EP2553525A1 - Dispositif comportant un module optique et une plaque de support - Google Patents

Dispositif comportant un module optique et une plaque de support

Info

Publication number
EP2553525A1
EP2553525A1 EP10807317A EP10807317A EP2553525A1 EP 2553525 A1 EP2553525 A1 EP 2553525A1 EP 10807317 A EP10807317 A EP 10807317A EP 10807317 A EP10807317 A EP 10807317A EP 2553525 A1 EP2553525 A1 EP 2553525A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
image pickup
pickup element
support plate
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10807317A
Other languages
German (de)
English (en)
Inventor
Gerhard Müller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP2553525A1 publication Critical patent/EP2553525A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the invention relates to an optical device comprising an optical module and a carrier plate, on which an image pickup element is arranged.
  • connection techniques For the connection of an optical module, for example a lens, with a carrier housing, for example a lens holder or camera housing, a variety of connection techniques are used.
  • the quality of cameras depends crucially on the quality of the connection between the optical module and the carrier housing and results u. a. from camera intrinsic tolerances and installation tolerances.
  • location and position tolerances, in particular roll, yaw and pitch angles, for example of the objective in the carrier housing have a considerable influence on the functionality of a camera.
  • connection technique in general a very good and long-term stable alignment of the optical module relative to the carrier housing is required.
  • an objective holder is connected to a circuit board, for example a flex circuit board.
  • a circuit board for example a flex circuit board.
  • an image pickup element for example, a picture chip (imager)
  • the image pickup element is usually soldered to the circuit board.
  • the image pickup element is also glued directly to the printed circuit board in a so-called chip-on-board technology and a bond is established via bonds.
  • the optical devices described above for positioning an optical module over an image-receiving element have the disadvantage that shrinkages during curing of the adhesive directly affect the focusing of the optical device.
  • the image pickup element / circuit board / carrier plate structure ie the structure in which Jardinaufhahmeelement via printed circuit board and circuit board are arranged on support plate, also has the disadvantage that influences of the circuit board, such as tolerances, temperature behavior and aging, also affect the focusing of the optical device, because the optical module or the lens is connected via the lens holder directly to the circuit board.
  • a direct bonding of elements For example, a lens holder, for example, with a flexible circuit board, as is the case with known devices, difficult to realize.
  • the invention is therefore an object of the invention to provide an optical device, wherein with the least possible manufacturing and Justageaufwand a positioning of an optical module is made on an image pickup element that is as robust as possible tolerances and influencing factors such as temperature behavior and aging as little as possible with each other has to be connected components.
  • An essential idea of the invention is to arrange the image pickup element directly on the carrier plate and to install the printed circuit board below the carrier plate. This results in an advantageous image pickup / support plate / Leite latte- structure, wherein the image pickup element sits directly on the support plate, resulting in various advantages over the known from the prior art devices.
  • On the one hand causes the arrangement of the image pickup element on the support plate a good thermal connection or heat dissipation, especially if the support plate is designed as a metal plate.
  • the arrangement of optical module and image pickup element on one side of the carrier plate and by arranging the circuit board on the other side of the carrier plate is an advantageous separation of various components.
  • This particularly relates to the separation of passive components, such as the printed circuit board and other possible passive components, which are mounted on the circuit board, such as resistors, of such components, which must be applied by special methods on the support plate, for example by adhesive bonding and / or soldering ,
  • the purpose of this separation is, for example, the avoidance of contamination of individual active and passive components, such as the image pickup element.
  • the passive components are mounted on the circuit board and the image receiving element applied in a later process step on the carrier plate.
  • the passive components are mounted on the circuit board and the image receiving element applied in a later process step on the carrier plate.
  • the bonding of the optical module, in particular of a lens, according to the invention can be carried out directly on the support plate, whereby the component lens holder can be saved over known optical devices.
  • the material of the support plate can be advantageously selected according to the requirements of the bond and the expansion coefficient of the housing of the optical module.
  • the image pickup element is arranged in an opening in the carrier plate and equipped on the guide plate. The main advantage of this variant is also in accordance with the image pickup element / carrier plate / circuit board structure that the optical module can be connected directly to the carrier plate.
  • the optical device according to the invention comprises an optical module, an image pickup element, a printed circuit board and a carrier plate.
  • the optical device according to the invention further comprises an electrical contact between image pickup element and printed circuit board.
  • the support plate is preferably designed so that on one side of the
  • the circuit board is arranged.
  • the optical module preferably comprises at least one lens and is connected to the carrier plate, wherein the optical module, in particular on the side of the carrier plate on which the
  • Image pickup element is arranged over this is positioned.
  • the connection between carrier plate and optical module is preferably a
  • an advantageous image recording element / carrier plate results /
  • Print circuit board assembly image pickup element via carrier plate via printed circuit board.
  • any other possible connection technology between optical module and support bar is possible, for example, a solder joint.
  • the optical module is, for example, a lens, a
  • Lens holder and / or a connection of lens and lens holder are provided.
  • the printed circuit board for example a flex printed circuit board, preferably consists of electrically insulating material and is designed with conductive connections adhering thereto and optionally with further electrical and / or electromechanical components.
  • the image receiving element is preferably an image acquisition chip or imager chip, for example a CMOS chip or CCD chip.
  • the support plate may be configured, for example, as a metal or ceramic plate.
  • the carrier plate is made of the same material as the optical module, e.g. if the optical module is a lens, preferably of the same material as the lens housing.
  • Another advantage in the design of the support plate as a metal plate is in particular that results in a higher long-term stability of the optical device according to the invention over the known from the prior art devices.
  • optical module, Profaufiiahmeelement and / or circuit board are connected directly to the carrier plate.
  • the connection may be, for example, an adhesive connection and / or a solder connection.
  • the carrier plate comprises at least one opening.
  • the at least one breakthrough may be formed, for example, in the form of a ring or rectangle, preferably beside or around the image pickup element and / or partially below the image pickup element, in the carrier plate.
  • the electrical contact between Profaufiiahmeelement and circuit board is carried out in particular by the at least one breakthrough.
  • the contacting takes place via bonds, such as wire bonds, which are passed through the at least one breakthrough.
  • the carrier plate has two openings, which are preferably arranged on opposite sides of the image pickup element, and optionally partially below the image pickup element, in the carrier plate.
  • the contacting takes place via bonds that are passed through the two openings.
  • the carrier plate has an opening which is designed in the form of the image receiving element.
  • the breakthrough is formed with a certain excess with respect to the image pickup element.
  • an opening in the carrier plate is formed, wherein the picture element is arranged above and / or in the opening.
  • a contact between image pickup element and circuit board is preferably carried out via balls.
  • the image pickup element can be designed for this purpose, for example, as a BGA imager.
  • BGA stands in particular for Ball Grid Array.
  • a BGA imager includes spherical solder leads on the bottom of the component, i. in an image pickup element, which is designed as a BGA imager, the contacts are preferably designed as Lotballs on the back of the image pickup element.
  • Each CMOS or CCD chip can be implemented as a BGA imager.
  • the contacting between the image-receiving element and the printed circuit board can also be configured via bonds, for example in the form of wire bonds or chip bonds.
  • the optical module and / or the carrier plate and / or the circuit board are rotationally symmetrical.
  • the carrier plate is designed as a thin-walled and plate-shaped sheet metal part and can have a bent-up edge region.
  • the carrier plate is formed with at least one wave-shaped shoulder.
  • the wave-shaped shoulder is preferably formed on the side of the plate surface of the support plate on which the image pickup element is arranged.
  • the heel may be arranged, for example, circular or annular, around the image-receiving element. In this way, in particular, an internal volume around the image-receiving element is limited, in which potting compound can be arranged for sealing.
  • FIG. 1 an example of an optical device 1 as known from the prior art is shown. Between a carrier housing 12, in this case an objective holder, and an optical module 2, in this case an objective, an adhesive bead 3 is arranged.
  • the lens holder 12 is connected via a circuit board 4 with an image pickup element 6, wherein under the circuit board 4, a support plate 5 and above the circuit board 4, the image pickup element 6 is arranged.
  • the image pickup element 6 in FIG. 1 is an image chip with a contact to the printed circuit board 4, which takes place via balls 7, or an image chip in the ball grid package.
  • Ball-Grid Package means in particular a placement of the image chips, in which the connections for the assembly are compact on the bottom of the chip.
  • the terminals are small balls of solder (English balls), which preferably stand side by side in a grid of columns and rows. These beads are melted, for example, during soldering in a brazing furnace and combine with the material, such as copper, the circuit board.
  • the lens holder 12 is connected directly to the circuit board 4.
  • the illustrated in Fig. 1 Jardinaumahmeelement / Leite latte / sluggish latte structure (image pickup element 6 via PCB 4 and PCB 4 on support plate 5) has the disadvantage that influences the circuit board 4, for example, tolerances, temperature behavior and aging directly focusing the optical Affect device 1.
  • the optical module 2 has a plurality of optical elements 2.1, which are in particular lenses.
  • FIG. 2 shows another example of an optical device 1 as known from the prior art.
  • the structure of the optical device 1 corresponds to much of the description of FIG. 1, wherein the image pickup element 6 is glued in Fig. 2 directly to the circuit board 4 and wherein a contact between image pickup element 6 and circuit board 4 via bonds 8 takes place.
  • the image pickup element 6 in FIG. 2 also has a cover glass 6.1.
  • further passive components 13, for example electrical or electromechanical assemblies, may be arranged on the printed circuit board 4.
  • a resistor is arranged as a possible further passive component 13 on the printed circuit board 4.
  • FIG. 3 shows an example of an optical device 1 according to the invention.
  • an image pickup element 6 is arranged directly on a support plate 5 and connected thereto.
  • a printed circuit board 4 with optionally one or more passive ones Components 13, for example, with one or more resistors, is located below the support plate 5.
  • An optical module 2 is arranged on the support plate 5 above the image receiving element 6 and connected directly to this via an adhesive connection, in particular by means of a Kleberaupe 3, whereby, for example, manufacturing and / or mounting tolerances can be compensated.
  • FIG. 3 shows an essential advantage of the invention, which consists in that the optical module 2, in this case an objective, is connected directly to the carrier plate 5.
  • the optical module 2 in this case an objective
  • FIG. 3 shows an essential advantage of the invention, which consists in that the optical module 2, in this case an objective, is connected directly to the carrier plate 5.
  • a complicated structure with an additional component in the form of an objective holder 12 is omitted.
  • the optical module 2 has a plurality of optical elements 2.1, wherein at least one of the optical elements 2.1 is a lens.
  • Both carrier plate 5, circuit board 4, image pickup element 6, passive component 13 and optical module 2 may be fiction, according to also formed in several parts or have a different shape than shown in Fig. 3.
  • a support plate 5 is shown, which can be arranged in an optical device 1 according to the invention.
  • the carrier plate 5 two apertures 9 are configured in this case, through which a bonding by means of bonds 8 takes place between the image receiving element 6 and the printed circuit board 4.
  • the circuit board 4 which may be arranged according to the invention below the support plate 5 is not shown in Fig. 4.
  • the image recording element 6 in FIG. 4 has, in particular, an active region 6.2.
  • Both support plate 5, image pickup element 6 and openings 9 can also be designed in several parts according to the invention or have a different shape than shown in FIG. 4.
  • FIG. 5 shows a further example of an optical device 1 according to the invention.
  • the structure of the optical device 1 corresponds in many parts of
  • an aperture 9 is formed in the carrier plate 5 below the image-receiving element 6.
  • the image pickup element 6, in this case a BGA imager, is arranged in the opening 9 of the carrier plate 5 directly on the printed circuit board 4.
  • FIG. 6 shows a further example of an optical device 1 according to the invention.
  • the structure of the device 1 corresponds to a large part of the description of FIG. 3, whereas in Fig. 6, the support plate 5 in particular as a cast or diecasting and stamping, deep-drawing and / or pressing part, for example made of sheet metal, be made can.
  • the support plate 5 is designed as a thin-walled and plate-shaped sheet metal part and has a wave-shaped shoulder 10.
  • the wave-shaped shoulder 10 is formed around the image pickup element 6 around and limited an internal volume 14 is disposed in the potting compound 11.
  • the image pickup element 6, comprising a cover glass 6.1, is also connected through openings 9 in the support plate 5 through bonds 8 to the circuit board 4.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

L'invention concerne un dispositif optique (1) comportant un module optique (2), par exemple un objectif, une carte à circuit imprimé (4), un élément de prise de vue (6) et une plaque de support (5). Le module optique (2) et l'élément de prise de vue (6) sont situés sur un côté de la plaque de support (5), et la carte à circuit imprimé (4) est située sur le côté opposé de la plaque de support (5). Une ou plusieurs ouvertures (9) ménagées dans la plaque de support (5) permettent une mise en contact électrique entre l'élément de prise de vue (6) et la plaque de support (5). Dans un mode de réalisation spécial de l'invention, l'élément de prise de vue (6) est situé dans une ouverture (9) de la plaque de support (5) et directement relié à la carte à circuit imprimé (4).
EP10807317A 2010-04-01 2010-12-18 Dispositif comportant un module optique et une plaque de support Withdrawn EP2553525A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010013902 2010-04-01
PCT/DE2010/001500 WO2011120480A1 (fr) 2010-04-01 2010-12-18 Dispositif comportant un module optique et une plaque de support

Publications (1)

Publication Number Publication Date
EP2553525A1 true EP2553525A1 (fr) 2013-02-06

Family

ID=43667291

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10807317A Withdrawn EP2553525A1 (fr) 2010-04-01 2010-12-18 Dispositif comportant un module optique et une plaque de support

Country Status (7)

Country Link
US (1) US9025061B2 (fr)
EP (1) EP2553525A1 (fr)
JP (1) JP5913284B2 (fr)
KR (2) KR20130024910A (fr)
CN (1) CN103119510B (fr)
DE (1) DE112010004616A5 (fr)
WO (1) WO2011120480A1 (fr)

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CN104954634B (zh) * 2014-03-25 2019-01-29 宁波舜宇光电信息有限公司 一种摄像模组及其制造方法
EP2942938B1 (fr) * 2014-05-07 2021-01-27 Veoneer Sweden AB Module de caméra pour véhicule automobile et procédé de pré-focalisation d'objectif de lentille dans un support de lentille
CN105739244B (zh) * 2014-12-07 2018-03-02 上海微电子装备（集团）股份有限公司 光刻机投影物镜及其镜片支架的通孔设计方法
WO2016180378A2 (fr) * 2015-05-14 2016-11-17 宁波舜宇光电信息有限公司 Module de capture d'images et son procédé d'assemblage
DE102016215955A1 (de) 2016-08-25 2018-03-01 Conti Temic Microelectronic Gmbh Optische Vorrichtung zur Bilderfassung
JP2019096637A (ja) * 2017-11-17 2019-06-20 株式会社小糸製作所 レーザー光源ユニット
CN112911824A (zh) * 2019-12-04 2021-06-04 菲尼萨公司 用于光纤印刷电路板组件的表面安装技术
DE102022208782A1 (de) 2022-07-19 2024-01-25 Continental Autonomous Mobility Germany GmbH Kameramodul und Verfahren zur Herstellung eines Kameramoduls
WO2024017443A1 (fr) 2022-07-19 2024-01-25 Continental Autonomous Mobility Germany GmbH Module de caméra et procédé de production d'un module de caméra

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Also Published As

Publication number Publication date
CN103119510A (zh) 2013-05-22
DE112010004616A5 (de) 2013-01-24
US9025061B2 (en) 2015-05-05
WO2011120480A1 (fr) 2011-10-06
CN103119510B (zh) 2016-08-03
KR101984632B1 (ko) 2019-05-31
KR20130024910A (ko) 2013-03-08
JP5913284B2 (ja) 2016-04-27
US20130016273A1 (en) 2013-01-17
KR20180038056A (ko) 2018-04-13
JP2013524702A (ja) 2013-06-17

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