JPS57169082A - Continuous vacuum vapor-depositing method - Google Patents
Continuous vacuum vapor-depositing methodInfo
- Publication number
- JPS57169082A JPS57169082A JP5174281A JP5174281A JPS57169082A JP S57169082 A JPS57169082 A JP S57169082A JP 5174281 A JP5174281 A JP 5174281A JP 5174281 A JP5174281 A JP 5174281A JP S57169082 A JPS57169082 A JP S57169082A
- Authority
- JP
- Japan
- Prior art keywords
- evaporation
- vapor
- deposition
- controlling
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To elevate a response propertly for controlling the quantity of evaporation, by dividing an evaporation source into an optional number, and suitably controlling the quantity of evaporation of a small evaporation soruce, in case of continuous vacuum vapor-deposition. CONSTITUTION:An evaporation in a vacuum evaporation chamber 7 is divided into small evaporation sources V-1-V-4, and a molten vapor-deposition metal M is vapor-deposited onto a steel belt 6 by an electric heater 8. Uniformity of the quatity of vapor-deposition in the lengthwise direction of the steel belt 6 is secured by detecting the quantity of vapor-deposition and controlling turn-on power of the electric heater 8. Also, in case when the target quantity of vapor- deposition is changed, for instance, in case when the quantity of vapor-deposition is reduced to 3/4, it can be reduced to 3/4 instantaneously by closing a shutter 5 of the evaporation source V-1 and setting the quantity of evaporation from the evaporation source V-1 to zero. Also, as necessary, the quantity of evaporation can be controlled minutely by controlling the electric power.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5174281A JPS57169082A (en) | 1981-04-08 | 1981-04-08 | Continuous vacuum vapor-depositing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5174281A JPS57169082A (en) | 1981-04-08 | 1981-04-08 | Continuous vacuum vapor-depositing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57169082A true JPS57169082A (en) | 1982-10-18 |
Family
ID=12895363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5174281A Pending JPS57169082A (en) | 1981-04-08 | 1981-04-08 | Continuous vacuum vapor-depositing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57169082A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059064A (en) * | 1983-08-20 | 1985-04-05 | ライボルト・アクチエンゲゼルシャフト | Method and device for controlling local evaporation power of evaporator on manufacturing thin layer on substrate by vacuum evaporation process |
JPS62158861A (en) * | 1985-12-28 | 1987-07-14 | Ishikawajima Harima Heavy Ind Co Ltd | Ion plating device |
EP1246951A1 (en) * | 1999-10-22 | 2002-10-09 | Kurt J. Lesker Company | Method and apparatus for coating a substrate in a vacuum |
-
1981
- 1981-04-08 JP JP5174281A patent/JPS57169082A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059064A (en) * | 1983-08-20 | 1985-04-05 | ライボルト・アクチエンゲゼルシャフト | Method and device for controlling local evaporation power of evaporator on manufacturing thin layer on substrate by vacuum evaporation process |
JPS62158861A (en) * | 1985-12-28 | 1987-07-14 | Ishikawajima Harima Heavy Ind Co Ltd | Ion plating device |
EP1246951A1 (en) * | 1999-10-22 | 2002-10-09 | Kurt J. Lesker Company | Method and apparatus for coating a substrate in a vacuum |
EP1246951A4 (en) * | 1999-10-22 | 2004-10-13 | Kurt J Lesker Company | Method and apparatus for coating a substrate in a vacuum |
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