EP1665776A1 - Module optique et systeme optique - Google Patents

Module optique et systeme optique

Info

Publication number
EP1665776A1
EP1665776A1 EP04766782A EP04766782A EP1665776A1 EP 1665776 A1 EP1665776 A1 EP 1665776A1 EP 04766782 A EP04766782 A EP 04766782A EP 04766782 A EP04766782 A EP 04766782A EP 1665776 A1 EP1665776 A1 EP 1665776A1
Authority
EP
European Patent Office
Prior art keywords
support
lens
semiconductor element
optical module
lens unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04766782A
Other languages
German (de)
English (en)
Inventor
Danut Bogdan
Josef Dirmeyer
Henryk Frenzel
Harald Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1665776A1 publication Critical patent/EP1665776A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the invention relates to an optical module with a circuit carrier, a housed semiconductor element arranged on the circuit carrier and a lens unit for projecting electromagnetic radiation onto the semiconductor element, the housed semiconductor element and the lens unit being designed in two pieces.
  • the invention further relates to an optical system with an optical module designed in this way.
  • the typical lifespan for systems in the vehicle is 10 to 15 years, whereby only extremely low failure rates are tolerated, so that the components of an optical one Systems of the type mentioned at the beginning are only allowed to show very slow aging.
  • the components sensor and optics must be geometrically very precisely coordinated.
  • the tolerance range for the distance from the camera chip to the optics in the z-axis is usually in the range of a few hundredths of a millimeter in order to achieve an optimally sharp image for a certain depth of field. This is particularly problematic for so-called fixed focus systems, since these may have little tolerance during manufacture.
  • An offset from the camera chip to the optics in the x or y axis also has the consequence that the optical system may "squint", i.e. the image is cut off at one edge (horizontal or vertical) because the offset means that there are no more pixels here and had to be provided as a precaution.
  • tilt ie tilting of the camera chip around the x or y axis
  • rotation ie a rotation about the z axis from the camera chip to the optics.
  • An adjustment step may also be necessary for the xy offset or, if this does not take place, a correspondingly larger sensor can be provided which compensates for the tolerances by adding more pixels. It is also known to use software to calculate or calibrate the "rotation". Since otherwise sharp image information is available, the pixels only have to be reassigned in a type of "calibration process". However, there can be no more information at the edges or corners because they have been cut off. Finally, a purely mechanical reduction of "tilt" and "rotation" between the chip and the optics can usually only be achieved with high-precision manufacturing and
  • Cameras for specific low cost applications such as Automotive, industry, digital cameras, cell phones, toys etc., however, should be able to be produced from cost and quality assurance aspects without any adjustment processes between the optics and the camera chip, i.e. without adjusting the focus to the optical surface of the CMOS or CCD sensor. This is fundamentally contrary to the requirements mentioned.
  • One possibility to develop a focus-free system is to reduce the sum of the possible tolerances and elements, so that the module or system can be designed without adjustment. works at least in a certain distance and temperature range.
  • sharp images should be ensured at distances of, for example, 15 cm to 130 cm and at temperatures of, for example, -40 ° C. to + 105 ° C. , This is all the more realizable, the fewer elements are included in the tolerance chain.
  • With housed semiconductor elements have msb. the necessary solder and possibly adhesive connections or the like between chip and circuit carrier make up a large proportion in the tolerance chain.
  • the lens holder itself which preferably consists of plastic, can be connected to the lens arrangement in various ways, so that an exact optical alignment of the lens arrangement and the semiconductor element with respect to the lens holder or the lens arrangement can always be ensured.
  • the camera chip or the semiconductor element being mounted in a housing on a suitable circuit carrier, it is difficult to avoid the problems mentioned in their entirety and at the same time to avoid the problems mentioned To meet quality requirements.
  • the chip housing offers sufficient protection from behind, for example for the silicon which is transparent to IR radiation.
  • the lens itself needs to be adjusted to the camera chip and have a defined focus. This is currently done by means of tolerance-related fixing options, for example by screwing, gluing or the like, by means of which the lens is fixed on the circuit carrier relative to the camera chip.
  • the invention has for its object to provide an optical module and an optical system with a housed semiconductor element arranged on a circuit carrier, in which the possible tolerance chain is minimized so that reliable optical quality without adjustment and in particular focusing effort can be made available and is maintained over the life of the module or system.
  • necessary measures against external light radiation or other environmental influences from the front should be avoided as far as possible.
  • the invention is based on the generic optical module in that a support is formed at least in sections on the housing of the semiconductor element, on which a lens unit is arranged in a supported manner.
  • This can be easily achieved, especially when using injection-molded plastic housings, since in addition to the actual housing shape, in particular the edge area can be designed in almost any way, in particular as a defined reference plane, in particular in relation to the chip.
  • the tolerance range available for focusing is kept as small as possible so that this only includes manufacturing tolerances of the support and the lens unit.
  • the proposed solution has the advantage that the direct contact of the lens unit and the housed chip greatly prevents the incidence of extraneous light from the side.
  • the support is preferably in the form of an annular collar, but at least partially tilt-free, which not only advantageously maintains the distance and thus the focus area to the required extent, but also reduces tilting of the components to one another to a minimum.
  • the lens unit comprises a support lens, the lens unit being supported by the support lens.
  • a design of the support lens is selected which comprises a flat section which is designed to correspond to the support, for example plan at least in sections, and which lies on the supports formed on the housing of the semiconductor element.
  • the lens unit comprises a lens holder, wherein the lens unit is supported by the lens holder.
  • a design of the lens holder is selected which comprises a flat section which is correspondingly designed for support, for example at least sectionally planned, and which rests on the supports formed on the housing of the semiconductor element.
  • the support on the lens holder further advantageously reduces the support due to the support acting on the outside Overturning. It also allows the formation of smaller modules as modules with support via a support lens.
  • the support lens or lens holder preferably has a collar, at least in sections, which is part of the lens and is essentially designed to correspond to a contact surface formed on the support.
  • a collar at least in sections, which is part of the lens and is essentially designed to correspond to a contact surface formed on the support.
  • an abutment surface is formed at least in sections on the support.
  • the contact surface may be tapered, or in a further development may be tapered, in particular conical, when viewed from the semiconductor element in the direction of the optical axis of the module.
  • a type of self-centering can advantageously take place, which ensures exact positioning of the optics relative to the chip with respect to the x and y axes and also reduces the "tilt" to a minimum.
  • the invention also consists in an optical system with an optical module of the type mentioned above. In this way, the advantages of the optical module also come into play in the context of an overall system.
  • the invention is based on the knowledge that the formation of a support, at least in sections, directly on the housing of a housed semiconductor element, even with Usually housed semiconductor chips, in which only the component to a standard SMD is populated regardless of the optics, a camera module can be built up in which any mechanical focus adjustment can be dispensed with.
  • the module can be manufactured fully automatically, which has the advantage of reducing the manufacturing and assembly costs for large numbers of pieces.
  • the optical module can be developed without moving parts such as threads or fixing screws, which leads to higher reliability. Due to the small tolerances of the structure in the x and y axes, the chip surface does not have to be unnecessarily large, which makes the camera chip cheaper.
  • the construction of such a module can be made relatively compact, which has the advantage that the camera module can also be used in applications where space is limited.
  • the integrative structure also advantageously offers protection against extraneous light radiation.
  • the invention can be used particularly useful in the implementation of video systems, possibly in combination with radar systems, ultrasound systems or the like in the motor vehicle sector.
  • FIG. 1 shows a sectional view of an optical module according to the invention
  • FIG. 2 shows an enlarged section X of the module according to FIG. 1;
  • FIG. 3 shows a semiconductor element designed according to the invention.
  • Figures 1 to 3 show in different sections and perspectives an optical module with a circuit carrier 10; a housed semiconductor element 12 arranged on the circuit carrier 10 and a lens unit 14; 16, 18, 20; 21 for projecting electromagnetic radiation onto the semiconductor element 12.
  • the lens unit 14; separately formed for the housed semiconductor element (12); 16, 18, 20; 21 comprises a lens holder 14 and a lens arrangement 16,
  • a support 13a is formed on the housing 13 of the semiconductor element 12, at least in sections, on which the lens unit 14; 16, 18, 20; 21 is arranged trimmed.
  • the support of the lens unit 14; 16, 18, 20; 21 takes place either via the lens 16, which is preferably designed as a so-called support lens 16, or the lens holder (not shown).
  • support lens 16 or lens holder have, at least in sections, a flat section 16a which corresponds to the support 13a and is, for example, planar in the figures and rests on the support 13a formed on the housing 13 of the semiconductor element 12.
  • the support lens 16 or the lens holder has, at least in sections, a collar 16b which is essentially designed to correspond to a contact surface 13b formed on the support 13a.
  • the support 13a is therefore preferably in the form of an annular collar 13a.
  • the contact surface 13b of the annular collar 13a is preferably conical, so that not only for automated production, a type of self-centering of adjacent components, in the present case of lens 16 and support 13a, is more easily made possible.
  • the optical quality can be improved by a lens with a plurality of lenses, which is also possible within the scope of the present invention, in particular since it is possible to work with small tolerances.
  • fluctuations in the lens arrangement 16, 18, 20; 21 in the Z direction that is, in the direction in which the lenses follow one another, practically excluded.
  • the tolerances are only from the lens arrangement 16, 18, 20; 21 itself dependent.
  • the relative positions of the lenses to one another are determined by the geometry of the lenses 16, 18, 20 and, if appropriate, diaphragms 21 themselves.
  • the arrangement of the lenses can also be determined in the XY direction by the lenses themselves, namely that contact surfaces of the lenses or diaphragms are designed accordingly.
  • the lenses 16, 18, 20 or diaphragms 21 held in the lens holder 14 are therefore preferably shaped such that they assume a defined position within the lens holder 14 relative to one another.
  • at least one of the lenses 20 is designed in such a way that it interacts with the lens holder 14 and thus also assumes a defined position with respect to the semiconductor element 12. In this way, all lenses 16, 18, 20 are adjusted with respect to the semiconductor element 12.
  • the lens holder 14 is connected to the circuit carrier 10, for example via a screw connection 23.
  • the housed semiconductor element 12 is arranged on the circuit carrier 10 via lead frames 30.
  • an adhesive bond 22 or other known connection techniques can be provided.
  • the lens holder (not shown). Since the lenses determine their relative positions with one another, it is sufficient to fix exactly one lens or diaphragm with the lens holder. In this way, the entire lens arrangement is aligned with respect to the semiconductor element, as a result of which the advantageous optical quality can ultimately be ensured.
  • the exactly one lens is connected to the lens holder in a watertight and dustproof manner.
  • the foremost lens is advantageously selected as the lens which interacts with the lens holder for sealing. This can be done, for example, in such a way that the exactly one lens is connected to the lens holder by ultrasound, laser welding and / or adhesive methods. that is, optionally alternatively or cumulatively using screws and / or putty.
  • the lens arrangement is snapped into the area holding the lenses via latching means (likewise not shown). This also ensures exact positioning. It should also be emphasized that this makes it easier to separate between the lenses and the other components, in particular the expensive semiconductor element.
  • the sealing effect is provided in a particularly advantageous manner, in particular in connection with snap mounting, in that the lenses have a hard and a soft component, the soft component being arranged on the circumference of the lenses for sealing.
  • the soft component also supports the general requirement that when snapping be careful not to introduce tension into the lenses; Tensions have always had a negative impact on the optical properties.
  • the lens arrangement 16, 18, 20; 21 is held in the lens holder 14 via a holding element 15 (molded ring).
  • the holding element 15 preferably has a hard 15a and at least in sections a permanently elastic component 15b.
  • a permanently elastic component 15b which is preferably circumferentially formed, can also be used, in particular, to seal the lens arrangement 16, 18, 20; 21 serve against moisture and dirt - in addition to their own balancing function of any mechanical and / or thermal stresses that may occur.
  • the permanently elastic component 15b is preferably formed on the circumference adjacent to the lens 20.
  • the holding element 15 is arranged on the area 14 holding the lenses, for example ultrasound or laser-welded, glued, riveted, molded or by means of another similarly easily automatable connection method.
  • the hard component 15a of the retaining ring 15 preferably contains a thermoplastic material. Accordingly, a permanently elastic component 15b, which preferably contains thermoplastic elastomers (TPE) or silicone or the like, has been retained. In order to provide a uniform and easy-to-use component 15, the permanently elastic component 15b is preferably molded onto the hard component 15a or vice versa, for example by a two-component injection molding process.
  • TPE thermoplastic elastomers
  • the module can be connected to a rigid circuit board using a flexible printed circuit board or, in particular, when using a flexible circuit board as a circuit carrier (the latter are also referred to as rigid-flex systems), in particular (for example, by means of solder plugs) , In terms of angle and position, etc., this is a particularly flexible solution for connecting the circuit carrier 10 or the module to a controller or circuit board (not shown).
  • the invention allows one directly on the housing 13 package semiconductor element 12, the construction of a camera module, in which any mechanical focus adjustment can be dispensed with in principle.
  • the module can be manufactured fully automatically, which has the advantage of reducing the manufacturing and assembly costs for large quantities.
  • the optical module can be developed without moving parts such as threads or fixing screws, which leads to greater reliability.
  • the chip surface does not have to be unnecessarily large, which makes the camera chip cheaper.
  • the construction of such a module can be made relatively compact, which has the advantage that the camera module can also be used in applications where space is limited.
  • the structure offers the possibility to design a hermetically sealed module that is well protected against environmental influences such as moisture or dust.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

L'invention concerne un module optique comportant un support de circuit (10) ; un élément semi-conducteur (12) sous boîtier, disposé sur le support de circuit (10) ; et une unité lenticulaire (14 ; 16, 18, 20 ; 21) pour projeter un rayonnement électromagnétique sur l'élément semi-conducteur (12). L'unité lenticulaire (14 ; 16, 18, 20 ; 21) conçue de manière séparée par rapport à l'élément semi-conducteur (12) sous boîtier, comprend de préférence un système de lentilles comportant de préférence trois lentilles (16, 18, 20) et un diaphragme (21). Les lentilles (16, 18, 20), éventuellement conjointement avec le diaphragme (21), sont orientées de manière univoque, de par leur configuration géométrique, de sorte à ne pas impliquer d'autre alignement optique. Selon l'invention, il est prévu au moins un élément d'appui (13a) sur le boîtier (13) de l'élément semi-conducteur (12), au moins par endroits, élément d'appui sur lequel l'unité lenticulaire (14 ; 16, 18, 20 ; 21) est disposée en appui. L'invention se fonde sur le fait que la configuration d'un élément d'appui (13a) permet de monter un module de caméra directement sur le boîtier (13) d'un élément semi-conducteur (12) sous boîtier, y compris avec des puces semi-conductrices sous boîtier de type classique, module avec lequel il est possible de renoncer à toute mise au point mécanique. L'invention est adaptée notamment à des applications dans la zone extérieure ou intérieure d'automobiles.
EP04766782A 2003-09-26 2004-09-14 Module optique et systeme optique Withdrawn EP1665776A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10344760A DE10344760A1 (de) 2003-09-26 2003-09-26 Optisches Modul und optisches System
PCT/EP2004/052159 WO2005032123A1 (fr) 2003-09-26 2004-09-14 Module optique et systeme optique

Publications (1)

Publication Number Publication Date
EP1665776A1 true EP1665776A1 (fr) 2006-06-07

Family

ID=34384298

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04766782A Withdrawn EP1665776A1 (fr) 2003-09-26 2004-09-14 Module optique et systeme optique

Country Status (5)

Country Link
US (1) US7679156B2 (fr)
EP (1) EP1665776A1 (fr)
JP (1) JP4546963B2 (fr)
DE (1) DE10344760A1 (fr)
WO (1) WO2005032123A1 (fr)

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Also Published As

Publication number Publication date
DE10344760A1 (de) 2005-05-04
JP4546963B2 (ja) 2010-09-22
US7679156B2 (en) 2010-03-16
US20060202293A1 (en) 2006-09-14
JP2007507139A (ja) 2007-03-22
WO2005032123A1 (fr) 2005-04-07

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