EP1665392A1 - Module optique et systeme optique - Google Patents

Module optique et systeme optique

Info

Publication number
EP1665392A1
EP1665392A1 EP04787186A EP04787186A EP1665392A1 EP 1665392 A1 EP1665392 A1 EP 1665392A1 EP 04787186 A EP04787186 A EP 04787186A EP 04787186 A EP04787186 A EP 04787186A EP 1665392 A1 EP1665392 A1 EP 1665392A1
Authority
EP
European Patent Office
Prior art keywords
lenses
holding
lens
optical module
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04787186A
Other languages
German (de)
English (en)
Inventor
Danut Bogdan
Josef Dirmeyer
Henryk Frenzel
Harald Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1665392A1 publication Critical patent/EP1665392A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the invention relates to an optical module with a circuit carrier, a packaged semiconductor element arranged on the circuit carrier and a lens unit for projecting electromagnetic radiation onto the semiconductor element.
  • the invention further relates to an optical system with an optical module designed in this way.
  • LFD Blind Spot Detection
  • OOP Out of Position Detection
  • the components sensor and optics must be geometrically very precisely coordinated.
  • the tolerance range for the distance from the camera chip to the optics in the z-axis is usually in the range of a few hundredths of a millimeter in order to achieve an optimally sharp image for a certain depth of field. This is particularly problematic for so-called fixed focus systems, since these may have little tolerance during manufacture.
  • An offset from the camera chip to the optics in the x or y axis additionally has the consequence that the optical system may "squint", i.e. the image is cut off at one edge (horizontal or vertical) because the offset means that there are no more pixels here and had to be provided as a precaution.
  • tilt ie tilting of the camera chip around the x or y axis
  • rotation ie a rotation about the z axis from the camera chip to the optics.
  • An adjustment step may also be necessary for the xy offset or, if this does not take place, a correspondingly larger sensor can be provided which compensates for the tolerances by adding more pixels. It is also known to use software to calculate or calibrate the "rotation". Since otherwise sharp image information is available, the pixels only have to be reassigned in a type of "calibration process". However, there may be no more information at the edges or corners because they have been cut off. A purely mechanical reduction of "tilt" and "rotation" between the chip and the optics can usually only be achieved in conventional systems through high-precision manufacturing and
  • Cameras for specific low cost applications such as Automotive, industry, digital cameras, cell phones, toys etc., however, should be possible from cost and quality assurance aspects without any adjustment processes between the optics and the camera chip, i.e. without adjusting the focus to the optical surface of the CMOS or CCD sensor. This is fundamentally contrary to the requirements mentioned.
  • One possibility to develop a focus-free system is to reduce the sum of the possible tolerances and elements, so that the module or system can be designed without adjustment. works at least in a certain distance and temperature range.
  • it should be possible to guarantee sharp images at distances of, for example, 15 cm to 130 cm and at temperatures of, for example, -40 ° C. to + 105 ° C. This is all the more realizable, the fewer elements are included in the tolerance chain.
  • the necessary solder and possibly adhesive connections or the like between the chip and the circuit carrier have a large proportion in the tolerance chain.
  • the lens holder itself which preferably consists of plastic, can be connected to the lens arrangement in various ways, so that an exact optical alignment of the lens arrangement and the semiconductor element with respect to the lens holder or the lens arrangement can always be ensured.
  • the camera chip or the semiconductor element being mounted in a housing on a suitable circuit carrier, it is difficult to avoid the problems mentioned in their entirety and at the same time to avoid the problems mentioned To meet quality requirements.
  • the chip housing offers sufficient protection from behind, for example for the silicon which is transparent to IR radiation.
  • the lens itself needs to be adjusted to the camera chip and have a defined focus. This is currently done by means of tolerance-related fixing options, for example by screwing, gluing or the like, by means of which the lens is fixed on the circuit carrier relative to the camera chip.
  • the invention has for its object to provide an optical module and an optical system with a semiconductor element arranged on a circuit carrier, in which the possible tolerance chain is minimized as much as possible, so that reliable optical quality without adjustment is possible with simple and inexpensive installation. and in particular focusing effort can be made available and is maintained over the life of the module or system. In addition, necessary measures against external light radiation or other environmental influences from the front should be avoided as far as possible.
  • the invention is based on the generic optical module in that the lens unit for projecting electromagnetic radiation onto the semiconductor element comprises a type of lens holder which is an integral part of the housing of the semiconductor element.
  • the edge area in particular can be designed in almost any way, in particular with a holding area for a lens arrangement with a defined focus on the chip.
  • SMD Surface Mounted Device
  • the tolerance range that is available for focusing is only dependent on the lens arrangement itself.
  • the proposed solution has the advantage that the incident light from the side is completely eliminated by the integrative design of the lens holder and chip housing.
  • the area holding the lenses is formed in one piece with the housing, for example from a thermosetting material.
  • the area holding the lenses is preferred, e.g. after a two-component injection molding process, molded onto the housing.
  • thermoplastics The major difference between heat deformable thermoplastics and heat non-deformable thermosets is due to the behavior of the respective plastic during shaping.
  • a thermoplastic When a thermoplastic is heated and pressed into a mold, there is no chemical reaction. After the plastic has cooled down in the mold and has hardened, it could be brought back into another shape by heating it again without the characteristics of the plastic changing noticeably.
  • This property can also be advantageous for the connections described below. can be used by at least one lens with the area holding it.
  • Thermosets change chemically as they are brought into their final form. They react with polycondensation and network to form a spatial grid. This hardening by changing the structure of the molecule is advantageous, in particular with regard to fixing the lead frame of a semiconductor component, and is irreversible: once a thermoset has been molded, it can no longer be changed.
  • Thermosets include e.g. Phenolic resins, melamines and the urea resins.
  • a lens arrangement with a plurality of lenses and possibly at least one diaphragm in the form of a packet is preferably provided.
  • the optical quality can be improved by a lens with a plurality of lenses, which is also possible within the scope of the present invention, in particular since it is possible to work with small tolerances.
  • Faceplate are in direct contact with each other.
  • fluctuations in the lens arrangement in the Z direction that is, in the direction in which the lenses follow one another, are practically excluded.
  • the tolerances are only dependent on the lens arrangement itself.
  • the relative positions of the lenses to one another are determined by the geometry of the lenses and, if necessary, diaphragms themselves.
  • the arrangement of the lenses can also be determined in the XY direction by the lenses themselves, namely by designing contact surfaces of the lenses or diaphragms accordingly.
  • exactly one of the lenses or apertures is in direct contact with the lens holder. Since the lenses determine their relative positions with one another, it is sufficient to fix exactly one lens or diaphragm with the lens holder.
  • the entire lens arrangement is aligned with respect to the semiconductor element, as a result of which the advantageous optical quality can ultimately be ensured.
  • the exactly one lens is connected to the lens holder in a watertight and dust-tight manner.
  • the foremost lens is advantageously selected as the lens which interacts with the lens holder for sealing. This can be done, for example, in such a way that the exactly one lens is connected to the lens holder by ultrasound, laser welding and / or adhesive methods; if necessary, alternatively or cumulatively using screws and / or putty.
  • the lens arrangement is snapped into the area holding the lenses by means of latching means. This also ensures exact positioning. It should also be emphasized that this makes it easier to separate the lenses from the other components, in particular the expensive semiconductor element.
  • the sealing effect is provided in a particularly advantageous manner, in particular in connection with snap mounting, in that the lenses have a hard and a soft component, the soft component being arranged on the circumference of the lenses for sealing.
  • the soft component also supports the general requirement that when snapping be careful not to introduce any tension into the lenses; Tensions would always have a negative impact on the optical properties.
  • a specially designed holding element molded ring
  • the holding element preferably has a hard and at least partially a permanently elastic component.
  • a permanently elastic component which is preferably circumferentially formed, can at the same time serve, in particular, to seal the lens arrangement against moisture and dirt - in addition to its own compensation function for any mechanical and / or thermal stresses that may occur.
  • the permanently elastic component is preferably formed on the circumference adjacent to the lens.
  • the holding element is arranged on the area holding the lenses, for example ultrasonically or laser-welded, glued, riveted, molded on or by means of another similarly easily automated connection method. Screw and snap connections are also conceivable.
  • the hard component of the retaining ring preferably contains a thermoplastic material. Accordingly, a permanently elastic component that preferably contains thermoplastic elastomers (TPE) or silicone or the like has proven itself. In order to provide a uniform and easy-to-use component, the permanently elastic component is preferred, e.g. after one
  • Two-component injection molding molded onto the hard component or vice versa Two-component injection molding molded onto the hard component or vice versa.
  • the invention also consists in an optical system with an optical module of the type mentioned above. In this way, the advantages of the optical module also come into play in the context of an overall system.
  • the invention is based on the knowledge that by designing a chip housing with an integrated area holding the lenses before mounting the lenses, a chip can be fitted using SMD technology and a camera module can be built up with mounting the lenses, in which any mechanical focus adjustment is dispensed with can be.
  • the module can be manufactured fully automatically, which has the advantage of reducing the manufacturing and assembly costs for large numbers of pieces.
  • the optical module can be developed without moving parts such as threads or fixing screws, which leads to greater reliability. Due to the small tolerances of the structure in the x and y axes, the chip surface does not have to be unnecessarily large, which makes the camera chip cheaper.
  • the construction of such a module can be made relatively compact, which has the advantage that the camera module can also be used in applications where space is limited.
  • the integrative structure also advantageously offers protection against extraneous light radiation.
  • the invention can be used particularly useful in the implementation of video systems, possibly in combination with radar systems, ultrasound systems or the like in the motor vehicle sector.
  • the invention will now be explained by way of example with reference to the accompanying drawings based on preferred embodiments.
  • FIG. 1 shows the perspective view of an optical module according to the invention.
  • Fig. 2 shows the module of Fig. 1 in a sectional view along the line A-A.
  • FIG. 1 shows the perspective view of an optical module according to the invention with a circuit carrier 10; an SMD-housed semiconductor element 12 arranged on the circuit carrier 10; and a lens unit 14; 16, 18, 20; 21 for projecting electromagnetic radiation onto the semiconductor element 12.
  • Fig. 2 shows the module of Fig. 1 in a sectional view along a section line A-A.
  • the lens unit comprises a lens holder 14, which is an integral part of the housing 13 of the semiconductor element 12.
  • the area 14 holding the lenses is preferably formed in one piece with the housing 13, for example from one Typical duoplastic material for chip housings, which is advantageously particularly suitable for a snap, screw and / or snap connection between a lens 20 held in the area 14 and the area 14.
  • a molded connection of the lens arrangement 16, 18, 20; 21 holding area 14 with the housing 13 conceivable.
  • the semiconductor element 12 can, according to the current technology, e.g. be designed as CMOS or CCD.
  • the connection between the housed semiconductor element 12 and the circuit carrier 10 takes place via so-called leadframes 30, which are contacted via gold wires 28 with bond points (not shown) formed on the semiconductor chip 12.
  • leadframes 30 which are contacted via gold wires 28 with bond points (not shown) formed on the semiconductor chip 12.
  • the housing 13 of the chip 12 is preferably additionally glued to the circuit carrier 10. So-called SMD adhesives or the like are suitable for this.
  • the circuit carrier 10 itself is preferably designed as a rigid PCB.
  • This 10 can be electrically connected to other rigid circuit boards (not shown) via a flat cable.
  • Such a separate electrical connection can advantageously be omitted if a flexible printed circuit board is used as the circuit carrier 10, which at the same time serves for the electrical coupling (for example by means of a plumb bob) (not shown).
  • these so-called rigid-flex systems are a particularly flexible solution for connecting the circuit carrier 10 or the module to a controller or circuit board (not shown).
  • three lenses 16, 18, 20 and a diaphragm 21 are preferably used for applications in a vehicle interior.
  • the lenses 16, 18, 20, like the diaphragm 21, are shaped such that they assume a defined position relative to one another within the region 14 of the housing 13 that holds the lenses. Furthermore, at least one of the lenses 16 is designed in such a way that it interacts with the region 14 holding the lenses in such a way that this 16 assumes a defined position relative to a surface 34 of the semiconductor element 12 that is sensitive to electromagnetic radiation. In addition, at least one lens 20 is connected to the holder 14 in a watertight and dustproof manner, for example via latching means 32. In this way, all lenses 16, 18, 20 and, if necessary, diaphragms 21 are adjusted with respect to the semiconductor element 12. This adjustment is not influenced by further measures, since the lenses 16, 18, 20; 21 holding area 14 is directly part of the semiconductor house 13.
  • the lenses 16; 18, 20; 21 holding area 14 the construction of a camera module, in which prior to assembly of the lenses 16, 18, 20; 21 a chip 12, 13 can be fitted with SMD technology and during the assembly of the lenses 16, 18, 20; 21 any mechanical focus adjustment can be dispensed with.
  • the module can be manufactured fully automatically, which has the advantage that the production and assembly costs are lower when there are large numbers of pieces.
  • the module can be developed without moving parts such as threads or fixing screws, resulting in a higher one
  • the structure 13; 14; 16, 18, 20; 21 also in the x and y axes the chip surface 34 does not have to be unnecessarily large, which is the camera chip 12 makes cheaper.
  • the structure of such a module can be made very compact, which has the advantage that the camera module can also be used in applications with limited space.
  • the structure offers the possibility of designing a hermetically sealed module that is well protected against environmental influences such as moisture, dust or the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)

Abstract

L'invention concerne un module optique comportant un support de circuit (10) ; un élément semi-conducteur (12), sous boîtier, disposé sur le support de circuit (10) ; et une unité lenticulaire (14 ; 16, 18, 20 ; 21) pour projeter le rayonnement électromagnétique sur l'élément semi-conducteur (12). L'unité lenticulaire comprend de préférence un système de lentilles composé de par exemple trois lentilles (16, 18, 20) et d'un diaphragme (21). Les lentilles (16, 18, 20), éventuellement conjointement avec le diaphragme (21), sont orientées de manière univoque, de par leur configuration géométrique, de sorte à ne pas impliquer d'autre alignement optique. Selon l'invention, les lentilles (16, 18, 20 ; 21) sont maintenues dans une sorte de porte-lentilles (14) qui fait partie intégrante du boîtier (13) de l'élément semi-conducteur (12).
EP04787186A 2003-09-26 2004-09-22 Module optique et systeme optique Withdrawn EP1665392A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10344771 2003-09-26
PCT/EP2004/052266 WO2005031879A1 (fr) 2003-09-26 2004-09-22 Module optique et systeme optique

Publications (1)

Publication Number Publication Date
EP1665392A1 true EP1665392A1 (fr) 2006-06-07

Family

ID=34384306

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04787186A Withdrawn EP1665392A1 (fr) 2003-09-26 2004-09-22 Module optique et systeme optique

Country Status (3)

Country Link
US (1) US7570439B2 (fr)
EP (1) EP1665392A1 (fr)
WO (1) WO2005031879A1 (fr)

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TW200632506A (en) * 2005-03-02 2006-09-16 Premier Image Technology Corp Camera module and its manufacturing process
CN101526655A (zh) * 2008-03-04 2009-09-09 鸿富锦精密工业（深圳）有限公司 镜片及镜头模组
DE102009002559A1 (de) * 2009-04-22 2010-10-28 Robert Bosch Gmbh Sensoranordnung
TWI575271B (zh) * 2013-03-06 2017-03-21 鴻海精密工業股份有限公司 光通訊模組及用於該光通訊模組之點膠方法
CN204187529U (zh) * 2013-09-04 2015-03-04 正峰新能源股份有限公司 可达到最大集光效果的照明装置
CN107295222B (zh) * 2016-04-13 2021-02-02 台湾东电化股份有限公司 照相镜头模块
US11402602B2 (en) 2019-09-27 2022-08-02 Waymo Llc Lens retainer ring with compliant element

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Also Published As

Publication number Publication date
US20060239632A1 (en) 2006-10-26
WO2005031879A1 (fr) 2005-04-07
US7570439B2 (en) 2009-08-04

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