WO2016180378A2 - Module de capture d'images et son procédé d'assemblage - Google Patents

Module de capture d'images et son procédé d'assemblage Download PDF

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Publication number
WO2016180378A2
WO2016180378A2 PCT/CN2016/089890 CN2016089890W WO2016180378A2 WO 2016180378 A2 WO2016180378 A2 WO 2016180378A2 CN 2016089890 W CN2016089890 W CN 2016089890W WO 2016180378 A2 WO2016180378 A2 WO 2016180378A2
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WO
WIPO (PCT)
Prior art keywords
photosensitive chip
camera module
circuit board
wiring board
lens holder
Prior art date
Application number
PCT/CN2016/089890
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English (en)
Chinese (zh)
Other versions
WO2016180378A3 (fr
Inventor
方方
罗孟杰
张宝忠
赵波杰
王明珠
李建军
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201510245458.8A external-priority patent/CN106303164B/zh
Priority claimed from CN201510638267.8A external-priority patent/CN106559609B/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2016180378A2 publication Critical patent/WO2016180378A2/fr
Publication of WO2016180378A3 publication Critical patent/WO2016180378A3/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the field of optical imaging, and in particular to a camera module and an assembly method thereof.
  • the design idea of the camera module is extremely important for the imaging quality of the camera module in the later use.
  • the camera module of the prior art directly attaches the photosensitive chip to the FPC flexible printed circuit board, and is sensitive in the process of capturing images by the camera module.
  • the chip bears a large amount of heat by the photoelectric conversion work, and the heat is directly transmitted to the flexible circuit board, and the flexible circuit board is easily deformed due to the poor thermal conductivity of the flexible circuit board, and the deformation of the flexible circuit board is inevitable.
  • the inclination and position of the photosensitive chip are changed, so that the original focal length of the camera module is changed, and the output image of the camera module is blurred.
  • the heat accumulated on the flexible circuit board cannot be dissipated into the external environment of the camera module in time, and the heat will destroy the original connection relationship between the photosensitive chip and the flexible circuit board, thereby causing the imaging quality of the camera module to be degraded.
  • the reinforcing plate for preventing the change of the flexible circuit board is attached to the side of the flexible circuit board opposite to the photosensitive chip, that is, the prior art camera module attaches the reinforcing plate and the photosensitive chip respectively to the flexible Both sides of the circuit board, and between the flexible circuit board and the reinforcing board are fixed by the thermal conductive adhesive, and the thermal conductivity of the flexible circuit board and the thermal conductive adhesive are relatively poor, which causes the photosensitive chip to generate heat during the light conversion work. It cannot be effectively diverged by the reinforcing plate, thus affecting the imaging effect of the camera module.
  • the lens holder of the prior art camera module is directly attached to the flexible circuit board.
  • the relative position of the photosensitive chip and the lens disposed on the lens holder is changed, so that the relative position of the photosensitive chip changes.
  • causes problems such as blurred output images.
  • the photosensitive chip and the lens holder are attached to the flexible circuit board, the flatness of the flexible circuit board is poor, and the tilt of the photosensitive chip due to the thermal deformation of the circuit board cannot be avoided.
  • the change in position between the sensor chip and the lens is an image caused by the image quality of the camera module.
  • the camera module includes a circuit board 32P and a sensor chip 10P.
  • the packaging process of the sensor chip 10P and the circuit board 32P is COB (Clip On Board). Packaging process)
  • COB Chip On Board
  • This COB packaging process requires high input cost, multiple devices, and requires a long production cycle, resulting in low productivity and high cost of the camera module with large aperture and high pixel. And other issues. Therefore, when manufacturing the camera module having a large aperture and a high pixel, it is inevitable that the photosensitive chip 10P and the circuit board 32P are packaged by a CSP (Clip Scale Package) packaging process.
  • CSP Chip Scale Package
  • the photosensitive chip 10P and the wiring board 32P are packaged by a CSP packaging process, it is necessary to etch the pad on the wiring board 32P by etching, and the outside of the pad is covered with ink, thereby being on the pad. A weld zone is formed in the middle. Due to the deviation of the ink coverage of the circuit board 32P and the etching accuracy of the pad, the size and position of the soldering area of the wiring board 32P and the soldering area of the photosensitive chip 10P are often inconsistent, thereby When performing SMT (Surface Mount Technology) on the camera module, the amount of solder paste of each pad on the circuit board 32P has a certain difference, so that the photosensor chip 10 is mounted.
  • SMT Surface Mount Technology
  • a large inclination is generated between the photosensitive chip 10P and the circuit board 32P, and the inclination between the photosensitive chip 10P and the circuit board 32P is as high as 50 um.
  • the inclination existing between the photosensitive chip 10P and the circuit board 32P is too large (for example, the amount of tilt between the photosensitive chip 10P and the circuit board 32P exceeds the allowable lens of the camera module).
  • the amount of the imaging module is directly blurred, so that the imaging quality of the camera module is seriously affected.
  • An object of the present invention is to provide a camera module and a method for assembling the same, wherein the sensor chip of the camera module is not mounted on a circuit board, but the sensor chip is directly mounted on a carrier component.
  • the heat generated by the photosensitive chip during the photoelectric conversion operation causes the circuit board to cause a change in the inclination and position of the photosensitive chip due to deformation, thereby facilitating the improvement of the imaging mode.
  • the imaging quality of the group is possible to avoid the problem that the heat generated by the photosensitive chip during the photoelectric conversion operation causes the circuit board to cause a change in the inclination and position of the photosensitive chip due to deformation, thereby facilitating the improvement of the imaging mode.
  • the imaging quality of the group is to provide a camera module and a method for assembling the same, wherein the sensor chip of the camera module is not mounted on a circuit board, but the sensor chip is directly mounted on a carrier component.
  • An object of the present invention is to provide a camera module and a method for assembling the same, wherein the photosensitive chip is directly attached to the carrier member, so that the heat generated by the photosensitive chip during the photoelectric conversion operation can pass through
  • the carrier element is rapidly radiated to the external environment of the camera module, thereby ensuring the working stability of the camera module by reducing the internal temperature of the camera module.
  • An object of the present invention is to provide a camera module and a method for assembling the same, wherein the lens holder of the camera module is not mounted on the circuit board, but the lens holder is directly attached to the carrier member.
  • the heat generated by the photosensitive chip during the photoelectric conversion operation is prevented from causing the circuit board to be deformed to cause the photosensitive chip and the optical lens of the camera module mounted on the lens.
  • the problem of the change in the inclination is generated, thereby contributing to improving the image quality of the camera module.
  • An object of the present invention is to provide a camera module and an assembly method thereof, wherein the circuit board is provided with a package channel, the circuit board and the sensor chip are both mounted on the carrier member, and the sensor chip
  • the height of the camera module of the present invention along the direction of the light path is determined by the manner in which the photosensitive chip is mounted on the circuit board in the package channel of the circuit board.
  • the camera module is adapted to be applied to mobile electronic devices that are thin and thin, such as mobile electronic devices such as smart phones and tablet computers.
  • An object of the present invention is to provide a camera module and an assembly method thereof, wherein the photosensitive chip and an inner wall of the circuit board for forming the package passage have a first predetermined distance to prevent the line A phenomenon occurs in which the photosensitive chip is tilted and changed in position caused by the plate being touched by the photosensitive chip when heated, and the second predetermined distance between the circuit board and the inner wall of the lens holder is A situation in which the photosensitive chip and the optical lens mounted on the lens holder are changed in inclination and position due to the touch of the wiring board by the thermal deformation is prevented.
  • An object of the present invention is to provide a camera module and a method of assembling the same, wherein the sensor chip is mounted on the carrier member instead of the circuit board, thereby reducing the mounting of the sensor chip on the carrier In the component, the photosensitive chip is ensured to have a reasonable inclination, and the manufacturing cost of the camera module is reduced.
  • An object of the present invention is to provide a camera module and an assembly method thereof, wherein the flatness of the photosensitive chip is not limited by the size of the connecting member between the photosensitive chip and the wiring board and the size of the soldering region. Thereby, the flatness of the photosensitive chip after being assembled can be effectively improved.
  • An object of the present invention is to provide an image pickup module and an assembly method thereof, wherein when the photosensitive chip and the wiring board are assembled, the liquid connecting member between the photosensitive chip and the wiring board is not A force applied by the photosensitive chip and the wiring board, so that even if the amount of the connecting member at different positions of the wiring board and the photosensitive chip is different, the connecting member formed after curing is not The flatness of the photosensitive chip is affected, thereby improving the imaging quality of the camera module.
  • An object of the present invention is to provide a camera module and an assembly method thereof, in the sensor chip and the At least one positioning element may be formed between the circuit boards, each of the positioning elements for separating and respectively supporting the photosensitive chip and the circuit board, that is, there is no between the photosensitive chip and the circuit board
  • the connecting member formed by curing is supported to improve the flatness between the photosensitive chip and the wiring board.
  • An object of the present invention is to provide a camera module and an assembly method thereof, wherein the photosensitive chip is assembled to the lens holder, and the photosensitive chip is electrically connected to the circuit board through the connecting member, In a manner, the flatness of the photosensitive chip is not affected by the flatness of the circuit board.
  • An object of the present invention is to provide a camera module and an assembly method thereof.
  • the photosensitive chip, the circuit board and the carrier member are assembled in a superimposed manner, thereby not only manufacturing the camera module.
  • the flatness of the photosensitive chip and the circuit board is ensured during the process, and the heat generated by the photosensitive chip does not cause the photosensitive chip and the circuit board during the use of the camera module. The flatness is affected.
  • An object of the present invention is to provide a camera module and an assembly method thereof, wherein the carrier component can also improve the heat dissipation performance of the camera module.
  • An object of the present invention is to provide a camera module and an assembly method thereof, wherein the assembly method is particularly suitable for a manufacturing process of the camera module having a large aperture and a high pixel (more than 5 million pixels).
  • An object of the present invention is to provide a camera module and an assembly method thereof, wherein the assembly method can reduce the inclination between the photosensitive chip and the circuit board, thereby improving the product yield of the camera module and Improving the imaging quality of the camera module.
  • An object of the present invention is to provide a camera module and an assembly method thereof, wherein the assembly method can reduce the production cost of the camera module, reduce the investment of production equipment in the process of manufacturing the camera module, and Shorten the production cycle of the camera module.
  • a camera module capable of achieving the above and other objects and advantages includes:
  • the photosensitive chip is electrically connected to the wiring board, the optical lens is disposed on a photosensitive path of the photosensitive chip, wherein an optical axis of the optical lens is maintained substantially perpendicular to the photosensitive
  • the photosensitive surface of the chip to improve the imaging quality of the camera module.
  • the camera module further includes a carrier component, wherein the sensor chip and the circuit board are respectively mounted on the carrier component, and the sensor chip is electrically connected to the camera The wiring board is described, and the photosensitive chip is not in contact with the wiring board.
  • the camera module further includes a lens holder, wherein the lens holder includes an upper end portion and a lower end portion, and the optical lens is disposed at the upper end portion of the lens holder.
  • the lower end portion of the lens holder forms a lower mounting surface, and the lower mounting surface of the lower end portion of the lens is attached to the carrier member.
  • the upper end portion of the lens holder forms an upper mounting surface
  • the optical lens is attached to the upper mounting surface of the upper end portion of the lens holder.
  • the photosensitive chip and the wiring board are mounted on the same side of the carrier member.
  • the photosensitive chip and the wiring board are mounted on opposite sides of the wiring board.
  • the circuit board has a package channel, the package channel being communicated with both sides of the circuit board, wherein the photosensitive chip is held in the package channel of the circuit board, and The periphery of the photosensitive chip has a first predetermined distance from an inner wall of the circuit board for forming the package channel.
  • the carrier member has an inner mounting surface, an outer mounting surface, and at least one channel, each of the channels being respectively connected to the inner mounting surface and the outer mounting surface.
  • the photosensitive chip is mounted on the inner mounting surface of the carrier member
  • the wiring board is mounted on the outer mounting surface of the carrier member
  • the photosensitive chip and the wiring board pass Each of the channels of the carrier element are connected to each other.
  • the lower mounting surface of the lens holder is attached to the carrier member along an outer edge of the carrier member, and an inner wall of the lens holder and an outer side of the circuit board The edge has a second predetermined distance.
  • the parameter of the first preset distance is set to D1
  • the chip size tolerance parameter of the photosensitive chip is U1
  • the chip attach tolerance parameter of the photosensitive chip is U2
  • the line The circuit board attaching tolerance parameter of the board is U3, wherein the first preset distance and the chip size tolerance of the photosensitive chip, the chip attach tolerance of the photosensitive chip, and the circuit board attaching tolerance of the circuit board satisfy Function expression: D1 ⁇ U1+U2+U3.
  • the parameter of the second preset distance is set to D2, the lens holder of the lens holder has a tolerance of T1, and the lens holder of the lens holder has a tolerance parameter of T2.
  • Circuit board The board attach tolerance parameter is T3, the second preset distance is different from the mirror seat size tolerance of the lens holder, the mirror mount attachment tolerance of the mirror base, and the circuit board attachment tolerance of the circuit board satisfying a function Expression: D2 ⁇ T1 + T2 + T3.
  • the first preset distance has a value range of D1 ⁇ 0.11 mm.
  • the second preset distance has a value range of: D2 ⁇ 0.14 mm.
  • the first predetermined distance is 0.15 mm.
  • the second predetermined distance is 0.15 mm.
  • the camera module further includes at least one positioning component, wherein each of the positioning components is disposed between the photosensitive chip and the circuit board to prevent the photosensitive chip from tilting.
  • the camera module further includes a lens holder, wherein the optical lens is mounted to the lens holder, and the circuit board is mounted on the lens holder.
  • the camera module further includes a lens holder, wherein the optical lens is integrally formed with the lens holder, and the circuit board is mounted on the lens holder.
  • each of the positioning members integrally extends to the photosensitive chip
  • the wiring board is disposed on each of the positioning elements
  • each of the positioning elements and the photosensitive chip is Made of the same material.
  • each of the positioning members integrally extends to the circuit board, the photosensitive chip is disposed on each of the positioning members, and each of the positioning members and the circuit board is Made of the same material.
  • each of the positioning elements is separately formed, and the photosensitive chip and the wiring board are each disposed on each of the positioning elements.
  • the camera module further includes a carrier member, wherein the carrier member includes a heat dissipation portion and at least one heat conduction portion, and each of the heat conduction portions integrally extends from the heat dissipation portion.
  • the circuit board has at least one through hole, the circuit board is mounted on the heat dissipating portion of the carrying member, and each of the heat conducting portions of the carrying member is respectively passed through and held on the line Each of the perforations of the plate forms each of the positioning elements.
  • the wiring board has at least one positioning groove, and each of the positioning grooves of the wiring board corresponds to each of the positioning elements of the photosensitive chip to make each of the Positioning elements are respectively positioned in each of the positioning slots of the circuit board.
  • each of the positioning elements is respectively disposed at a corner of the photosensitive chip.
  • each of the positioning elements is distributed in a triangular configuration on one side of the photosensitive chip.
  • each of said positioning elements is symmetrically disposed on said photosensitive chip.
  • each of said positioning elements is disposed along an edge of said photosensitive chip.
  • the section of each of the positioning elements is selected from the group consisting of a circle, an ellipse and a polygon.
  • each of said positioning elements is selected from the group consisting of said positioning post, a positioning strip and a positioning ring.
  • the photosensitive chip and the wiring board are disposed on both sides of the positioning element.
  • the positioning member has an inner wall, the photosensitive chip is disposed on the inner wall of the positioning member, and the wiring board is disposed on one side of the positioning member.
  • the carrier element is made in one piece from a stainless steel material.
  • the camera module further includes a lens holder, wherein the optical lens is mounted on the lens holder, and the circuit board and the photosensitive chip are respectively disposed on the lens holder. To prevent the photosensitive chip from tilting.
  • the lens holder is provided with at least one positioning element, the photosensitive chip is disposed on each of the positioning elements, and the circuit board is disposed on the lens holder.
  • a part of the lens holder forms at least one positioning element
  • the photosensitive chip is disposed on each of the positioning elements
  • the wiring board is disposed on the lens holder.
  • each of said positioning elements is selected from the group consisting of said positioning post, a positioning strip and a positioning ring.
  • the circuit board includes at least one molding portion and at least one wiring portion, wherein each of the molding portions forms a molding plane, and each of the wiring portions is disposed to overlap each other The forming plane of the forming portion.
  • the circuit board includes at least two of the forming portions, each of the The molding portions are disposed adjacent to each other and are not in contact with each other, wherein surfaces of each of the molding portions are in the same plane to form the molding plane, and each of the routing portions is simultaneously disposed at a different one of the molding portions .
  • the wiring board includes one of the molding portions, wherein the molding portion is provided with at least one separation groove, and each of the separation grooves respectively corresponds to a different position of the wire portion.
  • the present invention further provides a method for assembling a camera module, wherein the assembling method comprises the following steps:
  • the photosensitive chip and the wiring board are respectively mounted on a carrier member, and the photosensitive chip and the wiring board are not in direct contact.
  • the method further comprises the steps of:
  • the lens holder is attached to the carrier member such that the optical lens is held in a photosensitive path of the photosensitive chip.
  • the method further comprises the steps of:
  • the lens holder is attached to the carrier member along an outer edge of the carrier member, and a second predetermined distance is formed between a circumference of the circuit board and an inner wall of the lens holder.
  • the method further comprises the steps of:
  • the photosensitive chip and the wiring board are electrically connected through a channel of the carrier member.
  • the parameter of the first preset distance is set to D1
  • the chip size tolerance parameter of the photosensitive chip is U1
  • the chip attach tolerance parameter of the photosensitive chip is U2
  • the line The circuit board attaching tolerance parameter of the board is U3, wherein the first preset distance and the chip size tolerance of the photosensitive chip, the chip attach tolerance of the photosensitive chip, and the circuit board attaching tolerance of the circuit board satisfy Function expression: D1 ⁇ U1+U2+U3.
  • the parameter of the second preset distance is set to D2, the lens holder of the lens holder has a tolerance of T1, and the lens holder of the lens holder has a tolerance parameter of T2.
  • the circuit board attaching tolerance parameter of the circuit board is T3, the second preset distance is different from the lens holder size tolerance of the lens holder, the lens holder attaching tolerance of the lens holder, and the circuit board sticker of the circuit board.
  • the method further comprises the steps of:
  • the method further comprises the steps of:
  • At least one positioning member is formed between the photosensitive chip and the wiring board, wherein each of the positioning members prevents tilting of the photosensitive chip electrically connected to the wiring board.
  • each of the positioning members integrally extends to the photosensitive chip, and the wiring board is disposed to each of the positioning members.
  • each of the positioning members integrally extends to the wiring board, and the photosensitive chip is disposed to each of the positioning members.
  • the method further comprises the steps of:
  • Each of the positioning elements is formed by a lens holder, and the photosensitive chip is disposed on each of the positioning elements, and the associated circuit board is disposed on the lens holder.
  • the method further comprises the steps of:
  • the cross-sectional shape of the positioning element is selected from the group consisting of a circle, an ellipse and a polygon.
  • the type of positioning element is selected from the group consisting of a positioning post, a positioning strip and a positioning ring.
  • the circuit board includes at least one molding portion and at least one wiring portion, wherein each of the molding portions forms a molding plane, and each of the wiring portions is disposed to overlap each other to make The forming plane of the profile.
  • the wiring board includes at least two of the molding portions, each of the molding portions being disposed adjacent to each other and not in contact with each other, wherein a surface of each of the molding portions is in the same plane
  • the forming plane is formed to be formed, and each of the routing portions is respectively disposed at a different one of the molding portions.
  • the wiring board includes one of the molding portions, wherein the molding portion is provided with at least one separation groove, and each of the separation grooves respectively corresponds to a different position of the wire portion.
  • the present invention further provides a wiring board for mounting a photosensitive chip, wherein the wiring board includes at least one wiring portion and at least one molding portion, wherein each of the wiring lines The portions are respectively overlapped and disposed on the molding portion, and the molding portion forms a flat mounting surface for each of the wiring portions to prevent the photosensitive chip attached to the mounting surface from being inclined.
  • the wiring board includes at least two of the molding portions, each of the molding portions being disposed adjacent to each other and not in contact with each other, wherein a surface of each of the molding portions is in the same plane To form a molding plane, each of the routing portions is simultaneously disposed at a different one of the molding portions.
  • the wiring board includes one of the molding portions, wherein the molding portion is provided with at least one separation groove, and each of the separation grooves respectively corresponds to a different position of the wire portion.
  • the shaped portion is made of a metal material.
  • the shaped portion is of a copper material.
  • FIG. 1 is a cross-sectional view showing the relationship between a photosensitive chip and a wiring board of a camera module of the prior art.
  • FIG. 2 is a perspective view of a camera module in accordance with a preferred embodiment of the present invention.
  • FIG 3 is an exploded perspective view of a camera module in accordance with the above preferred embodiment of the present invention.
  • FIG. 4 is a schematic structural view of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position of the optical lens.
  • Figure 5 is a top plan view showing the mounting of the photosensitive chip and the wiring board to the carrier member, respectively, in accordance with the above-described preferred embodiment of the present invention.
  • 6A to 6E are schematic views showing an assembly process of a camera module according to the above preferred embodiment of the present invention.
  • Figure 7 is an exploded perspective view of a modified embodiment of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 8 is a top plan view of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position of the optical lens.
  • FIG. 9 is a top plan view, taken along the intermediate position of the optical lens, according to another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 10 is a flow chart showing a method of assembling a camera module according to the above preferred embodiment of the present invention.
  • FIG. 11 is a cross-sectional view of a camera module in accordance with another preferred embodiment of the present invention.
  • Figure 12 is a front elevational view of a photosensitive chip in accordance with the above-described preferred embodiment of the present invention.
  • Figure 13 is a front elevational view of a circuit board in accordance with the above-described preferred embodiment of the present invention.
  • Figure 14 is a cross-sectional view of a wiring board in accordance with the above preferred embodiment of the present invention.
  • 15A and 15B are respectively schematic plan views of a molded portion of a wiring board according to the above preferred embodiment of the present invention.
  • Figure 16 is a cross-sectional view showing the relationship between a photosensitive chip and a wiring board in accordance with the above preferred embodiment of the present invention.
  • 17A, 17B, and 17C are front elevational views, respectively, of different embodiments of a photosensitive chip in accordance with the above-described preferred embodiment of the present invention.
  • Figure 18 is a front elevational view showing a modified embodiment of a wiring board in accordance with the above preferred embodiment of the present invention.
  • FIG. 19 is a cross-sectional view of a camera module in accordance with another preferred embodiment of the present invention.
  • Figure 20 is a cross-sectional view showing the relationship between a photosensitive chip and a wiring board in accordance with the above preferred embodiment of the present invention.
  • 21 is a cross-sectional view of a camera module in accordance with another preferred embodiment of the present invention.
  • Figure 22 is a cross-sectional view showing the relationship between a photosensitive chip and a wiring board in accordance with the above preferred embodiment of the present invention.
  • Figure 23 is a schematic view showing the manufacturing process of the image pickup module according to the above preferred embodiment of the present invention.
  • Figure 24 is a cross-sectional view showing a modified embodiment of the image pickup module according to the above preferred embodiment of the present invention.
  • Figure 25 is a cross-sectional view of a camera module in accordance with another preferred embodiment of the present invention.
  • Figure 26 is a schematic view showing a manufacturing process of a camera module in accordance with the above preferred embodiment of the present invention.
  • Figure 27 is a cross-sectional view showing a modified embodiment of the camera module according to the above preferred embodiment of the present invention. intention.
  • Figure 28 is a cross-sectional view showing a camera module in accordance with a fourth preferred embodiment of the present invention.
  • Figure 29 is a cross-sectional view showing the relationship of a photosensitive chip, a wiring board, and a substrate in accordance with the above preferred embodiment of the present invention.
  • Figure 30 is a schematic illustration of the manufacturing process of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • a camera module in accordance with a preferred embodiment of the present invention will be described, the camera module being adapted to be mounted to an electronic device for acquiring images, wherein the camera
  • the module includes a photosensitive chip 10, an optical lens 20, and a connecting device 30.
  • the optical lens 20 is disposed on a photosensitive path of the photosensitive chip 10, and the connecting device 30 is configured to connect the photosensitive chip 10 to the electronic device, for example, the camera module is mounted on a mobile electronic device.
  • the connecting device 30 is configured to connect the camera module to the mobile electronic device, so that a user can use the camera module to collect an image related to an object.
  • the light reflected by the object is received by the photosensitive chip 10 and photoelectrically converted after passing through the optical lens 20, so that the light signal related to the object is converted into an object-related electric light by the photosensitive chip 10.
  • the connecting device 30 includes a carrying member 31 and a circuit board 32.
  • the photosensitive chip 10 and the circuit board 32 are respectively mounted on the carrying member 31, which is different from the prior art camera module.
  • the photosensitive chip 10 is not mounted on the circuit board 32, but the photosensitive chip 10 is directly mounted on the carrier element 31. In this way, on the one hand, the photosensitive chip 10 can be avoided.
  • the heat generated during the photoelectric conversion operation causes the photosensitive chip 10 to be tilted due to thermal deformation of the circuit board 32, and on the other hand, the photosensitive module of the camera module can be reduced.
  • the mobile electronic device is a smart phone or a tablet computer, etc., and those skilled in the art It will be understood that the smartphone and tablet are merely illustrative of the mobile electronic device and do not constitute a limitation on the content and scope of the mobile electronic device.
  • the photosensitive chip 10 and the wiring board 32 are mounted on the same side of the carrier member 31.
  • the circuit board 32 is provided with a package channel 321 to communicate with both side portions of the circuit board 32.
  • the photosensitive chip 10 is located in the package channel 321 of the circuit board 32.
  • the height of the camera module is The reduced size is at least the thickness dimension of the circuit board 32, which in turn makes the camera module suitable for use in the mobile electronic device that seeks to be thin and light.
  • the photosensitive chip 10 and the circuit board 32 are respectively mounted on the carrier member 31, the photosensitive chip 10 and the circuit board 32 are not in direct contact, thereby avoiding The case where the circuit board 32 touches the photosensitive chip 10 when it is deformed by the influence of the heat generated when the photosensitive chip 10 is subjected to the photoelectric conversion operation, causing the photosensitive chip 10 to change in inclination and position. To ensure the imaging quality of the imaging module.
  • the photosensitive chip 10 and the wiring board 32 are respectively mounted on the carrier member 31, the photosensitive chip 10 and the wiring board 32 are formed to form the package via 321 There is a first predetermined distance D1 between the inner walls, so that the circuit board 32 is deformed only within a range allowed by the first predetermined distance D1 after being heated, so that the circuit board 32 does not deform after being deformed. Any position of the photosensitive chip 10 is touched.
  • the first preset distance D1 is also used to accommodate the dimensional tolerance of the photosensitive chip 10 and to mount the photosensitive chip 10 and the circuit board 32 on the carrier respectively.
  • the photosensitive chip 10 may have a chip size tolerance U1 when manufactured by a chip manufacturer, within a tolerance range that does not affect the imaging quality of the camera module.
  • the chip size tolerance U1 of the photosensitive chip 10 is allowed to have a tolerance range of U1 ⁇ 0.02 mm, that is, the maximum size of the chip size tolerance U1 is 0.02 mm; the photosensitive chip 10 is in the process of being limited by the mounting process and conditions.
  • the chip attaching tolerance U2 may be present in the process of being mounted on the carrier member 31, and the chip attach tolerance U2 of the photosensitive chip 10 is allowed within a tolerance range in which the imaging quality of the camera module is not imaged.
  • the tolerance range is: U2 ⁇ 0.04mm, that is, the maximum dimension of the chip attachment tolerance U2 is 0.04mm; also limited by the limitations of the attachment process and conditions, the line
  • the circuit board 32 may have a board attaching tolerance U3 in the process of being mounted on the carrying member 31, and the circuit board of the circuit board 32 may be within a tolerance range of imaging quality of the image capturing module.
  • the first predetermined distance D1 is 0.15 mm.
  • the camera module further includes a lens holder 40 for connecting the optical lens 20 and the carrier element 31 of the connecting device 30.
  • the lens holder 40 includes an upper end portion 401 and a lower end portion 402.
  • the optical lens 20 is mounted to the upper end portion of the lens holder 40. 401.
  • the lower end portion 402 of the lens holder 40 forms a lower mounting surface 4021 to be attached to the carrier member 31, so that the lens holder 40 connects the optical lens 20 and the carrier member 31.
  • the upper end portion 401 of the lens holder 40 further forms an upper mounting surface 4011 to allow the optical lens 20 to be attached to the lens holder 40.
  • the upper mounting surface 4011 of the upper end portion 401 that is, in this embodiment, the lens holder 40 actually forms a bracket for attaching the optical lens 20 and the carrier member 31
  • the manner of mounting on the mirror mount 40 is for carrying the optical lens 20 and the carrier element 31. It is worth mentioning that when the camera module of the present invention is implemented in the manner shown in FIG. 9, the optical lens 20 further includes a mirror case to be directly attached to the carrier member 31. In addition, those skilled in the art can also understand that the optical lens 20 can be a fixed focus optical lens or a moving focus optical lens, and the invention is not limited in this respect.
  • the lower mounting surface 4021 of the lower end portion 402 of the lens holder 40 is attached along the edge of the carrier member 31, as shown in FIG. 5 of the accompanying drawings, and is attached to the lens holder 40.
  • the inner wall of the lens holder 40 is not in direct contact with the outer edge of the circuit board 32, thereby preventing the circuit board 32 from being generated when the photosensitive chip 10 is subjected to photoelectric conversion work.
  • the inclination and positional change between the photosensitive chip 10 and the optical lens 20 mounted on the lens holder 40 caused by the influence of the heat upon the deformation of the inner wall of the lens holder 40 To ensure the imaging quality of the imaging module.
  • the inner wall of the lens holder 40 and the outer edge of the circuit board 32 have a second predetermined distance D2, so that The circuit board 32 is deformed only within a range allowed by the second preset distance D2 after being heated, thereby The circuit board 32 does not touch any position of the inner wall of the mirror mount 40 after being deformed.
  • the second preset distance D2 is also used to accommodate the tolerance when the lens holder 40 is mounted on the carrier element 31.
  • the lens holder 40 may have a lens holder dimensional tolerance T1 when manufactured by the lens holder manufacturer, and the tolerance range of the imaging quality of the camera module is not corresponding.
  • the tolerance of the lens holder of the lens holder 40 is allowed to be within a tolerance range of T1 ⁇ 0.05 mm, that is, the maximum dimension of the lens holder size tolerance T1 is 0.05 mm; due to the limitation of the attachment process and conditions,
  • the lens holder 40 may have a lens holder attachment tolerance T2 during the process of being attached to the carrier member 31, and the lens holder 40 is attached to the lens holder within a tolerance range that does not affect the imaging quality of the camera module.
  • Tolerance T2 is allowed to have a tolerance range of: T2 ⁇ 0.04 mm, that is, the maximum dimension of the lens mount tolerance T2 is 0.04 mm; also limited by the attachment process and conditions, the circuit board 32 is placed
  • the board attaching tolerance T3 may exist during the process of the carrying member 31, and the board attaching tolerance T3 of the circuit board 32 is allowed within a tolerance range of not imaging the imaging quality of the camera module.
  • the camera module further includes a filter element 50, the filter element 50 is mounted on the lens holder 40, and the filter element 50 is located in the photosensitive path of the photosensitive chip 10, thereby being reflected by an object.
  • the light rays are sequentially received by the photosensitive chip 10 through the optical lens 20 and the filter element 50 for photoelectric conversion.
  • the filter element 50 is implemented as an infrared cut filter element for filtering the object reflected by the object through the optical lens 20 into the interior of the camera module. The infrared portion of the light, thereby improving the imaging quality of the camera module.
  • the camera module of the present invention can directly pass the heat generated by the photosensitive chip 10 during the photoelectric conversion operation through the carrier member 31 by directly attaching the photosensitive chip 10 to the carrier member 31. Radiation to the external environment of the camera module, compared with the heat generated by the photosensitive chip used in the camera module of the prior art, through the heat dissipation method of the circuit board and the thermal conductive adhesive for connecting the circuit board and the reinforcing plate, The heat dissipation capability of the camera module of the invention is greatly improved, so that even the heat generated by the sensor chip 10 by the camera module can be timely and efficiently passed through the carrier.
  • the component 31 radiates to an external environment of the camera module to improve the camera The reliability of the module when it is used.
  • the carrier element 31 can be made of a metal material with better heat dissipation performance.
  • the material for manufacturing the carrier element 31 is phosphor bronze or stainless steel. In this way, not only the heat conduction and heat dissipation capability of the carrier element 31 can be ensured.
  • the bearing member 31 is not deformed during the assembly process or the use process of the camera module, that is, the bearing member 31 itself has a good leveling control capability, so that it is mounted on the device.
  • the inclination between the photosensitive chip 10 of the carrier member 31 and the optical lens 20 carried by the lens holder 40 of the carrier member 31 is not used during the use of the camera module It will change, which is beneficial to ensure the imaging quality of the camera module.
  • the packaging process of the camera module includes the following steps.
  • the photosensitive chip 10 is attached to the carrier member 31.
  • the photosensitive chip 10 is implemented to be mounted in the middle of the carrier member 31.
  • the circuit board 32 is mounted on the carrier member 31, and the photosensitive chip 10 is located in the package channel 321 of the circuit board 32 and the photosensitive chip 10 is electrically connected to the Circuit board 32.
  • the circuit board 32 can be first mounted on the carrier component 31, and the sensor chip 10 is subsequently Mounted on the carrier element 31.
  • the photosensitive chip 10 and the circuit board 32 are mounted on the carrier element 31, the photosensitive chip 10 and the circuit board 32 are formed to form the package channel 321 .
  • the spacing of the first predetermined distance D1 is maintained between the inner walls.
  • the photosensitive chip 10 and the wiring board 32 may be attached to the same side of the carrier member 31 using glue or other equivalent embodiments, respectively, and the photosensitive chip 10 and the line are attached.
  • the plates 32 are connected together by gold wires, so that after the photosensitive chip 10 converts an optical signal associated with the object into an electrical signal associated with the object, the electrical signal can be transmitted to the Mobile electronic devices.
  • the optical lens 20 is mounted to the upper end portion 401 of the lens holder 40.
  • the filter element 50 is attached to the lower end portion 402 of the lens holder 40.
  • the lens holder 40 is mounted on the carrier member 31 such that the optical lens 20, the filter element 50, and the photosensitive chip 10 are along the camera module 10.
  • the photosensitive path direction of the photosensitive chip 10 is arranged.
  • the lens holder 40 is attached along the outer edge of the carrier member 31, and the inner wall of the lens holder 40 is attached to the outer edge of the wiring board 32 of the carrier member 31.
  • the second preset distance D2 is maintained between.
  • 7 and 8 are a modified embodiment of the above-described preferred embodiment of the present invention, which is different from the above-described embodiment of the present invention in that the photosensitive chip 10 and the wiring board 32 are not attached. Mounted on the same side of the carrier member 31, the photosensitive chip 10 and the wiring board 32 are respectively mounted on different sides of the carrier member 31.
  • the carrier member 31 has an inner mounting surface 311, an outer mounting surface 312, and at least one channel 313, and each of the channels 313 communicates with the inner mounting surface of the carrier member 31. 311 and the outer mounting surface 312.
  • the photosensitive chip 10 and the lens holder 40 are respectively attached to the inner mounting surface 311 of the carrier member 31 such that the optical lens 20 mounted on the lens holder 40 is located in the photosensitive surface Photosensitive path of the chip 10.
  • the circuit board 32 is mounted on the outer mounting surface 312 of the carrier member 31, and the photosensitive chip 10 and the wiring board 32 pass through the channel 313 of the carrier member 31. connection.
  • the present invention also provides a method of assembling a camera module, wherein the assembling method comprises the following steps:
  • a photosensitive chip 10 and a wiring board 32 are respectively mounted on a carrier member 31, wherein the photosensitive chip 10 is electrically connected to the wiring board 32, and the photosensitive chip 10 is not connected to the wiring board 32. Direct contact;
  • An optical lens 20 is disposed on the photosensitive path of the photosensitive chip 10.
  • the step (b) further comprises the steps of:
  • step (a) further comprises the steps of:
  • step (a) further includes the steps of:
  • the method further includes the steps of: providing a filter element 50 between the photosensitive chip 10 and the optical lens 20, and the filter element 50 is located at the photosensitive chip A photosensitive path of 10 such that light reflected by the object passes through the optical lens 20 and a portion of the light having a specific property entering the inside of the camera module 10 is filtered, for example, the filter element 50 can be implemented as infrared Cut off the filter element.
  • FIG. 14 is a camera module according to another preferred embodiment of the present invention, wherein the camera module includes a circuit board 32A, a sensor chip 10A, an optical lens 20A, and other possible components. .
  • the optical lens 20A is disposed on the photosensitive path of the photosensitive chip 10A, and the photosensitive chip 10A is electrically connected to the wiring board 32A, so that the light reflected by the object passes through the optical lens 20A. Capable of being received by the photosensitive surface of the photosensitive chip 10A, and photoelectrically converting by the photosensitive chip 10A, thereby generating an electrical signal associated with the object, and subsequently, the electrical signal is transmitted through the circuit board 32A. To generate an image related to the object. It can be understood by those skilled in the art that the optical axis of the optical lens 20A is preferably perpendicular to the photosensitive surface of the photosensitive chip 10A, thereby improving the imaging quality of the camera module.
  • the camera module further includes at least one connecting component 100A, wherein the photosensitive chip 10A is connected to the circuit board 32A through the connecting component 100A.
  • the connecting member 100A may be a solder paste or other metal material capable of conducting electricity, and the metal materials such as solder paste form the connecting member 100A after curing.
  • the connecting member 100A may be characterized in that, in a relatively high temperature environment, the connecting member 100A exhibits a liquid state for bonding the photosensitive chip 10A and the wiring board 32A in a normal temperature environment or lower. In the environment, the connecting member 100A exhibits a solid state to fix the connection relationship between the photosensitive chip 10A and the wiring board 32A, and the present invention is not limited in this respect.
  • the camera module of the present invention is in the photosensitive chip 10A and when the photosensitive chip 10A and the circuit board 32A are assembled by using the connecting component 100A.
  • the liquid connecting member 100A between the wiring boards 32A is not subjected to the force applied by the photosensitive chip 10A and the wiring board 32A, so that even between the wiring board 32A and the photosensitive chip 10A.
  • the amount of the connecting element 100A at different positions is different, and the connecting element 100A formed after curing does not affect the flatness of the photosensitive chip 10A, thereby facilitating improvement of the imaging quality of the camera module.
  • the circuit board 32A is provided with at least one pad 322A
  • the photosensitive chip 10A is provided with at least one solder joint 11A
  • each of the pads of the circuit board 32A 322A corresponds to each of the solder joints 11A of the photosensitive chip 10A
  • the connecting member 100A is respectively connected to each of the pads 322A of the wiring board 32A and each of the solder joints 11A of the photosensitive chip 10A.
  • the circuit board 32A includes at least one routing portion 323A and at least one molding portion 324A, wherein each of the routing portions 323A is overlapped and disposed on the molding portion 324A, respectively.
  • the pads 322A are respectively disposed on the molding portion 324A, and each of the pads 322A is electrically connected to each of the wiring portions 323A.
  • the molding portion 324A can not only shape the wire portion 323A but also maintain the wire portion 323A in a flat state, and the molding portion 324A can also provide a heat dissipation function.
  • the molding portion 324A has a molding plane 3240A, wherein each of the routing portions 323A is disposed to be overlapped on the molding plane 3240A, respectively. Since the molding portion 324A has rigidity, it is overlappedly disposed on the molding.
  • the surface of each of the wiring portions 324A of the molding plane 3240A of the portion 324A also forms a flat surface, and the photosensitive chip 10A is attached to each of the wiring portions 324A of the wiring board 32A. When the flat surface is formed, it is advantageous to maintain the flatness of the photosensitive chip 10A so that the optical axes of the photosensitive chip 10A and the optical lens 20A are kept perpendicular.
  • the number of layers of the routing portion 323A is not limited.
  • the number of layers of the routing portion 323A may be three layers, that is,
  • the trace portion 323A includes a first trace layer 3231A, a second trace layer 3232A, and a third trace layer 3233A, wherein the first trace layer 3231A and the second trace layer 3232A And the third wiring layer 3233A is disposed on the molding plane 3240A of the molding portion 324A so as to overlap the first wiring layer 3231A by the molding plane 3240A of the molding portion 324A.
  • the second wiring layer 3232A and the third wiring layer 3233A are maintained to form a flat surface.
  • the first routing layer 3231A, the second routing layer 3232A, and the third routing of the routing portion 323A The size of the layer 3233A is uniform, and in this way, the consistency of the circuit board 32A can be ensured.
  • first wiring layer 3231A, the second wiring layer 3232A, and the third wiring layer 3233A of the routing portion 323A are respectively used for laying a line, for example, as described in the present invention.
  • the first trace layer 3231A, the second trace layer 3232A, and the third trace layer 3233A of the trace portion 323A may be respectively printed by way of printing.
  • the first wiring layer 3231A, the second wiring layer 3232A, and the third wiring layer 3233A of the routing portion 323A are routed to form a hollow. In this manner, the wiring portion 323A can disperse stress to reduce stress concentration, thereby facilitating the flatness of the camera module after being packaged by maintaining the flatness of the circuit board 32A. In order to improve the imaging quality of the camera module.
  • the number of the molding portions 324A is plural, for example, the number of the molding portions 324A may be 2, 3, 4, 5, 6 7, 8, 9, or more than 9, each of the molding portions 324A are disposed adjacent to each other, and the adjacent molding portions 324A are not in contact with each other, wherein the surface of each of the molding portions 324A is in the same plane Therefore, each of the forming portions 324A forms a flat forming surface 3240A. In this manner, when each of the routing portions 323A is overlappedly disposed on the molding plane 3240A, it is advantageous to ensure The flatness of the circuit board 32A.
  • the number of the molding portions 324A is one, and the molding portion 324A may have a separation groove 3241A at different positions.
  • the manner of the separation groove 3241A can maintain the flatness of the molded portion 324A as much as possible.
  • the molding portion 324A is employed to open the separation groove 3241A, once the molding portion 324A is forced to deform, when forming a position to be transmitted to the separation groove 3241A, The stop is such that the flatness of the other positions of the molded portion 324A is not affected.
  • the distance between adjacent molding portions 324A or the size of the separation groove 3241A of the molding portion 324A should not be too large to ensure no The flatness of the circuit board 32A is affected.
  • the material of the molding portion 324A may be selected from a metal material having a good heat dissipation capability to diffuse heat transferred from the photosensitive chip 10A to the wiring portion 323A. In this manner, the imaging module can be improved. The heat dissipation effect of the group.
  • each of the pads 322A of the wiring board 32A is electrically connected to a circuit provided in the wiring portion 323A, respectively, wherein the connecting member 100A is electrically connected to the photosensitive chip 10A.
  • Each of the pads 11A and each of the pads 322A of the circuit board 32A can electrically connect the photosensitive chip 10A to the circuit of the circuit board 32A. That is, each of the pads 322A of the wiring board 32A includes the wiring portion 323A, wherein the wiring portion 323A includes the circuit provided on the wiring board 32A, and in each of the soldering
  • the periphery of the disk 322A is covered with ink, respectively, so that a land is formed in the middle of each of the pads 322A.
  • the connecting member 100A When each of the pads 322A of the wiring board 32A is connected using the connecting member 100A, the connecting member 100A is soldered to a land of each of the pads 322A of the wiring board 32A. It will be understood by those skilled in the art that since the ink is provided on the outer portion of each of the pads 322A of the wiring board 32A, the photosensitive chip 10A and the wiring board 32A are electrically connected using the connecting member 100A. At this time, the heated connecting member 100A does not break the wiring portion 323A of the wiring board 32A.
  • each of the pads 322A of the circuit board 32A is formed by etching, so that the accuracy and size of each of the pads 322A of the circuit board 32A may vary. There is also a certain deviation in the thickness and size of the ink outside the pad 322A of the circuit board 32A, resulting in the process of electrically connecting the photosensitive chip 10A to the circuit board 32A. There is a certain difference in the amount of the connecting member 100A of each of the pads 322A of the wiring board 32A.
  • the prior art assembly of the photosensitive chip 10A on the wiring board 32A causes the liquid connecting element 100A located in the photosensitive chip 10A and the wiring board 32A to be subjected to the photosensitive chip 10A and the The force applied by the circuit board 32A causes the tilt between the photosensitive chip 10A and the circuit board 32A after the connecting component 100A is cured, so that the imaging of the camera module is seriously affected. quality.
  • the liquid connecting member 100A located between the photosensitive chip 10A and the wiring board 32A is not subjected to the The force applied by the photosensitive chip 10A and the wiring board 32A, so that the amount of tilt between the photosensitive chip 10A and the wiring board 32A is remarkably reduced after the connecting member 100A is cured, Thereby, it is advantageous to improve the imaging quality of the camera module.
  • the photosensitive chip 10A is provided with at least one positioning member 12A, and the wiring board 32A is assembled to each of the positioning members 12A of the photosensitive chip 10A, thereby preventing the photosensitive chip. 10A appears tilted.
  • each of the positioning elements 12A may extend integrally to the photosensitive chip 10A, that is, each of the positioning elements 12A and the photosensitive chip 10A may be made of the same material.
  • each of the positioning elements 12A can also be made separately from the photosensitive chip 10A, and then each can be glued or otherwise equivalent.
  • the positioning member 12A is fixed to the photosensitive chip 10A to form a photosensitive chip with a positioning member.
  • the photosensitive chip with positioning elements includes the photosensitive chip 10A and a plurality of the positioning elements 12A extending from the photosensitive chip 10A, wherein each of the positioning elements 12A allows the wiring board 32A to be mounted, In order to prevent the photosensitive chip 10A from being tilted after the wiring board 32A and the photosensitive chip 10A are assembled by the positioning member 12A.
  • each of the positioning elements 12A and each of the solder joints 11A of the photosensitive chip 10A are disposed on the same side of the photosensitive chip 10A, wherein the photosensitive chip 10A and the line are assembled through each of the positioning elements 12A.
  • the liquid connecting member 100A is used to be electrically connected to each of the pads 11A of the photoreceptor chip 10A and each of the pads of the wiring board 32A, thereby, each of the positioning elements 12A for preventing the connection member 100A in a liquid state between the photosensitive chip 10A and the wiring board 32A from being subjected to a force applied by the photosensitive chip 10A and the wiring board 32A, thereby curing the connecting member 100A Thereafter, the flatness of the photosensitive chip 10A is not affected.
  • each of the positioning members 12A forms an accommodation space 200A between the photosensitive chip 10A and the wiring board 32A, so that the connection member 100A is housed in the accommodation space 200A, as shown in the figure. 16 is
  • each of the pads 11A of the photosensitive chip 10A and each of the pads 322A of the wiring board 32A face the accommodating space 200A, respectively, for connecting each of the pads 11A of the photosensitive chip 10A and
  • the connecting member 100A of each of the pads 322A of the wiring board 32A is housed in the accommodating space 200A. That is, each of the positioning members 12A serves to separate and support the photosensitive chip 10A and the wiring board 32A, thereby being accommodated in the assembly when the photosensitive chip 10A and the wiring board 32A are assembled together.
  • the connecting member 100A which is in a liquid state in the accommodating space 200A is not subjected to the force applied by the photosensitive chip 10A and the wiring board 32A, in such a manner, even in the line
  • the amount of the connecting member 100A at different positions between the road board 32A and the photosensitive chip 10A is different, and the connecting member 100A formed after curing does not affect the wiring board 32A and the photosensitive chip 10A.
  • the flatness is beneficial to improve the imaging quality of the camera module.
  • the wiring board 32A and each of the positioning elements 12A of the photosensitive chip 10A are in contact, so that each of the pads 322A of the wiring board 32A is In the process of reflowing each of the solder joints 11A of the photosensitive chip 10A, the relative position of the wiring board 32A and the photosensitive chip 10A is determined by each of the positioning members 12A to prevent the wiring board 32A and The tilt of the photosensitive chip 10A.
  • the positioning member 12A is made of a material having good rigidity, such as but not limited to a metal material, so that when the wiring board 32A and the photosensitive chip 10A are assembled using the positioning member 12A, The positioning member 12A is not thermally deformed, thereby ensuring the flatness of the photosensitive chip 10A after assembly.
  • the number of the positioning elements 12A of the photosensitive chip 10A may be four, and each of the positioning elements 12A may be respectively disposed at a corner of the photosensitive chip 10A. At the office.
  • the number of the positioning elements 12A of the photosensitive chip 10A may be three, and each of the positioning elements 12A may be disposed in a triangular structure. The same side of the photosensitive chip 10A. It is to be noted that the shape of the positioning element 12A of the photosensitive chip 10A of the present invention is not limited.
  • the cross-sectional shape of the positioning element 12A of the photosensitive chip 10A is selected from the group consisting of a triangle, a quadrangle, and a five sides.
  • the positioning element 12A is a positioning post.
  • the number of the positioning members 12A of the photosensitive chip 10A may be two, and preferably, the positioning member 12A is a positioning bar, and Each of the positioning elements 12A is symmetrically disposed on the photosensitive chip 10A.
  • the number of the positioning elements 12A of the photosensitive chip 10A may be one.
  • the positioning element 12A is a positioning ring, and The positioning original 22 is disposed along the edge of the photosensitive chip 10A. That is, the positioning element 12A is selected from one or more of a positioning post, a positioning bar, and a positioning ring.
  • the type of positioning element 12A is selected from the group consisting of a positioning post, a positioning strip and a positioning ring.
  • FIG. 18 is a modified embodiment of the circuit board 32A of the present invention, wherein the circuit board 32A may be provided with at least one positioning slot 325A, wherein each of the positioning slots of the circuit board 32A 325A and each of the pads 322A are located on the same side of the circuit board 32A, and each of the positioning grooves 325A of the circuit board 32A corresponds to each of the positioning elements 12A of the photosensitive chip 10A, thereby When the photosensitive chip 10A and the circuit board 32A are assembled, each of the positioning elements 12A of the photosensitive chip 10A can be positioned in each of the positioning slots 325A of the circuit board 32A. In this way, When the photosensitive chip 10A and the circuit board 32A are assembled, a misalignment occurs between the photosensitive chip 10A and the circuit board 32A to improve the imaging quality of the camera module.
  • each of the positioning grooves 325A of the wiring board 32A corresponds to the size, shape and position of each of the positioning elements 12A of the photosensitive chip 10A.
  • the camera module includes a lens holder 40A.
  • the optical lens 20A can be mounted to the lens holder 40A.
  • the camera unit 40A The optical lens 20A may also be formed integrally with the mirror holder 40A.
  • the wiring board 32A is assembled to the mirror mount 40A such that the photosensitive surface of the photosensitive chip 10A faces the optical lens 20A such that the optical lens 20A corresponds to the photosensitive surface of the photosensitive chip 10A, and
  • the optical axis of the optical lens 20A is perpendicular to the photosensitive surface of the photosensitive chip 10A. That is, the mirror holder 40A functions to assemble the wiring board 32A and the optical lens 20A, thereby causing the wiring board 32A, the photosensitive chip 10A, the optical lens 20A, and the lens holder. 40A forms the camera module.
  • FIG. 19 and FIG. 20 illustrate a camera module according to another preferred embodiment of the present invention, wherein the camera module includes a circuit board 32B, a sensor chip 10B, and an optical lens 20B, wherein the optical The lens 20B is disposed on the photosensitive path of the photosensitive chip 10B, and the photosensitive chip 10B is electrically connected to the wiring board 32B.
  • the camera module further includes a lens holder 40B, wherein the optical lens 20B can be integrated with the lens holder 40B, and the optical lens 20B and the lens holder 40B can be separately formed, and then The optical lens 20B is attached to the lens holder 40B, and the wiring board 32B is attached to the lens holder 40B, and the photosensitive surface of the photosensitive chip 10B electrically connected to the wiring board 32B is oriented.
  • the optical lens 20B, and thus the light reflected by the object can be received by the photosensitive surface of the photosensitive chip 10B after passing through the optical lens 20B, and photoelectrically converted by the photosensitive chip 10B, thereby generating the object
  • the associated electrical signal is transmitted by the circuit board 32B to generate an image associated with the object.
  • the camera module further includes a connecting component 100B, wherein the photosensitive chip 10B and the circuit board 32B are electrically connected by the connecting component 100B.
  • a connecting component 100B wherein the photosensitive chip 10B and the circuit board 32B are electrically connected by the connecting component 100B.
  • the circuit board 32B is provided with at least one of the positioning elements 12B, such that each of the positioning elements 12B is respectively Extending the circuit board 32B such that when the photosensitive chip 10B and the wiring board 32B are assembled together, the photosensitive chip 10B is in contact with the positioning member 12B of the wiring board 32B, thereby
  • the accommodation space 200B is formed between the photosensitive chip 10B and the wiring board 32B as shown in FIG.
  • each of the positioning elements 12B may extend integrally to the circuit board 32B, that is, each of the positioning elements 12B and the circuit board 32B may be The same material is integrally formed; in another preferred embodiment of the invention, each of the positioning elements 12B can also be made separately from the circuit board 32B and then passed through glue or other equivalent embodiment.
  • Each of the positioning members 12B is fixed to the wiring board 32B to form a wiring board with positioning elements.
  • the wiring board with the positioning member includes the wiring board 32B and a plurality of positioning members 12B extending from the wiring board 32B, wherein each of the positioning members 12B allows the photosensitive chip 10B to be mounted to prevent After the wiring board 32B and the photosensitive chip 10B are assembled by the positioning member 12B, the photosensitive chip 10B is inclined.
  • Each of the positioning members 12B for preventing the liquid connection member 100B between the photosensitive chip 10B and the wiring board 32B from being received by the photosensitive chip when assembling the photosensitive chip 10B and the wiring board 32B 10B and the force applied by the wiring board 32B, so that the flatness of the photosensitive chip 10B is not affected when the connecting member 100B is cured. It will be understood by those skilled in the art that the number, size and shape of the positioning elements 12B provided on the circuit board 32B are not limited, and can be adjusted according to the type and needs of the camera module.
  • 21 to 23 are camera modules according to another preferred embodiment of the present invention, wherein the camera module includes a circuit board 32C, a sensor chip 10C, a positioning component 12C, and an optical lens 20C. .
  • the optical lens 20C is disposed in a photosensitive path of the photosensitive chip 10C, the positioning member 12C is used to assemble the wiring board 32C and the photosensitive chip 10C, and the positioning element 12C is used to prevent the photosensitive chip 10C tilting, thereby improving the imaging quality of the camera module. That is, in the camera module of the present invention, the circuit board 32C and the photosensitive chip 10C are respectively located on different sides of the positioning element 12C, so that the photosensitive chip 10C and the circuit board 32C A receiving space 200C is formed therebetween, wherein the camera module further includes a connecting member 100C, wherein the connecting member 100C is electrically connected to the photosensitive chip 10C and the circuit board 32C, and the connecting member 100C is accommodated In the accommodation space 200C.
  • the positioning member 12C serves to prevent the connection member 100C in a liquid state between the photosensitive chip 10C and the wiring board 32C from being subjected to a force applied by the photosensitive chip 10C and the wiring board 32C, thereby even
  • the amount of the connecting member 100C at different positions between the photosensitive chip 10C and the wiring board 32C is different, and the connecting member 100C formed after fixing does not affect the wiring board 32C and the
  • the flatness of the photosensitive chip 10C is advantageous for improving the imaging quality of the camera module.
  • the photosensitive chip 10C and the circuit board 32C are not in direct contact, but the photosensitive chip 10C and the circuit board are connected through the positioning component 12C. 32C, the photosensitive chip 10C and the wiring board 32C are electrically connected through the connecting member 100C, thereby being accommodated in the photosensitive chip 10C and the process in assembling the wiring board 32C and the photosensitive chip 10C.
  • the connecting member 100C between the wiring boards 32C is not subjected to a force applied from the photosensitive chip 10C and the wiring board 32C, so that the flatness between the photosensitive chip 10C and the wiring board 32C can be made flat. Get protected.
  • the positioning member 12C has an inner wall 121C, and the photosensitive chip 10C is assembled to the inner wall 121C of the positioning member 12C, and the circuit board 32C is assembled in the same.
  • the thickness of the camera module can be made thinner, so that the camera module can be applied to electronic devices that are thin and thin, such as mobile phones. Tablets, etc.
  • the photosensitive chip 10C can be assembled to the inner wall 121C of the positioning element 12C by glue or other equivalent embodiment.
  • the camera module further includes a lens holder 40C, wherein the optical lens 20C may be integrated with the lens holder 40C, or the optical lens 20C and the lens holder 40C may be separately formed. Then, the optical lens 20C is mounted on the lens holder 40C, and the circuit board 32C is mounted.
  • the lens holder 40C is disposed such that the photosensitive surface of the photosensitive chip 10C electrically connected to the wiring board 32C faces the optical lens 20C.
  • FIG. 23 shows an assembly process 2300 of the camera module.
  • stage 2310 a photosensitive surface and at least one solder joint 11C are respectively disposed on different sides of the photosensitive chip 10C.
  • Stage 2320 The photosensitive chip 10C is attached to the positioning element 12C by glue or other equivalent embodiment.
  • the photosensitive chip 10C can be assembled.
  • Stage 2330 the circuit board 32C and the photosensitive chip 10C are assembled by an SMT (Surface Mount Technology) process. Unlike the prior art camera module, the photosensitive chip 10C has no direct contact.
  • SMT Surface Mount Technology
  • the circuit board 32C forms the accommodating space 200C between the photosensitive chip 10C and the wiring board 32C through the positioning member 12C, thereby electrically connecting each of the solder joints of the photosensitive chip 10C.
  • the connecting member 100C of each of the pads 322 of the circuit board 32C is housed in the accommodating space 200C.
  • Stage 2340 attaching the circuit board 32C to the lens holder 40C, and causing the photosensitive surface of the photosensitive chip 10C electrically connected to the circuit board 32C to face the optical lens 20C, thereby making the imaging Module.
  • Figure 24 is a variant embodiment of the above preferred embodiment of the present invention.
  • the photosensitive chip 10C is not assembled to the inner wall 121C of the positioning member 12C. Instead, it is assembled to the end of the positioning element 12C. That is, the photosensitive chip 10C and the wiring board 32C are respectively assembled to the ends of the positioning member 12C.
  • FIG. 25 and FIG. 26 are a camera module according to another preferred embodiment of the present invention, wherein the camera module includes a circuit board 32D, a sensor chip 10D, an optical lens 20D, and a lens holder 40D. .
  • the photosensitive chip 10D is electrically connected to the circuit board 32D, and the circuit board 32D is assembled to the lens holder 40D.
  • the optical lens 20D may be integrated with the lens holder 40D, or may be The optical lens 20D is mounted on the lens holder 40D, and the optical lens 20D is positioned on the photosensitive path of the photosensitive chip 10D, that is, the lens holder 40D is used to connect the circuit board 32D, The photosensitive chip 10D and the optical lens 20D.
  • the photosensitive chip 10D is not assembled to the circuit board 32D, but the photosensitive chip 10D is assembled on the lens holder 40D.
  • a receiving space 200D is formed between the photosensitive chip 10D and the circuit board 32D, wherein the camera module further includes a connecting component 100D, wherein the connecting component 100D is electrically connected to the photosensitive chip 10D and the The wiring board 32D is disposed, and the connecting member 100D is housed in the accommodating space 200D in such a manner that when the connecting member 100D is in a liquid state and is used for electrically connecting the wiring board 32D and the photosensitive chip 10D
  • the liquid connecting member 100D is not subjected to a force applied from the wiring board 32D and the photosensitive chip 10D, so that even at different positions between the wiring board 32D and the photosensitive chip 10D
  • the amount of the connecting member 100D is different, and the connecting member 100D formed after curing does not affect the flatness of the photosensitive chip 10D, thereby facilitating improvement of the imaging quality
  • the lens holder 40D is provided with at least one positioning member 12D, and the photosensitive chip 10D can be assembled to each of the positioning members 12D.
  • each of the positioning elements 12D may extend from a direction in which the optical lens 20D of the lens holder 40D is mounted to a direction in which the circuit board 32D is mounted, and in a preferred embodiment of the present invention
  • the side portion of the photosensitive chip 10D provided with the photosensitive surface may be assembled to the end of each of the positioning elements 12D of the lens holder 40D; in another preferred embodiment of the invention, the photosensitive
  • the sidewall of the chip 10D may also be assembled to the inner wall of each of the positioning elements 12D of the mirror mount 40D.
  • FIG. 26 shows an assembly process 2600 of the camera module. Specifically, stage 2610: assembling the photosensitive chip 10D to each of the positioning elements 12D of the lens holder 40D, for example, in a preferred embodiment of the present invention, the photosensitive chip 10D can be assembled The end of each of the positioning elements 12D; in another preferred embodiment of the present invention, the photosensitive chip 10D may also be assembled to the inner wall of each of the positioning elements 12D.
  • Stage 2620 electrically connecting the photosensitive chip 10D to the wiring board 32D by an SMT (Surfae Mount Tehnology) process, and assembling the wiring board 32D on the lens holder 40D, wherein
  • the accommodating space 200D is formed between the photosensitive chip 10D and the wiring board 32D for accommodating the power supply connection between the photosensitive chip 10D and the wiring board 32D, and the wiring board 10D and the circuit board.
  • the connecting member 100D of 32D in such a manner, when the connecting member 100D is in a liquid state and used to electrically connect the wiring board 32D and the photosensitive chip 10D, the liquid connecting member 100D is not subjected to The force applied by the wiring board 32D and the photosensitive chip 10D, so that even if the amount of the connecting member 100D at different positions between the wiring board 32D and the photosensitive chip 10D is different, the formed after curing
  • the connecting element 100D does not affect the flatness of the photosensitive chip 10D, thereby facilitating the change. Good imaging quality of the camera module.
  • Stage 2630, the optical lens 20D is disposed on the photosensitive path of the photosensitive chip 10D.
  • Figure 27 is a variant embodiment of the above-described preferred embodiment of the present invention in which a portion of the lens holder 40D forms the positioning member 12D, that is, the photosensitive member.
  • the chip 10D extends to the periphery and is assembled to the inner wall of the lens holder 40D, thereby realizing assembly of the wiring board 32D and the photosensitive chip 10D by the positioning member 12D.
  • the present invention further provides a camera module, wherein the camera module includes the circuit board 32D, the sensor chip 10D, and the lens holder 40D, wherein the lens holder 40D is used to assemble the line
  • the plate 32D and the photosensitive chip 10D are used, and the lens holder 40D serves to prevent the photosensitive chip 10D from being tilted.
  • FIG. 28 to FIG. 30 show still another modified embodiment of the above preferred embodiment of the present invention, wherein the camera module includes a circuit board 32E, a sensor chip 10E, an optical lens 20E, and a carrier component. 31E.
  • One side of the carrying member 31E is provided with a first platform 314E and a second platform 315E which are parallel to each other, and the first platform 314E and the second platform 315E of the carrying member 31E are not in the same plane.
  • a height difference is formed between the first platform 314E and the second platform 315E of the carrier member 31E, so that the carrier member 31E further forms a heat dissipation portion 316E and at least one heat conduction portion 317E.
  • each of the heat transfer portions 317E of the carrier member 31E integrally extends from the heat dissipation portion 316E of the carrier member 31E.
  • the circuit board 32E is provided with at least one through hole 326E, wherein each of the through holes 326E of the circuit board 32E corresponds to each of the heat conducting portions 317E of the carrying member 31E, so that the circuit board 32E is to be
  • each of the heat conducting portions 317E of the carrier member 31E passes through and is held by each of the through holes 326E of the wiring board 32E.
  • the height difference between the first platform 314E and the second platform 315E of the carrier element 31E is greater than the thickness of the circuit board 32E, so that each of the heat conducting portions 317E of the carrier element 31E forms a positioning.
  • the photosensitive chip 10E is mounted on the positioning element 12E.
  • the photosensitive chip 10E and the wiring board 32E are not in direct contact, but the photosensitive chip 10E and the circuit board are passed through each of the positioning elements 12E.
  • a receiving space 200E is formed between the 32Es, wherein the camera module further includes a connecting component 100E, wherein the connecting component 100E is electrically connected to the photosensitive chip 10E and the circuit board 32E, And the connecting member 100E is housed in the accommodating space 200E, in such a manner that when the connecting member 100E is in a liquid state and is used for electrically connecting the wiring board 32E and the photosensitive chip 10E, the liquid state
  • the connecting member 100E is not subjected to a force applied from the wiring board 32E and the photosensitive chip 10E, so that the amount of the connecting member 100E at different positions between the wiring board 32E and the photosensitive chip 10E Differently, the connecting component 100E formed after curing does not affect the flatness of the photosensitive chip 10E, thereby facilitating improvement of the imaging quality of the camera module
  • the optical lens 20E is disposed on the photosensitive path of the photosensitive chip 10E, so that the light reflected by the object can be received by the photosensitive surface of the photosensitive chip 10E after passing through the optical lens 20E, and The photosensitive chip 10E performs photoelectric conversion to generate an electrical signal associated with the object, and subsequently, the electrical signal is further transmitted by the circuit board 32E to generate an image associated with the object.
  • the photosensitive chip 10E during operation of the camera module of the present invention, the photosensitive chip 10E generates heat which is conducted through each of the heat conducting portions 317E of the carrier member 31E.
  • the heat dissipation portion 316E is radiated to the external environment of the camera module by the heat dissipation portion 316E to reduce the temperature of the interior of the camera module. That is, in the camera module of the present invention, the carrier element 31E can not only ensure the flatness of the photosensitive chip 10E, but also assist the heat dissipation of the camera module, which is a prior art camera.
  • the module is unexpected and effective in improving the imaging quality of the camera module.
  • the carrier element 31E is made of a stainless steel material.
  • the camera module further includes a lens holder 40E, wherein the optical lens 20E may be integrated with the lens holder 40E, or the optical lens 20E and the lens holder 40E may be separately formed. Then, the optical lens 20E is mounted on the lens holder 40E, and the wiring board 32E is assembled to the lens holder 40E, and is electrically connected to the photosensitive surface of the photosensitive chip 10E of the wiring board 32E.
  • the optical lens 20E is oriented. That is, the mirror holder 40E functions to connect the wiring board 32E and the optical lens 20E.
  • FIG. 30 shows an assembly flow 3000 of the camera module.
  • the stage 3010 assembling the circuit board 32E to the heat dissipation portion 316E of the carrier member 31E, and passing and holding each of the heat conduction portions 317E of the carrier member 31E on the circuit board
  • Each of the perforations 326E of 32E wherein a height difference between the first platform 314E and the second platform 315E of the carrier element 31E is greater than a thickness of the circuit board 32E, thereby being at the carrier element 31E
  • Each of the heat conducting portions 317E passes through the After each of the through holes 326E of the wiring board 32E, each of the positioning members 12E is formed for each of the heat conducting portions 317E.
  • Stage 3020 assembling the photosensitive chip 10E on each of the positioning elements 12E formed by each of the heat conducting portions 317E of the carrier member 31E to form a space between the photosensitive chip 10E and the wiring board 32E
  • the accommodation space 200E at the same time, the photosensitive chip 10E is electrically connected to the wiring board 32E by an SMT (Surface Mount Technology) process, and is used for electrically connecting the photosensitive chip 10E and the
  • the connecting member 100E of the wiring board 32E is housed in the accommodating space 200E, in such a manner that in the process of mounting the photosensitive chip 10E and the wiring board 32E, the photosensitive chip 10E and the The connecting member 100E between the wiring boards 32E is not subjected to a force applied from the photosensitive chip 10E and the wiring board 32E, thereby facilitating improvement of the flatness between the photosensitive chip 10E and the wiring board 32E.
  • Stage 3030 assembling the circuit board 32E to the lens holder 40E, and mounting the optical lens 20E on the lens holder 40E such that the optical lens 20E is electrically connected to the circuit board 32E.
  • the photosensitive chip 10E is exposed on the photosensitive path to form the camera module.
  • the present invention also provides an assembly method of a camera module for assembling a circuit board 32E and a photosensitive chip 10E, wherein the assembling method includes the steps of: forming at least one positioning component 12E on the circuit board 32E and the photosensitive chip Between 10E, so that each of the positioning members 12E prevents the photosensitive chip 10E electrically connected to the wiring board 32E from being tilted.
  • the circuit board 32E and the photosensitive chip 10E are electrically connected by a cured connecting member 100E.
  • the liquid connecting members 100E between the wiring board 32E and the photosensitive chip 10E respectively bond the wiring board The soldering zone of 32E and each of the solder joints 11 of the photosensitive chip 10E, and after the bonding component 100E is cured, electrically connect the photosensitive chip 10E and the wiring board 32E.
  • each of the positioning members 12E for blocking the liquid connection member 100E between the wiring board 32E and the photosensitive chip 10E is applied by the wiring board 32E and the photosensitive chip 10E.
  • the cured connecting member 100E does not have the flatness of the photosensitive chip 10E. The effect is generated to improve the imaging quality of the camera module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)

Abstract

L'invention concerne un module de capture d'images et un procédé d'assemblage associé. Le module de capture d'images comprend une puce photosensible, une lentille optique et un dispositif de connexion, la lentille optique étant disposée sur un chemin photosensible de la puce photosensible, le dispositif de connexion comprenant une carte de circuit imprimé et un élément de palier. La puce photosensible et la carte de circuit imprimé sont respectivement montées sur l'élément de palier, la puce photosensible est connectée électriquement à la carte de circuit imprimé, et la puce photosensible n'est pas en contact direct avec la carte de circuit imprimé. Par conséquent, la chaleur produite par la puce photosensible lorsque commence une opération de conversion photoélectrique ne déforme pas la carte de circuit imprimé et n'amène pas la puce photosensible à s'incliner et à affecter la qualité d'image du module de capture d'images.
PCT/CN2016/089890 2015-05-14 2016-07-13 Module de capture d'images et son procédé d'assemblage WO2016180378A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201510245458.8 2015-05-14
CN201510245458.8A CN106303164B (zh) 2015-05-14 2015-05-14 防止芯片倾斜的摄像模组及其组装方法
CN201510638267.8 2015-09-29
CN201510638267.8A CN106559609B (zh) 2015-09-29 2015-09-29 摄像模组及其组装方法

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CN108881675A (zh) * 2017-05-10 2018-11-23 南昌欧菲光电技术有限公司 摄像模组
CN109491181A (zh) * 2019-01-02 2019-03-19 昆山丘钛微电子科技有限公司 相机模组及其制造方法
CN109585464A (zh) * 2017-09-28 2019-04-05 宁波舜宇光电信息有限公司 摄像模组及其感光组件和制造方法
CN110278427A (zh) * 2018-03-18 2019-09-24 宁波舜宇光电信息有限公司 深度信息摄像模组及其基座组件、电子设备和制备方法
CN110958365A (zh) * 2018-09-27 2020-04-03 宁波舜宇光电信息有限公司 多群组镜头、摄像模组以及电子设备和组装方法
CN115502539A (zh) * 2022-09-29 2022-12-23 江西盛泰精密光学有限公司 内窥镜组件组装方法
CN115811642A (zh) * 2021-09-10 2023-03-17 宁波舜宇光电信息有限公司 摄像模组

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CN108810329A (zh) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 摄像模组及其防损伤感光组件
CN108881675A (zh) * 2017-05-10 2018-11-23 南昌欧菲光电技术有限公司 摄像模组
CN109585464A (zh) * 2017-09-28 2019-04-05 宁波舜宇光电信息有限公司 摄像模组及其感光组件和制造方法
CN110278427A (zh) * 2018-03-18 2019-09-24 宁波舜宇光电信息有限公司 深度信息摄像模组及其基座组件、电子设备和制备方法
CN110278427B (zh) * 2018-03-18 2024-02-20 宁波舜宇光电信息有限公司 深度信息摄像模组及其基座组件、电子设备和制备方法
CN110958365A (zh) * 2018-09-27 2020-04-03 宁波舜宇光电信息有限公司 多群组镜头、摄像模组以及电子设备和组装方法
CN109491181A (zh) * 2019-01-02 2019-03-19 昆山丘钛微电子科技有限公司 相机模组及其制造方法
CN109491181B (zh) * 2019-01-02 2024-03-19 昆山丘钛微电子科技股份有限公司 相机模组及其制造方法
CN115811642A (zh) * 2021-09-10 2023-03-17 宁波舜宇光电信息有限公司 摄像模组
CN115502539A (zh) * 2022-09-29 2022-12-23 江西盛泰精密光学有限公司 内窥镜组件组装方法
CN115502539B (zh) * 2022-09-29 2024-05-28 江西盛泰精密光学有限公司 内窥镜组件组装方法

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