EP1576381A1 - Magnetoresistives schichtsystem und sensorelement mit diesem schichtsystem - Google Patents

Magnetoresistives schichtsystem und sensorelement mit diesem schichtsystem

Info

Publication number
EP1576381A1
EP1576381A1 EP03773554A EP03773554A EP1576381A1 EP 1576381 A1 EP1576381 A1 EP 1576381A1 EP 03773554 A EP03773554 A EP 03773554A EP 03773554 A EP03773554 A EP 03773554A EP 1576381 A1 EP1576381 A1 EP 1576381A1
Authority
EP
European Patent Office
Prior art keywords
layer
magnetic
magnetoresistive
magnetic layer
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03773554A
Other languages
German (de)
English (en)
French (fr)
Inventor
Maik Rabe
Henrik Siegle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1576381A1 publication Critical patent/EP1576381A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09Magnetoresistive devices
    • G01R33/093Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors

Definitions

  • Magnetoresistive layer systems or corresponding sensor elements are known from the prior art, for example for use in motor vehicles, in which the operating point can be shifted by auxiliary magnetic fields.
  • the generation of an auxiliary magnetic field by means of mounted macroscopic hard magnets or current-carrying field coils is known.
  • DE 101 28 135.8 also explains a concept in which a hard magnetic layer is deposited in the vicinity of a magnetoresistive layer stack, in particular on or under the layer stack, which mainly couples to the actual sensitive layers of the layer stack through its stray field.
  • the focus is on the highest possible coercivity as a target parameter and on the other hand the remanent magnetic field as a limiting parameter.
  • such a hard magnetic layer also leads to an electrical short circuit of the adjacent sensitive layers of the magnetoresistive layer system, which is a desired GMR effect ("giant magnetoresistance") or AMR effect (“anisotropic magnetoresistance”) or the sensitivity of the Layer system limited to an external magnetic field to be analyzed.
  • the magnetoresistive layer system according to the invention and the sensor element according to the invention with this layer system have the advantage over the prior art that their sensitivity to detect external magnetic fields with respect to strength and / or direction is only very small or preferably not appreciably temperature-dependent within a predetermined temperature interval.
  • the maximum sensitivity of the layer stack which is generally to be achieved at room temperature, changes with respect to an external magnetic field or the field strength of this magnetic field the temperature. Furthermore, its sensitivity also changes as a function of the bias magnetic field or auxiliary magnetic field generated within the layer stack, for example via an integrated hard magnetic layer, so that one can indeed set an operating point of the magnetoresistive layer stack that depends on the temperature and the strength of the bias or auxiliary magnetic field is. Overall, this leads to the fact that the operating point of the sensor element shifts considerably as a function of the temperature for a given bias magnetic field, which is usually accompanied by a significant loss in sensitivity.
  • the layer arrangement in the magnetoresistive layer system according to the invention or in the sensor element produced therewith shows a temperature profile of the resulting magnetic field, which can be adapted to the temperature profile of the working point of the magnetoresistive layer stack, while hard magnetic materials, in particular with high Curie temperatures, have an intrinsic temperature profile Have magnetization.
  • the bias magnetic field or auxiliary magnetic field generated above is always approximately proportional to the magnetization of the hard magnetic layer
  • the resulting magnetic field of the layer arrangement provided according to the invention is advantageously determined by the temperature dependence of the interlayer exchange coupling.
  • the stray field coupling of the first magnetic layer and the second magnetic layer, which are ferromagnetically exchange-coupled via the interlayer is opposite in the case of the provided ferromagnetic interlayer coupling, i. in this sense antiferromagnetic.
  • the antiferromagnetic component increases in relative terms and thus reduces the total stray magnetic field of the layer arrangement. Accordingly, the previously set operating point shifts to smaller magnetic fields as a result of the temperature increase and thus compensates for a change in the sensitivity of the magnetoresistive layer stack as a function of the temperature.
  • the strength of the resulting magnetic field generated by the layer arrangement coincides with a required magnetic field value to achieve maximum sensitivity of the magnetoresistive layer stack, a particularly high sensitivity of the magnetoresistive layer system or the sensor element generated thereby is advantageously achieved. This then advantageously remains over the entire temperature interval that the layer system drive is normally exposed, that is, for example, the temperature interval from -30 ° C to + 200 ° C, the same.
  • the layer arrangement and the magnetoresistive layer stack show a similar or the same temperature dependency, which is determined in each case by the interlayer exchange coupling.
  • the layer arrangement can be brought into proximity to the magnetoresistive layer stack in various designs, i.e. in the case of vertical integration, it can be arranged above or below the magnetoresistive layer stack and / or in the case of horizontal integration on one side or preferably on both sides next to the magnetoresistive layer stack.
  • the two magnetic layers of the layer arrangement have a different thickness.
  • FIG. 1 shows a section through a magnetoresistive layer system.
  • FIG. 1 shows a first magnetic layer 12 with a resulting magnetization mi with the direction indicated in FIG. 1, on which an intermediate layer 11 is located.
  • a second magnetic layer 13 with a resulting magnetization m 2 with the direction indicated in FIG. 1 is arranged on the intermediate layer 11.
  • a magnetoresistive layer stack 14, as is known per se from the prior art, is then located on the second magnetic layer 13.
  • the magnetoresistive layer stack 14 works on the basis of the GMR effect according to the principle of coupled multilayers or according to the spin valve principle.
  • the first magnetic layer 12, the intermediate layer 11 and the second magnetic layer 13 together form a layer arrangement 15, which generates a resulting magnetic field which acts on the magnetoresistive layer stack. It is further provided that the first magnetic layer 12 and the second magnetic layer 13 are ferromagnetically exchange-coupled via the intermediate layer 11.
  • the first magnetic layer 12 is, for example, a soft magnetic layer, in particular a layer made of permalloy, CoFe, Co, Fe, Ni, FeNi and magnetic alloys which contain these materials.
  • the second magnetic layer 13 is, for example, a hard magnetic layer, in particular a hard magnetic layer consisting of CoSm, CoCrPt, CoCrTa, Cr or CoPt.
  • the first magnetic layer 12 can also be a hard magnetic layer made of the materials mentioned and the second magnetic layer 13 can be a soft magnetic layer made of the materials mentioned.
  • both the first magnetic layer 12 and the second magnetic layer 13 can be a hard magnetic layer made of CoSm, CoCrPt, CoCrTa, Cr or CoPt.
  • the thickness of the first magnetic layer 12 differs from the thickness of the second magnetic layer 13.
  • the thickness of the second magnetic layer 13 is preferably greater than that of the first magnetic layer 12.
  • the non-magnetic intermediate layer 11 consists, for example, of copper, an alloy with or of copper, silver and gold, such as CuAgAu or preferably of ruthenium.
  • the deposition of the individual layers explained in FIG. 1 is otherwise not critical to known influencing factors.
  • the desired ferromagnetic interlayer exchange coupling can be set using the non-magnetic interlayer 11 over known layer thicknesses of the intermediate layer 11.
  • the ferromagnetic interlayer exchange coupling between the first magnetic layer 12 and the second magnetic layer 13 initially "softens".
  • the stray field coupling of the two coupled magnetic layers 12, 13 is the ferromagnetic interlayer exchange coupling opposite direction.
  • this softening of the ferromagnetic layer coupling by increasing the temperature means that the opposing stray field coupling of the magnetic layers 12, 13 increases relatively, so that the entire stray field of the layer arrangement 15, i. H. the resulting magnetic field acting on the magnetoresistive layer stack 14 is reduced. Accordingly, the working point of the magnetoresistive layer stack 14 set via the layer arrangement 15 is shifted to smaller magnetic fields.
  • FIG. 1 shows how the first magnetic layer 12 generates a stray field Hj, which acts on the magnetoresistive layer stack 14, and how the second magnetic layer 13 generates a stray field H 2 , which also acts on the magnetoresistive layer stack 14. If the interlayer exchange coupling between the first magnetic layer 12 and the second magnetic layer 13 is softened, the sum of the stray fields Hi, H 2 , ie the resulting bias magnetic field acting on the magnetoresistive layer stack, is reduced overall in the example explained.
  • one of the magnetic layers 12, 13 is a soft magnetic layer, for example the second magnetic layer 13, it is even possible to set the two stray fields Hi and H 2 in such a way that they largely compensate each other.
  • the concept explained for the layer arrangement 15 can be easily inserted into existing magnetoresistive layer systems with GMR multilayers, GMR spin valve structure and AMR layer systems or CMR layer systems ("colossal magnetoresistance").
  • the magnetoresistive layer system 5 according to FIG. 1 is typically located on a substrate and is connected to this substrate via a so-called buffer layer.
  • a cover layer for example made of tantalum, can also be located on the magnetoresistive layer stack 14.

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
  • Thin Magnetic Films (AREA)
EP03773554A 2002-12-17 2003-10-18 Magnetoresistives schichtsystem und sensorelement mit diesem schichtsystem Withdrawn EP1576381A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10258860A DE10258860A1 (de) 2002-12-17 2002-12-17 Magnetoresistives Schichtsystem und Sensorelement mit diesem Schichtsystem
DE10258860 2002-12-17
PCT/DE2003/003503 WO2004055537A1 (de) 2002-12-17 2003-10-18 Magnetoresistives schichtsystem und sensorelement mit diesem schichtsystem

Publications (1)

Publication Number Publication Date
EP1576381A1 true EP1576381A1 (de) 2005-09-21

Family

ID=32518994

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03773554A Withdrawn EP1576381A1 (de) 2002-12-17 2003-10-18 Magnetoresistives schichtsystem und sensorelement mit diesem schichtsystem

Country Status (6)

Country Link
US (1) US20060119356A1 (zh)
EP (1) EP1576381A1 (zh)
JP (2) JP4546835B2 (zh)
CN (1) CN100504426C (zh)
DE (1) DE10258860A1 (zh)
WO (1) WO2004055537A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7199986B2 (en) * 2004-02-18 2007-04-03 Hitachi Global Storage Technologies Magnetoresistive sensor with decoupled hard bias multilayers
JP2008249556A (ja) * 2007-03-30 2008-10-16 Tdk Corp 磁気センサ
US10091594B2 (en) 2014-07-29 2018-10-02 Cochlear Limited Bone conduction magnetic retention system
CN104660390B (zh) * 2015-02-10 2017-11-14 西南交通大学 一种cdma结合aco‑ofdm的光多载波码分多址系统通信方法
US10130807B2 (en) 2015-06-12 2018-11-20 Cochlear Limited Magnet management MRI compatibility
US20160381473A1 (en) 2015-06-26 2016-12-29 Johan Gustafsson Magnetic retention device
CN104992809B (zh) * 2015-07-08 2018-01-30 兰州大学 平面内任意方向均能实现GHz高磁导率的磁性材料及制备方法
US10917730B2 (en) 2015-09-14 2021-02-09 Cochlear Limited Retention magnet system for medical device
US9872115B2 (en) * 2015-09-14 2018-01-16 Cochlear Limited Retention magnet system for medical device
US11595768B2 (en) 2016-12-02 2023-02-28 Cochlear Limited Retention force increasing components
US10620279B2 (en) * 2017-05-19 2020-04-14 Allegro Microsystems, Llc Magnetoresistance element with increased operational range
KR20210087089A (ko) 2018-11-27 2021-07-09 엑스콤 랩스 인코퍼레이티드 넌-코히어런트 협력 다중 입출력 통신
US10756795B2 (en) 2018-12-18 2020-08-25 XCOM Labs, Inc. User equipment with cellular link and peer-to-peer link
US11063645B2 (en) 2018-12-18 2021-07-13 XCOM Labs, Inc. Methods of wirelessly communicating with a group of devices
US11330649B2 (en) 2019-01-25 2022-05-10 XCOM Labs, Inc. Methods and systems of multi-link peer-to-peer communications
US11411779B2 (en) 2020-03-31 2022-08-09 XCOM Labs, Inc. Reference signal channel estimation

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710390B1 (en) * 1993-07-23 2001-06-20 Nonvolatile Electronics, Incorporated Magnetic structure with stratified layers
US5452163A (en) * 1993-12-23 1995-09-19 International Business Machines Corporation Multilayer magnetoresistive sensor
US5841611A (en) * 1994-05-02 1998-11-24 Matsushita Electric Industrial Co., Ltd. Magnetoresistance effect device and magnetoresistance effect type head, memory device, and amplifying device using the same
KR100232667B1 (ko) * 1994-12-13 1999-12-01 니시무로 타이죠 교환결합막과 자기저항효과소자
JPH09305929A (ja) * 1996-03-14 1997-11-28 Sony Corp 薄膜磁気ヘッド
KR19980042427A (ko) * 1996-11-18 1998-08-17 다까노야스아끼 자기 저항 효과막
JP3951192B2 (ja) * 1997-08-07 2007-08-01 Tdk株式会社 スピンバルブ型磁気抵抗効果素子およびその設計方法
US6248416B1 (en) * 1997-11-10 2001-06-19 Carnegie Mellon University Highly oriented magnetic thin films, recording media, transducers, devices made therefrom and methods of making
JPH11259821A (ja) * 1998-03-07 1999-09-24 Victor Co Of Japan Ltd 磁気抵抗効果型ヘッド及びその製造方法
EP1012617B1 (en) * 1998-05-11 2007-01-17 Koninklijke Philips Electronics N.V. Magnetic multilayer sensor
US5953248A (en) * 1998-07-20 1999-09-14 Motorola, Inc. Low switching field magnetic tunneling junction for high density arrays
US6348274B1 (en) * 1998-12-28 2002-02-19 Kabushiki Kaisha Toshiba Magnetoresistive element and magnetic recording apparatus
JP2001006932A (ja) * 1999-06-17 2001-01-12 Sony Corp 磁気抵抗効果膜とこれを用いた磁気読取りセンサ
KR20020008182A (ko) * 2000-03-09 2002-01-29 롤페스 요하네스 게라투스 알베르투스 데이터 저장 시스템 및 자기 특성 감지 시스템 및 자기시스템 및 자기 시스템 제조 방법 및 자기 시스템의 자기저항 특성 튜닝 방법
JP4136261B2 (ja) * 2000-03-29 2008-08-20 富士通株式会社 磁気抵抗効果素子を製造する方法
JP2002074620A (ja) * 2000-08-28 2002-03-15 Mitsumi Electric Co Ltd 磁気抵抗効果型磁気ヘッド
JP2002084019A (ja) * 2000-09-08 2002-03-22 Canon Inc 磁気デバイス及び固体磁気メモリ
JP3833512B2 (ja) * 2000-10-20 2006-10-11 株式会社東芝 磁気抵抗効果素子
JP3734716B2 (ja) * 2000-12-11 2006-01-11 アルプス電気株式会社 磁気検出素子の製造方法
JP4666775B2 (ja) * 2001-01-11 2011-04-06 キヤノン株式会社 磁気薄膜メモリ素子、磁気薄膜メモリおよび情報記録方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2004055537A1 *

Also Published As

Publication number Publication date
DE10258860A1 (de) 2004-07-15
US20060119356A1 (en) 2006-06-08
JP5124606B2 (ja) 2013-01-23
JP4546835B2 (ja) 2010-09-22
JP2010153895A (ja) 2010-07-08
WO2004055537A1 (de) 2004-07-01
CN100504426C (zh) 2009-06-24
CN1729403A (zh) 2006-02-01
JP2006510208A (ja) 2006-03-23

Similar Documents

Publication Publication Date Title
EP0674769B1 (de) Magnetowiderstands-sensor mit künstlichem antiferromagneten und verfahren zu seiner herstellung
DE69533636T2 (de) Magnetowiderstandseffektvorrichtung und hiermit versehener Magnetkopf, Speicher- und Verstärkungsanordnung
DE60013079T2 (de) Doppeltes magnetisches Element mit zwei magnetischen Zuständen und Herstellungsverfahren dafür
DE19528245B4 (de) Magneto-Widerstandskopf und dessen Verwendung in einer Magnetaufzeichnungsvorrichtung
DE68915040T2 (de) Ein magnetoresistiver Lesetransducer und ein Verfahren zu seiner Herstellung.
DE102009007479B4 (de) Dünnfilm-Magnetsensor
DE102006008257B4 (de) Magnetoresistives Mehrschichtensystem vom Spin Valve-Typ mit einer magnetisch weicheren Elektrode aus mehreren Schichten und dessen Verwendung
EP1576381A1 (de) Magnetoresistives schichtsystem und sensorelement mit diesem schichtsystem
EP1287372A2 (de) Verfahren zur herstellung einer wheatstonebrücke, beinhaltend brückenelemente bestehend aus einem spin-valve-system
EP1417690B1 (de) Schichtensystem mit erhöhtem magnetoresistiven effekt sowie verwendung desselben
DE19936378B4 (de) Magnetowiderstands-Dünnschichtelement vom Spin-Valve-Typ
WO2000072387A1 (de) Magnetische koppeleinrichtung und deren verwendung
DE10128150C1 (de) Magnetoresistives Sensorsystem
DE102019126320B4 (de) Magnetoresistiver Sensor und Fertigungsverfahren für einen magnetoresistiven Sensor
EP1399750A1 (de) Magnetoresistive schichtanordnung und gradiometer mit einer derartigen schichtanordnung
WO2004017085A1 (de) Magnetoresistives schichtsystem und sensorelement mit diesem schichtsystem
DE10128964B4 (de) Digitale magnetische Speicherzelleneinrichtung
EP0885398B1 (de) Magnetfeldempfindlicher sensor mit einem dünnschichtaufbau und verwendung des sensors
EP0993054A2 (de) Dünnschichtenaufbau eines magnetfeldempfindlichen Sensors mit einem magnetoresistiven Mehrschichtensystem mit Spinabhängigkeit der Elektronenstreuung
DE10003471A1 (de) Spin-Ventil-Magnetowiderstandselement und Verfahren zu seiner Herstellung
DE10325741B4 (de) Magnetisches Schichtsystem mit hoher Exchange-Bias-Feldstärke und Verfahren zur Herstellung
DE10140606C1 (de) Integriertes Speicher- und Sensierelement auf Basis des GMR-Effektes
DE10236983A1 (de) Magnetsensoranordnung
DE10114197C1 (de) Sensorelement vom TMR-Typ
DE10256246A1 (de) Magnetoresistives Schichtsystem und Sensorelement mit diesem Schichtsystem

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20050718

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

RBV Designated contracting states (corrected)

Designated state(s): DE FR GB IT

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20140501