperature 240°C in the first reflow zone 14a and the intermediate reflow zone 14b, and the temperature is controlled so as to be maintained at the reflow temperature 240°C in the final reflow zone 14c, whereby the temperature rise slope is made more gradual than in (a) when melting the solder paste, and the heating time for reflow may be set slightly longer in a state where the solder paste is melted.
  • the temperature rise slope from the preheating temperature 180°C to a melted state of solder paste is set large in the first reflow zone 14a, the temperature is slowly raised to the reflow temperature 240°C in the intermediate reflow zone 14b, and the reflow temperature 240°C is maintained in the final reflow zone 14c, wherein the heating time for reflow is set even longer than in (b) in a melted state of solder paste.
  • the temperature rise slope from the preheating temperature 180°C is set small in the first reflow zone 14a
  • the temperature rise slope to the reflow temperature 240°C is set large in the intermediate reflow zone 14b
  • the temperature is controlled so as to be maintained at the reflow temperature 240°C in the final reflow zone 14c, whereby the heating time for reflow is set shorter in a melted state of solder paste than in (b).
  • This case has intermediate temperature characteristics between (a) and (b).
  • the work temperature is raised at a fixed slope from the preheating temperature 180°C to the reflow temperature 240°C across all the zones including the first reflow zone 14a, intermediate reflow zone 14b and final reflow zone 14c, wherein the temperature rise slope is set at the most gradual when melting solder paste, and the reflow peak time can be shortened so as to conform to a work having a small thermal capacity and a weak heat resistance.
  • electrode portions 27 and 28 for a chip component 26 are mounted at the land portions 22 and 23 of the substrate 21 of the work W by solder paste 24 and 25.
  • solder paste 24 and 25 are radically heated for reflow.
  • Fig. 3(f) shows a case where the work temperature is controlled at the preheating temperature 180°C in the first reflow zone 14a and the intermediate reflow zone 14b, and is raised from the preheating temperature 180°C to the reflow temperature 240°C only in the final reflow zone 14c, and thereafter is immediately cooled down, wherein the reflow peak time is the shortest in amelted state of solderpaste. Therefore, this case is suitable for heating a work W, which is most deficient in heat resistance, for reflow.
  • the work temperature is raised from the preheating temperature 180°C to the reflow temperature 240°C in the first reflow zone 14a, and is controlled so as to be maintained at the reflow temperature 240°C in the intermediate zone 14b and the final reflow zone 14c.
  • This is suitable for a case where reflow heating time necessary and sufficient to obtain a sufficient soldering connection is secured in a work W having a large thermal capacity, wherein a longer reflow peak time than the reflow peak time in the conventional (h) can be brought about.
  • the temperature profiles such as reflow peak time of work W heated in the reflow zones 14a, 14b and 14c for reflow can be more precisely adjusted than in the conventional art.
  • components having weak heat resistance canbe processed by shortening the reflow peak time based on compact trapezoidal or triangular temperature profiles, andontheotherhand, reflow peak time necessary and sufficient to obtain a sufficient soldering connection can be secured, wherein various temperature profiles can be established.
  • the temperature profile of the reflow area 14 can be more precisely adjusted than in the conventional reflow area 4 having two reflow zones 4a and 4b, wherein variation in the temperature adjustment pattern can be widened.
  • the present invention is applicable to a reflow apparatus suitable for reflow soldering using lead-free solder, and further may be applicable for other uses.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tunnel Furnaces (AREA)
EP06842867A 2006-01-06 2006-12-19 Appareil de refusion Withdrawn EP1974844A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006001782 2006-01-06
PCT/JP2006/325263 WO2007077727A1 (fr) 2006-01-06 2006-12-19 Appareil de refusion

Publications (2)

Publication Number Publication Date
EP1974844A1 true EP1974844A1 (fr) 2008-10-01
EP1974844A4 EP1974844A4 (fr) 2009-10-14

Family

ID=38228083

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06842867A Withdrawn EP1974844A4 (fr) 2006-01-06 2006-12-19 Appareil de refusion

Country Status (6)

Country Link
US (1) US20100219228A1 (fr)
EP (1) EP1974844A4 (fr)
JP (1) JPWO2007077727A1 (fr)
CN (1) CN101309771A (fr)
TW (1) TW200734099A (fr)
WO (1) WO2007077727A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5217806B2 (ja) * 2008-09-05 2013-06-19 オムロン株式会社 加熱条件決定装置、加熱条件決定方法およびプログラム
JP5604812B2 (ja) * 2009-06-11 2014-10-15 千住金属工業株式会社 リフロー炉及びその制御方法
JP5463129B2 (ja) * 2009-12-04 2014-04-09 株式会社タムラ製作所 リフロー装置
DE102011103746A1 (de) * 2011-05-31 2012-12-06 Ixys Semiconductor Gmbh Verfahren zum Fügen von Metall-Keramik-Substraten an Metallkörpern
CN102689071B (zh) * 2012-06-18 2016-07-06 日东电子科技(深圳)有限公司 回流焊接设备
CN103769713B (zh) 2012-10-19 2016-02-03 台达电子电源(东莞)有限公司 预热模组、使用该预热模组的预热区及预热段
DE102013104806A1 (de) * 2013-05-08 2014-11-13 Sandvik Materials Technology Deutschland Gmbh Bandofen
DE102016110040A1 (de) * 2016-05-31 2017-11-30 Endress + Hauser Gmbh + Co. Kg Fertigungslinie zum Löten
CN108990311A (zh) * 2018-07-25 2018-12-11 湖州正直数码科技有限公司 一种用于电子产品的回流焊接装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04270062A (ja) * 1991-02-19 1992-09-25 Tamura Seisakusho Co Ltd 伝熱リフローはんだ付け装置
JPH0577035A (ja) * 1991-09-12 1993-03-30 Matsushita Electric Ind Co Ltd リフロー装置
US5413164A (en) * 1990-08-30 1995-05-09 Fujitsu Limited Heating furnace in combination with electronic circuit modules
US5467912A (en) * 1992-11-27 1995-11-21 Hitachi Techno Engineering Co., Ltd. Reflow soldering apparatus for soldering electronic parts to circuit substrate
EP0834375A1 (fr) * 1996-10-02 1998-04-08 SMT Maschinengesellschaft mbH Dispositif de soudage par refusion
US20010015368A1 (en) * 1999-12-10 2001-08-23 Hideki Mukuno Soldering machine
JP2002026508A (ja) * 2000-07-05 2002-01-25 Sony Corp リフロー炉およびリフロー炉による加熱方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726049Y2 (ja) * 1990-11-27 1995-06-14 株式会社今井製作所 自動半田付け機
JPH0726050Y2 (ja) * 1990-11-27 1995-06-14 株式会社今井製作所 自動半田付け機
US5232145A (en) * 1991-03-29 1993-08-03 Watkins-Johnson Company Method of soldering in a controlled-convection surface-mount reflow furnace
JPH0731561Y2 (ja) * 1991-10-17 1995-07-19 株式会社今井製作所 自動半田付け機
US5370531A (en) * 1992-08-27 1994-12-06 Matsushita Electric Industrial Co., Ltd. Atmospheric oven
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
JPH07212028A (ja) * 1994-01-13 1995-08-11 Matsushita Electric Ind Co Ltd リフロー装置
US5567151A (en) * 1994-10-21 1996-10-22 Senju Metal Industry Company Limited Reflow furnaces with hot air blow type heaters
US5971249A (en) * 1997-02-24 1999-10-26 Quad Systems Corporation Method and apparatus for controlling a time/temperature profile inside of a reflow oven
US6039236A (en) * 1997-06-11 2000-03-21 Soltec B.V. Reflow soldering apparatus with improved cooling
JPH1154903A (ja) * 1997-07-31 1999-02-26 Fujitsu Ltd リフローソルダリング方法及びリフロー炉
US5993500A (en) * 1997-10-16 1999-11-30 Speedline Technololies, Inc. Flux management system
JP3348639B2 (ja) * 1997-10-20 2002-11-20 富士通株式会社 リフロー炉内のハンダバンプの温度制御方法
JP3974525B2 (ja) * 2000-12-21 2007-09-12 富士通株式会社 リフロー半田付け装置及びリフロー半田付け方法
US6799712B1 (en) * 2001-02-21 2004-10-05 Electronic Controls Design, Inc. Conveyor oven profiling system
US6780225B2 (en) * 2002-05-24 2004-08-24 Vitronics Soltec, Inc. Reflow oven gas management system and method
JP4226855B2 (ja) * 2002-07-31 2009-02-18 パナソニック株式会社 熱解析方法及び熱解析装置、並びに前記熱解析方法を実施するプログラム
JP4401859B2 (ja) * 2004-04-28 2010-01-20 千住金属工業株式会社 リフロー炉
ATE551143T1 (de) * 2004-08-04 2012-04-15 Senju Metal Industry Co Reflow-ofen
JP4319647B2 (ja) * 2005-06-30 2009-08-26 株式会社タムラ古河マシナリー リフロー炉
KR20070021817A (ko) * 2005-08-19 2007-02-23 삼성전자주식회사 솔더링 장치 및 솔더링 방법
JP4758716B2 (ja) * 2005-09-16 2011-08-31 株式会社タムラ製作所 加熱装置の制御方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413164A (en) * 1990-08-30 1995-05-09 Fujitsu Limited Heating furnace in combination with electronic circuit modules
JPH04270062A (ja) * 1991-02-19 1992-09-25 Tamura Seisakusho Co Ltd 伝熱リフローはんだ付け装置
JPH0577035A (ja) * 1991-09-12 1993-03-30 Matsushita Electric Ind Co Ltd リフロー装置
US5467912A (en) * 1992-11-27 1995-11-21 Hitachi Techno Engineering Co., Ltd. Reflow soldering apparatus for soldering electronic parts to circuit substrate
EP0834375A1 (fr) * 1996-10-02 1998-04-08 SMT Maschinengesellschaft mbH Dispositif de soudage par refusion
US20010015368A1 (en) * 1999-12-10 2001-08-23 Hideki Mukuno Soldering machine
JP2002026508A (ja) * 2000-07-05 2002-01-25 Sony Corp リフロー炉およびリフロー炉による加熱方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007077727A1 *

Also Published As

Publication number Publication date
JPWO2007077727A1 (ja) 2009-06-11
EP1974844A4 (fr) 2009-10-14
WO2007077727A1 (fr) 2007-07-12
TW200734099A (en) 2007-09-16
US20100219228A1 (en) 2010-09-02
CN101309771A (zh) 2008-11-19

Similar Documents

Publication Publication Date Title
EP1974844A1 (fr) Appareil de refusion
JP4602536B2 (ja) リフローはんだ付け装置
CN1895013B (zh) 双级预热器
KR101705441B1 (ko) 반송 가열 장치
JP3581828B2 (ja) 半田付け用加熱炉
US5381945A (en) Process for soldering materials like printed circuit boards or sets of components in electronics or metals in engineering work
JP2002016352A (ja) リフロー基板加熱方法とその装置
JP4830635B2 (ja) はんだ付け方法、及びはんだ付け装置
JP2001326455A (ja) リフロー方法及びリフロー装置
US7759613B2 (en) Reflowing apparatus and reflowing method
JP2004214553A (ja) リフロー炉
JP6502909B2 (ja) リフロー装置
JP4186635B2 (ja) はんだ冷却方法、はんだ冷却装置、及びはんだリフロー装置
JP3732085B2 (ja) リフロー炉及びその処理方法
JP2008159961A (ja) 基板搬送装置
JP2002324972A (ja) リフロー装置およびそれを用いたリフローはんだ付け方法
JP4560999B2 (ja) ワークはんだ付け装置
JP4416916B2 (ja) リフロー炉
JP2001320163A (ja) リフロー装置およびその基板加熱方法
JP2004163020A (ja) 加熱炉
JP3495207B2 (ja) リフローはんだ付け装置
JP5191000B2 (ja) 挿入部品のはんだ付け方法
TWI260074B (en) Reflow processing apparatus
JP2555192B2 (ja) リフロー炉
JP2002009430A (ja) リフローはんだ付け方法およびリフローはんだ付け装置

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20080806

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE

RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20090914

17Q First examination report despatched

Effective date: 20091209

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20110211