DE10344760A1 - Optisches Modul und optisches System - Google Patents
Optisches Modul und optisches System Download PDFInfo
- Publication number
- DE10344760A1 DE10344760A1 DE10344760A DE10344760A DE10344760A1 DE 10344760 A1 DE10344760 A1 DE 10344760A1 DE 10344760 A DE10344760 A DE 10344760A DE 10344760 A DE10344760 A DE 10344760A DE 10344760 A1 DE10344760 A1 DE 10344760A1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor element
- lens unit
- optical
- dollar
- lenses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 230000003287 optical effect Effects 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 abstract 4
- 230000005670 electromagnetic radiation Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Optics & Photonics (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Die vorleigende Erfindung betrifft ein optisches Modul mit einem Schaltungsträger (10); einem auf dem Schaltungsträger (10) angeordneten gehäusten Halbleiterelement (12); und einer Linseneinheit (14; 16, 18, 20; 21) zum Projizieren von elektromagnetischer Strahlung auf das Halbleiterelement (12). Die Linseneinheit umfasst bevorzugt eine Linsenanordnung aus beispielsweise drei Linsen (16, 18, 20) und einer Blende (21). Vorzugsweise sind die Linsen (16, 18, 20) nebst ggf. Blende (21) durch ihre geometrische Gestaltung eindeutig ausgerichtet, so dass einerseits keine weitere optische Justierung erforderlich ist. DOLLAR A Erfindungsgemäß ist am Gehäuse (13) des Halbleiterelements (12) wenigstens abschnittsweise eine Abstützung (13a) ausgebildet, auf welcher die Linseneinheit (14; 16, 18, 20; 21) abgestützt angeordnet ist. DOLLAR A Der Erfindung liegt die Erkenntnis zugrunde, dass durch die Ausbildung einer Abstützung (13a) direkt am Gehäuse (13) eines gehäusten Halbleiterelements (12) auch mit klassischerweise gehäusten Halbleiterchips ein Kameramodul aufbaubar ist, bei dem auf jegliche mechanische Fokuseinstellung verzichtet werden kann. Die Erfindung eignet sich insbesondere bei Anwendungen im Innen- oder Außenbereich eines Kraftfahrzeugs.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10344760A DE10344760A1 (de) | 2003-09-26 | 2003-09-26 | Optisches Modul und optisches System |
PCT/EP2004/052159 WO2005032123A1 (de) | 2003-09-26 | 2004-09-14 | Optisches modul und optisches system |
JP2006527400A JP4546963B2 (ja) | 2003-09-26 | 2004-09-14 | 光学的なモジュール及び光学的なシステム |
US10/573,543 US7679156B2 (en) | 2003-09-26 | 2004-09-14 | Optical module and optical system |
EP04766782A EP1665776A1 (de) | 2003-09-26 | 2004-09-14 | Optisches modul und optisches system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10344760A DE10344760A1 (de) | 2003-09-26 | 2003-09-26 | Optisches Modul und optisches System |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10344760A1 true DE10344760A1 (de) | 2005-05-04 |
Family
ID=34384298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10344760A Ceased DE10344760A1 (de) | 2003-09-26 | 2003-09-26 | Optisches Modul und optisches System |
Country Status (5)
Country | Link |
---|---|
US (1) | US7679156B2 (de) |
EP (1) | EP1665776A1 (de) |
JP (1) | JP4546963B2 (de) |
DE (1) | DE10344760A1 (de) |
WO (1) | WO2005032123A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1897365B2 (de) † | 2005-06-17 | 2018-12-12 | Robert Bosch Gmbh | Kameraanordnung mit bildsensorabdichtung gegen umwelteinflüsse |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060049154A1 (en) * | 2004-09-09 | 2006-03-09 | Clifford George M Jr | System and method for bonding camera components after adjustment |
WO2006053080A2 (en) * | 2004-11-10 | 2006-05-18 | Leupold & Stevens, Inc. | Pivoting lens covers for riflescopes and the like |
US20070098400A1 (en) * | 2005-10-28 | 2007-05-03 | Hon Hai Precision Industry Co., Ltd. | Lens module and digital camera module using the same |
DE102006005519A1 (de) * | 2006-02-07 | 2007-08-09 | Siemens Ag | Optisches Erfassungssystem |
JP5324890B2 (ja) * | 2008-11-11 | 2013-10-23 | ラピスセミコンダクタ株式会社 | カメラモジュールおよびその製造方法 |
US8379333B2 (en) | 2009-02-23 | 2013-02-19 | Kyocera Corporation | Imaging module |
TWM372595U (en) * | 2009-07-31 | 2010-01-11 | Cheng Uei Prec Ind Co Ltd | Digital still camera module |
US8351219B2 (en) * | 2009-09-03 | 2013-01-08 | Visera Technologies Company Limited | Electronic assembly for an image sensing device |
KR101626132B1 (ko) * | 2009-09-28 | 2016-05-31 | 엘지이노텍 주식회사 | 일체형 카메라 모듈 |
CN102036004B (zh) * | 2009-09-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 成像模组 |
TWI425825B (zh) * | 2009-12-31 | 2014-02-01 | Kingpak Tech Inc | 免調焦距影像感測器封裝結構 |
US9369618B2 (en) * | 2011-11-29 | 2016-06-14 | Lg Innotek Co., Ltd. | Camera module having foreign object blocking structure and a method for assembling the same |
JP6655891B2 (ja) * | 2015-06-04 | 2020-03-04 | マクセル株式会社 | レンズユニットおよび車載カメラ |
FR3046879B1 (fr) * | 2016-01-20 | 2022-07-15 | Ulis | Procede de fabrication d'un detecteur de rayonnement electromagnetique a micro-encapsulation |
WO2017171388A1 (ko) | 2016-03-30 | 2017-10-05 | 엘지이노텍(주) | 카메라 모듈 및 이를 포함하는 광학 기기 |
CN109510924A (zh) * | 2017-09-15 | 2019-03-22 | 南昌欧菲光电技术有限公司 | 摄像模组及其感光组件 |
US11662541B2 (en) * | 2017-11-07 | 2023-05-30 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic modules having locking assemblies and methods for manufacturing the same |
DE102018216459A1 (de) * | 2018-09-26 | 2020-03-26 | Zf Friedrichshafen Ag | Kameramodul für ein Fahrzeug und Außenkarosserieteil mit Kameramodul |
JP7172363B2 (ja) * | 2018-09-26 | 2022-11-16 | 株式会社デンソー | カメラモジュール |
EP3816723B1 (de) | 2019-10-28 | 2023-09-20 | Ficosa Adas, S.L.U. | Kraftfahrzeugkameraanordnung |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19958229A1 (de) * | 1998-12-09 | 2000-06-15 | Fuji Electric Co Ltd | Optisches Halbleiter-Sensorbauelement |
JP2003168792A (ja) * | 2001-11-30 | 2003-06-13 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5400072A (en) * | 1988-12-23 | 1995-03-21 | Hitachi, Ltd. | Video camera unit having an airtight mounting arrangement for an image sensor chip |
JP3034995B2 (ja) * | 1991-05-31 | 2000-04-17 | シャープ株式会社 | Ccd素子取付構造 |
JP3542374B2 (ja) * | 1994-03-04 | 2004-07-14 | キヤノン株式会社 | 撮像装置 |
JPH10321827A (ja) * | 1997-05-16 | 1998-12-04 | Sony Corp | 撮像装置及びカメラ |
JPH11261861A (ja) | 1998-03-11 | 1999-09-24 | Olympus Optical Co Ltd | レンズ鏡枠用撮像ユニット |
DE19958299B4 (de) | 1999-12-03 | 2005-02-24 | Wilhelm Karmann Gmbh | Deformationselement |
US7088397B1 (en) * | 2000-11-16 | 2006-08-08 | Avago Technologies General Ip Pte. Ltd | Image sensor packaging with imaging optics |
US6683298B1 (en) * | 2000-11-20 | 2004-01-27 | Agilent Technologies Inc. | Image sensor packaging with package cavity sealed by the imaging optics |
JP3821652B2 (ja) * | 2001-02-26 | 2006-09-13 | 三菱電機株式会社 | 撮像装置 |
FR2822326B1 (fr) * | 2001-03-16 | 2003-07-04 | Atmel Grenoble Sa | Camera electronique a faible cout en technologie des circuits integres |
KR100422040B1 (ko) * | 2001-09-11 | 2004-03-11 | 삼성전기주식회사 | 촬상소자 모듈 패키지 |
JP2003298888A (ja) * | 2002-04-02 | 2003-10-17 | Konica Corp | 撮像装置の製造方法 |
JP2003319268A (ja) * | 2002-04-23 | 2003-11-07 | Citizen Electronics Co Ltd | 小型撮像モジュール |
JP2003333437A (ja) * | 2002-05-13 | 2003-11-21 | Rohm Co Ltd | イメージセンサモジュールおよびその製造方法 |
-
2003
- 2003-09-26 DE DE10344760A patent/DE10344760A1/de not_active Ceased
-
2004
- 2004-09-14 EP EP04766782A patent/EP1665776A1/de not_active Withdrawn
- 2004-09-14 US US10/573,543 patent/US7679156B2/en not_active Expired - Fee Related
- 2004-09-14 JP JP2006527400A patent/JP4546963B2/ja not_active Expired - Fee Related
- 2004-09-14 WO PCT/EP2004/052159 patent/WO2005032123A1/de active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19958229A1 (de) * | 1998-12-09 | 2000-06-15 | Fuji Electric Co Ltd | Optisches Halbleiter-Sensorbauelement |
JP2003168792A (ja) * | 2001-11-30 | 2003-06-13 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1897365B2 (de) † | 2005-06-17 | 2018-12-12 | Robert Bosch Gmbh | Kameraanordnung mit bildsensorabdichtung gegen umwelteinflüsse |
DE102005028144B4 (de) | 2005-06-17 | 2022-01-13 | Robert Bosch Gmbh | Kameraanordnung mit Bildsensorabdichtung gegen Umwelteinflüsse |
Also Published As
Publication number | Publication date |
---|---|
JP4546963B2 (ja) | 2010-09-22 |
US7679156B2 (en) | 2010-03-16 |
US20060202293A1 (en) | 2006-09-14 |
EP1665776A1 (de) | 2006-06-07 |
JP2007507139A (ja) | 2007-03-22 |
WO2005032123A1 (de) | 2005-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: CONTINENTAL AUTOMOTIVE GMBH, 30165 HANNOVER, DE |
|
8131 | Rejection |