CN110394711A - A kind of grinding device, chamfer processing method and device and processing method - Google Patents
A kind of grinding device, chamfer processing method and device and processing method Download PDFInfo
- Publication number
- CN110394711A CN110394711A CN201910646108.0A CN201910646108A CN110394711A CN 110394711 A CN110394711 A CN 110394711A CN 201910646108 A CN201910646108 A CN 201910646108A CN 110394711 A CN110394711 A CN 110394711A
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- Prior art keywords
- workpiece
- emery wheel
- processing method
- grinding
- wheel
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
The present invention provides a kind of grinding device, chamfer processing method and device and processing method, and grinding device includes at least one emery wheel, and the abradant surface of at least one emery wheel is in Cylinder Surface, and chamfer processing method and device includes grinding device；Workbench, the workbench include rotary shaft and loading stage, and the loading stage is done rotation movement under the drive of the rotary shaft；Chamfer processing method includes: to place workpiece on the table, and control workpiece is done rotation movement；Control emery wheel is contacted while rotation with the edge of the workpiece, and the emery wheel is made to do relative rotary motion with the workpiece to process to the workpiece.Grinding device, chamfer processing method and device and processing method according to an embodiment of the present invention, using Point contact machining, the silicon powder of generation is easier to exclude, and lapping liquid can carry out grinding point effectively cooling, it is ensured that the quality of silicon wafer processing reduces scrappage；The silicon wafer of the processable any edge contour shape out of motion profile by controlling emery wheel, high production efficiency.
Description
Technical field
The present invention relates to semiconductor monocrystal silicon wafer processing technique fields, fill more particularly to a kind of grinding device, chamfer machining
It sets and processing method.
Background technique
For silicon single crystal after the processing technologys such as outer diameter barreling, V-shaped groove processing and wire cutting are at silicon wafer, there are corner angle, hair in edge
Thorn, chipping, crackle, notch or other defect, edge surface is coarse, stress is concentrated, and is easy to cleavage, is crushed.Therefore, in order to increase
Marginal mechanical strength, the reduction particle contaminant for adding silicon to be sliced, need to carry out chamfer machining to silicon wafer.
But traditional chamfer machining technique first need to carry out thick chamfer machining using thicker emery wheel, then again with thin emery wheel
Smart chamfer machining, and the groove type emery wheel that traditional beveler is fixed using shape are carried out, silicon wafer part mistake is easily caused
Thermal expansion generates scuffing, chipping, fragment etc., or even silicon wafer is caused to scrap, and processing different edge shape silicon wafers makes to need frequently more
It changes, calibrate grinding wheel, high degree limits production capacity, inefficiency.
Therefore, wafer chamfering processing efficiency how is improved, while ensuring the Si wafer quality after processing, reducing silicon wafer scrappage
The problem of being current urgent need to resolve.
Summary of the invention
In view of this, the present invention provides a kind of grinding device, chamfer processing method and device and processing method, fallen for solving silicon wafer
Angle process easily causes damage even to scrap, silicon wafer the problem of processing efficiency is low.
In order to solve the above technical problems, the invention adopts the following technical scheme:
A kind of grinding device of embodiment according to a first aspect of the present invention, comprising:
At least one emery wheel, the abradant surface of at least one emery wheel are in Cylinder Surface.
Further, the emery wheel includes at least two grinding wheels of coaxial arrangement, the sand grains grain of at least two grinding wheel
It spends identical or different.
A kind of chamfer processing method and device of embodiment according to a second aspect of the present invention, comprising:
Grinding device, the grinding device are the grinding device as described in first aspect present invention embodiment；
Workbench, the workbench include rotary shaft and the loading stage for installing workpiece, the rotary shaft and the dress
Microscope carrier connection, the loading stage can be done rotation movement under the drive of the rotary shaft.
Further, the chamfer processing method and device further include:
Liquid device is ground, when grinding the workpiece using the emery wheel, the nozzle of the grinding liquid device is directed toward the mill
The contact point of wheel and the workpiece.
Further, the table top of the workbench is horizontal by 0-90 degree angle.
Further, the number of the emery wheel is two.
A kind of chamfer processing method of embodiment according to a third aspect of the present invention, comprising:
Workpiece is placed on the table, is controlled the workpiece and is done rotation movement；
Control emery wheel is contacted while rotation with the edge of the workpiece, and the emery wheel is made to do phase with the workpiece
To rotary motion to be processed to the workpiece.
Further, the control emery wheel contact with the edge of the workpiece while rotation include:
The position of the emery wheel is adjusted, so that the specified grinding wheel on the emery wheel is contacted with the edge of the workpiece.
Further, the disc of the projection straight line of the axis of the emery wheel in the horizontal plane and the workpiece is in the horizontal plane
Projection straight line formed by angle can be adjusted within the scope of 0-90 °.
Further, the method also includes:
Control the emery wheel and during the workpiece does relative rotary motion to process to the workpiece, control
Grind contact point jet grinding liquid of the liquid device to the emery wheel and the workpiece.
Further, the control emery wheel does relative rotary motion with the workpiece to process to the workpiece
Include:
Determine the motion profile of emery wheel, wherein the motion profile of the emery wheel includes that multiple, different motion profiles is corresponding
The different edge contour shapes of workpiece；
The emery wheel is controlled to be moved while rotation according to determining motion profile.
Above-mentioned technical proposal of the present invention has the beneficial effect that:
Point contact machining is carried out by using cylindrical wheel and silicon wafer, the silicon powder of generation is easier to exclude, and lapping liquid can
Grinding point is carried out effectively cooling, it is ensured that the quality of silicon wafer processing reduces scrappage；The movement of control emery wheel can be passed through simultaneously
Track processes the silicon wafer of any edge contour shape, high production efficiency.
Detailed description of the invention
Fig. 1 is beveler in the prior art using the schematic diagram of the grinding wheel workpieces processing of fixed groove；
Fig. 2 is the enlarged diagram that workpiece is processed in fixed groove in Fig. 1；
Fig. 3 is the schematic diagram of two kinds of edge contour shapes in the embodiment of the present invention after chamfering work piece processing；
Fig. 4 is the stereoscopic schematic diagram that chamfer processing method and device workpieces processing is used in the embodiment of the present invention；
Fig. 5 is the schematic diagram of the setting form of workbench and workpiece in the embodiment of the present invention；
Fig. 6 is the schematic side view that chamfer processing method and device workpieces processing is used in the embodiment of the present invention；
Fig. 7 is the schematic top plan view that chamfer processing method and device workpieces processing is used in the embodiment of the present invention.
Appended drawing reference:
Workpiece 1, arc-shaped type workpiece 2, ladder type workpiece 3；
Grinding wheel 4, concave groove 5；
Emery wheel 6, the first grinding wheel 601, the second grinding wheel 602, drive shaft 603；
Grind liquid device 7；
Workbench 8, loading stage 801, rotary shaft 802.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's every other embodiment obtained, shall fall within the protection scope of the present invention.
As shown in Figure 1, workpiece 1, after chamfer machining, edge surface is generally arc-shaped (R-type) or trapezoidal (T-
Type), i.e., processing obtains arc-shaped work 2 or trapezoidal workpiece 3.During chamfer machining, in order to improve processing dimension tolerance,
Reduce roughness and damaging layer, generally first thick chamfer machining is carried out with thicker diamond-impregnated wheel, then again with thin diamond
Chamfering grinding wheel carries out smart chamfer machining.
As shown in Figure 2,3, workpiece 1 is processed using beveler in the prior art, the sand that traditional beveler uses
The abradant surface of wheel 4 has the concave groove 5 being spaced apart, and the shape of concave groove 5 is fixed, and carries out packaging type to the edge of workpiece 1 and adds
Work, but in above-mentioned process, a part in abrasive areas be easy to be stopped by workpiece 1 and concave groove 5 and make lapping liquid without
Method can smoothly enter into, and the cooling effect that thus will lead to abrasive areas is bad, and 1 hot-spot of workpiece is caused to expand, and generates and scratches, collapses
Side, fragment etc., or even workpiece 1 is caused to scrap；Moreover, being also easy to produce a large amount of powder during the cutting process, the sand of concave groove 5 is offered
Wheel 4 is difficult that powder caused by cutting is discharged, thus equally will cause machining damage layer and scuffing；In addition, the shape of grinding wheel 4 is solid
Fixed, i.e., 5 form of concave groove opened up thereon is fixed, and workpiece (such as arc-shaped work of particular edge chamfered shape can only be processed
2) when, processing the workpiece 1 of different edge contour shapes, it need to frequently replace, calibrate grinding wheel 4, inefficiency largely limits
Production capacity, and to process the workpiece 1 of different edge contour shapes, it is also necessary to grinding wheel 4 of different shapes is bought, cost increases
Add.
As shown in figure 5, the embodiment of the present invention is in order to solve the above technical problems, provide a kind of chamfer processing method and device, including
Grinding device and workbench 8.Wherein, grinding device includes at least one emery wheel 6, and the abradant surface of emery wheel 6 is in Cylinder Surface, i.e.,
To be contacted using the abradant surface of emery wheel 6 with the edge of workpiece 1 progress point contact or line under grinding state, rather than above-mentioned tradition is fallen
The packaging type face contact that angle machine uses, the powder that thus attrition process generates are easier to be discharged.Workbench 8 includes loading stage 801
And rotary shaft 802, loading stage 801 is used to install fixed workpiece 1 and rotary shaft 802 is then connected with loading stage 801, is rotating
Under the drive of axis 802, loading stage 801 and fixed workpiece 1 be installed thereon do rotation movement, under machining state, workpiece 1 with
Emery wheel 6 does relative rotary motion, so that emery wheel 6 carries out attrition process to the edge of workpiece 1.
Further, in this embodiment emery wheel 6 it is cylindrical, at least two grinding wheels including coaxial arrangement, this implementation
It is specially two in example, i.e. the first grinding wheel 601 and the second grinding wheel 602, the grit size of the first grinding wheel 601 and the second grinding wheel 602
Difference, the first grinding wheel 601 in the present embodiment are coarseness grinding wheel, and the second grinding wheel 602 is fine granularity grinding wheel；Certainly, in reality
In, the quantity of grinding wheel can be increased or decreased, moreover, multiple grinding wheels according to the needs (such as roughing or finishing) of processing
Grit size size can be can be the same or different with unrestricted choice, under normal circumstances can be in the axial direction in gradually passing
Increase or successively decrease setting.By the way that the grinding wheel of different grit sizes is integrated into an emery wheel 6, can be chosen at random not in process
Grinding wheel with grit size carries out attrition process to workpiece 1, such as the switching of roughing and finishing in process, to save
The step of having gone frequent replacement, calibration grinding wheel, improves production and processing efficiency.First grinding wheel 601 and the second grinding wheel 602 are by driving
The connection driving of axis 603, drive shaft 603 can both drive the first grinding wheel 601 and the second grinding wheel 602 to do rotation movement, and can also drive the
One grinding wheel 601 and the second grinding wheel 602 move in space along specific motion profile, can also make the first grinding wheel 601 and the second sand
Wheel 602 does rotation movement to move in space along specific motion profile simultaneously, and drive shaft 603 can be by mechanical arm, lathe
Etc. automation equipments be attached control, it is as a result, by the motion profile of control emery wheel 6, i.e., processable to obtain any edge wheel
The workpiece of profile shape greatly improves processing such as the workpiece of arc-shaped work 2, trapezoidal workpiece 3 or other edge contour shapes
Flexibility and efficiency.
Further, the quantity of the emery wheel 6 in the embodiment of the present invention is preferably two, and two emery wheels 6 can be right respectively simultaneously
Two edges of workpiece 1 carry out, and shorten process time；Certainly, the quantity of emery wheel 6 can also continue growing, such as one of workpiece 1
It is processed on edge using two emery wheels 6, processing efficiency can also be improved.
As shown in Figure 4,5, the chamfer processing method and device in the embodiment of the present invention further includes grinding liquid device 7, grinding liquid device 7
The powder of abrasive areas generation is cooled down and taken away to abrasive areas for jet grinding liquid；Grind the nozzle of liquid device 7
It is directed toward the contact point of emery wheel 6 and workpiece 1, since emery wheel 6 is in point contact or line is contacted with workpiece 1, not will receive other structures
Hinder, therefore lapping liquid can easily be ejected into specified abrasive areas, lapping liquid to the cooling effect of workpiece 1 more preferably, and
The powder of generation is easier to be ground liquid band and walks to exclude, and ensures that the processing quality of workpiece 1, reduces abrasion, scratches very
To scrapping.
As shown in figure 5, further, the table top of the workbench 8 in the embodiment of the present invention horizontal by 0-90 degree angle,
Angle formed by the table top and horizontal plane of workbench 8 can be adjusted, to adapt to different processing conditions requirements；Special, work
Make platform 8 in vertical setting, i.e., rotary shaft 802 is in horizontal positioned, and loading stage 801 is perpendicular in horizontal plane placement, loads as a result,
Workpiece 1 on platform 801 also will be in vertical setting, and grinding liquid device 7 will be easier to be ejected into abrasive areas, emery wheel 6 and workpiece 1
Process of lapping also will be more smooth, to further increase the cooling effect and deslagging effect of abrasive areas.
The embodiment of the invention also provides a kind of chamfer processing method, this method applies above-mentioned chamfer processing method and device, including
Following steps:
Step S1: fixed workpiece 1 to be processed is installed on workbench 8 (i.e. loading stage 801), utilizes 802 band of rotary shaft
Dynamic loading stage 801 and workpiece 1 thereon are done rotation movement；
Step S2: control emery wheel 6 is contacted with the edge of workpiece 1 while rotation, emery wheel 6 is made to do phase with workpiece 1
To rotary motion to be processed to workpiece 1.
In step S2, the position that the side edge of emery wheel 6 and workpiece 1 is touched is selected according to actual processing demand, i.e., logical
The position of emery wheel 6 is overregulated, can make to specify the grinding wheel of grit size to be contacted with the edge of workpiece on emery wheel 6, such as working as needs
When carrying out roughing, the position of emery wheel 6 is adjusted, so that the first grinding wheel 601 of coarseness on emery wheel 6 is in contact with workpiece 1, with right
Workpiece 1 carries out roughing, when being finished, then adjusts the position of emery wheel 6, makes fine-grained second sand on emery wheel 6
Wheel 602 is in contact with workpiece 1, to finish to workpiece 1.In this way, the step of eliminating frequently replacement, calibration grinding wheel, mentions
High production and processing efficiency.
As shown in fig. 7, in step S2, the disc of straight line and workpiece 1 that the projection of the axis of emery wheel 6 in the horizontal plane obtains
Angle formed by the straight line that projection in the horizontal plane obtains is adjustable in 0-90 ° of range, i.e. the space bit by adjusting emery wheel 6
The position setting relationship for changing emery wheel 6 and workpiece 1 in space is set, the size of above-mentioned angle may make to send out within the scope of 0-90 °
It is raw to change, and by the way that above-mentioned corner dimension is adjusted, the effect for reducing processing mark and damage can be played.
Further, in embodiments of the present invention, during emery wheel 6 processes workpiece 1, grinding liquid device is utilized
7 to emery wheel 6 and workpiece 1 contact point jet grinding liquid, it is effectively cooling to be carried out to abrasive areas, and take away the powder that grinding generates
End can effectively reduce abrasion, scratch or even scrap.
Further, in order to process the workpiece of required edge contour shape, the fortune of emery wheel 6 should be also first determined before processing
Dynamic rail mark, the different edge contour shapes that the motion profile of emery wheel 6 has multiple, different motion profiles to correspond to workpiece 1, movement
The relative program order of track can be loaded previously into the mechanical arm of control 6 motion profile of emery wheel or the controller of lathe, true
After edge contour shape needed for determining workpiece 1, control emery wheel 6 is moved along motion profile corresponding with the edge contour,
To process required edge contour shape, in this way, the flexibility and efficiency of processing can be greatly improved.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of grinding device characterized by comprising
At least one emery wheel, the abradant surface of at least one emery wheel are in Cylinder Surface.
2. a kind of grinding device according to claim 1, which is characterized in that the emery wheel includes at least the two of coaxial arrangement
The grit size of a grinding wheel, at least two grinding wheel is identical or different.
3. a kind of chamfer processing method and device characterized by comprising
Grinding device, the grinding device are such as the described in any item grinding devices of claim 1-2；
Workbench, the workbench include rotary shaft and the loading stage for installing workpiece, the rotary shaft and the loading stage
Connection, the loading stage can be done rotation movement under the drive of the rotary shaft.
4. a kind of chamfer processing method and device according to claim 3, which is characterized in that further include:
Grind liquid device, when grinding the workpiece using the emery wheel, the nozzle of the grinding liquid device be directed toward the emery wheel with
The contact point of the workpiece.
5. a kind of chamfer processing method and device according to claim 3, which is characterized in that the table top and horizontal plane of the workbench
In 0-90 degree angle.
6. a kind of chamfer processing method, which is characterized in that chamfer machining dress of the application as described in any one of claim 3-5
It sets, which comprises
Workpiece is placed on the table, is controlled the workpiece and is done rotation movement；
Control emery wheel is contacted while rotation with the edge of the workpiece, and the emery wheel and the workpiece is made to do opposite rotation
Transhipment is dynamic to process to the workpiece.
7. a kind of chamfer processing method according to claim 6, which is characterized in that application is ground as claimed in claim 2
Mill apparatus, the control emery wheel contact with the edge of the workpiece while rotation include:
The position of the emery wheel is adjusted, so that the specified grinding wheel on the emery wheel is contacted with the edge of the workpiece.
8. a kind of chamfer processing method according to claim 6, which is characterized in that the axis of the emery wheel is in the horizontal plane
Projection straight line and the workpiece disc projection straight line in the horizontal plane formed by angle can be adjusted within the scope of 0-90 °
Section.
9. a kind of chamfer processing method according to claim 6, which is characterized in that further include:
Control the emery wheel and during the workpiece does relative rotary motion to process to the workpiece, control grinding
Contact point jet grinding liquid of the liquid device to the emery wheel and the workpiece.
10. a kind of chamfer processing method according to claim 6, which is characterized in that the control emery wheel with it is described
Workpiece does relative rotary motion to carry out processing to the workpiece
Determine the motion profile of emery wheel, wherein the motion profile of the emery wheel includes that multiple, different motion profiles corresponds to workpiece
Different edge contour shapes；
The emery wheel is controlled to be moved while rotation according to determining motion profile.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910646108.0A CN110394711A (en) | 2019-07-17 | 2019-07-17 | A kind of grinding device, chamfer processing method and device and processing method |
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| CN201910646108.0A CN110394711A (en) | 2019-07-17 | 2019-07-17 | A kind of grinding device, chamfer processing method and device and processing method |
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Cited By (7)
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|---|---|---|---|---|
| CN110802502A (en) * | 2019-11-12 | 2020-02-18 | 西安奕斯伟硅片技术有限公司 | Edge grinding equipment |
| CN112123110A (en) * | 2020-09-15 | 2020-12-25 | 慈溪市豪格机械有限公司 | Bearing inner race groove super lapping machine |
| CN112589573A (en) * | 2020-12-12 | 2021-04-02 | 卢志强 | Automatic double-side chamfering device |
| CN113043108A (en) * | 2021-03-19 | 2021-06-29 | 上海北玻自动化技术有限公司 | Vertical glass edge grinding machine |
| CN114589574A (en) * | 2022-03-17 | 2022-06-07 | 蓝思科技（长沙）有限公司 | Large-bevel-edge 2.5D cover plate machining device and machining method |
| CN114986317A (en) * | 2022-06-30 | 2022-09-02 | 西安奕斯伟材料科技有限公司 | Semiconductor edge grinding apparatus and semiconductor edge grinding method |
| CN115023316A (en) * | 2020-01-20 | 2022-09-06 | 发那科株式会社 | Polishing amount estimating device |
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| CN115023316A (en) * | 2020-01-20 | 2022-09-06 | 发那科株式会社 | Polishing amount estimating device |
| CN112123110A (en) * | 2020-09-15 | 2020-12-25 | 慈溪市豪格机械有限公司 | Bearing inner race groove super lapping machine |
| CN112123110B (en) * | 2020-09-15 | 2022-05-31 | 慈溪市豪格机械有限公司 | Bearing inner race groove super lapping machine |
| CN112589573A (en) * | 2020-12-12 | 2021-04-02 | 卢志强 | Automatic double-side chamfering device |
| CN113043108A (en) * | 2021-03-19 | 2021-06-29 | 上海北玻自动化技术有限公司 | Vertical glass edge grinding machine |
| CN114589574A (en) * | 2022-03-17 | 2022-06-07 | 蓝思科技（长沙）有限公司 | Large-bevel-edge 2.5D cover plate machining device and machining method |
| CN114986317A (en) * | 2022-06-30 | 2022-09-02 | 西安奕斯伟材料科技有限公司 | Semiconductor edge grinding apparatus and semiconductor edge grinding method |
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