EP1183916A1 - Module de puissance intelligent de structure sandwich - Google Patents

Module de puissance intelligent de structure sandwich

Info

Publication number
EP1183916A1
EP1183916A1 EP00938710A EP00938710A EP1183916A1 EP 1183916 A1 EP1183916 A1 EP 1183916A1 EP 00938710 A EP00938710 A EP 00938710A EP 00938710 A EP00938710 A EP 00938710A EP 1183916 A1 EP1183916 A1 EP 1183916A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
power
control
control circuit
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP00938710A
Other languages
German (de)
English (en)
Inventor
Michael Frisch
Bernd Winkens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Original Assignee
Tyco Electronics Logistics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics AG filed Critical Tyco Electronics Logistics AG
Publication of EP1183916A1 publication Critical patent/EP1183916A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole

Definitions

  • the invention relates to an intelligent power module with control and power connections, in which a control circuit board is arranged in parallel to a substrate with at least one power semiconductor component in a second level.
  • IPM integrated power module
  • Control elements are currently used, for example, in applications in connection with welding machines, power supplies and in drive technology.
  • Frequency converter solutions for speed control are increasingly being used, particularly in the field of asynchronous motors, with IGBT (isolated gate bipolar transistor) power semiconductors being used in particular in the power section of the module.
  • the power substrate as a carrier for the required power components
  • high electrical insulation towards the cooling plate required on the other hand, good heat transfer is ensured.
  • the latter is not the case with the known printed circuit boards made of plastic, so that the power components are currently built up on relatively complex substrates, for example DCB (Direct Copper Bonding) aluminum oxide, IMS (aluminum-polyimide-copper) or aluminum nitrite, depending on the application requirement.
  • DCB Direct Copper Bonding
  • IMS aluminum-polyimide-copper
  • aluminum nitrite aluminum nitrite
  • the problem with conventional module technology is the connection between the logic and power components on the one hand and from the module to a system circuit board on the other. These connections, where typically L t- Contacts, terminals, plug connections or pressure contacts are often a qualitative weak point and cause high costs.
  • the problems with the connection technology become even greater if, for reasons of space, the user requests a sandwich structure of the module, in which, for example, the power substrate is connected via pins to the control printed circuit board arranged above it, as for example from EP 0 463 589 A2, cf. there Figure 1 is known.
  • the base substrate with power semiconductors is inserted into the frame of the module housing there, connecting lines are soldered on and a sealing compound is introduced, whereupon the control board is inserted into the module housing and soldered to the connecting lines.
  • various connection pins protruding from the substrate protrude from the module housing.
  • the invention has for its object to provide an intelligent power module that does not require complex internal and external connection technology and can therefore be produced with little effort, and which is easily adaptable with regard to customer-specific control circuits.
  • an intelligent power module of the type mentioned at the outset in that the power substrate is used as a base plate in and with a housing made of electrically insulating material together forms a power unit, from the top of which faces the control circuit board, at least in an edge region, there protrude pins which are soldered in through-hole with contact holes of the control circuit board, at least one strip area along one side of the circuit board from contact holes and Control components remains free, and that the circuit board on this side has contact pads as control and power connections, by means of which the module can be soldered directly into the slot-like opening of a system circuit board.
  • the module according to the invention therefore basically consists of a logic part and a structurally independent or independent and therefore standardizable power part. Since the connecting pins are already part of the power section, the power sections standardized in terms of mechanical design can be connected to the control section in a simple manner by means of push-through soldering with a single wave soldering process.
  • the control circuit board offers the customer almost completely free design of the control circuit and, thanks to the contact pads formed on the circuit board itself, a particularly simple connection option to another circuit board.
  • Such circuit boards which can be soldered directly into a system circuit board have been known per se for a short time, but have not previously been used in connection with power modules which typically use more robust structural design elements such as pins, screws and plugs, in particular not in connection with IPMs.
  • FIG. 2 in a side sectional view the same module as in Figure 1, but in the finished, soldered state.
  • FIG. 1 shows a module with a standardized power unit, in which, for example, a ceramic substrate is used as a carrier for power components 2 in a plastic housing 1 as a base plate.
  • a heat sink 3 is usually attached to the underside of the base plate.
  • the control circuit board 4 in FIG. 1 and FIG. 2 is plugged with the rear side upward onto the upper ends of the connection pins 5 of the power section, which are wave soldered on the rear side of the circuit board 4.
  • the strip area 6 of the control circuit board 4 that remains free of contact holes and control components 12 must in any case be wide enough to form contact pads 7 on the circuit board 4 itself and to be pushed through the opening slot of a second circuit board, here called system circuit board 8 , to allow.
  • Figure 2 shows a module soldered into a system circuit board 8 with the solder joints 9.
  • control circuit board 4 is larger than the power section as far as possible on all sides, that is to say it projects beyond it, since the circuit board 4 is then fitted with the power sections and soldered and only then can be divided into the individual modules.
  • the circuit board 4 can, for example, a commercially available plastic board, for. B. FR4.
  • control components 12 are arranged, if possible, only in one area of the control circuit board 4. are net, which is the top 11 of the power section directly opposite. This results in circuit and space advantages.
  • the electronic control components 12 should be arranged as close as possible to the gates of the power semiconductor components 2.
  • spacers 10 can also be seen, which are integrally formed on the housing 1 and which mutually support the printed circuit board 4 and the power unit.
  • the connecting pins 5 of the power section are advantageously, as shown, arranged in rows along the outer edges of the top of the power section.
  • the housing 1 is only shown in FIG. 1 for understanding, with a lateral opening 13.
  • the modules can be used in a wide power range, e.g. 600 V / 5-30 A, 1200 V / 2.5-15 A.

Abstract

L'invention concerne un substrat de puissance introduit sous forme de plaque de base dans un boîtier (1), qui forme conjointement avec ledit boîtier une partie de puissance normalisée et hors de la face extérieure (11) duquel font saillie des broches de connexion brasées avec des trous de contact de la carte de circuits de commande (4), en mode de brasage traversant. La carte de circuits (4) présente des plots de contact (7) dans une zone en ruban (6), qui font office de connexions de commande et de puissance, grâce auxquelles le module peut être brasé directement dans l'ouverture sous forme de fente d'une carte de circuits de système (8).
EP00938710A 1999-05-31 2000-05-30 Module de puissance intelligent de structure sandwich Ceased EP1183916A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19924993 1999-05-31
DE19924993A DE19924993C2 (de) 1999-05-31 1999-05-31 Intelligentes Leistungsmodul in Sandwich-Bauweise
PCT/EP2000/004945 WO2000074445A1 (fr) 1999-05-31 2000-05-30 Module de puissance intelligent de structure sandwich

Publications (1)

Publication Number Publication Date
EP1183916A1 true EP1183916A1 (fr) 2002-03-06

Family

ID=7909824

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00938710A Ceased EP1183916A1 (fr) 1999-05-31 2000-05-30 Module de puissance intelligent de structure sandwich

Country Status (6)

Country Link
US (1) US6646884B1 (fr)
EP (1) EP1183916A1 (fr)
JP (1) JP2003501811A (fr)
CN (1) CN1271900C (fr)
DE (1) DE19924993C2 (fr)
WO (1) WO2000074445A1 (fr)

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DE10125696A1 (de) * 2001-05-25 2002-12-05 Eupec Gmbh & Co Kg Leistungshalbleitermodul
DE10232566B4 (de) * 2001-07-23 2015-11-12 Fuji Electric Co., Ltd. Halbleiterbauteil
DE10250674A1 (de) * 2002-10-31 2004-05-13 Hella Kg Hueck & Co. Spiegelsymmetrische elektronische Baugruppe
DE10306643B4 (de) 2003-02-18 2005-08-25 Semikron Elektronik Gmbh Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul
DE102004021122B4 (de) 2004-04-29 2007-10-11 Semikron Elektronik Gmbh & Co. Kg Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul
DE102004025609B4 (de) * 2004-05-25 2010-12-09 Semikron Elektronik Gmbh & Co. Kg Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul
DE102004040592A1 (de) 2004-08-21 2006-03-09 Robert Bosch Gmbh Elektrische Vorrichtung
JP4583122B2 (ja) * 2004-09-28 2010-11-17 三菱電機株式会社 半導体装置及びその製造方法
KR100630960B1 (ko) * 2004-10-05 2006-10-02 삼성전자주식회사 Ｐｃｂ조립체
JP2006140192A (ja) 2004-11-10 2006-06-01 Matsushita Electric Ind Co Ltd 電子回路装置
JP2006332247A (ja) * 2005-05-25 2006-12-07 Sansha Electric Mfg Co Ltd 電源装置および電気装置の放熱構造
CN101536624B (zh) * 2006-10-06 2012-09-05 株式会社安川电机 功率模块安装结构及其具备该结构的马达控制装置
CN102208403B (zh) * 2011-05-24 2013-03-20 嘉兴斯达半导体股份有限公司 一种半桥功率模块
JP5456843B2 (ja) * 2012-05-24 2014-04-02 三菱電機株式会社 電源装置
DE102013215648A1 (de) * 2013-08-08 2015-02-12 Siemens Aktiengesellschaft Leistungselektronikmodul mit Substrat, Bauelement und Leiterplatte
CN106298713A (zh) * 2015-06-09 2017-01-04 台达电子工业股份有限公司 一种垂直连接的功率模块及其堆叠连接的引脚
JP6432712B2 (ja) * 2016-07-11 2018-12-05 三菱電機株式会社 半導体装置

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US4884125A (en) 1986-10-15 1989-11-28 Sanyo Electic Co., Ltd. Hybrid integrated circuit device capable of being inserted into socket
JPH02170597A (ja) 1988-12-23 1990-07-02 Mazda Motor Corp 車載用制御ユニツト構造
JPH0432291A (ja) * 1990-05-29 1992-02-04 Taiyo Yuden Co Ltd 電子回路基板の実装方法
DE9007439U1 (fr) * 1990-06-29 1991-11-14 Abb-Ixys Semiconductor Gmbh, 6840 Lampertheim, De
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JP2956363B2 (ja) * 1992-07-24 1999-10-04 富士電機株式会社 パワー半導体装置
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JPH0730061A (ja) * 1993-06-25 1995-01-31 Sanyo Electric Co Ltd 混成集積回路装置
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Also Published As

Publication number Publication date
WO2000074445A1 (fr) 2000-12-07
DE19924993A1 (de) 2000-12-21
CN1352869A (zh) 2002-06-05
JP2003501811A (ja) 2003-01-14
US6646884B1 (en) 2003-11-11
CN1271900C (zh) 2006-08-23
DE19924993C2 (de) 2002-10-10

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