AU2001223873A1 - Grinding pin for grinding machines comprising resin bonded selections of rough grit and fine grit - Google Patents

Grinding pin for grinding machines comprising resin bonded selections of rough grit and fine grit

Info

Publication number
AU2001223873A1
AU2001223873A1 AU2001223873A AU2387301A AU2001223873A1 AU 2001223873 A1 AU2001223873 A1 AU 2001223873A1 AU 2001223873 A AU2001223873 A AU 2001223873A AU 2387301 A AU2387301 A AU 2387301A AU 2001223873 A1 AU2001223873 A1 AU 2001223873A1
Authority
AU
Australia
Prior art keywords
grinding
grit
rough
selections
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001223873A
Inventor
Mark Andrew Stocker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intermec Europe Ltd
Original Assignee
Unova UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unova UK Ltd filed Critical Unova UK Ltd
Publication of AU2001223873A1 publication Critical patent/AU2001223873A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2210/00—Machine tools incorporating a specific component
    • B23Q2210/002—Flexures

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Disintegrating Or Milling (AREA)

Abstract

A grinding pin (53) for grinding notches in the edges of disc workpieces, such as semi-conductor wafers, comprises a metal spindle (132) for mounting in a grinding machine, and an adjoining cylindrical region having axially spaced sections of fine grit (160) and rough grit (162), the latter being axially nearer the spindle (132). In use on a grinding machine having a rotatable forming wheel, similar profiled notch-grinding grooves (140) and (142) are formed by the wheel in the grinding sections (162) and (160) respectively.
AU2001223873A 2000-02-02 2001-01-10 Grinding pin for grinding machines comprising resin bonded selections of rough grit and fine grit Abandoned AU2001223873A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0002251 2000-02-02
GBGB0002251.7A GB0002251D0 (en) 2000-02-02 2000-02-02 Improvements in and relating to grinding machines
PCT/GB2001/000073 WO2001056739A1 (en) 2000-02-02 2001-01-10 Grinding pin for grinding machines comprising resin bonded selections of rough grit and fine grit

Publications (1)

Publication Number Publication Date
AU2001223873A1 true AU2001223873A1 (en) 2001-08-14

Family

ID=9884718

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001223873A Abandoned AU2001223873A1 (en) 2000-02-02 2001-01-10 Grinding pin for grinding machines comprising resin bonded selections of rough grit and fine grit

Country Status (11)

Country Link
US (1) US6739954B2 (en)
EP (1) EP1251996B1 (en)
JP (1) JP2003521816A (en)
KR (1) KR20020081291A (en)
CN (1) CN1424953A (en)
AT (1) ATE265912T1 (en)
AU (1) AU2001223873A1 (en)
DE (1) DE60103123T2 (en)
ES (1) ES2220703T3 (en)
GB (2) GB0002251D0 (en)
WO (1) WO2001056739A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004057596B4 (en) * 2004-04-22 2009-06-04 Reishauer Ag Profiling gear and method for profiling a grinding worm
US7115023B1 (en) * 2005-06-29 2006-10-03 Lam Research Corporation Process tape for cleaning or processing the edge of a semiconductor wafer
CN101104246B (en) * 2007-07-30 2012-10-10 刘小辉 Edge finishing machine
KR20090063804A (en) * 2007-12-14 2009-06-18 주식회사 실트론 Grinding wheel truing tool and manufacturing method thereof, truing apparatus, manufacturing method of grinding wheel, and wafer edge grinding apparatus using the same
GB0801366D0 (en) 2008-01-25 2008-03-05 Cinetic Landis Grinding Ltd Machine tools and methods of operation thereof
GB2476468B (en) * 2009-12-22 2012-08-15 Cinetic Landis Ltd Machine tools and methods of operation thereof
US8512098B1 (en) * 2010-09-28 2013-08-20 Jeffrey Bonner Machining technique using a plated superabrasive grinding wheel on a swiss style screw machine
CN102343539A (en) * 2011-10-29 2012-02-08 重庆川仪自动化股份有限公司 Machining method of R-ring groove of cylindrical excircle surface of sapphire
CN103128674B (en) * 2011-11-22 2015-06-24 深圳市常兴技术股份有限公司 Diamond abrasive tool in multilevel various granularity zone and processing technology thereof
CN103128624B (en) * 2011-11-22 2015-10-28 深圳市常兴技术股份有限公司 The processing technology of face glass
CN102528615B (en) * 2011-11-25 2015-02-11 深圳市创造机电有限公司 Glass fine grinding machine and grinding control method thereof
US8888565B2 (en) * 2012-11-20 2014-11-18 Welch Manufacturing Technologies, Ltd Sharpening tool, sharpening system and kit
CN103624699A (en) * 2013-12-05 2014-03-12 湖南大学 Combined grinding wheel for carrying out rough and fine centerless grinding on bar part
CN106425697A (en) * 2015-08-10 2017-02-22 蓝思科技（长沙）有限公司 Production method for 3D (three-dimensional) sapphire panel and sapphire panel
CN106956225B (en) * 2016-01-12 2019-02-19 蓝思科技股份有限公司 A kind of glass processing grinding wheel stick and CNC glass forming method
CN107414085B (en) * 2017-07-07 2019-07-16 泉州众志金刚石工具有限公司 A kind of diamond segment carcass material and fine-granularity diamond saw blade
DE102018217927A1 (en) * 2018-10-19 2020-04-23 Robert Bosch Gmbh Hydraulic unit
CN110394711A (en) * 2019-07-17 2019-11-01 西安奕斯伟硅片技术有限公司 A kind of grinding device, chamfer processing method and device and processing method
JP7298100B2 (en) * 2019-08-29 2023-06-27 株式会社ノリタケカンパニーリミテド Multi-layer whetstone for gear grinding
CN111993295A (en) * 2020-06-16 2020-11-27 上海新欣晶圆半导体科技有限公司 Grinding wheel with one coarse groove and four fine grooves and application thereof
JP7093875B2 (en) * 2021-06-24 2022-06-30 一郎 片山 Workpiece processing equipment, grindstone, and work processing method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3183632A (en) * 1962-07-09 1965-05-18 Gen Motors Corp Grinding tool
ZA713105B (en) * 1971-05-12 1972-09-27 De Beers Ind Diamond Diamond and the like grinding wheels
US4286415A (en) * 1979-03-12 1981-09-01 Ait Industries, Inc. Method of edging lenses
JPS6288579A (en) * 1985-10-15 1987-04-23 Toyoda Mach Works Ltd Grinding tool
DE8629226U1 (en) * 1986-11-03 1986-12-18 Wernicke & Co GmbH, 40231 Düsseldorf Turning tool for edge processing of spectacle lens edges
JPH081493A (en) * 1994-06-17 1996-01-09 Shin Etsu Handotai Co Ltd Mirror finished surface polishing method for wafer chamfering part and mirror finished surface polishing device
US5542876A (en) * 1994-08-19 1996-08-06 Coburn Optical Industries, Inc. V-profile grinding wheel
JP3099216B2 (en) * 1994-08-22 2000-10-16 旭栄研磨加工株式会社 Donut substrate grinding tool
JP3010572B2 (en) * 1994-09-29 2000-02-21 株式会社東京精密 Wafer edge processing equipment
JPH08243891A (en) * 1995-03-07 1996-09-24 Kao Corp Chamfer work device for substrate
AU3042097A (en) * 1996-06-15 1998-01-07 Unova U.K. Limited Improvements in and relating to grinding machines
JPH1133918A (en) * 1997-07-16 1999-02-09 Nikon Corp Grinding wheel for working inside and outside diameter of substrate for magnetic recording medium, and method for working inside and outside diameter
JPH11221742A (en) * 1997-09-30 1999-08-17 Hoya Corp Grinding method, grinding device, glass substrate for magnetic recording medium and magnetic recording medium
GB2335620B (en) * 1998-03-25 2003-03-19 Unova Uk Ltd Improvements in and relating to grinding machines

Also Published As

Publication number Publication date
KR20020081291A (en) 2002-10-26
EP1251996B1 (en) 2004-05-06
GB0100613D0 (en) 2001-02-21
EP1251996A1 (en) 2002-10-30
CN1424953A (en) 2003-06-18
DE60103123T2 (en) 2005-04-28
GB2360965B (en) 2002-08-28
DE60103123D1 (en) 2004-06-09
GB2360965A (en) 2001-10-10
GB0002251D0 (en) 2000-03-22
US20030003853A1 (en) 2003-01-02
US6739954B2 (en) 2004-05-25
WO2001056739A1 (en) 2001-08-09
ES2220703T3 (en) 2004-12-16
ATE265912T1 (en) 2004-05-15
JP2003521816A (en) 2003-07-15

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