Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/58—Optical field-shaping elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
  • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/484—Connecting portions
  • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/483—Containers
  • H01L33/486—Containers adapted for surface mounting
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
  • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
  • Y10T428/264—Up to 3 mils
  • Y10T428/265—1 mil or less

Definitions

• Thermosetting plastics such as epoxy polymers or silicones can be used for the encapsulations or optical components of optoelectronic components. However, these plastics are difficult to mold.
• the aim of the present invention is therefore to provide an optical component which reduces the above-mentioned disadvantages.
• optical component according to claim 1.
• optical component and optoelectronic component with the component and its production are the subject of further claims.
• the invention relates to an optical component having a specific shape, comprising a thermoplastic which has been crosslinked during or after molding.
• a standard thermoplastic can be used which, due to its thermoplastic properties, has a flow transition range above its service temperature and is therefore particularly simple in the softened state, for example by pressing, extrusion, injection molding or injection compression molding and other shaping processes can be formed into an optical component.
• the thermoplastic is then crosslinked only during or after molding, resulting in a modified thermoplastic having increased temperature dimensional stability, a lower coefficient of thermal expansion, and improved mechanical performance.
• optical components according to the invention which comprise the additionally crosslinked thermoplastics are also solder-stable, so that optoelectronic components which have these components can also be mounted particularly easily by means of soldering to substrates, for example printed circuit boards.
• optical components according to the invention can have any desired shapes. So they can z. B. be formed as a housing for the radiation-emitting semiconductor chips, as reflectors or as lenses. The optical components can thus be brought into any form that can be used for optoelectronic applications. Due to the thermoplastic properties, the shape, z. B. by means of injection molding particularly simple, wherein only during or after shaping the crosslinking takes place.
• an optical component is understood to be a component that interacts with light, that is to say in particular light-shaping, light-guiding and / or light-transducing.
• optical components are z. As lenses that can focus the light and reflectors that reflect the light.
• thermoplastic has been crosslinked by irradiation.
• irradiation for the crosslinking of the thermoplastic can be carried out, for example, by irradiation with beta or gamma rays.
• Such irradiations can be carried out, for example, in conventional electron accelerators and gamma systems. Due to the irradiation u. a. Radicals generated in the readily processable thermoplastics, which cause a further crosslinking of the thermoplastic polymer strands due to their reactivity, so that highly crosslinked three-dimensional polymer networks can arise.
• crosslinking agents may include, for example, organic peroxides, which may also provide for the chemical crosslinking of the thermoplastics. This can result in a uniform network of thermoplastic macromolecules.
• Crosslinking aids can also be used in the above-mentioned beam crosslinking to shorten the irradiation times and by-products of irradiation z. B. by fragmentation or oxidation to reduce.
• thermoplastics used in the optical components according to the invention may be selected from a group comprising the following plastics: polyamide, polyamide 6, polyamide 6,6, polyamide 6,12, polybutylene terephthalate, polyethylene terephthalate, polycarbonate, polyphenylene oxide, polyoxymethylene, acrylonitrile butadiene Styrene copolymer, polymethyl methacrylate, modified polypropylene, ultrahigh molecular weight polyethylene, ethylene-styrene interpolymers, copolyester elastomers, thermoplastic urethane, polymethyl methacrylimide, cycloolefin copolymers, cycloolefin polymers, polystyrene and styrene-acrylonitrile copolymer.
• plastics mentioned can each be used alone or in any desired combinations in the production of optical components according to the invention.
• thermoplastics By means of various thermal, physical and mechanical tests, it is possible to detect the property changes which occur during the subsequent crosslinking of thermoplastics. In this way it is possible to crosslink conventional non-crosslinked thermoplastics Thermoplastics to distinguish.
• the incorporation of polar oxygen-containing groups on the surface of radiation-crosslinked thermoplastics can be detected by means of IR spectroscopy.
• U. a. Electron irradiation increases the surface tension of radiation cured thermoplastic materials, thereby increasing the polarity of the surface of the thermoplastics.
• the increase in the glass transition temperature of additionally crosslinked thermoplastics can be detected, for example, by means of dilatometric, dielectric, dynamic-mechanical or refractometric measurements by DSC (differential scanning calorimetry) or by means of NMR spectroscopy, all of which are known to a person skilled in the art.
• DMA torsion tests also provide direct information on the glass transition temperature T 9 , the changed melt crystallization behavior and the temperature stability of the cross-linked thermoplastics.
• cross-linked thermoplastic materials up to the melting range are often stiffer than uncrosslinked thermoplastic materials with the consequence that cross-linked thermoplastics no longer flow, so that an improved temperature dimensional stability is ensured.
• Crosslinked thermoplastics often behave elastically in the melting area and do not flow anymore. The crosslinking further reduces the thermal expansion and the permeability to water and oxygen. Likewise, silver migration is restricted. - S -
• Optical components according to the invention advantageously comprise a thermoplastic which is substantially transparent to radiation.
• the radiation can be emitted by all possible radiation sources, for example optoelectronic components, into which the optical component is integrated.
• substantially transparent means that the thermoplastic has a transparency of about 70 to 80%, preferably up to 92%, for the radiation.
• the inventors have surprisingly found that crosslinked thermoplastics still have sufficiently transparent properties.
• an inorganic coating may additionally be arranged on an optical component according to the invention. This can increase the mechanical resistance, soldering resistance and resistance to water penetration in addition to crosslinking.
• This inorganic coating may include, for example, materials selected from silica and titania. The coating may comprise only one of the materials or a combination of both materials.
• Such layers can be applied, for example, in a gas phase deposition process with layer thicknesses of about 50 nm to 1000 nm. Coatings with such layer thicknesses are additionally also largely transparent to radiation.
• connecting elements can be formed from the thermoplastic material of an optical component according to the invention (see, for example, FIGS. 3 and 4).
• Such connecting elements can serve, for example, to connect optical components with optoelectronic radiation-emitting components.
• Optoelectronic components with these optical Components can then also be mounted on a substrate, for example a printed circuit board, in a particularly simple manner via further connecting elements made of the crosslinked thermoplastics (see, for example, FIG. 4).
• the connecting elements such as pins, tabs, plugs or the like can be particularly easily formed from thermoplastic materials, since they are well meltable and therefore easily malleable. Only after or during the formation of these connecting elements, the thermoplastic materials of an optical component according to the invention are then further crosslinked, so that an increased stability results.
• Optical components according to the invention can in this case comprise a lens or a reflector (see, for example, FIGS. 1 to 5).
• a lens this can be glued onto an existing encapsulation of an optoelectronic component, this component then being solder resistant in spite of the thermoplastic (see, for example, FIG. 2).
• a reflector as an optical component, a thermoplastic material is preferably used which has a high reflectivity and is not transparent. Frequently, in this case, the thermoplastic still further additives, such as titanium dioxide (white pigment) is added. It is also possible to form housings of subsequently cross-linked thermoplastic material, which at the same time also have reflector properties (see, for example, Figures 1 and 2).
• the invention further relates to an optoelectronic, radiation-emitting component with an optical component comprising a crosslinked thermoplastic.
• Such components often have similar good optical properties as components from previously used special high-temperature plastics, but are easier and cheaper to produce.
• the optical component is formed as a housing, since in this way a particularly good soldering stability of a radiation-emitting component can be ensured. Due to its good optical properties, for example its good transparency, the optical component can also be arranged in the beam path of the component and is then substantially transparent to the emitted radiation (see, for example, FIG. 2).
• the invention further provides a method for producing an optical component of a specific shape with the method steps:
• thermoplastic A) providing a thermoplastic
• an injection molding process is used in process step B).
• a crosslinking aid is additionally added before process step C).
• TAIC triallyl isocyanurate
• the molded thermoplastic in method step C) can be exposed to an irradiation dose of about 30 to 400 kGy, preferably 33 to 165 kGy, with electron beams.
• TAIC triallyl isocyanurate
• Peralink 301 triallyl isocyanurate
• the proportion of the added TAIC was 2-5 wt% # preferably about 3 to 4 wt%.
• the addition was either directly as a liquid or adsorbed to a hollow granules.
• Calcium silicate was not used, as usual, as a carrier material for TAIC, since it adversely affects the transparency of the lenses.
• Subsequent cross-linking was by irradiation with beta rays at typically 66-132 kGy for a few seconds.
• Irradiation is sequential in 33 kGy increments.
• the irradiation takes place at least twice, but preferably four times with, for example, the same in each case Radiation doses.
• the lenses may have connecting elements for anchoring in the form of legs (see, for example, FIGS. 3 and 6).
• the lenses of the radiation-crosslinked Grilamid TR 90 were, in contrast to lenses made of the uncrosslinked material solder-stable and had a transparency of about 70-95%, preferably 85-90%.
• the water absorption of the lenses of the crosslinked material was reduced so much that when blasting at a maximum temperature of 260 0 C at 30s no blistering was observed.
• housings of LEDs which comprise thermoplastics filled with white pigment can also be used, for example.
• B. produced by means of injection molding and radiation crosslinking the resulting housing then in contrast to the non-radiation crosslinked housings are solder resistant.
• TOP LEDs can also be such.
• B. still the housing of so-called the expert also known "SMART LEDs", and "chip LEDs" are radiation crosslinked.
• SMART LEDs are described, for example, in the document DE 199 63 806 C2, which is hereby incorporated by reference, and have an LED with a leadframe which is encapsulated by a plastic molding compound in such a way that the LED is connected to its LED
• the plastic molding compound can still be mixed with a light conversion substance, in the case of "chip LEDs", LEDs are mounted on a PCB that has contacts for mounting and encapsulated by a plastic molding compound.
• Figures 1 to 7 show various embodiments of radiation-emitting devices according to the invention with optical components of crosslinked thermoplastic materials in cross section and a radiation-crosslinked lens, which is suitable for installation in an optoelectronic device.
• FIG. 1 shows, in cross-section, a radiation-emitting component 5A, in which a semiconductor component 5, e.g. B. an LED by means of a bonding wire 10 and a conductor strip 20 is electrically contacted.
• the semiconductor component 5 is located in a reflector trough which has a reflector surface 2 and which concentrates the light emitted by the semiconductor component.
• the reflector pan and the semiconductor component 5 located therein are of a casting 15, z. B. encompassing epoxy or silicone.
• the radiation-emitting component 5A has a housing 1 made of a radiation-cured or chemically crosslinked thermoplastic on, which has high reflectivity and from the same time the reflector surfaces 2 of the reflector trough are formed.
• the housing 1 consists either of expensive high-temperature plastics or thermosetting plastics
• radiation-emitting components according to the invention are cheaper and easier to produce due to the easy formability of the thermoplastics.
• FIG. 2 shows a cross section of a further embodiment of a radiation-emitting component 5A according to the invention.
• a lens 25 is additionally present, which is applied to the encapsulation 15 of the component.
• Such a lens 25 may also be particularly easily formed from a post-crosslinked thermoplastic material.
• the housing 1 may also include a thermoplastic material crosslinked according to the invention in the component of FIG. 2 or may comprise conventional high-temperature thermoplastics or thermosetting plastics. Since it is surprisingly also possible to produce subsequently crosslinked thermoplastic materials with sufficiently transparent properties, it is readily possible to arrange the lens 25 made of the subsequently crosslinked thermoplastic material in the beam path 60 of the component 5A.
• FIG. 3 shows a further variant of a radiation-emitting component 5A according to the invention, in which a lens 25 is arranged on the casting 15, which likewise subsequently comprises radiation-crosslinked thermoplastic material and which additionally has connecting elements 30A.
• the connecting elements 30A consist of small feet it allow by means of a snap mechanism to anchor the feet in recesses 3OC of the housing 1 mechanically. In such an embodiment, it is no longer necessary, as usual, to fasten the lens 25, for example by gluing, on the casting 15 of the component 5A.
• connecting elements 3OB can also be formed in the housing 1, which additionally comprises crosslinked thermoplastic materials according to the invention, which allow an anchoring of the component 5A on a substrate 100, for example a printed circuit board, in a particularly simple manner.
• the fasteners 3OB are fixed in the form of feet by means of a snap mechanism in recesses 3OD of the substrate 100.
• Such fastening methods can replace, for example, conventional soldering methods and thus reduce or prevent thermal stress on the component.
• radiation-emitting components having the housings 1 made from these materials can also be attached to substrates 100 without major problems by means of soldering methods.
• FIG. 5 shows in cross-section a further embodiment of the invention, in which both the lens 25 and the housing 1 comprise subsequently cross-linked thermoplastic materials.
• the lens 25 may be an inorganic one Coating 25A and be disposed on the housing 1, an inorganic coating IA.
• Such coatings which may include, for example, materials selected from silica and titania, may be deposited, for example, by gas deposition processes having layer thicknesses of 50 nm to 1000 nm.
• the device is mounted by soldering through the solder 50 on the substrate 100.
• FIG. 6 shows a component in which the lens 25 is placed on the housing 1 via fastening elements 25B.
• the fastening elements 25 B comprise the housing 1.
• FIG. 7 shows in FIGS. 7A and 7B perspective views of a possible embodiment of a lens 25 which, similar to that shown in FIG. 6, can be plugged onto a housing 1.
• pins 25C are also provided, which are inserted into corresponding recesses in the housing.
• Figure IC shows the lens 25 in cross section.
• thermoplastic materials used as well as the shape and function of the optical components formed from these subsequently crosslinked thermoplastic materials are not limited to the embodiments presented. Rather, the invention encompasses any novel feature as well as any combination of features, including in particular any combination of features in the claims, even if this feature or combination itself is not explicitly stated in the patent claims or exemplary embodiments. Further variations are possible above all with regard to the thermoplastic materials used as well as the shape and function of the optical components formed from these subsequently crosslinked thermoplastic materials.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Led Device Packages (AREA)
• Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
• Injection Moulding Of Plastics Or The Like (AREA)
• Manufacture Of Macromolecular Shaped Articles (AREA)
• Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

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• 2005
  • 2005-08-03 DE DE102005036520A patent/DE102005036520A1/de not_active Withdrawn
• 2006
  • 2006-04-18 CN CN201210148435.1A patent/CN102683561B/zh not_active Expired - Fee Related
  • 2006-04-18 US US11/912,831 patent/US20080224159A1/en not_active Abandoned
  • 2006-04-18 CN CN2006800135892A patent/CN101164174B/zh not_active Expired - Fee Related
  • 2006-04-18 EP EP06742249A patent/EP1875522A2/de not_active Withdrawn
  • 2006-04-18 JP JP2008508070A patent/JP2008539567A/ja active Pending
  • 2006-04-18 WO PCT/DE2006/000673 patent/WO2006114082A2/de active Application Filing
  • 2006-04-18 KR KR1020077015313A patent/KR20080003768A/ko active Search and Examination
  • 2006-04-26 TW TW095114964A patent/TWI381935B/zh not_active IP Right Cessation

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