EP1591197A4 - Procede de rectification et dispositif de rectification - Google Patents

Procede de rectification et dispositif de rectification

Info

Publication number
EP1591197A4
EP1591197A4 EP03811872A EP03811872A EP1591197A4 EP 1591197 A4 EP1591197 A4 EP 1591197A4 EP 03811872 A EP03811872 A EP 03811872A EP 03811872 A EP03811872 A EP 03811872A EP 1591197 A4 EP1591197 A4 EP 1591197A4
Authority
EP
European Patent Office
Prior art keywords
grinding
work
rotating
grinding wheel
brush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03811872A
Other languages
German (de)
English (en)
Japanese (ja)
Other versions
EP1591197A1 (fr
EP1591197B1 (fr
Inventor
Fukuo Murai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Seimitsu Industry Co Ltd
Original Assignee
Musashi Seimitsu Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Seimitsu Industry Co Ltd filed Critical Musashi Seimitsu Industry Co Ltd
Publication of EP1591197A1 publication Critical patent/EP1591197A1/fr
Publication of EP1591197A4 publication Critical patent/EP1591197A4/fr
Application granted granted Critical
Publication of EP1591197B1 publication Critical patent/EP1591197B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/10—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor

Abstract

L'invention concerne un procédé de rectification permettant de rectifier la surface périphérique d'une pièce (10) en rotation, au moyen d'une meule (22) mise en rotation par un tourillon de meule (21), qui comprend les étapes consistant à faire tourner la meule (22) sur un de ses côtés, à rectifier la pièce (10) au moyen de la meule rotative (22) et à déplacer la meule (22) et la pièce (10) l'une par rapport à l'autre suivant la direction axiale de manière à brosser la surface rectifiée de la pièce avec la brosse rotative (40) afin de polir cette surface rectifiée de la pièce (10), ceci permettant de ne nécessiter ni transfert de la pièce ni dispositifs d'ébavurage et de polissage exclusifs et contribuant à une réduction des coûts de traitement.
EP03811872A 2002-11-26 2003-09-12 Procede de rectification et dispositif de rectification Expired - Fee Related EP1591197B1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002341988 2002-11-26
JP2002341988 2002-11-26
JP2003038043 2003-02-17
JP2003038043A JP2004223696A (ja) 2002-11-26 2003-02-17 研削方法及びその装置
PCT/JP2003/011673 WO2004048033A1 (fr) 2002-11-26 2003-09-12 Procede de rectification et dispositif de rectification

Publications (3)

Publication Number Publication Date
EP1591197A1 EP1591197A1 (fr) 2005-11-02
EP1591197A4 true EP1591197A4 (fr) 2006-06-21
EP1591197B1 EP1591197B1 (fr) 2007-11-14

Family

ID=32396267

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03811872A Expired - Fee Related EP1591197B1 (fr) 2002-11-26 2003-09-12 Procede de rectification et dispositif de rectification

Country Status (6)

Country Link
US (1) US7435164B2 (fr)
EP (1) EP1591197B1 (fr)
JP (1) JP2004223696A (fr)
AU (1) AU2003262092A1 (fr)
DE (1) DE50308620D1 (fr)
WO (1) WO2004048033A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004223696A (ja) * 2002-11-26 2004-08-12 Musashi Seimitsu Ind Co Ltd 研削方法及びその装置
CN103358202A (zh) * 2013-07-26 2013-10-23 苏州信能精密机械有限公司 一种零件内孔去毛刺装置
CN105458851B (zh) * 2015-11-13 2018-08-31 宁波星箭航天机械有限公司 三通接头的去毛刺装置
CN105458850B (zh) * 2015-11-13 2019-03-01 宁波星箭航天机械有限公司 三通接头的内孔去毛刺装置
CN105598765B (zh) * 2015-11-13 2018-07-27 宁波星箭航天机械有限公司 旋入式锥形直通接头内孔去毛刺装置
CN105598767B (zh) * 2015-11-13 2018-04-10 宁波星箭航天机械有限公司 用于三通接头的内孔去毛刺装置
CN106826444A (zh) * 2017-03-24 2017-06-13 江苏汉格智能科技有限公司 一种孔内沟槽毛刺去除机构
WO2021124590A1 (fr) * 2019-12-16 2021-06-24 日本生販合同会社 Machine de traitement de surface
CN112757088B (zh) * 2021-01-15 2022-06-14 浙江祥和阀门有限公司 一种阀门加工用外表毛刺处理装置
CN114160890A (zh) * 2021-12-01 2022-03-11 北京精密机电控制设备研究所 一种精密内环槽专用去毛刺装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312055A (ja) * 1987-06-10 1988-12-20 Musashi Seimitsu Ind Co Ltd カムの研削方法
JPH10296611A (ja) * 1997-04-26 1998-11-10 Musashi Seimitsu Ind Co Ltd カムシャフトの磨き方法及びその装置
DE19913747A1 (de) * 1999-03-26 2000-10-05 Bracker Gmbh Vorrichtung zum Reinigen bzw. Säubern von langgestreckten Hohlräumen
US20020065030A1 (en) * 2000-11-24 2002-05-30 Tamio Inoue Grinding tool

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220754A (en) * 1992-03-02 1993-06-22 Amad Tayebi Recovered compact disk and a method and an apparatus for recovery thereof
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
JPH0724712A (ja) * 1993-07-15 1995-01-27 Hakko Co Ltd 既設管内面の研削工法及び装置
JPH07108306A (ja) 1993-10-13 1995-04-25 Nippon Steel Corp 金属板圧延用ロールの研削方法
JPH07276197A (ja) * 1994-04-01 1995-10-24 Matsumoto Kokan Kk 管の内面研磨方法及び研磨装置
JPH09300193A (ja) 1996-05-20 1997-11-25 Shigiya Seiki Seisakusho:Kk カム研削盤用工作物位相決め駆動装置
JPH09320999A (ja) * 1996-05-31 1997-12-12 Komatsu Electron Metals Co Ltd 半導体ウェハ貼付プレートの付着物除去装置
NZ314024A (en) * 1997-01-06 1999-03-29 Norton Co Wire brush attachment, for angle grinder or hand-held drill, with at least one aperture therethrough
US6120363A (en) * 1998-11-09 2000-09-19 Dunn; Herbert Selectable abrasive head extended reciprocating tool
JP4065185B2 (ja) * 2002-11-26 2008-03-19 武蔵精密工業株式会社 非円形回転体ワークの研削方法及びその装置
JP2004223696A (ja) * 2002-11-26 2004-08-12 Musashi Seimitsu Ind Co Ltd 研削方法及びその装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312055A (ja) * 1987-06-10 1988-12-20 Musashi Seimitsu Ind Co Ltd カムの研削方法
JPH10296611A (ja) * 1997-04-26 1998-11-10 Musashi Seimitsu Ind Co Ltd カムシャフトの磨き方法及びその装置
DE19913747A1 (de) * 1999-03-26 2000-10-05 Bracker Gmbh Vorrichtung zum Reinigen bzw. Säubern von langgestreckten Hohlräumen
US20020065030A1 (en) * 2000-11-24 2002-05-30 Tamio Inoue Grinding tool

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 153 (M - 813) 13 April 1989 (1989-04-13) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 02 26 February 1999 (1999-02-26) *
See also references of WO2004048033A1 *

Also Published As

Publication number Publication date
US7435164B2 (en) 2008-10-14
JP2004223696A (ja) 2004-08-12
EP1591197A1 (fr) 2005-11-02
EP1591197B1 (fr) 2007-11-14
AU2003262092A1 (en) 2004-06-18
DE50308620D1 (de) 2007-12-27
US20060128280A1 (en) 2006-06-15
WO2004048033A1 (fr) 2004-06-10

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