EP1484792A4 - Procede de meulage de la surface arriere d'une plaquette semi-conductrice - Google Patents

Procede de meulage de la surface arriere d'une plaquette semi-conductrice

Info

Publication number
EP1484792A4
EP1484792A4 EP03744040A EP03744040A EP1484792A4 EP 1484792 A4 EP1484792 A4 EP 1484792A4 EP 03744040 A EP03744040 A EP 03744040A EP 03744040 A EP03744040 A EP 03744040A EP 1484792 A4 EP1484792 A4 EP 1484792A4
Authority
EP
European Patent Office
Prior art keywords
grinding
rear surface
semiconductor wafer
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03744040A
Other languages
German (de)
English (en)
Other versions
EP1484792A1 (fr
Inventor
Kazuya Fukuda
Takashi Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002070773A external-priority patent/JP2003273053A/ja
Priority claimed from JP2002374230A external-priority patent/JP2004207459A/ja
Application filed by Disco Corp filed Critical Disco Corp
Publication of EP1484792A1 publication Critical patent/EP1484792A1/fr
Publication of EP1484792A4 publication Critical patent/EP1484792A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP03744040A 2002-03-14 2003-03-10 Procede de meulage de la surface arriere d'une plaquette semi-conductrice Withdrawn EP1484792A4 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002070773 2002-03-14
JP2002070773A JP2003273053A (ja) 2002-03-14 2002-03-14 平面研削方法
JP2002374230A JP2004207459A (ja) 2002-12-25 2002-12-25 半導体ウェーハの研削方法
JP2002374230 2002-12-25
PCT/JP2003/002797 WO2003077297A1 (fr) 2002-03-14 2003-03-10 Procede de meulage de la surface arriere d'une plaquette semi-conductrice

Publications (2)

Publication Number Publication Date
EP1484792A1 EP1484792A1 (fr) 2004-12-08
EP1484792A4 true EP1484792A4 (fr) 2006-08-02

Family

ID=27806990

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03744040A Withdrawn EP1484792A4 (fr) 2002-03-14 2003-03-10 Procede de meulage de la surface arriere d'une plaquette semi-conductrice

Country Status (7)

Country Link
US (1) US20040097084A1 (fr)
EP (1) EP1484792A4 (fr)
KR (1) KR20040089438A (fr)
CN (1) CN1509495A (fr)
AU (1) AU2003211886A1 (fr)
TW (1) TWI263556B (fr)
WO (1) WO2003077297A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004349649A (ja) * 2003-05-26 2004-12-09 Shinko Electric Ind Co Ltd ウエハーの薄加工方法
JP4647228B2 (ja) * 2004-04-01 2011-03-09 株式会社ディスコ ウェーハの加工方法
WO2006010289A2 (fr) * 2004-07-30 2006-02-02 Synova S.A. Procede pour separer des unites electroniques de type circuits (puces) qui sont disposees sur une plaquette en semi-conducteur
KR100596923B1 (ko) * 2004-12-28 2006-07-06 동부일렉트로닉스 주식회사 웨이퍼 베벨영역 라운딩 처리를 통한 반도체 소자의 수율향상방법
JP2007019379A (ja) * 2005-07-11 2007-01-25 Disco Abrasive Syst Ltd ウェーハの加工方法
US7786551B2 (en) * 2005-09-16 2010-08-31 Stats Chippac Ltd. Integrated circuit system with wafer trimming
DE112006003839T5 (de) * 2006-04-21 2009-02-26 Infineon Technologies Ag Verfahren zur Herstellung eines dünnen Halbleiter-Chips
US8389099B1 (en) 2007-06-01 2013-03-05 Rubicon Technology, Inc. Asymmetrical wafer configurations and method for creating the same
CN101941181B (zh) * 2009-07-03 2012-10-17 日月光半导体制造股份有限公司 晶圆的研磨方法
CN108237468B (zh) * 2016-12-26 2021-08-03 台湾积体电路制造股份有限公司 厚度缩减装置及厚度缩减方法
CN109499984B (zh) * 2018-10-13 2022-03-18 广东嗨学云教育科技有限公司 一种集成电路通用制造装置
CN111633852A (zh) * 2020-04-16 2020-09-08 江苏京创先进电子科技有限公司 一种晶圆芯片的去边加工方法及其应用的划片机
CN111653498A (zh) * 2020-06-12 2020-09-11 长江存储科技有限责任公司 一种半导体结构及其研磨方法
JP7747466B2 (ja) * 2021-08-25 2025-10-01 株式会社ディスコ チップの製造方法
CN115256108B (zh) * 2022-07-12 2023-12-19 山东润马光能科技有限公司 一种浮动式晶圆边缘打磨方法及装置
CN115319639A (zh) * 2022-09-22 2022-11-11 西安奕斯伟材料科技有限公司 研磨装置、研磨方法及硅片
CN117381654A (zh) * 2023-11-06 2024-01-12 星钥(珠海)半导体有限公司 一种晶圆边缘修饰方法及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745568A (ja) * 1993-07-30 1995-02-14 Hitachi Ltd 半導体ウエハの研削方法
JPH0837169A (ja) * 1994-07-26 1996-02-06 Hitachi Ltd 半導体基板の研削方法及び研削装置及び半導体装置の製造方法
JP2000068171A (ja) * 1998-08-19 2000-03-03 Japan Energy Corp 半導体ウエハーおよびその製造方法
JP2000173961A (ja) * 1998-12-01 2000-06-23 Sharp Corp 半導体装置の製造方法および製造装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504544B1 (fr) * 1970-12-21 1975-02-20
US4054010A (en) * 1976-01-20 1977-10-18 Headway Research, Inc. Apparatus for grinding edges of planar workpieces
US4339896A (en) * 1977-06-13 1982-07-20 General Electric Company Abrasive compact dressing tools, tool fabrication methods for dressing a grinding wheel with such tools
JPH0624179B2 (ja) * 1989-04-17 1994-03-30 信越半導体株式会社 半導体シリコンウェーハおよびその製造方法
JP3580600B2 (ja) * 1995-06-09 2004-10-27 株式会社ルネサステクノロジ 半導体装置の製造方法およびそれに使用される半導体ウエハ並びにその製造方法
US5928066A (en) * 1995-12-05 1999-07-27 Shin-Etsu Handotai Co., Ltd. Apparatus for polishing peripheral portion of wafer
JP3336866B2 (ja) * 1996-08-27 2002-10-21 信越半導体株式会社 気相成長用シリコン単結晶基板の製造方法
JP3197253B2 (ja) * 1998-04-13 2001-08-13 株式会社日平トヤマ ウエーハの面取り方法
JP4109371B2 (ja) * 1999-01-28 2008-07-02 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハ
JP4846915B2 (ja) * 2000-03-29 2011-12-28 信越半導体株式会社 貼り合わせウェーハの製造方法
JP2001308039A (ja) * 2000-04-25 2001-11-02 Speedfam Co Ltd 積層膜除去装置及びその使用方法
US6465353B1 (en) * 2000-09-29 2002-10-15 International Rectifier Corporation Process of thinning and blunting semiconductor wafer edge and resulting wafer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745568A (ja) * 1993-07-30 1995-02-14 Hitachi Ltd 半導体ウエハの研削方法
JPH0837169A (ja) * 1994-07-26 1996-02-06 Hitachi Ltd 半導体基板の研削方法及び研削装置及び半導体装置の製造方法
JP2000068171A (ja) * 1998-08-19 2000-03-03 Japan Energy Corp 半導体ウエハーおよびその製造方法
JP2000173961A (ja) * 1998-12-01 2000-06-23 Sharp Corp 半導体装置の製造方法および製造装置

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 05 30 June 1995 (1995-06-30) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 06 28 June 1996 (1996-06-28) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09 13 October 2000 (2000-10-13) *
See also references of WO03077297A1 *

Also Published As

Publication number Publication date
WO2003077297A1 (fr) 2003-09-18
TW200305480A (en) 2003-11-01
US20040097084A1 (en) 2004-05-20
AU2003211886A1 (en) 2003-09-22
CN1509495A (zh) 2004-06-30
TWI263556B (en) 2006-10-11
KR20040089438A (ko) 2004-10-21
EP1484792A1 (fr) 2004-12-08

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Effective date: 20060816