EP1664882A1 - Module optique comportant un element d'espacement entre le boitier d'un element a semiconducteurs et une unite de lentilles - Google Patents

Module optique comportant un element d'espacement entre le boitier d'un element a semiconducteurs et une unite de lentilles

Info

Publication number
EP1664882A1
EP1664882A1 EP04766799A EP04766799A EP1664882A1 EP 1664882 A1 EP1664882 A1 EP 1664882A1 EP 04766799 A EP04766799 A EP 04766799A EP 04766799 A EP04766799 A EP 04766799A EP 1664882 A1 EP1664882 A1 EP 1664882A1
Authority
EP
European Patent Office
Prior art keywords
optical module
semiconductor element
spacer
lens
lens unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04766799A
Other languages
German (de)
English (en)
Inventor
Danut Timisoara Str. Martir Vasile Balmus BOGDAN
Josef Dirmeyer
Henryk Frenzel
Harald Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1664882A1 publication Critical patent/EP1664882A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the invention relates to an optical module with a circuit carrier, a packaged semiconductor element arranged on the circuit carrier and a lens unit for processing electromagnetic radiation along an optical axis onto the semiconductor element, the packaged semiconductor element and the lens unit being formed in two pieces ,
  • the invention further relates to an optical system with an optical module designed in this way.
  • optical system with an optical module designed in this way. 15
  • Generic optical modules and systems are used in particular in automotive engineering.
  • the components sensor and optics have to be geometrically coordinated very precisely.
  • the tolerance range for the distance from camera chip to optics in z-Ac se is usually in the range of a few hundredths of a millimeter in order to achieve an optimally sharp image for a certain depth of field. This is particularly problematic for so-called fixed focus systems, since these may have little tolerance during manufacture.
  • An offset from the camera chip to the optics in the x or y axis has the additional consequence that the optical system may squint " ⁇ ", ie the image is cut off at one edge (horizontal or vertical) because of the offset there are no more pixels here and should be provided as a precaution.
  • the image has a blurring gradient in the horizontal or vertical direction. Besides it can result in a "rotation”, ie a rotation around the z-axis from the camera chip to the optics.
  • Cameras for specific low-cost applications such as automotive, industry, digital cameras, cell phones, toys, etc. should, however, be able to be produced from cost and aspects of quality assurance as far as possible without adjustment processes between the optics and the camera chip, i.e. without adjusting the focus on the optical surface of the CMOS - or CCD sensor. This is fundamentally contrary to the requirements mentioned.
  • One possibility of developing a focus-free system is to reduce the sum of the possible tolerances and elements, so that the module or system works, depending on the design, without vJustage at least in a certain distance and temperature range.
  • the present invention when using the invention, for example in the context of an occupant protection system of a motor vehicle, to which the present invention is not limited, it should be possible to guarantee sharp images at distances of, for example, 15 cm to 130 cm and at temperatures of, for example, -40 ° C. to + 105 ° C. , This is all the more realizable, the fewer elements are included in the tolerance chain.
  • the circuit carrier for the camera chip (currently eg CCD or CMOS) has a large share in the tolerance chain.
  • the necessary soldered and possibly adhesive connections or the like between the chip and the circuit carrier have a large proportion in the tolerance chain.
  • the lens holder itself which preferably consists of plastic, can be connected to the lens arrangement in various ways, so that an exact optical alignment of the lens arrangement and the semiconductor element with respect to the lens holder or the lens arrangement can always be ensured.
  • the invention has for its object to provide an optical module and an optical system with a semiconductor element arranged on a circuit carrier, in which possibly remaining tolerances can be compensated in such a way that reliable and simple optical quality without adjustment and in particular focusing effort can be made available and is maintained over the life of the module or system.
  • the invention is based on the generic optical module in that at least one spacer element, which is also referred to as a spacer, is arranged outside the optical axis between the housing of the semiconductor element and the lens unit. In this way, any remaining manufacturing tolerances between the semiconductor housing and the lens unit, for example due to tool-related Wear, or other differences within or between different production lots or manufacturer-specific types of construction or the like can be advantageously compensated for.
  • the spacer element is preferably designed as a film or washer, for example like a washer in the form of an annular washer.
  • Ring disks generally allow the formation of defined, e.g. planer, surfaces, with which a uniform support can be realized, which largely eliminates tilting of the components to one another in an advantageous manner.
  • the spacer element is preferably a stamped part. Particularly in the case of spacer elements with a very small thickness of a few tenths or hundredths of a millimeter, these can advantageously be punched out of a film.
  • the spacer element is designed to be adhesive at least on one side, preferably on both sides.
  • Such spacer elements can easily be made, for example, from a single-sided or double-sided adhesive tape or an adhesive film, preferably punched out.
  • the spacer element is preferably part of a set of elements which preferably comprises two or more spacer elements of differently predefined thickness dimensions or with a uniform basic dimension and each of these nominal dimensions expanded or reduced differently.
  • a typical set of elements would, for example, include elements with nominal size changes from +/- 0.005 mm or +/- 0.01 mm to +/- 0.03 mm or the like. In this way, any remaining tolerance clearances between the semiconductor housing and the lens unit can in principle be advantageously compensated for without great adjustment effort.
  • At least one spacer element according to the invention is preferably designed at the same time as a perforated diaphragm, stray light diaphragm or the like and can thus save on separate diaphragms etc.
  • the spacer element is suitably made from a plastic, for example from a thermoplastic.
  • the invention also consists in an optical system with an optical module of the type mentioned above. In this way, the advantages of the optical module also come into play in the context of an overall system.
  • the invention is based on the knowledge that any remaining manufacturing tolerances, in particular between packaged semiconductor chips and lens units of different series, can be compensated for simply and inexpensively by means of at least one specially designed spacer element.
  • This means that the optical module can be developed without moving parts such as threads or fixing screws, which leads to greater reliability. Due to the small tolerances of the structure, also in the x and y axes, the chip surface does not have to be unnecessarily large, which makes the camera chip cheaper.
  • the structure of such a module can be made very compact, which has the advantage that the camera module can also be used in applications where space is limited.
  • the invention can be used particularly useful in the implementation of video systems, possibly in combination with radar systems, ultrasound systems or the like in the field of motor vehicles.
  • FIG. 1 shows the arrangement of a spacer element according to the invention in a sectional view of an optical module according to the invention with a customer-specific, packaged semiconductor element
  • FIG. 2 shows an enlarged section X of the module according to FIG. 1 ;
  • Fig. 3 a spacer element used according to the invention in isolation /
  • FIG. 4 shows the arrangement of a distance element according to the invention in a sectional view of an optical module according to the invention with a semiconductor element which is housed as standard.
  • FIGS. 1 to 5 show in different sections and perspectives the arrangement of a spacer element 35 according to the invention in an optical module with a circuit carrier 10; a packaged semiconductor element 12 arranged on the circuit carrier 10 and a lens unit 14; 16, 18, 20; 21 for projecting electromagnetic radiation along an optical axis 33 onto the semiconductor element 12.
  • the lens unit 14; 16, 18, 20; 21 comprises a lens holder 14 and a lens arrangement 16, 18, 20; 21 with at least one lens 20 and possibly an aperture 21.
  • the semiconductor element 12 can be arranged in a standard housing (cf. FIG. 4 below) or in a customized SMD housing (cf. FIGS. 1 and 2).
  • the exemplary embodiment according to FIG. 1 is based on a customer-specific SMD housing 13.
  • a support 13a on which the lens unit 14; 16, 18, 20; 21 is arranged supported.
  • the support of the lens unit 14; 16, 18, 20; 21 takes place either via the lens 16, which is preferably designed in the manner of a support lens 16, or via the lens holder 14 (not shown).
  • support lens 16 or lens holder have, at least in sections, a surface section 16a which corresponds to the support 13a and which, for example, is flat and rests on the support 13a formed on the housing 13 of the semiconductor element 12.
  • the lens 16 or the lens holder has, at least in sections, a collar 16b, which essentially corresponds to a contact surface 13b formed on the support 13a is formed.
  • the support 13a is therefore preferably designed in the form of an annular collar 13a.
  • the system pool 13b of the ring collar 13a is preferably conical when viewed in the direction of the optical axis 33 of the module, so that a type of self-centering of adjacent components, in the present case of lens 16 and support 13a, is easier, not only for automated production.
  • the optical quality can be improved by a lens with a plurality of lenses, which is also possible within the scope of the present invention, in particular since it is possible to work with small tolerances.
  • fluctuations in the lens arrangement 16, 18, 20; 21 in the Z direction ie practically excluded in the direction in which the lenses follow one another.
  • the tolerances are only from the lens arrangement 16, 18, 20; 21 dependent.
  • the relative positions of the lenses to one another are determined by the geometry of the lenses 16, 18, 20 and, if appropriate, diaphragms 21 themselves.
  • the arrangement of the lenses can also be determined in the XY direction by the lenses themselves, in that contact surfaces of the lenses or diaphragms are designed accordingly.
  • the lenses 16, 18, 20 or diaphragms 21 held in the lens holder 14 are therefore preferably shaped such that they assume a defined position within the lens holder 14 relative to one another. Furthermore, at least one of the lenses 20 is designed such that it coincides with the lens holder 14. acts and thus also occupies a defined position with respect to the semiconductor element 12. In this way, all lenses 16, 18, 20 are adjusted with respect to the semiconductor element 12.
  • the lens holder 14 is connected to the circuit carrier 10, for example via a screw connection 23.
  • the packaged semiconductor element 12 is arranged on the circuit carrier 10 via lead frames 30.
  • an adhesive connection 22 or other known connection techniques can be provided.
  • the lens holder (not shown). Since the lenses determine their relative positions with one another, it is sufficient to fix exactly one lens or diaphragm with the lens holder. In this way, the entire lens arrangement is aligned with respect to the semiconductor element, as a result of which the advantageous optical quality can ultimately be ensured.
  • the exactly one lens is connected to the lens holder in a watertight and dustproof manner.
  • the foremost lens is advantageously selected as the lens which interacts with the lens holder for sealing. This can be done, for example, in such a way that the exactly one lens is connected to the lens holder by ultrasound, laser welding and / or adhesive methods, optionally alternatively or cumulatively using screws and / or putty.
  • the lens arrangement is snapped into the area holding the lenses via latching means 32 (cf. FIG. 4). This can also be an exact Positioning can be ensured. It should also be emphasized that this makes it easier to separate the lenses from the other components, in particular the expensive semiconductor element.
  • the sealing effect is provided in a particularly advantageous manner, in particular in connection with snap mounting, in that the lenses have a hard and a soft component, the soft component being arranged on the circumference of the lenses for sealing (not shown).
  • the soft component also supports the general requirement that care should be taken when snapping, no stresses in the lenses 16, 18, 20; 21 to introduce; Tensions would always have a negative impact on the optical properties.
  • the lens arrangement 16, 18, 20; 21 is held in the lens holder 14 via a holding element 15 (molded ring).
  • the holding element 15 preferably has a hard 15a and at least in sections a permanently elastic component 15b.
  • a permanently elastic component 15b which is preferably circumferentially formed, can also be used, in particular, to seal the lens arrangement 16, 18, 20; 21 serve against moisture and dirt - in addition to their own balancing function of any mechanical and / or thermal stresses that may occur.
  • the permanently elastic component 15b is preferably formed on the circumference adjacent to the lens 20.
  • the holding element 15 is arranged on the area 14 holding the lenses, for example ultrasonically or laser-welded, glued, riveted, molded or by means of another similarly easily automated connection method. Screw and snap connections are also conceivable.
  • the hard component 15a of the retaining ring 15 contains a thermal plastic material.
  • a permanently elastic component 15b which preferably contains thermoplastic elastomers (TPE) or silicone or the like, has proven itself.
  • the permanently elastic component 15b is preferably molded onto the hard component 15a, for example after a two-component injection molding process, or vice versa.
  • the module can be connected to a rigid circuit board via a flat cable or, in particular, if a flexible printed circuit board is used as the circuit carrier (the latter are also referred to as rigid-flex systems), in particular (for example by means of strap soldering) , In terms of angle and position, etc., this is a particularly flexible solution for connecting the circuit carrier 10 or the module to a controller or circuit board (not shown).
  • the spacer lies between the support 13a and the lens 16 or the lens holder 1.
  • FIG. 3 shows a spacer element 35 used according to the invention in isolation.
  • the spacer 35 is punched out of a film.
  • Disc-shaped spacer elements 35 are also conceivable, for example in FIG.
  • the spacer element 35 is preferably part of a set of elements a, b, c with at least two or more spacer elements 35a, 35b, 35c of uniformly predefined thickness basic dimensions and each of these nominally expanding or reducing nominal dimensions.
  • the element set a, b, c can comprise spacer elements 35 with nominal size changes from 4 - / - 0.005 mm or +/- 0.01 mm to +/- 0.03 mm or the like.
  • the spacer element 35 can preferably also be designed as a perforated diaphragm, a scattering diaphragm or the like, which, depending on the structure of the end, can advantageously advantageously reduce parts.
  • FIG. 4 shows the arrangement of a spacer element 35 according to the invention in a sectional view of an optical module according to the invention with a semiconductor element 12 housed as standard.
  • the spacer element or spacer 35 rests on a transparent glass cover 36, which in particular has the sensitive surface 34 of the semiconductor chip 12 Protects dust etc.
  • the spacer 35 can of course also be arranged directly on the chip housing 13.
  • any manufacturing tolerances e.g. supports 13a of a custom chip package 13 or inexpensive lens units 14; 16, 18, 20; 21 or the like in an advantageous manner by means of easily manageable spacer elements 35, which are preferably in the form of a set of elements a, b, c, ... for typical thickness dimensions for series of different manufacturing quality.
  • spacer elements 35 which are preferably in the form of a set of elements a, b, c, ... for typical thickness dimensions for series of different manufacturing quality.
  • the use of at least one compensating element 35 proposed according to the invention advantageously enables the construction of reliable camera modules, in which any mechanical focus adjustment can still be dispensed with.
  • the optical module can be installed without moving parts such as threads or fixing screws.
  • the chip surface 34 does not have to be unnecessarily large, which makes the camera chip cheaper.
  • the structure of such a module can be made relatively compact, which has the advantage that the camera module can also be used in applications where space is limited. Furthermore, the structure described offers the possibility of designing a hermetically sealed module that is well protected against environmental influences such as moisture or dust.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)

Abstract

La présente invention concerne un module optique comportant un support de circuit (10), un élément à semiconducteurs (12) logé dans un boîtier, disposé sur le support de circuit (10), et une unité de lentilles (14; 16, 18, 20; 21) destinée à la projection de rayonnement électromagnétique le long d'un axe optique (33), sur l'élément à semiconducteurs (12), l'élément à semiconducteurs (12) et l'unité de lentilles (14; 16, 18, 20; 21) étant conçus en deux parties. Selon l'invention, au moins un élément d'espacement (35) est disposé en dehors de l'axe optique (33), entre le boîtier (13) de l'élément à semiconducteurs (12) et l'unité de lentilles (14; 16, 18, 20; 21). La disposition d'un élément d'espacement économique (35) permet de compenser simplement des tolérances de fabrication restantes, par exemple entre des boîtiers à semiconducteurs (13) spécifiques aux clients, et des unités de lentilles (14; 16, 18, 20; 21) provenant de séries de qualités différentes. Comme des séries excédant les tolérances ne trouvaient aucune utilisation jusque-là en tant que rejets, l'élément de compensation selon l'invention (35) permet de fabriquer avantageusement des modules de caméra fiables, s'affranchissant de tout réglage mécanique du foyer. De tels modules de caméra sont particulièrement adaptés à une utilisation à l'intérieur et/ou à l'extérieur d'un véhicule.
EP04766799A 2003-09-26 2004-09-15 Module optique comportant un element d'espacement entre le boitier d'un element a semiconducteurs et une unite de lentilles Withdrawn EP1664882A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10344770A DE10344770A1 (de) 2003-09-26 2003-09-26 Optisches Modul und optisches System
PCT/EP2004/052187 WO2005031422A1 (fr) 2003-09-26 2004-09-15 Module optique comportant un element d'espacement entre le boitier d'un element a semiconducteurs et une unite de lentilles

Publications (1)

Publication Number Publication Date
EP1664882A1 true EP1664882A1 (fr) 2006-06-07

Family

ID=34384305

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04766799A Withdrawn EP1664882A1 (fr) 2003-09-26 2004-09-15 Module optique comportant un element d'espacement entre le boitier d'un element a semiconducteurs et une unite de lentilles

Country Status (5)

Country Link
US (1) US20070031137A1 (fr)
EP (1) EP1664882A1 (fr)
JP (1) JP2007506126A (fr)
DE (1) DE10344770A1 (fr)
WO (1) WO2005031422A1 (fr)

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US20070031137A1 (en) 2007-02-08
JP2007506126A (ja) 2007-03-15
WO2005031422A1 (fr) 2005-04-07

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