EP1035229B1 - Bain de rhodium et procédè pour le dépôt du rhodium - Google Patents

Bain de rhodium et procédè pour le dépôt du rhodium Download PDF

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Publication number
EP1035229B1
EP1035229B1 EP20000103134 EP00103134A EP1035229B1 EP 1035229 B1 EP1035229 B1 EP 1035229B1 EP 20000103134 EP20000103134 EP 20000103134 EP 00103134 A EP00103134 A EP 00103134A EP 1035229 B1 EP1035229 B1 EP 1035229B1
Authority
EP
European Patent Office
Prior art keywords
rhodium
bath
water
deposition
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP20000103134
Other languages
German (de)
English (en)
Other versions
EP1035229A1 (fr
Inventor
Lothar Weber
Thomas Brinz
Edith Kuttesch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1035229A1 publication Critical patent/EP1035229A1/fr
Application granted granted Critical
Publication of EP1035229B1 publication Critical patent/EP1035229B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Definitions

  • the invention relates to a rhodium bath and a method for depositing rhodium on a substrate, in particular for the electroless rhodium plating of surfaces, according to the preamble of the main claims.
  • electroless metallization processes or metallization baths are used in particular for the coating of nonconductive surfaces, of powders or of components or substrates which can not be contacted individually or only at great expense.
  • Known rhodium baths also preferably use chlorine-containing rhodium starting compounds, which often lead to disturbances in applications in sensor technology.
  • the rhodium bath according to the invention and the method of depositing it according to claims 1 and 5 have the advantage over the prior art that the bath yield is substantially increased and only a very small part of the rhodium used precipitates or precipitates on the vessel wall. Typical Badausbeuten are about 90% and above.
  • substrates such as non-conductive surfaces, metals, powders or other difficult to access or difficult to contact components in a simple, reliable and cost-effective manner.
  • the rhodium bath according to the invention is almost universally applicable to a wide variety of substrates and, moreover, insensitive to fluctuations in the bath parameters with regard to the pH of the bath, the bath temperature and the concentrations of the individual bath constituents used.
  • a further significant advantage is that water can be used as the solvent for the rhodium bath according to the invention and the rhodium compounds used are readily soluble in water.
  • the thickness of the deposition and the deposition rate reach the substrate used.
  • the pH of the rhodium bath is adjusted to a value of 8.5 to 10.5 and more preferably 9 to 10.
  • the bath temperature is advantageously a temperature of 70 ° C to 95 ° C, preferably from 80 ° C to 90 ° C.
  • a wetting agent in particular a surfactant such as a fluoroalcohol, is advantageously added to the rhodium bath for better wetting of a submerged substrate.
  • a reducing agent in particular a 10% hydrazine solution.
  • rhodium bath is first as a good water-soluble rhodium compound ammonium di (pyridine-2,6-dicarboxylate) rhodium (III), or a rhodium acetate h.
  • ammonium di pyridine-2,6-dicarboxylate
  • rhodium (III) rhodium (III)
  • rhodium acetate h rhodium acetate h.
  • the compound [Rh 3 O (CH 3 COO) 6 (H 2 O) 3 ] (CH 3 COO) dissolved in water as a solvent a combination of several of the above well water-soluble rhodium compounds is possible.
  • Rhodium compounds which are readily soluble in water are understood to mean those rhodium compounds which dissolve in water at a temperature of from 80 ° C. to 90 ° C. in an amount of at least 1 g / l without precipitating or spontaneously reducing.
  • Preferred rhodium compounds which are readily soluble in water are those rhodium compounds which can be dissolved in water at said temperatures in an amount of typically at least 10 g / l without precipitation or spontaneous reduction.
  • the upper limit of the amount of rhodium dissolved or dissolved in water is approximately 50 g / l in the cases relevant to the invention.
  • the amount of the rhodium compound to be dissolved in the individual case in the water depends on the size of the surface to be metallized or coated or on the surface to be achieved Thickness of the coating and can therefore be easily calculated by the expert in the specific case thereof.
  • a surfactant such as, for example, a fluoroalcohol in a concentration of 0.01% is further added to the rhodium bath produced.
  • the temperature of the rhodium bath is 70 ° C to 95 ° C, preferably 80 ° C to 90 ° C.
  • the pH of the bath is adjusted to a value of 8.5 to 10.5, preferably 9 to 10.
  • the adjustment of the pH is carried out, for example, by means of ammonia, NaOH or KOH.
  • a substrate is now introduced or immersed, on which the rhodium contained in the bath is deposited electrolessly in metallic form.
  • a substrate to be metallized for example, a non-conductive ceramic powder, a ceramic substrate, a metallic powder or a metallic component, in particular Al 2 O 3 , ZrO 2 or Pt, comes into question.
  • the substrate Before the substrate is inserted or immersed, the substrate can additionally be activated beforehand in a manner known per se. This happens, for example, via a deposition of a Pd salt on the surface.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Claims (6)

  1. Bain de rhodium, en particulier pour le dépôt sans courant de rhodium sur des substrats, et qui contient au moins un composé de rhodium bien soluble dans l'eau ainsi que de l'eau comme solvant,
    caractérisé en ce que
    le composé de rhodium bien soluble dans l'eau est l'ammoniumdi(pyridine-2,6-dicarboxylate)-rhodium(III) ou un acétate de rhodium, et le pH du bain se situe entre 8,5 et 10,5.
  2. Bain de rhodium selon la revendication 1,
    caractérisé en ce qu'
    au bain de rhodium est ajouté un agent d'imprégnation, en particulier un agent tensioactif comme un fluoroalcool.
  3. Bain de rhodium selon la revendication 1,
    caractérisé en ce que
    le pH du bain se situe entre 9 et 10.
  4. Bain de rhodium selon la revendication 1,
    caractérisé en ce qu'
    une quantité de rhodium allant de 1 à 50 g/l, en particulier de 5 à 15 g/l, est solubilisable dans le bain de rhodium.
  5. Procédé de dépôt de rhodium sur un substrat avec un bain de rhodium selon au moins une des revendications 1 à 4,
    caractérisé en ce que
    l'achèvement du revêtement du substrat est indiqué par une décoloration du bain de rhodium.
  6. Utilisation d'un bain de rhodium, en particulier pour le dépôt sans courant de rhodium sur des substrats, et qui contient au moins un composé de rhodium bien soluble dans l'eau ainsi que de l'eau comme solvant,
    caractérisée en ce que
    le composé de rhodium bien soluble dans l'eau est l'ammoniumdi(pyridine-2,6-dicarboxylate)-rhodium(III) ou un acétate de rhodium,
EP20000103134 1999-03-05 2000-02-16 Bain de rhodium et procédè pour le dépôt du rhodium Expired - Lifetime EP1035229B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1999109678 DE19909678C1 (de) 1999-03-05 1999-03-05 Rhodiumbad und Verfahren zum Abscheiden von Rhodium
DE19909678 1999-03-05

Publications (2)

Publication Number Publication Date
EP1035229A1 EP1035229A1 (fr) 2000-09-13
EP1035229B1 true EP1035229B1 (fr) 2006-09-13

Family

ID=7899803

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20000103134 Expired - Lifetime EP1035229B1 (fr) 1999-03-05 2000-02-16 Bain de rhodium et procédè pour le dépôt du rhodium

Country Status (3)

Country Link
EP (1) EP1035229B1 (fr)
JP (1) JP2000282248A (fr)
DE (2) DE19909678C1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2625777A1 (fr) 2005-10-13 2007-04-26 Velocys, Inc. Depot autocatalytique dans des microcanaux
CN110952081B (zh) * 2018-09-27 2022-04-29 Imec 非营利协会 用于形成互连部的方法和溶液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1771053A1 (de) * 1968-03-28 1971-11-25 Telefunken Patent Verfahren zum stromlosen Abscheiden von Metallschichten der Platinmetallgruppe auf Oberflaechen metallischer und nichtmetallischer Teile
CH606475A5 (fr) * 1976-02-05 1978-10-31 Bbc Brown Boveri & Cie
US4402802A (en) * 1981-01-03 1983-09-06 Dequssa Aktiengesellschaft Electrolytic bath for the deposition of rhodium coatings
JPS5939504B2 (ja) * 1982-05-19 1984-09-25 工業技術院長 ロジウム又はロジウム合金の無電解メツキ浴
US4789437A (en) * 1986-07-11 1988-12-06 University Of Hong Kong Pulse electroplating process

Also Published As

Publication number Publication date
DE19909678C1 (de) 2000-07-27
JP2000282248A (ja) 2000-10-10
EP1035229A1 (fr) 2000-09-13
DE50013442D1 (de) 2006-10-26

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