EP1485660A1 - Kälteanlage für zu kühlende teile einer einrichtung - Google Patents
Kälteanlage für zu kühlende teile einer einrichtungInfo
- Publication number
- EP1485660A1 EP1485660A1 EP03714661A EP03714661A EP1485660A1 EP 1485660 A1 EP1485660 A1 EP 1485660A1 EP 03714661 A EP03714661 A EP 03714661A EP 03714661 A EP03714661 A EP 03714661A EP 1485660 A1 EP1485660 A1 EP 1485660A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cold
- line
- parts
- vacuum
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
- F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/06—Several compression cycles arranged in parallel
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/17—Re-condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/14—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/04—Cooling
Definitions
- Refrigeration system for parts of a facility to be cooled
- the invention relates to a refrigeration system with a cold head, which is thermally coupled to parts of a device to be cooled via a line system for a refrigerant circulating according to a thermosiphon effect.
- a corresponding refrigeration system can be found in WO 00/13296 A.
- metal oxide superconductor materials with transition temperatures T c have been known since 1987 of over 77 K. The latter materials are also referred to as high (high) T c superconductor materials or HTS materials.
- cooling units in the form of so-called cryocoolers with a closed He compressed gas circuit are preferably used in the temperature range mentioned.
- cryocoolers are in particular of the Gifford-McMahon or Stirling type or are designed as so-called pulse tube coolers.
- Corresponding cold Units also have the advantage that the cooling capacity is available at the push of a button and the user is spared the handling of cryogenic liquids.
- a device of superconductivity technology such as a magnetic coil or a transformer winding is only indirectly cooled by heat conduction to a cold head of a refrigerator (cf. e.g. also "Proc. 16 th Int. Cryog. Engng.Conf. [ICEC 16p, Kitakyushu , JP, May 20-24, 1996, Elsevier Science Verlag, 1997, pages 1109 to 1129).
- a corresponding cooling technology is also provided for the superconducting rotor of an electrical machine which can be gathered from the WO-A document mentioned at the beginning.
- the rotor contains a winding made of HTS conductors, which can be kept at a desired operating temperature well below 77 K using a cooling unit designed as a cryocooler.
- the refrigeration unit contains a cold head located outside the rotor. Its colder side is thermally coupled to the winding via neon as a refrigerant, which circulates using a thermophone effect in a line system that has parts that protrude into the rotor up to the winding. In the event of a malfunction in the refrigeration unit, in particular its cold head, in the event of a repair or replacement thereof, the operating state of the winding to be cooled can hardly be maintained.
- EP 0 696 380 B1 also shows a superconducting magnet of an MRI device which has a refrigeration system for cooling its superconducting winding, which comprises two refrigeration units in the form of cryocoolers.
- the two cold heads of these cryocoolers are thermally coupled to a solid heat-conducting body, which is in heat-conducting connection with the parts of the winding to be cooled.
- the cold heads of the two cryocoolers are each housed in their own vacuum space, so that the second can be switched off during operation of one cryocooler and / or is interchangeable.
- additional heat conduction losses due to a cold head that has possibly been switched off have to be accepted as a rule.
- the object of the present invention is to design the refrigeration system with the features mentioned at the outset such that when cooling using a refrigerant circulating in line parts using a thermosiphon effect, continuous cooling operation is possible without the risk of significant heat conduction losses the circulating refrigerant is present.
- At least one further cold head is provided, which is connected in parallel to the first cold head by means of a branching of the line system, line parts of the line system running between the branching and the two cold heads being at least partially poorly heat-conducting.
- a poorly heat-conducting pipe section is understood here to mean that the heat introduced into the area of the respective cold head by its tubular material is negligibly small in comparison to the available cooling capacity of the head.
- the refrigeration system designed according to the invention thus comprises several separate areas, in which the recondensation of the refrigerant or one in a thermosiphon line system
- thermosiphon line system allows, with negligible additional heat input, economical operation at part load, in which not all of them built-in cold heads must be in operation at the same time.
- This makes it possible, in particular, to replace a cold head, for example for maintenance or repair reasons, while at the same time maintaining the operating temperature on the parts of the superconducting device to be cooled with the aid of the remaining cold head or cold heads.
- the branched line sections can be designed to be sufficiently flexible, for example in the area of bends, to allow mechanical compensation of temperature-related changes in length, which inevitably occur in cold heads at different temperature levels.
- the poorly heat-conducting line pieces can preferably each consist at least partially of a poorly heat-conductive metallic material or, if appropriate, even of a plastic material. This not only achieves the desired thermal decoupling of the two cold heads from the parts to be cooled via the wall material of the pipe sections; any stretching problems are also manageable.
- the device to be cooled can be located in the interior of a vacuum vessel, the cold heads with end parts protruding into the vacuum vessel, to which the line pieces are thermally coupled. An undesired introduction of heat into the area of the device to be cooled can thus be limited.
- the cold heads can advantageously have cold surfaces at the ends to which end spaces of the line pieces are thermally coupled, in which cooling or condensation of the refrigerant takes place.
- a refrigerant flow using the desired thermosiphon effect can be stimulated in this way.
- the end parts of the cold heads can be surrounded by separate (own) vacuum (partial) spaces, in particular to facilitate maintenance or repair interventions, these, for example, in the region of the ends of the cold heads or on the line pieces by means of poorly heat-conductive, vacuum-tight connecting pieces can be separable from the rest of the interior of the vacuum vessel.
- the system according to the invention is particularly suitable for parts of the device to be cooled which contain superconducting material, preferably high-T 0 superconducting material, which is also to be kept at a temperature below 77K.
- thermosiphon line systems with different refrigerants can be planned.
- FIG. 1 shows a first embodiment of a refrigeration system
- FIG. 2 shows a special further development of this system.
- corresponding parts are provided with the same reference symbols.
- the refrigeration system according to the invention can be used wherever there are multiple cold sources for cooling spatially extensive parts of any facility is provided.
- the parts to be cooled can be metallic or non-metallic, electrically conductive, in particular superconducting, or also non-conductive.
- the parts to be cooled are a superconducting winding of an electrical machine (see, for example, WO 00/13296 A or US 5,482,919 A) or a superconducting magnet (for example, see US 5,396,206 A or US) 6,246,308 Bl).
- a refrigeration system indicated in FIG. 1 can preferably be provided for a corresponding application.
- the refrigeration system is intended to cool parts 3a of a device 3, such as a superconducting magnet, not shown in the figure.
- the cooling takes place with the aid of a liquid and / or gaseous refrigerant K or working medium such as He, for example, which circulates in a line system 5 using a thermosiphon effect.
- the line system 5 can therefore also be referred to as a thermosiphon line system.
- the cooling capacity is provided by two cooling units 7a and 8a, of which only their cold heads 7 and 8 are indicated in the figure.
- These cold heads are intended to be located essentially outside a vacuum vessel 9, which is used for thermal insulation of the device 3 accommodated in its interior 9a with its parts 3a to be cooled.
- the cold heads only protrude into the interior 9a of the vessel with thermally highly conductive end parts 7b and 8b, where they form cold surfaces 7c and 8c at their lower ends facing the device 3.
- thermosiphon line system 5 with a plurality of separate condenser spaces 11a, 12a, in which the refrigerant K can recondense as part of a thermosiphon process.
- the line pieces 11 and 12 merge at a branch 13 of the line system 5 into a common line part 14, which leads into the area of the device 3 to be cooled.
- the line pieces 11 and 12 are to be at least partially of poor thermal conductivity. In this way a mutual thermal decoupling of the two cold heads is possible, so that a single condenser space 11a or 12a e.g. can be warmed up to room temperature without significant heat being supplied to the parts to be cooled or to the refrigerant K located in the interior of the line system.
- the line pieces 11 and 12 can advantageously be designed in such a way that different expansion compensation is also possible.
- the line pieces 11 and 12 each made of poorly heat-conducting metals such. B. consist of special steels or Cu alloys. Special low-temperature plastic materials, which can also be fiber-reinforced, or ceramic materials may also be considered. Different materials and / or different design forms can also be provided for these line pieces.
- the line pieces can e.g. Bends, for example spiral shapes, which allow thermal changes in length to compensate.
- the second one could take over (emergency) cooling after a cooling period, during which time the first one can be warmed up, replaced or repaired without the cooling of the System is affected.
- the cooling period if maintenance work can be carried out on a cold head without impairing the cooling, it should be possible to separate the vacuum spaces required for thermal insulation, on the one hand, for the thermosiphon line system and, on the other hand, the cold heads. Then each cold head can be removed individually without affecting the thermal insulation of the rest of the thermosiphon line system.
- a corresponding embodiment is shown in Figure 2.
- the two end parts 7b and 8b of their cold heads 7 and 8 are advantageously each in a separate vacuum subspace 15a and 15b.
- thermosiphon line system 5 and the cold heads 7 and 8 are advantageously made as poorly heat-conducting as possible. According to FIG. 2, this connection is made between the warm vacuum vessel 9 and the thermosyhon line system 5, which is cold during operation, in the region of its condenser spaces 11a and 12a.
- this connection can also be provided directly on the pipe system at other points on the line sections 11 and 12 with a significantly smaller diameter.
- ⁇ 16 and 17 respectively designated lines, a corresponding separation can, for example, according to the cross-sectionally enlarged end spaces 11a and 12a schedule.
- a refrigeration system according to the invention can of course also be designed with a plurality of thermosiphon line systems, at least one of which is a parallel connection of must have two cold heads by branching this system.
- thermosiphon line systems at least one of which is a parallel connection of must have two cold heads by branching this system.
- Several such systems can be used in parallel with different refrigerants and thus, depending on the requirements of the application, graded working temperatures, eg for pre-cooling, a quasi-continuous thermal coupling or a quasi-continuous thermal coupling due to overlapping working temperature ranges of the refrigerants.
- graded working temperatures eg for pre-cooling
- a quasi-continuous thermal coupling or a quasi-continuous thermal coupling due to overlapping working temperature ranges of the refrigerants.
- condenser rooms with separate condensation areas for the different work equipment or several individual condenser rooms are attached to a cold head or the cold heads.
- the refrigerant K only consists of a single component, such as He or Ne.
- mixtures of at least two refrigerant components such as N 2 + Ne with different condensation temperatures can also be provided as refrigerants.
- the gas with the highest condensation temperature can initially condense and form a closed circuit for heat transfer to the parts of the device to be cooled. After these parts have been pre-cooled to the triple point temperature of this gas, it will freeze out in the region of the condenser spaces, whereupon at least one cold head is cooled down to the condensation temperature of the next gas mixture component.
- the individual components of the gas mixture can be selected in such a way that it is advantageous to implement quasi-continuous cooling with optimal utilization of the cooling capacity of the respective cold head.
- the operation of a cold head at a higher temperature at the beginning of the cooling phase leads to a correspondingly higher cooling capacity and thus permits significantly shorter cooling times.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10211568 | 2002-03-15 | ||
DE10211568A DE10211568B4 (de) | 2002-03-15 | 2002-03-15 | Kälteanlage für zu kühlende Teile einer Einrichtung |
PCT/DE2003/000619 WO2003078906A1 (de) | 2002-03-15 | 2003-02-26 | Kälteanlage für zu kühlende teile einer einrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1485660A1 true EP1485660A1 (de) | 2004-12-15 |
EP1485660B1 EP1485660B1 (de) | 2007-01-24 |
Family
ID=27815671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03714661A Expired - Fee Related EP1485660B1 (de) | 2002-03-15 | 2003-02-26 | Kälteanlage für zu kühlende teile einer einrichtung |
Country Status (5)
Country | Link |
---|---|
US (1) | US7174737B2 (de) |
EP (1) | EP1485660B1 (de) |
JP (1) | JP3955022B2 (de) |
DE (2) | DE10211568B4 (de) |
WO (1) | WO2003078906A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10361885B3 (de) * | 2003-12-19 | 2004-12-09 | Siemens Ag | Kälteanlage mit einem eine Anschlussfläche für einen Kaltkopf aufweisenden Kondensor |
TW200605758A (en) * | 2004-07-21 | 2006-02-01 | Metal Ind Res & Dev Ct | Closed-loop cycling type heat-dissipation apparatus |
DE102005002361B3 (de) * | 2005-01-18 | 2006-06-08 | Siemens Ag | Kälteanlage eines Gerätes der Supraleitungstechnik mit mehreren Kaltköpfen |
JP4563281B2 (ja) * | 2005-08-10 | 2010-10-13 | 住友重機械工業株式会社 | 冷凍機冷却型超電導磁石装置 |
DE102006046688B3 (de) | 2006-09-29 | 2008-01-24 | Siemens Ag | Kälteanlage mit einem warmen und einem kalten Verbindungselement und einem mit den Verbindungselementen verbundenen Wärmerohr |
DE102006059139A1 (de) | 2006-12-14 | 2008-06-19 | Siemens Ag | Kälteanlage mit einem warmen und einem kalten Verbindungselement und einem mit den Verbindungselementen verbundenen Wärmerohr |
EP2161758A1 (de) * | 2008-09-05 | 2010-03-10 | Flexucell ApS | Solarzelle und Verfahren zu dessen Herstellung |
US8676282B2 (en) | 2010-10-29 | 2014-03-18 | General Electric Company | Superconducting magnet coil support with cooling and method for coil-cooling |
FR2975176B1 (fr) * | 2011-05-09 | 2016-03-18 | Air Liquide | Dispositif et procede de refroidissement cryogenique |
JP2013144099A (ja) * | 2011-12-12 | 2013-07-25 | Toshiba Corp | 磁気共鳴イメージング装置 |
CN109945596B (zh) * | 2019-03-05 | 2024-01-16 | 中国工程物理研究院激光聚变研究中心 | 温度梯度型低温环境制备装置 |
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JPS61234059A (ja) * | 1985-04-10 | 1986-10-18 | Hitachi Ltd | 半導体素子の沸謄冷却装置 |
JPH0724293B2 (ja) * | 1987-09-30 | 1995-03-15 | 株式会社日立製作所 | 沸騰冷却装置 |
JPH04159467A (ja) * | 1990-10-22 | 1992-06-02 | Sanyo Electric Co Ltd | 極低温膨張機 |
US5333460A (en) * | 1992-12-21 | 1994-08-02 | Carrier Corporation | Compact and serviceable packaging of a self-contained cryocooler system |
US5482919A (en) * | 1993-09-15 | 1996-01-09 | American Superconductor Corporation | Superconducting rotor |
US5430423A (en) * | 1994-02-25 | 1995-07-04 | General Electric Company | Superconducting magnet having a retractable cryocooler sleeve assembly |
US5396206A (en) * | 1994-03-14 | 1995-03-07 | General Electric Company | Superconducting lead assembly for a cryocooler-cooled superconducting magnet |
JP2995144B2 (ja) * | 1994-07-15 | 1999-12-27 | 日本原子力研究所 | 冷却装置を用いた検出装置 |
US6104934A (en) * | 1995-08-09 | 2000-08-15 | Spectral Solutions, Inc. | Cryoelectronic receiver front end |
US6173761B1 (en) * | 1996-05-16 | 2001-01-16 | Kabushiki Kaisha Toshiba | Cryogenic heat pipe |
US6173577B1 (en) * | 1996-08-16 | 2001-01-16 | American Superconductor Corporation | Methods and apparatus for cooling systems for cryogenic power conversion electronics |
JP3547916B2 (ja) * | 1996-09-20 | 2004-07-28 | 三洋電機株式会社 | クライオポンプ |
JPH10282200A (ja) * | 1997-04-09 | 1998-10-23 | Aisin Seiki Co Ltd | 超電導磁石システムの冷却装置 |
US5953930A (en) * | 1998-03-31 | 1999-09-21 | International Business Machines Corporation | Evaporator for use in an extended air cooling system for electronic components |
JPH11288809A (ja) | 1998-03-31 | 1999-10-19 | Toshiba Corp | 超電導マグネット装置 |
CA2295565A1 (en) * | 1998-05-22 | 1999-12-02 | Sumitomo Electric Industries, Ltd. | Method and device for cooling superconductor |
US6376943B1 (en) * | 1998-08-26 | 2002-04-23 | American Superconductor Corporation | Superconductor rotor cooling system |
JP2000114609A (ja) * | 1998-10-07 | 2000-04-21 | Fujitsu Ltd | 断熱槽、恒温槽およびクライオスタット |
JP3843186B2 (ja) * | 1998-11-10 | 2006-11-08 | 住友重機械工業株式会社 | 極低温冷凍機のオーバーホール装置およびオーバーホ−ル方法 |
US6122920A (en) * | 1998-12-22 | 2000-09-26 | The United States Of America As Represented By The United States Department Of Energy | High specific surface area aerogel cryoadsorber for vacuum pumping applications |
US6181228B1 (en) | 1999-11-09 | 2001-01-30 | General Electric Company | Superconductive magnet including a cryocooler coldhead |
US6761212B2 (en) * | 2000-05-25 | 2004-07-13 | Liebert Corporation | Spiral copper tube and aluminum fin thermosyphon heat exchanger |
DE10039964A1 (de) * | 2000-08-16 | 2002-03-07 | Siemens Ag | Supraleitungseinrichtung mit einer Kälteeinheit zur Kühlung einer rotierenden, supraleitenden Wicklung |
US6553773B2 (en) * | 2001-05-15 | 2003-04-29 | General Electric Company | Cryogenic cooling system for rotor having a high temperature super-conducting field winding |
US6536510B2 (en) * | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
US6388882B1 (en) * | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
-
2002
- 2002-03-15 DE DE10211568A patent/DE10211568B4/de not_active Expired - Fee Related
-
2003
- 2003-02-26 WO PCT/DE2003/000619 patent/WO2003078906A1/de active IP Right Grant
- 2003-02-26 EP EP03714661A patent/EP1485660B1/de not_active Expired - Fee Related
- 2003-02-26 JP JP2003576874A patent/JP3955022B2/ja not_active Expired - Fee Related
- 2003-02-26 DE DE50306376T patent/DE50306376D1/de not_active Expired - Lifetime
- 2003-02-26 US US10/507,848 patent/US7174737B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO03078906A1 * |
Also Published As
Publication number | Publication date |
---|---|
US7174737B2 (en) | 2007-02-13 |
DE10211568A1 (de) | 2003-10-09 |
DE10211568B4 (de) | 2004-01-29 |
JP3955022B2 (ja) | 2007-08-08 |
JP2005521019A (ja) | 2005-07-14 |
WO2003078906A1 (de) | 2003-09-25 |
US20050150242A1 (en) | 2005-07-14 |
EP1485660B1 (de) | 2007-01-24 |
DE50306376D1 (de) | 2007-03-15 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20040722 |
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