EP1733401A4 - CONDUCTIVE COMPOSITION FOR PRODUCING A SOFT HEATING CARBON STRUCTURE, SOFT HEATING CARBON STRUCTURE USING THE METHOD, AND PROCESS FOR MANUFACTURING THE SAME - Google Patents

CONDUCTIVE COMPOSITION FOR PRODUCING A SOFT HEATING CARBON STRUCTURE, SOFT HEATING CARBON STRUCTURE USING THE METHOD, AND PROCESS FOR MANUFACTURING THE SAME

Info

Publication number
EP1733401A4
EP1733401A4 EP05789643A EP05789643A EP1733401A4 EP 1733401 A4 EP1733401 A4 EP 1733401A4 EP 05789643 A EP05789643 A EP 05789643A EP 05789643 A EP05789643 A EP 05789643A EP 1733401 A4 EP1733401 A4 EP 1733401A4
Authority
EP
European Patent Office
Prior art keywords
heating structure
flexible heating
silicon rubber
liquid silicon
carbon flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05789643A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1733401A1 (en
Inventor
Sanggu Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centech Co Ltd
Original Assignee
Centech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2004-0028299A external-priority patent/KR100535175B1/ko
Application filed by Centech Co Ltd filed Critical Centech Co Ltd
Publication of EP1733401A1 publication Critical patent/EP1733401A1/en
Publication of EP1733401A4 publication Critical patent/EP1733401A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/18—Conductive material dispersed in non-conductive inorganic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
EP05789643A 2004-03-29 2005-03-29 CONDUCTIVE COMPOSITION FOR PRODUCING A SOFT HEATING CARBON STRUCTURE, SOFT HEATING CARBON STRUCTURE USING THE METHOD, AND PROCESS FOR MANUFACTURING THE SAME Withdrawn EP1733401A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020040021056 2004-03-29
KR10-2004-0028299A KR100535175B1 (ko) 2004-03-29 2004-04-23 카본유연성 발열구조체 제조용 전도성 조성물과 이를 이용한 카본유연성 발열구조체 및 이의 제조방법
PCT/KR2005/000914 WO2006004282A1 (en) 2004-03-29 2005-03-29 Conductive composition for producing carbon flexible heating structure, carbon flexible heating structure using the same, and manu¬ facturing method thereof

Publications (2)

Publication Number Publication Date
EP1733401A1 EP1733401A1 (en) 2006-12-20
EP1733401A4 true EP1733401A4 (en) 2008-05-21

Family

ID=35783058

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05789643A Withdrawn EP1733401A4 (en) 2004-03-29 2005-03-29 CONDUCTIVE COMPOSITION FOR PRODUCING A SOFT HEATING CARBON STRUCTURE, SOFT HEATING CARBON STRUCTURE USING THE METHOD, AND PROCESS FOR MANUFACTURING THE SAME

Country Status (4)

Country Link
EP (1) EP1733401A4 (ja)
JP (1) JP2007531217A (ja)
CA (1) CA2561750A1 (ja)
WO (1) WO2006004282A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8243358B2 (en) 2006-11-24 2012-08-14 The Hong Kong University Of Science & Technology Constructing planar and three-dimensional microstructures with PDMS-based conducting composite
KR100924469B1 (ko) * 2008-04-04 2009-11-03 주식회사 유니웜 발열 시트 제조방법
WO2011055330A1 (en) 2009-11-05 2011-05-12 Winstone Wallboards Limited Heating panel and method therefor
DE102010019777B4 (de) 2010-05-07 2019-08-22 Airbus Operations Gmbh Luftfahrzeug mit einem Fluidleitungssystem
US9345069B2 (en) 2010-12-03 2016-05-17 Wood Stone Ideas, Llc Heat generation and exchange devices incorporating a mixture of conductive and dielectric particles
KR20120096451A (ko) * 2012-08-12 2012-08-30 박상구 도전성 실리콘고무 발열체의 제조방법
CN107666729B (zh) * 2017-08-14 2020-11-06 深圳市维特欣达科技有限公司 一种中温固化电热浆的制备方法及中温固化电热浆
CN111712003B (zh) * 2020-06-29 2022-02-22 佛山(华南)新材料研究院 一种低压红外电热膜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382024A (en) * 1977-05-18 1983-05-03 Hotfoil Limited Electrically conductive rubber
EP0352039A2 (en) * 1988-07-20 1990-01-24 Dow Corning Corporation Electrically conductive silicone compositions
EP0543292A1 (en) * 1991-11-18 1993-05-26 Wacker-Chemie Gmbh A flame retardant elastomeric composition
WO2003027174A1 (en) * 2001-09-21 2003-04-03 Dow Corning Toray Silicone Co., Ltd. Electroconductive silicone rubber sponge

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55108455A (en) * 1979-02-15 1980-08-20 Toray Silicone Co Ltd Electrically conductive liquid silicone rubber composition for extrusion molding
US4695508A (en) * 1985-09-06 1987-09-22 The Yokohama Rubber Co., Ltd. Adhesive composition
JPS6345804A (ja) * 1986-08-12 1988-02-26 三ツ星ベルト株式会社 発熱体ゴム組成物
JPH0654704B2 (ja) * 1987-02-21 1994-07-20 サンライズ工業株式会社 自己温度調節面状発熱体の製造法
JPS63284048A (ja) * 1987-05-14 1988-11-21 Sanraizu Kogyo Kk 車両用ヒ−タ付ミラ−
JPH0748396B2 (ja) * 1989-03-02 1995-05-24 禮男 森 面状発熱体
US5082595A (en) * 1990-01-31 1992-01-21 Adhesives Research, Inc. Method of making an electrically conductive pressure sensitive adhesive
JP2631572B2 (ja) * 1990-04-27 1997-07-16 東芝シリコーン株式会社 導電性シリコーンゴム組成物
JPH04304266A (ja) * 1991-03-29 1992-10-27 Polytec Design:Kk 可変抵抗ゴム
JPH06231869A (ja) * 1993-02-08 1994-08-19 Uizumu Internatl:Kk 複合化ゴム発熱体製品及びその製造法
JP2731691B2 (ja) * 1993-04-26 1998-03-25 東芝シリコーン株式会社 導電性シリコーンゴム組成物
JPH07242827A (ja) * 1994-03-08 1995-09-19 Toshiba Silicone Co Ltd 導電性シリコーンゴム組成物、導電性シリコーンゴム組成物の製造方法および面状発熱体
JPH0873746A (ja) * 1994-09-02 1996-03-19 Awaji Sangyo Kk 発熱体用オルガノポリシロキサン組成物及び発熱体の製造方法
JP3541264B2 (ja) * 1995-12-22 2004-07-07 株式会社高純度化学研究所 正温度特性素子
JPH10289780A (ja) * 1997-04-11 1998-10-27 Nippon Tungsten Co Ltd 連鎖形ヒーターユニット及びその製造方法
JPH11345681A (ja) * 1998-06-03 1999-12-14 Co-Op Chem Co Ltd 面状発熱体
AU2001234176A1 (en) * 2000-04-26 2001-11-07 Asahi Kasei Kabushiki Kaisha Conductive resin composition and process for producing the same
JP2002008830A (ja) * 2000-06-21 2002-01-11 Shuho Kk 保護層を有する面状発熱体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382024A (en) * 1977-05-18 1983-05-03 Hotfoil Limited Electrically conductive rubber
EP0352039A2 (en) * 1988-07-20 1990-01-24 Dow Corning Corporation Electrically conductive silicone compositions
EP0543292A1 (en) * 1991-11-18 1993-05-26 Wacker-Chemie Gmbh A flame retardant elastomeric composition
WO2003027174A1 (en) * 2001-09-21 2003-04-03 Dow Corning Toray Silicone Co., Ltd. Electroconductive silicone rubber sponge

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006004282A1 *

Also Published As

Publication number Publication date
JP2007531217A (ja) 2007-11-01
CA2561750A1 (en) 2006-01-12
EP1733401A1 (en) 2006-12-20
WO2006004282A1 (en) 2006-01-12

Similar Documents

Publication Publication Date Title
EP1733401A4 (en) CONDUCTIVE COMPOSITION FOR PRODUCING A SOFT HEATING CARBON STRUCTURE, SOFT HEATING CARBON STRUCTURE USING THE METHOD, AND PROCESS FOR MANUFACTURING THE SAME
CA3043354C (en) A method for preparing high shrinkage stability styrene butadiene rubber-based nanocomposite foams
WO2005105854A3 (en) Method of producing a tire composition having improved silica reinforcement
CN110157082B (zh) 中底材料组合物与中底材料的制作方法及鞋底
SG109587A1 (en) Composition for polyolefin resin foam, foam of the same, and process for producing foam
CN101696279A (zh) 一种动态硫化热塑性弹性体的制备方法
CN101519578A (zh) 一种汽车密封条专用料及其制备方法
EP1736512A4 (en) CONDUCTIVE RESIN COMPOSITION
CN103408948B (zh) 一种橡胶组合物及其应用
CN102816351B (zh) 低比重橡胶发泡鞋底及其生产方法
JP2005321764A5 (ja)
CN101418085A (zh) 天然橡胶鞋底板及其制备方法
CN108192163A (zh) 一种运动鞋底用橡胶及其制备方法
CN107188453A (zh) 一种蛭石基耐高温密封材料的制备方法
CN110128711A (zh) 耐磨天然橡胶基纳米复合发泡材料及其制备方法
MX2009007119A (es) Revestimiento interno de neumatico.
CN108948541A (zh) 一种用于门窗密封条制备的耐磨抗老化橡胶
GB0421183D0 (en) Rubber compositions,methods of making rubber compositions,rubber and rubber-containing articles
CN102731857A (zh) 耐磨鞋底及其生产方法
CN108117759A (zh) 一种低粘度模具胶及其制备方法
CN105153702B (zh) 用于压制紧固件密封罩的胶料和制备密封罩的方法
CN110204803B (zh) 一种轻比重橡胶制品及其制备方法
CN104262565B (zh) 一种聚氨酯微孔弹性运动场材料配方及其制备方法
KR101196480B1 (ko) 부구 제조방법
CN109608681A (zh) 一种聚氨酯发泡鞋底的生产工艺

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20060921

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20080417

RIC1 Information provided on ipc code assigned before grant

Ipc: H01B 1/04 20060101AFI20060214BHEP

Ipc: C08K 3/04 20060101ALI20080411BHEP

17Q First examination report despatched

Effective date: 20080826

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20091223