EP1246951A4 - Verfahren und vorrichtung zum beschichten eines substrates im vakuum - Google Patents

Verfahren und vorrichtung zum beschichten eines substrates im vakuum

Info

Publication number
EP1246951A4
EP1246951A4 EP00975328A EP00975328A EP1246951A4 EP 1246951 A4 EP1246951 A4 EP 1246951A4 EP 00975328 A EP00975328 A EP 00975328A EP 00975328 A EP00975328 A EP 00975328A EP 1246951 A4 EP1246951 A4 EP 1246951A4
Authority
EP
European Patent Office
Prior art keywords
vacuum
coating
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00975328A
Other languages
English (en)
French (fr)
Other versions
EP1246951A1 (de
Inventor
Gary L Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurt J Lesker Co
Original Assignee
Kurt J Lesker Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurt J Lesker Co filed Critical Kurt J Lesker Co
Publication of EP1246951A1 publication Critical patent/EP1246951A1/de
Publication of EP1246951A4 publication Critical patent/EP1246951A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
EP00975328A 1999-10-22 2000-10-20 Verfahren und vorrichtung zum beschichten eines substrates im vakuum Withdrawn EP1246951A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16109499P 1999-10-22 1999-10-22
US161094P 1999-10-22
PCT/US2000/029099 WO2001031081A1 (en) 1999-10-22 2000-10-20 Method and apparatus for coating a substrate in a vacuum

Publications (2)

Publication Number Publication Date
EP1246951A1 EP1246951A1 (de) 2002-10-09
EP1246951A4 true EP1246951A4 (de) 2004-10-13

Family

ID=22579796

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00975328A Withdrawn EP1246951A4 (de) 1999-10-22 2000-10-20 Verfahren und vorrichtung zum beschichten eines substrates im vakuum

Country Status (9)

Country Link
EP (1) EP1246951A4 (de)
JP (1) JP2003513169A (de)
KR (1) KR100495751B1 (de)
CN (1) CN1175126C (de)
AU (1) AU1339401A (de)
CA (1) CA2388178A1 (de)
DE (1) DE10085115T1 (de)
TW (1) TW574396B (de)
WO (1) WO2001031081A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW490714B (en) 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
US20020011205A1 (en) 2000-05-02 2002-01-31 Shunpei Yamazaki Film-forming apparatus, method of cleaning the same, and method of manufacturing a light-emitting device
JP4704605B2 (ja) * 2001-05-23 2011-06-15 淳二 城戸 連続蒸着装置、蒸着装置及び蒸着方法
SG113448A1 (en) * 2002-02-25 2005-08-29 Semiconductor Energy Lab Fabrication system and a fabrication method of a light emitting device
KR100473485B1 (ko) * 2002-03-19 2005-03-09 주식회사 이노벡스 유기 반도체 소자 박막 제작을 위한 선형 증발원
US7309269B2 (en) 2002-04-15 2007-12-18 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating light-emitting device and apparatus for manufacturing light-emitting device
US6749906B2 (en) 2002-04-25 2004-06-15 Eastman Kodak Company Thermal physical vapor deposition apparatus with detachable vapor source(s) and method
US20040035360A1 (en) 2002-05-17 2004-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
TWI277363B (en) 2002-08-30 2007-03-21 Semiconductor Energy Lab Fabrication system, light-emitting device and fabricating method of organic compound-containing layer
AU2003263609A1 (en) 2002-09-20 2004-04-08 Semiconductor Energy Laboratory Co., Ltd. Fabrication system and manufacturing method of light emitting device
US7211461B2 (en) 2003-02-14 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4493926B2 (ja) 2003-04-25 2010-06-30 株式会社半導体エネルギー研究所 製造装置
US7211454B2 (en) 2003-07-25 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate
US8123862B2 (en) 2003-08-15 2012-02-28 Semiconductor Energy Laboratory Co., Ltd. Deposition apparatus and manufacturing apparatus
JP4551996B2 (ja) * 2003-10-09 2010-09-29 グローバル・オーエルイーディー・テクノロジー・リミテッド・ライアビリティ・カンパニー 蒸発装置
US20050241585A1 (en) * 2004-04-30 2005-11-03 Eastman Kodak Company System for vaporizing materials onto a substrate surface
ITMI20042279A1 (it) * 2004-11-24 2005-02-24 Getters Spa Sistema dispensatore di metalli alcalini in grado di dispensare quantita' elevate di metalli
JP2006225757A (ja) * 2005-01-21 2006-08-31 Mitsubishi Heavy Ind Ltd 真空蒸着装置
KR100635496B1 (ko) * 2005-02-25 2006-10-17 삼성에스디아이 주식회사 격벽을 구비하는 측면 분사형 선형 증발원 및 그 증발원을구비하는 증착장치
US7433141B2 (en) 2005-03-09 2008-10-07 Tandberg Data Corporation Data randomization for rewriting in recording/reproduction apparatus
JP4696710B2 (ja) * 2005-06-15 2011-06-08 ソニー株式会社 蒸着成膜装置および蒸着源
KR100745619B1 (ko) * 2006-04-11 2007-08-02 한국전기연구원 플룸 형상 제어 레이저 증착 시스템
KR101108152B1 (ko) * 2009-04-30 2012-01-31 삼성모바일디스플레이주식회사 증착 소스
KR101094299B1 (ko) 2009-12-17 2011-12-19 삼성모바일디스플레이주식회사 선형 증발원 및 이를 포함하는 증착 장치
KR102077803B1 (ko) * 2013-05-21 2020-02-17 삼성디스플레이 주식회사 증착원 및 유기층 증착 장치
CN104178734B (zh) * 2014-07-21 2016-06-15 京东方科技集团股份有限公司 蒸发镀膜装置
KR102319998B1 (ko) * 2015-01-22 2021-11-01 삼성디스플레이 주식회사 볼륨 가변형 도가니를 구비한 증착원
KR102488260B1 (ko) * 2016-03-07 2023-01-13 삼성디스플레이 주식회사 증착 장치 및 표시 장치의 제조 방법
CN106148878B (zh) * 2016-06-24 2018-06-08 中南大学 一种模拟高温喷镀过程的装置及其使用方法

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB685269A (en) * 1951-02-02 1952-12-31 Nat Res Corp Apparatus and process for coating a substrate with a metal
DE970246C (de) * 1948-10-02 1958-08-28 Siemens Ag Vorrichtung zur laufenden Bedampfung endloser Gebilde
US3746502A (en) * 1971-12-20 1973-07-17 Xerox Corp Evaporation crucible
DE2436431A1 (de) * 1974-07-29 1976-02-12 Licentia Gmbh Verdampfer zum herstellen von aufdampfschichten
JPS57169082A (en) * 1981-04-08 1982-10-18 Mitsubishi Heavy Ind Ltd Continuous vacuum vapor-depositing method
JPS5943869A (ja) * 1982-09-04 1984-03-12 Konishiroku Photo Ind Co Ltd 蒸着方法
GB2211209A (en) * 1987-10-16 1989-06-28 Philips Electronic Associated A method of forming a defect mixed oxide
US4903165A (en) * 1986-08-01 1990-02-20 Metalvuoto Films S.P.A. Process and apparatus for manufacturing metallized films for electric capacitors and products thus obtained
EP0489443A1 (de) * 1990-12-06 1992-06-10 Xerox Corporation Vakuum-Aufdampfvorrichtung
US5265189A (en) * 1991-07-15 1993-11-23 Leybold Aktiengesellschaft Serial evaporator for vacuum vapor depositing apparatus
DE4422697C1 (de) * 1994-06-29 1996-01-25 Zsw Verdampferquelle für eine Aufdampfanlage und ihre Verwendung
US5544618A (en) * 1991-12-04 1996-08-13 Emcore Corp Apparatus for depositing a coating on a substrate
GB2339800A (en) * 1998-07-24 2000-02-09 Gen Vacuum Equip Ltd Vacuum deposition on a moving web using a radiant heat supply
US6082296A (en) * 1999-09-22 2000-07-04 Xerox Corporation Thin film deposition chamber

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US4023523A (en) * 1975-04-23 1977-05-17 Xerox Corporation Coater hardware and method for obtaining uniform photoconductive layers on a xerographic photoreceptor
US4264803A (en) * 1978-01-10 1981-04-28 Union Carbide Corporation Resistance-heated pyrolytic boron nitride coated graphite boat for metal vaporization
US4332838A (en) * 1980-09-24 1982-06-01 Wegrzyn James E Particulate thin film fabrication process
DE3330092A1 (de) * 1983-08-20 1985-03-07 Leybold-Heraeus GmbH, 5000 Köln Verfahren zum einstellen der oertlichen verdampfungsleistung an verdampfern in vakuumaufdampfprozessen
US5182567A (en) * 1990-10-12 1993-01-26 Custom Metallizing Services, Inc. Retrofittable vapor source for vacuum metallizing utilizing spatter reduction means
DE4203632C2 (de) * 1992-02-08 2003-01-23 Applied Films Gmbh & Co Kg Vakuumbeschichtungsanlage
US5803976A (en) * 1993-11-09 1998-09-08 Imperial Chemical Industries Plc Vacuum web coating
US5433791A (en) * 1994-05-26 1995-07-18 Hughes Aircraft Company MBE apparatus with photo-cracker cell
JPH0853763A (ja) * 1994-06-06 1996-02-27 Matsushita Electric Ind Co Ltd 薄膜の製造方法
US5709753A (en) * 1995-10-27 1998-01-20 Specialty Coating Sysetms, Inc. Parylene deposition apparatus including a heated and cooled dimer crucible

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE970246C (de) * 1948-10-02 1958-08-28 Siemens Ag Vorrichtung zur laufenden Bedampfung endloser Gebilde
GB685269A (en) * 1951-02-02 1952-12-31 Nat Res Corp Apparatus and process for coating a substrate with a metal
US3746502A (en) * 1971-12-20 1973-07-17 Xerox Corp Evaporation crucible
DE2436431A1 (de) * 1974-07-29 1976-02-12 Licentia Gmbh Verdampfer zum herstellen von aufdampfschichten
JPS57169082A (en) * 1981-04-08 1982-10-18 Mitsubishi Heavy Ind Ltd Continuous vacuum vapor-depositing method
JPS5943869A (ja) * 1982-09-04 1984-03-12 Konishiroku Photo Ind Co Ltd 蒸着方法
US4903165A (en) * 1986-08-01 1990-02-20 Metalvuoto Films S.P.A. Process and apparatus for manufacturing metallized films for electric capacitors and products thus obtained
GB2211209A (en) * 1987-10-16 1989-06-28 Philips Electronic Associated A method of forming a defect mixed oxide
EP0489443A1 (de) * 1990-12-06 1992-06-10 Xerox Corporation Vakuum-Aufdampfvorrichtung
US5265189A (en) * 1991-07-15 1993-11-23 Leybold Aktiengesellschaft Serial evaporator for vacuum vapor depositing apparatus
US5544618A (en) * 1991-12-04 1996-08-13 Emcore Corp Apparatus for depositing a coating on a substrate
DE4422697C1 (de) * 1994-06-29 1996-01-25 Zsw Verdampferquelle für eine Aufdampfanlage und ihre Verwendung
GB2339800A (en) * 1998-07-24 2000-02-09 Gen Vacuum Equip Ltd Vacuum deposition on a moving web using a radiant heat supply
US6082296A (en) * 1999-09-22 2000-07-04 Xerox Corporation Thin film deposition chamber

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 0070, no. 11 (C - 145) 18 January 1983 (1983-01-18) *
PATENT ABSTRACTS OF JAPAN vol. 008, no. 134 (C - 230) 21 June 1984 (1984-06-21) *
See also references of WO0131081A1 *

Also Published As

Publication number Publication date
CN1402800A (zh) 2003-03-12
CA2388178A1 (en) 2001-05-03
CN1175126C (zh) 2004-11-10
DE10085115T1 (de) 2002-11-07
AU1339401A (en) 2001-05-08
TW574396B (en) 2004-02-01
JP2003513169A (ja) 2003-04-08
EP1246951A1 (de) 2002-10-09
KR100495751B1 (ko) 2005-06-17
KR20020068039A (ko) 2002-08-24
WO2001031081A1 (en) 2001-05-03

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