EP1532479A1 - Dispositif et procede pour inspecter un objet - Google Patents

Dispositif et procede pour inspecter un objet

Info

Publication number
EP1532479A1
EP1532479A1 EP03792406A EP03792406A EP1532479A1 EP 1532479 A1 EP1532479 A1 EP 1532479A1 EP 03792406 A EP03792406 A EP 03792406A EP 03792406 A EP03792406 A EP 03792406A EP 1532479 A1 EP1532479 A1 EP 1532479A1
Authority
EP
European Patent Office
Prior art keywords
dark field
light
field illumination
light source
beam path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03792406A
Other languages
German (de)
English (en)
Inventor
Franz Cemic
Lambert Danner
Uwe Graf
Robert Mainberger
Dirk SÖNKSEN
Volker Knorz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leica Microsystems CMS GmbH
Original Assignee
Leica Microsystems CMS GmbH
Vistec Semiconductor Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems CMS GmbH, Vistec Semiconductor Systems GmbH filed Critical Leica Microsystems CMS GmbH
Publication of EP1532479A1 publication Critical patent/EP1532479A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/06—Means for illuminating specimens
    • G02B21/08—Condensers
    • G02B21/10—Condensers affording dark-field illumination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/06—Means for illuminating specimens
    • G02B21/08—Condensers
    • G02B21/12—Condensers affording bright-field illumination
    • G02B21/125—Condensers affording bright-field illumination affording both dark- and bright-field illumination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8838—Stroboscopic illumination; synchronised illumination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/069—Supply of sources
    • G01N2201/0696—Pulsed

Definitions

  • the device according to the invention for inspecting an object achieves the above object by the features of patent claim 1.
  • a device is characterized in that the light used for dark field illumination is pulsed and that the pulse intensity of the light used for dark field illumination is greater than at least one order of magnitude the intensity of the continuous light used for bright field illumination related to a pulse interval.
  • Suitable light sources which can be used as dark field light sources, are advantageously available on the market in a large selection and in some cases inexpensively.
  • a xenon flash lamp, a laser or an LED can be used as dark field light sources.
  • the pulse intensity of the light used for dark field illumination is 10 to 10,000 times greater than the intensity of the continuous light used for bright field illumination related to a pulse interval. Since in particular the intensity of the light scattered on the object depends on the object property or on the property of the object surface, the intensity ratio of the two light sources can be selected depending on the object to be inspected, in particular the type of objects to be inspected, e.g. for masks for the semiconductor industry. Ultimately, the intensity of the continuously operating bright-field light source for bright-field illumination will be selected such that an optimal contrast can be achieved with the detector or with the detector system. The intensity of the pulsed dark field light source is then selected such that an optimal contrast can also be achieved in dark field illumination and that the two image data detected in the different illumination modes have an optimal intensity ratio relative to one another.
  • the control signal of the optical component can serve as a synchronization signal for the detector and / or for the detection system.
  • a delay circuit can be provided for synchronization with which For example, electronic time differences or temporal offsets can be compensated.
  • the device according to the invention is coupled to a control computer.
  • This control computer usually not only controls an automatic image data acquisition of several automatically inspected ones Objects, but also has a storage unit on which the detected object data or extracted measurement results are stored and / or evaluated.
  • the method according to the invention is preferably used to operate a device according to one of the claims 1 to 16. To avoid repetition, reference is made to the previous part of the description.
  • FIG. 1 shows a schematic illustration of a first exemplary embodiment of a device according to the invention
  • Fig. 3b is a schematic representation of a diagram of the temporal
  • FIG. 1 and 2 show a schematic representation of a device 1 for inspecting an object 2.
  • This device 1 is an optical inspection device with which masks and wafers for the semiconductor industry can be examined in particular for defects.
  • the device 1 has a bright-field illumination beam path 4 of a bright-field light source 5 that is designed with respect to imaging optics 3.
  • a dark field illumination beam path 6 of a dark field light source 7 is also provided.
  • the object 2 is imaged on the detector 8 with the imaging optics 3, the detection beam path 9 running from the object 2 to the detector 8.
  • Object 2 is illuminated simultaneously by the two light sources 5 and 7.
  • the dark field light source 7 shown in FIG. 2 is an arc lamp that emits pulsed light.
  • the dark field light source 7 shown in FIG. 1 is also an arc lamp, which, however, emits continuous light of a constant intensity.
  • the light from the dark field light source 7 from FIG. 1 is divided into individual pulses after collimation by means of a lens 12 with the aid of an optical component 13 in the form of a rotating shutter wheel.
  • the shutter wheel rotates about the axis of rotation 14 and has circumferentially arranged, translucent areas through which the light of the dark field light source 7 can pass.
  • A, for example, circular area is masked out by the aperture 15, so that in the further course of the dark field illumination beam path 6 there is only an annular illumination cross section.
  • the readiness for readout and evaluation of the detector 8 and of the detection system 16 arranged downstream of the detector 8 is synchronized with the pulse sequence of the light from the dark field light source 7 serving for dark field illumination.
  • the synchronization line 17 connects the optical component 13 to the detection system 16.
  • the synchronization line 17 connects the dark field light source 7 from FIG. 2 to the detection system 16.
  • the optical component 13 from FIG 1 and the dark field light source 7 from FIG. 2 are provided with a trigger signal.
  • the trigger signal of the optical component 13 can be generated, for example, by means of a light barrier (not shown).
  • the dark field light source 7 from FIG. 2 generates a trigger signal due to its internal control.
  • the detector 8 is connected to the downstream detection system 16 by means of the control and readout line 32.
  • a delay circuit 18 is also provided for synchronization, the offset or delay value of which can be changed in an adjustable manner.
  • the time interval 19 running from t1 to t3 characterizes the duration in which the detector 8 is in readiness for reading out for the light of the dark field light source 7 scattered on the object.
  • the time t2 ideally lies in the middle between the start and end values t1 and t3 of the time window 19, the time t2 characterizing the center of the light pulse.
  • the bright-field illumination beam path 4 in FIGS. 1 and 2 runs from the bright-field light source 5 via the beam splitter 20 to the object 2.
  • the light from the bright-field light source 5 is largely reflected on the beam splitter 20 in the direction of imaging optics 3.
  • the dark field illumination beam path 6 in FIG. 1 initially runs from the dark field light source 7 to the beam splitter 21, on which the light from the dark field light source 7 is shown in a mirrored area solid lines - is reflected in the direction of the imaging optics 3. It is shown only schematically how the light from the dark field light source 7 reflected at the beam splitter 21 is guided coaxially outside the bright field illumination beam path 4 in the direction of the object 2, with the drawing of a focusing optics required for this purpose being dispensed with.
  • the central region of the beam splitter 21 is transparent - shown in dash-dot lines - so that the light from the bright-field light source 5 and the light scattered or reflected on the object 2 in the bright-field illumination beam path 4 or in the detection beam path 9 can pass the beam splitter 21 in this region.
  • the optical axis 25 of the bright field illumination beam path 4 between the beam splitter 20 and the object 2 is perpendicular to the surface 26 of the object 2 to be inspected.
  • the optical axis 25 of the bright-field illumination beam path 4 is arranged perpendicular to the object plane of the imaging optics 3, which coincides with the surface 26 of the object 2 facing the imaging optics 3 and is therefore not shown separately.
  • the optical axis 27 of the detection beam path 9 running between the object 2 and the detector 8 is likewise perpendicular to the surface 26 of the object 2 to be inspected and perpendicular to the object plane of the imaging optics 3.
  • the optical axis 28 of the dark field illumination beam path 6 in FIG. 1 is between the beam splitter 21 and the object 2 coaxial to the optical axis 25 of the bright field illumination beam path 4 and coaxial to the optical axis 27 of the detection beam path 9.
  • 2 shows that the optical axis 28 of the dark field illumination beam path 6 has an angle 29 - indicated by the curved double arrow - to the optical axis 25 of the bright field illumination beam path 4 and to the optical axis 27 of the detection beam path 9.
  • the detection system 16 also includes a control computer (not shown separately) with which the individual components of the device 1 are controlled.
  • the object inspection is carried out automatically by means of a program running on the control computer.
  • the detection system 16 of the device 1 is coupled via a line 31 to a positioning system 30, which is also controlled by the control computer and positions the object 1.
  • the positioning system 30 positions the object 2 along the direction shown by the double arrow in FIGS. 1 and 2 in the positioning system 30. Furthermore, object positioning in the two opposite directions is provided perpendicular to it, that is, out of the plane of the drawing in FIGS. 1 and 2.

Landscapes

  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Microscoopes, Condenser (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

L'invention concerne un dispositif et un procédé servant à inspecter un objet (2) et comprenant un faisceau d'éclairage à fond clair (4) d'une source lumineuse à fond clair (5) réalisé par rapport à une optique de reproduction (3), ainsi qu'un faisceau d'éclairage à fond noir (6) d'une source lumineuse à fond noir (7) réalisé par rapport à l'optique de reproduction (3). L'objet (2) peut être reproduit à l'aide de l'optique de reproduction (3) sur au moins un détecteur (8) et est éclairé simultanément par les deux sources lumineuses (5, 7). Pour détecter simultanément des images à fond clair et à fond noir sans opérations de filtrage coûteuses, le dispositif et le procédé selon l'invention pour l'inspection d'un objet (2) sont caractérisés en ce que la lumière servant à l'éclairage à fond noir est pulsée et en ce que l'intensité d'impulsion de la lumière servant à l'éclairage à fond noir est supérieure d'au moins un ordre de grandeur à l'intensité, correspondant à un intervalle d'impulsion, de la lumière continue servant à l'éclairage à fond clair.
EP03792406A 2002-08-23 2003-08-21 Dispositif et procede pour inspecter un objet Withdrawn EP1532479A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10239548A DE10239548A1 (de) 2002-08-23 2002-08-23 Vorrichtung und Verfahren zur Inspektion eines Objekts
DE10239548 2002-08-23
PCT/EP2003/009274 WO2004019108A1 (fr) 2002-08-23 2003-08-21 Dispositif et procede pour inspecter un objet

Publications (1)

Publication Number Publication Date
EP1532479A1 true EP1532479A1 (fr) 2005-05-25

Family

ID=31197469

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03792406A Withdrawn EP1532479A1 (fr) 2002-08-23 2003-08-21 Dispositif et procede pour inspecter un objet

Country Status (6)

Country Link
US (1) US7271889B2 (fr)
EP (1) EP1532479A1 (fr)
JP (1) JP2005536732A (fr)
AU (1) AU2003253422A1 (fr)
DE (1) DE10239548A1 (fr)
WO (1) WO2004019108A1 (fr)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8531678B2 (en) 1999-07-09 2013-09-10 Nova Measuring Instruments, Ltd. Method and system for measuring patterned structures
IL130874A (en) 1999-07-09 2002-12-01 Nova Measuring Instr Ltd System and method for measuring pattern structures
DE10339651B3 (de) * 2003-08-28 2005-03-24 Man Roland Druckmaschinen Ag Verfahren und Vorrichtung zur Ermittlung von Rastertonwerten durch direkte Aufnahme von verschiedenen drucktechnischen Substraten
US7532749B2 (en) * 2003-11-18 2009-05-12 Panasonic Corporation Light processing apparatus
DE10361018C9 (de) * 2003-12-23 2021-03-04 QUISS Qualitäts-Inspektionssysteme und Service GmbH Verfahren zum Erkennen einer auf einem Substrat aufzubringenden Struktur mit mehreren Kameras sowie eine Vorrichtung hierfür
DE102004004761A1 (de) * 2004-01-30 2005-09-08 Leica Microsystems Semiconductor Gmbh Vorrichtung und Verfahren zur Inspektion eines Wafers
WO2005098515A1 (fr) * 2004-03-16 2005-10-20 Till I.D. Gmbh Dispositif de convergence et de guidage de faisceaux lumineux
EP1794577A4 (fr) * 2004-09-17 2010-10-06 Wdi Wise Device Inc Inspection optique de support plat mettant en oeuvre une technologie d'image directe
DE102005031647A1 (de) * 2005-07-06 2007-01-11 Chromasens Gmbh Beleuchtungsvorrichtung zur Dunkelfeldbeleuchtung für eine optische Testvorrichtung und Verfahren zum optischen Abtasten eines Objektes
DE102006017841A1 (de) * 2006-04-18 2007-10-25 Carl Zeiss Microimaging Gmbh Laser-Scanning-Mikroskop mit Hauptstrahlteiler zur räumlichen Trennung von Beleuchtungs- und Detektionsstrahlung
DE102006009593B4 (de) * 2005-10-01 2008-12-18 Vistec Semiconductor Systems Gmbh Vorrichtung zur Aufnahme von mehreren Bildern von scheibenförmigen Objekten
GB0606217D0 (en) * 2006-03-29 2006-05-10 Pilkington Plc Glazing inspection
US7567344B2 (en) * 2006-05-12 2009-07-28 Corning Incorporated Apparatus and method for characterizing defects in a transparent substrate
JP4931502B2 (ja) * 2006-07-13 2012-05-16 株式会社日立ハイテクノロジーズ 表面検査方法及び検査装置
DE102007048163B4 (de) 2007-10-08 2009-06-10 Siemens Ag Verfahren und Vorrichtung zur automatischen Prüfung, ob ein Gegenstand von einer Folie bedeckt ist
JP5749641B2 (ja) * 2008-04-04 2015-07-15 ナンダ テヒノロギーズ ゲーエムベーハー 光学検査システム及び方法
KR20110043616A (ko) * 2008-07-22 2011-04-27 오르보테크 엘티디. 효과적인 원격중심 광학 시스템(ｅｔｏｓ)
DE102008057096A1 (de) * 2008-11-13 2010-05-20 Carl Zeiss Ag Nahfeldmikroskop und Beobachtungseinheit dafür
SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
US8388204B2 (en) * 2009-09-22 2013-03-05 Cyberoptics Corporation High speed, high resolution, three dimensional solar cell inspection system
US8872912B2 (en) * 2009-09-22 2014-10-28 Cyberoptics Corporation High speed distributed optical sensor inspection system
US8681211B2 (en) * 2009-09-22 2014-03-25 Cyberoptics Corporation High speed optical inspection system with adaptive focusing
US8670031B2 (en) * 2009-09-22 2014-03-11 Cyberoptics Corporation High speed optical inspection system with camera array and compact, integrated illuminator
US8894259B2 (en) * 2009-09-22 2014-11-25 Cyberoptics Corporation Dark field illuminator with large working area
JP5501848B2 (ja) * 2010-05-10 2014-05-28 株式会社ハイロックス デジタル顕微鏡
DE102012210905B4 (de) * 2012-06-26 2014-01-09 Leica Microsystems Cms Gmbh Mikroskop mit einer Beleuchtungseinrichtung
JP2014089162A (ja) * 2012-10-31 2014-05-15 Hitachi High-Technologies Corp 検査装置及び検査方法
KR101480906B1 (ko) * 2012-11-15 2015-01-12 주식회사 포스코 잔류 스케일 측정 장치 및 방법
DE102013006996A1 (de) * 2013-04-19 2014-10-23 Carl Zeiss Microscopy Gmbh Verfahren zur Beleuchtung eines Objektes in einem digitalen Lichtmikroskop, digitales Lichtmikroskop und Hellfeld-Auflichtbeleuchtungsvorrichtung für ein digitales Lichtmikroskop
DK3004838T3 (da) 2013-05-28 2022-06-20 Chemometec As Billeddannende cytometer
JP6329397B2 (ja) * 2014-03-07 2018-05-23 株式会社ダイヘン 画像検査装置及び画像検査方法
JP6362435B2 (ja) * 2014-06-05 2018-07-25 オリンパス株式会社 顕微鏡システム
JP6300655B2 (ja) * 2014-06-16 2018-03-28 オリンパス株式会社 顕微鏡システム
KR102316146B1 (ko) * 2014-08-13 2021-10-22 삼성전자주식회사 표면 검사용 광학 모듈 및 이를 포함하는 표면 검사 장치
CN107533217A (zh) 2015-03-13 2018-01-02 格尼亚Ip控股私人有限公司 用于显微技术的方法与装置
CN104897693A (zh) * 2015-06-12 2015-09-09 武汉中导光电设备有限公司 一种玻璃表面缺陷增强装置及其检测方法
CN105043982A (zh) * 2015-07-02 2015-11-11 武汉中导光电设备有限公司 一种自动光学检测系统
US10393670B1 (en) 2016-05-19 2019-08-27 Applied Vision Corporation Container inspection system
US10783624B2 (en) * 2016-07-18 2020-09-22 Instrumental, Inc. Modular optical inspection station
US10147176B1 (en) 2016-09-07 2018-12-04 Applied Vision Corporation Automated container inspection system
CN108072659B (zh) * 2016-11-11 2022-05-31 三星显示有限公司 多光学视觉设备
US10295476B1 (en) * 2018-08-14 2019-05-21 Applied Materials Israel Ltd. System and method for multiple mode inspection of a sample
CN111458343B (zh) * 2019-01-18 2024-08-06 深圳中科飞测科技股份有限公司 检测设备及检测方法
CN110108720A (zh) * 2019-05-30 2019-08-09 苏州精濑光电有限公司 光学检测装置
CN110749606A (zh) * 2019-11-14 2020-02-04 中国工程物理研究院激光聚变研究中心 一种基于光学元件的激光损伤检测方法及系统
US20210302710A1 (en) * 2020-02-24 2021-09-30 Massachusetts Institute Of Technology Bragg light source for dark-field imaging devices
CN113447485A (zh) * 2020-03-26 2021-09-28 捷普电子(新加坡)公司 光学检测方法
CN111707670B (zh) * 2020-06-28 2023-10-27 武汉精立电子技术有限公司 一种基于旋转载台的缺陷检测方法及装置
US11676266B2 (en) 2020-11-04 2023-06-13 Tokyo Electron Limited Method and apparatus for inspecting pattern collapse defects

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1943510A (en) * 1931-10-15 1934-01-16 Zeiss Carl Fa Device for light-field and darkfield illumination of microscopic objects
AT297369B (de) 1969-05-09 1972-03-27 Reichert Optische Werke Ag Beleuchtungseinrichtung für Auflicht-Mikroskope
DE2331750C3 (de) * 1973-06-22 1978-04-20 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Auflicht-Beleuchtungseinrichtung für wahlweise Hell- und Dunkelfeldbeleuchtung
DE2542075A1 (de) * 1975-09-20 1977-07-21 Leitz Ernst Gmbh Auflicht-beleuchtungseinrichtung fuer hell- und dunkelfeldbeleuchtung
US4585315A (en) * 1984-11-13 1986-04-29 International Business Machines Corporation Brightfield/darkfield microscope illuminator
DE3714830A1 (de) * 1987-05-05 1988-11-17 Leitz Ernst Gmbh Kombinierte hellfeld-dunkelfeld- auflichtbeleuchtungseinrichtung
USRE36799E (en) * 1990-06-13 2000-08-01 Nikon Corporation Projection optical apparatus using plural wavelengths of light
JP3033135B2 (ja) * 1990-06-13 2000-04-17 株式会社ニコン 投影露光装置及び方法
JPH0743313A (ja) * 1993-07-29 1995-02-14 Canon Inc 異物検査装置及びそれを用いた半導体デバイスの 製造方法
KR960015001A (ko) * 1994-10-07 1996-05-22 가나이 쓰토무 반도체 기판의 제조방법과 피검사체상의 패턴결함을 검사하기 위한 방법 및 장치
US5917588A (en) * 1996-11-04 1999-06-29 Kla-Tencor Corporation Automated specimen inspection system for and method of distinguishing features or anomalies under either bright field or dark field illumination
US6075883A (en) * 1996-11-12 2000-06-13 Robotic Vision Systems, Inc. Method and system for imaging an object or pattern
US6201892B1 (en) * 1997-02-26 2001-03-13 Acuity Imaging, Llc System and method for arithmetic operations for electronic package inspection
US6246788B1 (en) * 1997-05-30 2001-06-12 Isoa, Inc. System and method of optically inspecting manufactured devices
JPH1137719A (ja) * 1997-07-15 1999-02-12 Fujitsu Ltd 検査装置
US6661912B1 (en) * 1998-08-03 2003-12-09 Hitachi Electronics Engineering Co., Ltd. Inspecting method and apparatus for repeated micro-miniature patterns
JPH11183389A (ja) * 1997-12-18 1999-07-09 Lintec Corp 観測装置
US6061125A (en) * 1998-01-27 2000-05-09 Insight Control Systems International Dual illumination apparatus for container inspection
US6248988B1 (en) * 1998-05-05 2001-06-19 Kla-Tencor Corporation Conventional and confocal multi-spot scanning optical microscope
US6153873A (en) * 1998-05-20 2000-11-28 E. I. Dupont De Numours And Company Optical probe having an imaging apparatus
US6122046A (en) * 1998-10-02 2000-09-19 Applied Materials, Inc. Dual resolution combined laser spot scanning and area imaging inspection
JP2000162134A (ja) * 1998-12-01 2000-06-16 Nidek Co Ltd 表面検査装置
DE19903486C2 (de) * 1999-01-29 2003-03-06 Leica Microsystems Verfahren und Vorrichtung zur optischen Untersuchung von strukturierten Oberflächen von Objekten
US6327374B1 (en) * 1999-02-18 2001-12-04 Thermo Radiometrie Oy Arrangement and method for inspection of surface quality
US6198529B1 (en) * 1999-04-30 2001-03-06 International Business Machines Corporation Automated inspection system for metallic surfaces
US6552783B1 (en) * 2000-06-28 2003-04-22 Teradyne, Inc. Optical system
US7136159B2 (en) * 2000-09-12 2006-11-14 Kla-Tencor Technologies Corporation Excimer laser inspection system
US6673637B2 (en) * 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US6806951B2 (en) * 2000-09-20 2004-10-19 Kla-Tencor Technologies Corp. Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen
US6891627B1 (en) * 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US7106425B1 (en) * 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US20020109843A1 (en) * 2001-02-13 2002-08-15 Applied Materials, Inc. Method and system for registering fiducials employing backlighting techniques
JP4030815B2 (ja) * 2001-07-10 2008-01-09 ケーエルエー−テンカー テクノロジィース コーポレイション 同時のまたは連続的な多重の斜視的な試料欠陥検査のためのシステムおよび方法
JP2003149169A (ja) * 2001-11-16 2003-05-21 Tokyo Seimitsu Co Ltd ウエハ欠陥検査装置
IL148566A (en) * 2002-03-07 2007-06-17 Nova Measuring Instr Ltd Method and system for measuring overlap accuracy

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2004019108A1 *

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AU2003253422A1 (en) 2004-03-11
US7271889B2 (en) 2007-09-18
DE10239548A1 (de) 2004-03-04
US20050259245A1 (en) 2005-11-24
WO2004019108A1 (fr) 2004-03-04
JP2005536732A (ja) 2005-12-02

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