ATE551143T1 - Reflow-ofen - Google Patents
Reflow-ofenInfo
- Publication number
- ATE551143T1 ATE551143T1 AT05768510T AT05768510T ATE551143T1 AT E551143 T1 ATE551143 T1 AT E551143T1 AT 05768510 T AT05768510 T AT 05768510T AT 05768510 T AT05768510 T AT 05768510T AT E551143 T1 ATE551143 T1 AT E551143T1
- Authority
- AT
- Austria
- Prior art keywords
- hot air
- suction ports
- discharge nozzles
- reflow oven
- air discharge
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
- F27B9/10—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated heated by hot air or gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/36—Arrangements of heating devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Glass Compositions (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004228072 | 2004-08-04 | ||
JP2005070208 | 2005-03-14 | ||
PCT/JP2005/014216 WO2006013895A1 (ja) | 2004-08-04 | 2005-08-03 | リフロー炉 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE551143T1 true ATE551143T1 (de) | 2012-04-15 |
Family
ID=35787176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05768510T ATE551143T1 (de) | 2004-08-04 | 2005-08-03 | Reflow-ofen |
Country Status (5)
Country | Link |
---|---|
US (1) | US8084717B2 (de) |
EP (1) | EP1870191B9 (de) |
JP (1) | JP4169075B2 (de) |
AT (1) | ATE551143T1 (de) |
WO (1) | WO2006013895A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101309771A (zh) * | 2006-01-06 | 2008-11-19 | 株式会社田村制作所 | 回流装置 |
JP4887858B2 (ja) * | 2006-03-27 | 2012-02-29 | 千住金属工業株式会社 | リフロー炉 |
DE102006056518A1 (de) * | 2006-11-06 | 2008-05-08 | Otto Junker Gmbh | Vorrichtung zur schwebenden Führung von bahnförmigem Material |
JP4957797B2 (ja) * | 2007-05-28 | 2012-06-20 | 千住金属工業株式会社 | 加熱炉 |
DE102008047498A1 (de) * | 2008-09-17 | 2010-04-15 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Verfahren zum Löten eines metallischen Wabenkörpers und zur Abgasbehandlung |
JPWO2010064428A1 (ja) * | 2008-12-02 | 2012-05-10 | 千住金属工業株式会社 | リフロー炉 |
US9751146B2 (en) * | 2009-09-24 | 2017-09-05 | Senju Metal Industry Co., Ltd. | Nozzle for heating device, heating device, and nozzle for cooling device |
JP5158288B2 (ja) * | 2010-04-28 | 2013-03-06 | 千住金属工業株式会社 | 加熱装置及び冷却装置 |
TWI397967B (zh) * | 2010-05-28 | 2013-06-01 | Taiwan Semiconductor Mfg | 晶圓級迴銲設備和銲料球體與覆晶晶片組裝體的製造方法 |
JP5541354B1 (ja) * | 2012-12-28 | 2014-07-09 | 千住金属工業株式会社 | 気体吹き出し孔の配列構造及びはんだ付け装置 |
JP5541353B1 (ja) * | 2012-12-28 | 2014-07-09 | 千住金属工業株式会社 | 気体吸込み孔の配列構造及びはんだ付け装置 |
US9837559B2 (en) * | 2013-03-13 | 2017-12-05 | China Sunergy (Nanjing) Co. Ltd. | Soldering system |
DE102013217952B3 (de) | 2013-09-09 | 2014-11-06 | Ersa Gmbh | Vorrichtung zur Zuführung eines Heißgasstroms |
JP2016203207A (ja) * | 2015-04-22 | 2016-12-08 | 吉塚精機株式会社 | リフロー炉 |
DE102016110040A1 (de) * | 2016-05-31 | 2017-11-30 | Endress + Hauser Gmbh + Co. Kg | Fertigungslinie zum Löten |
CN106081487B (zh) * | 2016-07-28 | 2019-04-16 | 深圳市劲拓自动化设备股份有限公司 | 一种垂直回流炉 |
CN106241203B (zh) * | 2016-07-28 | 2019-04-19 | 深圳市劲拓自动化设备股份有限公司 | 一种垂直回流炉 |
JP6905001B2 (ja) * | 2018-05-01 | 2021-07-21 | ユニバーサル製缶株式会社 | 缶体の製造方法 |
JP7241286B2 (ja) * | 2018-06-27 | 2023-03-17 | パナソニックIpマネジメント株式会社 | リフロー炉およびはんだ付け処理方法 |
JP7420532B2 (ja) | 2019-11-06 | 2024-01-23 | アルテミラ製缶株式会社 | 乾燥装置 |
JPWO2022085298A1 (de) * | 2020-10-22 | 2022-04-28 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2687504B2 (ja) * | 1988-11-17 | 1997-12-08 | 松下電器産業株式会社 | リフロー装置 |
JP2682138B2 (ja) | 1989-05-16 | 1997-11-26 | 松下電器産業株式会社 | 加熱方法及びその装置 |
US5567151A (en) * | 1994-10-21 | 1996-10-22 | Senju Metal Industry Company Limited | Reflow furnaces with hot air blow type heaters |
JP2001144427A (ja) * | 1999-11-12 | 2001-05-25 | Nihon Dennetsu Keiki Co Ltd | リフローはんだ付け装置 |
JP3877477B2 (ja) | 1999-11-12 | 2007-02-07 | 日本電熱計器株式会社 | リフローはんだ付け装置 |
JP4043694B2 (ja) | 2000-05-15 | 2008-02-06 | 松下電器産業株式会社 | リフロー装置 |
JP3581828B2 (ja) * | 2000-12-25 | 2004-10-27 | 古河電気工業株式会社 | 半田付け用加熱炉 |
JP3799278B2 (ja) * | 2001-02-23 | 2006-07-19 | 株式会社タムラ製作所 | 熱風噴射装置、熱風噴射型加熱装置および加熱炉 |
JP4127482B2 (ja) | 2002-05-14 | 2008-07-30 | 松下電器産業株式会社 | リフロー加熱装置 |
-
2005
- 2005-08-03 AT AT05768510T patent/ATE551143T1/de active
- 2005-08-03 JP JP2006531519A patent/JP4169075B2/ja active Active
- 2005-08-03 US US11/659,235 patent/US8084717B2/en active Active
- 2005-08-03 EP EP05768510A patent/EP1870191B9/de active Active
- 2005-08-03 WO PCT/JP2005/014216 patent/WO2006013895A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US8084717B2 (en) | 2011-12-27 |
EP1870191A4 (de) | 2009-12-09 |
EP1870191B9 (de) | 2012-09-19 |
JPWO2006013895A1 (ja) | 2008-05-01 |
EP1870191B1 (de) | 2012-03-28 |
JP4169075B2 (ja) | 2008-10-22 |
EP1870191A1 (de) | 2007-12-26 |
WO2006013895A1 (ja) | 2006-02-09 |
US20090134142A1 (en) | 2009-05-28 |
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