JP2011235408A - Silicon ingot chamfering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a silicon ingot chamfering device in which a chamfered width of a corner part of a silicon ingot can be more efficiently made constant than an ordinary silicon ingot chamfering device.SOLUTION: When a pair of guide roller devices 18 and 20 are moved in a longitudinal direction of the silicon ingot 22 along a pair of side surfaces 22a and 22b of the pair of guide roller devices 18 and 20 under a state where the pair of guide roller devices 18 and 20 are respectively allowed to abut on the pair of side surfaces 22a and 22b, a position of a lower surface 12a of a grinding sheet 12 and a position of an tip end of the corner part 22c are positioned in a cross section of the corner part 22c of the silicon ingot 22, and the grinding sheet 12 grinds the corner part 22c at a substantially fixed grinding height H by the lower surface 12a of the grinding sheet 12 and is guided in the longitudinal direction of the silicon ingot 22. Accordingly, the corner part 22c of the silicon ingot 22 is ground by the grinding height H and the chamfered width M of the corner part 22c formed by grinding is more efficiently made constant than the ordinary silicon ingot chamfering device.

Description

  The present invention relates to the manufacture of a silicon wafer used for a substrate of a battery cell of a solar battery panel, and in particular, the chamfering accuracy is improved by chamfering the silicon ingot which is performed when a silicon wafer is formed from a square columnar silicon ingot. The present invention relates to a silicon ingot chamfering device.

  A silicon wafer used as a substrate of a battery cell of a solar battery panel is manufactured by cutting a silicon ingot manufactured in a quadrangular prism shape into a thin plate shape using, for example, a wire saw. In this way, when a silicon ingot manufactured in the shape of a quadrangular prism is cut into a thin plate shape from the state as it is, the corner portion of the silicon ingot is chipped during the cutting, so conventionally silicon has been used to prevent the corner portion of the silicon ingot from being chipped. A silicon ingot chamfering device is used so that the corners of the silicon ingot are chamfered before the ingot is cut into a thin plate shape. For example, it is a silicon ingot chamfering apparatus as shown in Patent Document 1.

  Such a silicon ingot chamfering device includes a disc-shaped cutting tool that rotates around a predetermined rotation axis at a corner of a silicon ingot manufactured in a quadrangular prism shape, and a holding device that mechanically holds the silicon ingot. By automatically moving the disc-shaped cutting tool along a straight line to the other end in the longitudinal direction of the silicon ingot in a state where the disc cutting tool is in contact with the corner of the silicon ingot at one end of the longitudinal silicon ingot, Grinding is performed to chamfer the corners of the ingot.

JP 2009-233794 A

  However, the square columnar silicon ingot may be manufactured with warping or bending due to the residual strain. Therefore, when chamfering is performed on the corner of a silicon ingot having warpage or bending by the silicon ingot chamfering device as described above, when the grinding tool is moved along a straight line in the longitudinal direction of the silicon ingot, There has been a problem in that chamfering to be ground at the corners of the silicon ingot is uneven, or excessively chamfered in some cases, or a portion that is not chamfered is formed.

  In addition, when variation occurs in the width of the ground surface ground at the corner of the silicon ingot, the silicon ingot is then cut into a plurality of thin sheets to form a plurality of silicon wafers. Therefore, the laborious work of correcting the chamfering of the silicon ingot manually by using a grindstone is required.

  The present invention has been made against the background of the above circumstances, and the object of the present invention is to make the chamfering width of the corner portion of the silicon ingot more efficient and constant than the conventional silicon ingot chamfering device. The object is to provide a silicon ingot chamfering apparatus.

  To achieve this object, the gist of the invention according to claim 1 is that: (a) a lower surface of a disc-shaped grinding tool that rotates around a predetermined rotation axis at a corner of a silicon ingot manufactured in a quadrangular prism shape; A silicon ingot chamfering device for chamfering the corners of the silicon ingot by bringing the tool into contact with the tool, and (b) a tool equipped with a tool driving device for driving the grinding tool around the rotation axis A frame having a support portion and a pair of legs protruding from opposite ends of the tool support portion to the opposite side of the tool driving device; and (c) a predetermined corner portion of the silicon ingot that is symmetrical with respect to the rotation axis. A pair of guide roller devices provided on the leg portions of the frame so as to contact a pair of side surfaces adjacent to each other, and (d) the pair of guide roller devices includes a pair of the silicon ingots. The grinding tool is guided in the longitudinal direction of the silicon ingot along the side surface.

  The gist of the invention according to claim 2 is that, in the invention according to claim 1, the pair of guide roller devices are arranged on the front side in the traveling direction of the grinding tool in the longitudinal direction of the silicon ingot. A pair of front wheel guide rollers, a pair of rear wheel guide rollers disposed on the rear side in the advancing direction of the grinding tool with respect to the pair of front wheel guide rollers, the pair of front wheel guide rollers and the pair of rear wheels And providing a pair of intermediate guide rollers disposed between the guide rollers.

  Further, the gist of the invention according to claim 3 is that, in the invention according to claim 2, the pair of intermediate guide rollers is more than the pair of front wheel guide rollers and the pair of rear wheel guide rollers. It is that it is arranged close to the grinding tool side.

  Further, the gist of the invention according to claim 4 is that, in the invention according to claim 2 or 3, (a) the pair of intermediate guide rollers contacts a pair of side surfaces adjacent to corners of the silicon ingot. In this state, (b) the pair of front wheel guide rollers and the pair of rear wheel guide rollers are disposed so as to be separated from each other by a predetermined distance from a pair of side surfaces adjacent to corners of the silicon ingot. is there.

  Further, the gist of the invention according to claim 5 is that, in the invention according to any one of claims 1 to 4, the leg portion of the frame has an interval between the pair of guide roller devices and the grinding tool. A height adjusting device for adjusting the height.

  Further, the gist of the invention according to claim 6 is that, in the invention according to any one of claims 1 to 5, the frame is formed of the grinding tool by the pair of guide roller devices on the lower surface of the grinding tool. Supporting the tool driving device such that the rear side in the advancing direction is in contact with the corner of the silicon ingot and the front side in the advancing direction of the grinding tool on the lower surface of the grinding tool is inclined so as to be separated from the corner. It is in.

  The gist of the invention according to claim 7 is that, in the invention according to any one of claims 1 to 6, (a) the tool driving device moves the disk-shaped grinding tool around the rotation axis. (B) One of the first cloth having a brushed surface and the second cloth having a hooked surface is fixed to the front end surface of the rotating shaft. And the other cloth is fixed to the upper surface of the disk-shaped grinding tool, and (c) the disk-shaped grinding tool has the rotating shaft supported by the first cloth and the second cloth. It exists in attaching to a front end surface so that attachment or detachment is possible.

  According to the silicon ingot chamfering apparatus of the invention according to claim 1, (b) a tool support portion on which a tool driving device for driving the grinding tool around the rotation axis is mounted, and the tool from both ends of the tool support portion. A frame having a pair of legs projecting to the opposite side of the drive device; and (c) symmetric with respect to the rotational axis and in contact with a pair of side surfaces adjacent to predetermined corners of the silicon ingot. A pair of guide roller devices provided on the legs of the frame, and (d) the pair of guide roller devices moves the grinding tool along the pair of side surfaces of the silicon ingot in the longitudinal direction of the silicon ingot. When the pair of guide roller devices are brought into contact with the pair of side surfaces of the silicon ingot, respectively, in the cross section of the corner of the silicon ingot The tip of the corner and the position of the lower surface of the disposed on the rotational axis and the disc-shaped grinding tool and the position of the tip of the corner portion of the disc-shaped grinding tool is brought into position. Therefore, when the pair of guide roller devices are moved in the longitudinal direction of the silicon ingot along the pair of side surfaces in a state where the pair of guide roller devices are in contact with the pair of side surfaces of the silicon ingot, The disk-shaped grinding tool has the corner on the lower surface of the disk-shaped grinding tool while the position of the lower surface of the disk-shaped grinding tool and the position of the tip of the corner are positioned in the cross section of the corner of the silicon ingot. Since the portion is ground and guided in the longitudinal direction of the silicon ingot, the corner portion of the silicon ingot is ground by a predetermined amount, and the chamfering width of the corner portion formed by the grinding is compared with the conventional silicon ingot chamfering device. To make it constant and efficient.

  According to the silicon ingot chamfering device of the invention according to claim 2, the pair of guide roller devices includes a pair of front wheel guide rollers disposed on the front side in the traveling direction of the grinding tool in the longitudinal direction of the silicon ingot. A pair of rear wheel guide rollers disposed on the rear side in the advancing direction of the grinding tool with respect to the pair of front wheel guide rollers, and disposed between the pair of front wheel guide rollers and the pair of rear wheel guide rollers. And a pair of intermediate guide rollers. Therefore, when the corner of one end of the silicon ingot and the corner of the other end are ground with the grinding tool, for example, one of the pair of front wheel guide rollers and the pair of rear wheel guide rollers is a pair of the silicon ingot. The grinding tool is positioned at a corner of the silicon ingot at a corner of the pair of intermediate guide rollers, the pair of front wheel guide rollers and the pair of rear wheel guide rollers. Therefore, the silicon ingot is chamfered with higher accuracy at the corners at one end and the other end of the silicon ingot.

  According to the silicon ingot chamfering apparatus of the invention according to claim 3, the pair of intermediate guide rollers are arranged closer to the grinding tool side than the pair of front wheel guide rollers and the pair of rear wheel guide rollers. Therefore, when the plurality of guide rollers of the pair of guide roller devices are respectively brought into contact with the pair of side surfaces of the silicon ingot, the plurality of guide rollers in the cross section of the corner portion of the silicon ingot are the silicon ingot. The abutting width that abuts against the pair of side surfaces becomes longer, and the frame is less likely to be displaced around the axis of the silicon ingot, so that chamfering with higher accuracy is performed.

  According to the silicon ingot chamfering apparatus of the invention according to claim 4, (a) in a state where the pair of intermediate guide rollers are in contact with a pair of side surfaces adjacent to corners of the silicon ingot, The front wheel guide roller and the pair of rear wheel guide rollers are disposed so as to be separated from a pair of side surfaces adjacent to the corners of the silicon ingot by a predetermined distance. For example, the pair of front wheel guide rollers and the pair of rear wheel guide rollers The intermediate guide roller and the pair of rear wheel guide rollers are not brought into contact with the pair of side surfaces of the silicon ingot, respectively, and the pair of intermediate guide rollers are merely brought into contact with the pair of side surfaces of the silicon ingot. A disc-shaped grinding tool is easily positioned at the corner of the silicon ingot.

  According to the silicon ingot chamfering apparatus of the invention according to claim 5, the leg portion of the frame is provided with a height adjusting device for adjusting the distance between the pair of guide roller devices and the grinding tool. Therefore, by adjusting the height adjusting device, it is possible to freely set the width of the chamfering width by which the disk-like grinding tool chamfers the corners of the silicon ingot.

  According to the silicon ingot chamfering apparatus of the invention according to claim 6, the frame is configured such that the rear side in the traveling direction of the grinding tool by the pair of guide roller devices on the lower surface of the grinding tool is in contact with the corner portion of the silicon ingot. In order to support the tool driving device so that the front side in the traveling direction of the grinding tool on the lower surface of the grinding tool is inclined away from the corner portion, the lower surface of the disc-shaped grinding tool is made of the silicon ingot. When grinding is performed in contact with the corner portion, the grinding depth of the corner portion of the silicon ingot gradually increases as the grinding tool moves from the front to the rear in the traveling direction of the grinding tool. Corners are ground efficiently and with high surface accuracy.

  According to the silicon ingot chamfering apparatus of the invention according to claim 7, (a) the tool driving device includes a rotating shaft that rotates the disk-shaped grinding tool around the rotation axis, and (b) the rotating shaft. One of the first cloth with the raised surface of the cloth and the second cloth with the hooked surface is fixed to the front end surface of the cloth. (C) the disc-shaped grinding tool is detachably attached to the front end surface of the rotary shaft by the first and second fabrics. The grinding tool can be easily removed from and attached to the silicon ingot chamfering device, and the impact when the lower surface of the disc-shaped grinding tool abuts against the corner of the silicon ingot and is ground is affected by the first and second cloths. The silico during grinding because it is buffered by Chipping of the corners of the ingot is preferably suppressed.

It is a perspective view explaining a silicon ingot chamfering device to which the present invention is applied. It is the II-II sectional view taken on the line of FIG. FIG. 3 is a III-III view of FIG. 2. FIG. 4 is a IV-IV view of FIG. 3. It is a figure which shows the state which loosened the screw member and moved the movable plate member with which a pair of guide roller apparatus was attached to the front-end | tip part to a pair of side surface side of a silicon ingot. It is a figure explaining the 1st cloth and 2nd cloth arrange | positioned between the front end flat part of the tool attachment member fixed to the front-end | tip of a rotating shaft, and the upper surface of a grinding cloth paper. It is the elements on larger scale which expanded the lower surface of grinding cloth paper partially. It is the expanded sectional view which cut | disconnected and expanded some grinding cloth paper of FIG. It is a figure which shows the state at the time of grinding cloth grinding the corner | angular part of the one end part of a silicon ingot. It is a figure which shows a state when a grinding cloth grinds the corner | angular part of the other end part of a silicon ingot. It is a figure explaining the silicon ingot apparatus of the other Example of this invention, Comprising: It is a figure corresponded in FIG.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following embodiments, the drawings are appropriately simplified or modified, and the dimensional ratios, shapes, and the like of the respective parts are not necessarily drawn accurately.

  FIG. 1 is an overall view for explaining a silicon ingot chamfering apparatus 10 according to an embodiment of the present invention. The silicon ingot chamfering device 10 includes a pneumatic tool driving device 14 that rotates a disk-shaped grinding cloth (disk-shaped grinding tool) 12 around a rotation axis A, and a frame on which the tool driving device 14 is mounted. 16 and a pair of guide roller devices 18, 20 attached to the frame 16, and the pair of guide roller devices 18, 20 extends along the length of the silicon ingot 22 along the pair of side surfaces 22 a, 22 b of the square pillar-shaped silicon ingot 22. The chamfering is performed by moving in the direction and grinding the ground cloth paper 12 in contact with the corner portion 22c of the silicon ingot 22. Moreover, the dashed-two dotted line shown by FIG. 1 shows the cross section of the corner | angular part 22c of the quadrangular pillar-shaped silicon ingot 22, and the corner | angular part 22c shows the angle | corner where a pair of side surfaces 22a and 22b of the silicon ingot 22 cross.

  As shown in FIG. 1, the tool driving device 14 rotates the grinding cloth 12 around the rotation axis A by compressed air supplied from a hose 24 that supplies compressed air. Is integrally provided with a rotation speed adjustment unit 14a for adjusting the rotation speed of the grinding cloth 12 rotated by the tool driving device 14 by an adjustment lever (not shown), and the operator can adjust the rotation speed adjustment unit 14a. The rotational speed of the grinding cloth 12 is determined by the operation amount for operating the adjusting lever.

  As shown in FIG. 1, the frame 16 has a longitudinal flat plate portion (tool support portion) 16a on which the tool drive device 14 is mounted and supported, and the tool drive device 14 from both ends of the flat plate portion 16a. A pair of leg portions 16b and 16c projecting toward the opposite side, that is, the pair of side surfaces 22a and 22b of the silicon ingot 22, are provided substantially symmetrically with respect to the rotation axis A.

  As shown in FIGS. 1 and 2, the pair of guide roller devices 18 and 20 are disposed substantially symmetrically with respect to the rotation axis A at the tip ends of the pair of leg portions 16 b and 16 c, and The guide roller devices 18 and 20 include a pair of front wheel guide rollers 26 and 28 disposed on the front side in the traveling direction I of the grinding cloth 12 in the longitudinal direction of the silicon ingot 22, and the pair of front wheel guide rollers 26 and 28. The pair of rear wheel guide rollers 30, 20 disposed on the rear side in the traveling direction I of the grinding cloth 12, and between the pair of front wheel guide rollers 26, 28 and the pair of rear wheel guide rollers 30, 32. And a pair of intermediate guide rollers 34 and 36 arranged in a cylindrical shape. The guide rollers 26, 28, 30, 32, 34, and 36 are made of elastically deformable rubber, for example, and the pair of guide roller devices 18 and 20 are connected to the silicon ingot 22 by the rubber guide rollers. The impact at the time of making it contact | abut to a pair of side surface 22a, 22b is relieved.

  As shown in FIGS. 1 and 2, the pair of front wheel guide rollers 26 and 28 are paired with a pair of shaft members 26a and 28a fixed to the distal ends of the pair of leg portions 16b and 16c. A pair of shaft members, which are disposed so as to be relatively rotatable around the shaft centers B and C of 26a and 28a, and the pair of intermediate guide rollers 34 and 36 are fixedly paired at the distal ends of the pair of leg portions 16b and 16c. The pair of rear wheel guide rollers 30 and 32 are paired with the distal ends of the pair of leg portions 16b and 16c, respectively, by the shaft members 34a and 36a. A pair of fixed shaft members 30a, 32a are disposed so as to be relatively rotatable about the shaft centers F, G of the shaft members 30a, 32a.

  3 is a view of the silicon ingot chamfering apparatus 10 as viewed from the longitudinal direction of the silicon ingot 22, that is, a III-III perspective view of FIG. According to FIG. 3, the shaft members 26a, 30a, 34a of the front wheel guide roller 26, the rear wheel guide roller 30, and the intermediate guide roller 34 are arranged so that their axis centers B, D, F are substantially parallel to each other. Shaft members 26a, 30a, and 34a are disposed at the distal end portion of the leg portion 16b, and the shaft members 28a, 34a, and 36a of the front wheel guide roller 28, the rear wheel guide roller 32, and the intermediate guide roller 36 have their axes C and E. , G are arranged at the tip of the leg 16c so that the shaft members 28a, 32a, 36a are substantially parallel to each other.

  Further, as shown in FIG. 3, the front end portions of the pair of leg portions 16b and 16c are shaft members 26a, 30a of the front wheel guide roller 26, the rear wheel guide roller 30 and the intermediate guide roller 34 fixed to the front end portions. The angle θ1 at which the shaft centers B, D, and F of the shaft 34a intersect with the shaft centers C, E, and G of the shaft members 28a, 32a, and 36a of the front wheel guide roller 28, the rear wheel guide roller 32, and the intermediate guide roller 36 is a silicon ingot. The shape is bent so as to be substantially the same as the angle θ2 at which the pair of side surfaces 22a and 22b of 22 intersect. The cross section of the silicon ingot 22 shown in FIG. 3 is a cross sectional view cut along a plane passing through the axes D and E of the pair of intermediate guide rollers 34 and 36, that is, a cross sectional view taken along the line JJ of the silicon ingot 22 in FIG. In the present embodiment, the intersecting angle θ1 is 90 degrees, and the angle θ2 between the pair of side surfaces 22a and 22b of the silicon ingot 22 is 90 degrees. Further, in this embodiment, the pair of guide roller devices 18 and 20 are disposed substantially symmetrically with respect to the rotation axis A, and the extension members of the rotation axis A intersect with each other as shown in FIG. This is a bisector that bisects the angle θ1.

  Therefore, as shown in FIG. 3, the pair of front wheel guide rollers 26 and 28, the pair of intermediate guide rollers 34 and 36, and the pair of rear wheel guide rollers 30 and 32 are respectively placed on the pair of side surfaces 22 a and 22 b of the silicon ingot 22. When abutting, the tip of the corner 22c of the cross section of the corner 22c of the silicon ingot 22 is disposed on the rotation axis A of the grinding cloth 12, and the position of the tip of the corner 22c and the grinding cloth 12 And the grinding height H at which the corner 22c of the silicon ingot 22 is ground by the grinding cloth 12 is determined. Further, when the corner portion 22c of the silicon ingot 22 is ground at the grinding height H, the corner portion 22c is chamfered with a chamfering width M.

  As shown in FIGS. 3 and 4, the pair of leg portions 16 b and 16 c of the frame 16 are fixed to both ends of the flat plate portion 16 a of the frame 16 and have a flat plate shape protruding toward the pair of side surfaces 22 a and 22 b of the silicon ingot 22. A pair of fixed plate members 38, a substantially cylindrical male screw portion 40a screwed to the pair of fixed plate members 38, and a hexagonal head larger than the diameter of the male screw portion 40a fixed to one end of the male screw portion 40a Four screw members (height adjusting devices) 40 disposed on each of the pair of fixing plate members 38, and male screw portions 40a of two screw members 40 of the screw members 40, respectively. And a pair of movable plate members 42 having a pair of longitudinal guide holes 42a drilled to have a width dimension K larger than the diameter of the male screw portion 40a and smaller than the diameter of the head portion 40b. It is made. Therefore, the movable plate member 42 is fixed to the fixed plate member 38 by tightening the screw member 40. Further, when the screw member 40 is rotated in the direction opposite to the fastening direction, the movable plate member 42 replaces the pair of guide roller devices 18 and 20 disposed at the tip thereof with the pair of side surfaces 22a and 22a of the silicon ingot 22, respectively. Movement toward and away from the side 22b is possible. That is, the distance between the pair of guide roller devices 18 and 20 and the grinding cloth 12 is adjusted.

  As a result, when the front ends of the pair of movable plate members 42 are moved to the pair of side surfaces 22a and 22b of the silicon ingot 22, the corner portions 22c of the silicon ingot 22 are ground by the grinding cloth 12, as shown in FIG. The grinding height H is changed, and the chamfering width M chamfered at the corner 22c of the silicon ingot 22 is also changed.

  As shown in FIGS. 3 and 5, in the pair of guide roller devices 18 and 20, the pair of intermediate guide rollers 34 and 36 are compared to the pair of front wheel guide rollers 26 and 28 and the pair of rear wheel guide rollers 30 and 32. The guide rollers 26, 28, 30, 32, 34, 36 of the pair of guide roller devices 18, 20 are arranged close to the grinding cloth 12 side. When the guide rollers 26, 28, 30, 32, 34, 36 abut against the pair of side surfaces 22 a, 22 b of the silicon ingot 22 when abutted against the 22 b, the pair of intermediate guide rollers 34, 36 are ground. It becomes longer by the amount closer to the cloth 12 side.

  As shown in FIGS. 2 and 3, the tool driving device 14 is provided with a small-diameter cylindrical fixing portion 14b, and the flat plate portion 16a of the frame 16 is tightened with the fixing portion 14b being fitted. A tool fixing device 16b for fixing is provided.

  As shown in FIG. 2, the flat plate portion 16 a of the frame 16 has a silicon ingot on the lower side 12 a of the disc-shaped grinding cloth 12, the rear side of the traveling direction I of the grinding cloth 12 by the pair of guide roller devices 18, 20. 22 is in contact with the corner portion 22c of the intermediate guide roller 36 so that the front side of the lower surface 12a of the grinding cloth paper 12 in the traveling direction I of the grinding cloth paper 12 is separated from the corner portion 22c. The tool driving device 14 is supported so as to be inclined at a predetermined angle θ3, for example, about 5 degrees.

  As shown in FIGS. 3 and 6, the tool driving device 14 is provided with a substantially cylindrical rotating shaft 14c for rotating the grinding cloth 12 around the rotation axis A, and the tip of the rotating shaft 14c is provided with the rotating shaft 14c. A tool attachment member 44 for attaching the grinding cloth 12 is provided. The tool mounting member 44 includes a tip flat portion 44a having a flat tip, and a first cloth 46 having a raised surface fixed to the tip flat portion 44a. A second cloth 48 having a bowl-like surface fixed to the upper surface 12b of the ground cloth paper 12 is attached. The first cloth 46 and the second cloth 48 constitute a detachable fastener, and the ground cloth paper 12 is detachably attached to the tool attachment member 44 via the first cloth 46 and the second cloth 48. . Further, as shown in FIG. 1, when the grinding cloth 12 grinds the corner 22 c of the silicon ingot 22, water is supplied to the tool driving device 14 to the corner 22 c of the silicon ingot 22 and the grinding cloth 12. A water distribution pipe 50 is provided.

  FIG. 7 is a partially enlarged view in which the lower surface 12a of the grinding cloth 12 is partially enlarged. As shown in FIG. 7, the ground cloth 12 has a diamond layer 56 made of a hardened diamond paste 54 on the base layer 52 on the surface in contact with the corner 22c of the silicon ingot 22, that is, the lower surface 12a. It is formed. The diamond paste 54 is regularly applied on a polishing layer 58 described later by, for example, screen printing. The diamond paste 54 is regularly applied in a diamond shape or a stripe shape with a predetermined interval in FIG. 7, but the application shape of the diamond paste 54 is appropriately changed according to the required polishing characteristics. .

  FIG. 8 is an enlarged cross-sectional view of the grinding cloth 12 of FIG. 7 cut and enlarged. According to FIG. 8, the grinding cloth 12 is constituted by a three-layer structure of a base material layer 52, a polishing layer 58, and a diamond layer 56. The base material layer 52 is, for example, a flexible polyester. The polishing layer 58 is formed on the upper surface 52a of the base material layer 52. The polishing layer 58 is formed of a water-resistant cloth such as a cloth or a mixture of cotton and water-resistant paper. In addition, the polishing layer 58 is formed by applying an adhesive 60 made of a liquid resin such as polyimide or epoxy, and applying an abrasive 62 made of abrasive grains, glass grains, minerals, etc. and thermally curing. By forming the polishing layer 58, the strength of the grinding cloth 12 is increased, and the diamond paste 54 applied to the upper surface 58a is strongly held. The diamond paste 54 is made of a liquid resin 66 such as polyimide or epoxy mixed with diamond abrasive grains 64, and is thermally cured after being applied to the polishing layer 58 to form the diamond layer 56.

  In the silicon ingot chamfering device 10 configured as described above, a pair of side surfaces 22a and 22b in which an operator places the pair of front wheel guide rollers 26 and 28 of the pair of guide roller devices 18 and 20 at one end of the silicon ingot 22 are arranged. In the state where they are in contact with each other, the adjustment lever is operated to rotate the grinding cloth 12 and supply water from the water distribution pipe 50 to move the pair of guide roller devices 18 and 20 in the traveling direction I. . As a result, the lower surface 12 a of the grinding cloth 12 grinds the corner portion 22 c of the intermediate portion of the silicon ingot 22 at the grinding height H, and the corner portion 22 c of the intermediate portion of the silicon ingot 22 is chamfered.

  As shown in FIG. 9, when the lower surface 12a of the grinding cloth 12 is disposed on one end of the silicon ingot 22 and the pair of rear wheel guide rollers 30 and 32 are disengaged from the pair of side surfaces 22a and 22b, a pair of front wheel guide rollers 26 and 28 and a pair of intermediate rollers 34 and 36 in contact with the pair of side surfaces 22a and 22b of the silicon ingot 22, the pair of guide roller devices 18 and 20 are moved along the pair of side surfaces 22a and 22b. Since the lower surface 12a of the grinding cloth 12 can be moved in the traveling direction I, the corner 22c at one end of the silicon ingot 22 is ground at the grinding height H to chamfer the corner 22c at one end of the silicon ingot 22. Is given.

  Further, as shown in FIG. 10, when the lower surface 12a of the grinding cloth 12 is disposed on the other end portion of the silicon ingot 22 and the pair of front wheel guide rollers 26, 28 are separated from the pair of side surfaces 22a, 22b, Since the rollers 34 and 36 and the pair of rear wheel guide rollers 30 and 32 are in contact with the pair of side surfaces 22a and 22b, they can be moved in the traveling direction I along the pair of side surfaces 22a and 22b. The lower surface 12 a of the grinding cloth 12 is chamfered at the corner 22 c at the other end of the silicon ingot 22 by grinding the corner 22 c at the grinding height H at the corner 22 c at the other end of the silicon ingot 22. .

  According to the silicon ingot chamfering device 10 of the present embodiment, the pair of guide roller devices 18 and 20 are in contact with the pair of side surfaces 22a and 22b of the silicon ingots 18 and 20, respectively. , 20 is moved in the longitudinal direction of the silicon ingot 22 along the pair of side surfaces 22a, 22b, the disk-shaped grinding cloth (disk-shaped grinding tool) 12 is shown in its cross section at the corner of the silicon ingot 22. While the position of the lower surface 12a of the disc-shaped grinding cloth paper 12 and the position of the tip of the corner portion 22c are positioned, the corner portion 22c has a substantially constant grinding height H by the lower surface 12a of the disc-shaped grinding cloth paper 12. And is guided in the longitudinal direction of the silicon ingot 22, so that the corner 22 c of the silicon ingot 22 is ground by the grinding height H and shaped by grinding. Width M of the chamfer of the angular part 22c is in comparison to efficiently constant conventional silicon ingot chamfering device.

  Further, according to the silicon ingot chamfering device 10 of the present embodiment, the pair of guide roller devices 18 and 20 are provided on the pair of guide roller devices 18 and 20 on the front side in the traveling direction I of the grinding cloth 12 in the longitudinal direction of the silicon ingot 22. Front wheel guide rollers 26, 28, a pair of rear wheel guide rollers 30, 32 disposed on the rear side in the traveling direction I of the grinding cloth 12 with respect to the pair of front wheel guide rollers 26, 28, and the pair of front wheel guides A pair of intermediate guide rollers 34 and 36 disposed between the rollers 26 and 28 and the pair of rear wheel guide rollers 30 and 32 are provided. Therefore, when the corner 22c at one end of the silicon ingot 22 and the corner 22c at the other end are ground with the grinding cloth 12, for example, a pair of front wheel guide rollers 26, 28 and a pair of rear wheel guide rollers 30, 32 are provided. Even if one side is removed from the pair of side surfaces 22a, 22b of the silicon ingot 22, the position of the grinding cloth 12 at the corner 22c of the silicon ingot 22 is the pair of intermediate guide rollers 34, 36 and the pair of front wheel guide rollers 26, 28. Since the other of the pair of rear wheel guide rollers 30 and 32 is in contact with the pair of side surfaces 22 a and 22 b of the silicon ingot 22, the corners 22 c at one end of the silicon ingot 22 and the other ends are difficult to shift. The corner 22c of the part is chamfered with higher accuracy.

  Further, according to the silicon ingot chamfering apparatus 10 of the present embodiment, the pair of intermediate guide rollers 34 and 36 are ground cloth paper as compared with the pair of front wheel guide rollers 26 and 28 and the pair of rear wheel guide rollers 30 and 32. Since the two guide rollers 26, 28, 30, 32, 34, 36 of the pair of guide roller devices 18, 20 contact the pair of side surfaces 22 a, 22 b of the silicon ingot 22, respectively. The contact width L with which the plurality of guide rollers 26, 28, 30, 32, 34, 36 in the cross section of the corner 22 c of the silicon ingot 22 contacts the pair of side surfaces 22 a, 22 b of the silicon ingot 22 when contacted. And the frame 16 is less likely to be displaced around the axis of the silicon ingot 22, and chamfering with higher accuracy is performed.

  Further, according to the silicon ingot chamfering device 10 of the present embodiment, the leg portions 16b and 16c of the frame 16 are provided with four pieces for adjusting the distance between the pair of guide roller devices 18 and 20 and the grinding cloth paper 12. Since the screw member (height adjusting device) 40 is provided, by adjusting the four screw members 40, the movable plate member 42 having the pair of guide roller devices 18 and 20 disposed at the distal end portion is made of silicon. The pair of side surfaces 22a and 22b of the ingot 22 can be moved toward and away from each other, the grinding height H can be set freely, and the chamfering width M of the disc-shaped grinding cloth 12 grinding the corner portion 22c of the silicon ingot 22 can be set. The size can be set freely.

  Further, according to the silicon ingot chamfering apparatus 10 of the present embodiment, the frame 16 is configured such that the rear side in the traveling direction I of the grinding cloth paper 12 by the pair of guide roller devices 18 and 20 on the lower surface 12a of the grinding cloth paper 12 is a silicon ingot. The tool driving device 14 is supported so that the front side in the traveling direction I of the grinding cloth 12 on the lower surface 12a of the grinding cloth 12 is inclined so as to be separated from the corner 22c. Therefore, when the lower surface 12a of the abrasive cloth 12 is in contact with the corner portion 22c of the silicon ingot 22 and is ground, the abrasive cloth 12 is moved from the front to the rear in the traveling direction of the abrasive cloth 12. Since the grinding height H at which the corner portion 22c is ground is gradually increased, the corner portion 22c of the silicon ingot 22 is efficiently and highly polished. In the ground. Further, according to the silicon ingot chamfering apparatus 10 of the present embodiment, the lower surface 12a of the ground cloth paper 12 is provided with the diamond layer 56 having the diamond abrasive grains 64. The corner 22c of the silicon ingot 22 is ground efficiently and with high surface accuracy.

  Further, according to the silicon ingot chamfering device 10 of the present embodiment, the tool driving device 14 includes the rotating shaft 14c that rotates the disc-shaped grinding cloth 12 around the rotation axis A, and the tip end portion of the rotating shaft 14c. And a tool attachment member 44 for attaching the grinding cloth 12 to the tip flat portion 44a of the tool attachment member 44. A second cloth 48 having a bowl-like surface is fixed to the upper surface 12 b, and the disk-shaped ground cloth paper 12 is flattened by the first cloth 46 and the second cloth 48 on the tip end surface of the tool attachment member 44. 44a, the disc-shaped grinding cloth 12 can be easily detached and attached from the silicon ingot chamfering device 10, and the lower surface 12a of the disc-shaped grinding cloth 12 is a corner of the silicon ingot 22. Impact when being in contact with ground to 2c chipping of the corner portion 22c of the silicon ingot 22 during grinding because it is buffered by the first fabric 46 and second fabric 48 is suitably suppressed.

  Next, another embodiment of the present invention will be described. In the following other embodiments, portions common to the embodiments are denoted by the same reference numerals and description thereof is omitted.

  The silicon ingot chamfering apparatus according to the present embodiment is a first embodiment except that the pair of intermediate guide rollers 68 and 70 are different from each other in the pair of guide roller apparatuses 18 and 20 described above. FIG. 11 is a view for explaining the pair of intermediate guide rollers 68 and 70, and corresponds to FIG. 3 of the first embodiment.

  As shown in FIG. 11, the pair of intermediate guide rollers 68, 70 includes a guide roller 26, 28, 30, 32 between the pair of front wheel guide rollers 26, 28 and the pair of rear wheel guide rollers 30, 32. The same shape is disposed substantially symmetrically with respect to the rotational axis A at the distal ends of the pair of leg portions 16b and 16c. Further, as shown in FIG. 11, the pair of intermediate guide rollers 68 and 70 are paired with a pair of shaft members 68a and 70a fixed to the tip ends of the pair of leg portions 16b and 16c. , 70a are arranged so as to be relatively rotatable around the axis N, O.

  11, the shaft center N of the shaft member 68a of the intermediate guide roller 68 is substantially parallel to the shaft centers B and F of the shaft members 26a and 30a of the front wheel guide roller 26 and the rear wheel guide roller 30, respectively. The shaft center O of the shaft member 70a of the intermediate guide roller 70 is fixed to the tip end portion of the leg portion 16b so that the shaft centers C and G of the shaft members 28a and 32a of the front wheel guide roller 28 and the rear wheel guide roller 32 are formed. Are fixed to the tip of the leg 16c so as to be substantially parallel to each other. Further, as shown in FIG. 11, the pair of intermediate guide rollers 68 and 70 are provided with shaft members 26a, 28a, 30a, A pair of side surfaces 22a and 22b of the silicon ingot 22 are arranged close to each other in parallel to the shaft centers B, C, F, G and E of 32a. That is, in a state where the pair of intermediate guide rollers 68 and 70 are in contact with the pair of side surfaces 22a and 22b of the silicon ingot 22, the pair of front wheel guide rollers 26 and 28 and the pair of rear wheel guide rollers 30 and 32 The ingot 22 is disposed so as to be separated from the pair of side surfaces 22a and 22b adjacent to the corner portion 22c by a predetermined distance P.

  As shown in FIG. 11, the angle θ4 between the axis N of the shaft member 68a of the intermediate guide roller 68 and the axis O of the shaft member 70a of the intermediate guide roller 70 is a pair of side surfaces 22a, 22b of the silicon ingot 22. Is substantially the same as the angle θ2 at which. Therefore, when the pair of intermediate guide rollers 68 and 70 are brought into contact with the pair of side surfaces 22a and 22b of the silicon ingot 22, respectively, the tip of the corner 22c in the cross section of the corner 22c of the silicon ingot 22 is the abrasive cloth 12. And the position of the tip of the corner 22c and the position of the lower surface 12a of the grinding cloth 12 are positioned and the corner 22c of the silicon ingot 22 is ground by the grinding cloth 12. Height H is determined.

  According to the silicon ingot chamfering apparatus of the present embodiment, a pair of front wheel guide rollers in a state where the pair of intermediate guide rollers 68 and 70 are in contact with the pair of side surfaces 22a and 22b adjacent to the corner portion 22c of the silicon ingot 22. 26 and 28 and the pair of rear wheel guide rollers 30 and 32 are disposed so as to be separated from the pair of side surfaces 22a and 22b adjacent to the corner 22c of the silicon ingot 22 by a predetermined distance P, for example, a pair of front wheels Even if the guide rollers 26 and 28, the pair of intermediate guide rollers 68 and 70, and the pair of rear wheel guide rollers 30 and 32 are not brought into contact with the pair of side surfaces 22a and 22b of the silicon ingot 22, respectively, the pair of intermediate guide rollers 68 , 70 is brought into contact with the pair of side surfaces 22a, 22b of the silicon ingot 22 so as to make a disk-shaped abrasive. The fabric sheet 12 is easily positioned in the corner 22c of the silicon ingot 22.

  As mentioned above, although the Example of this invention was described based on drawing, this invention is applied also in another aspect.

  For example, in the silicon ingot chamfering device 10 of the present embodiment, the pair of guide roller devices 18 and 20 include a pair of front wheel guide rollers 26 and 28, a pair of rear wheel guide rollers 30 and 32, a pair of intermediate guide rollers 34, Although a total of 36 guide rollers were used, the pair of guide roller devices 18 and 20 do not necessarily need to use 6 guide rollers. It has 20 functions. Furthermore, six or more guide rollers may be used.

  Further, in the silicon ingot chamfering device 10 of the present embodiment, a first cloth 46 having a raised surface is fixed to the tip flat surface portion 44 a of the tool mounting member 44, and is attached to the upper surface 12 b of the disc-shaped grinding cloth paper 12. The second cloth 48 having a bowl-like surface is fixed, but the first cloth 46 is fixed to the upper surface 12b of the ground cloth paper 12, and the second cloth 48 is fixed to the tip flat surface portion 44a of the tool mounting member 44. May be.

  Although not illustrated one by one, the present invention can be implemented in variously modified and improved modes based on the knowledge of those skilled in the art.

10: Silicon ingot chamfering device 12: Grinding cloth (disk-shaped grinding tool)
12a: Lower surface 14: Tool drive device 14c: Rotating shaft 16: Frame 16a: Flat plate portion (tool support portion)
16b, 16c: a pair of legs 18, 20: a pair of guide roller devices 22: silicon ingots 22a, 22b: a pair of side surfaces 22c: corners 26, 28: a pair of front wheel guide rollers 30, 32: a pair of rear wheel guides Rollers 34, 36, 68, 70: A pair of intermediate guide rollers 40: Screw members (height adjusting device)
46: First cloth 48: Second cloth A: Axis of rotation I: Direction of travel

Claims (7)

A silicon ingot chamfering apparatus that performs chamfering on a corner of the silicon ingot by bringing a lower surface of a disk-like grinding tool rotating around a predetermined rotation axis into contact with a corner of the silicon ingot manufactured in a quadrangular prism shape. Because
A frame having a tool support portion to which a tool driving device for driving the grinding tool around the rotation axis is mounted, and a pair of legs protruding from opposite ends of the tool support portion to the opposite side of the tool driving device;
A pair of guide roller devices provided on leg portions of the frame so as to be in contact with a pair of side surfaces adjacent to a predetermined corner of the silicon ingot symmetrical to the rotation axis;
The pair of guide roller devices guide the grinding tool along the longitudinal direction of the silicon ingot along a pair of side surfaces of the silicon ingot.   The pair of guide roller devices includes a pair of front wheel guide rollers disposed on the front side in the traveling direction of the grinding tool in the longitudinal direction of the silicon ingot, and the progress of the grinding tool with respect to the pair of front wheel guide rollers. A pair of rear wheel guide rollers disposed on the rear side in the direction, and a pair of intermediate guide rollers disposed between the pair of front wheel guide rollers and the pair of rear wheel guide rollers. Item 2. A silicon ingot chamfering device according to item 1.   3. The silicon ingot chamfer according to claim 2, wherein the pair of intermediate guide rollers are disposed closer to the grinding tool side than the pair of front wheel guide rollers and the pair of rear wheel guide rollers. apparatus. In a state where the pair of intermediate guide rollers are in contact with a pair of side surfaces adjacent to a corner of the silicon ingot,
4. The pair of front wheel guide rollers and the pair of rear wheel guide rollers are disposed so as to be separated from each other by a predetermined distance from a pair of side surfaces adjacent to corner portions of the silicon ingot. Silicon ingot chamfering device.   The height adjustment device for adjusting the space | interval of the said pair of guide roller apparatus and the said grinding tool is provided in the leg part of the said frame, The any one of Claim 1 thru | or 4 characterized by the above-mentioned. Silicon ingot chamfering device.   In the frame, the rear side in the traveling direction of the grinding tool by the pair of guide roller devices on the lower surface of the grinding tool is in contact with the corner of the silicon ingot, and the front side in the traveling direction of the grinding tool is on the lower surface of the grinding tool. The silicon ingot chamfering device according to any one of claims 1 to 5, wherein the tool driving device is supported so as to be inclined away from the corner portion. The tool driving device includes a rotation shaft that rotates the disk-shaped grinding tool around the rotation axis,
One of the first cloth having a brushed surface and the second cloth having a hooked surface is fixed to the tip surface of the rotating shaft, and is attached to the upper surface of the disk-shaped grinding tool. Is the one to which the other fabric is fixed,
The silicon ingot chamfering device according to any one of claims 1 to 6, wherein the disk-shaped grinding tool is detachably attached to a tip surface of the rotating shaft by the first cloth and the second cloth.

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