EP0716432B1 - Inductivité plane - Google Patents

Inductivité plane Download PDF

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Publication number
EP0716432B1
EP0716432B1 EP95203290A EP95203290A EP0716432B1 EP 0716432 B1 EP0716432 B1 EP 0716432B1 EP 95203290 A EP95203290 A EP 95203290A EP 95203290 A EP95203290 A EP 95203290A EP 0716432 B1 EP0716432 B1 EP 0716432B1
Authority
EP
European Patent Office
Prior art keywords
carrier
inductance
ferromagnetic
planar
ferromagnetic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95203290A
Other languages
German (de)
English (en)
Other versions
EP0716432A1 (fr
Inventor
Ulrich c/o Philips Rittner
Heiner c/o Philips Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Koninklijke Philips NV
Original Assignee
Philips Corporate Intellectual Property GmbH
Philips Patentverwaltung GmbH
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Corporate Intellectual Property GmbH, Philips Patentverwaltung GmbH, Koninklijke Philips Electronics NV filed Critical Philips Corporate Intellectual Property GmbH
Publication of EP0716432A1 publication Critical patent/EP0716432A1/fr
Application granted granted Critical
Publication of EP0716432B1 publication Critical patent/EP0716432B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00—Variable inductances or transformers of the signal type
    • H01F21/02—Variable inductances or transformers of the signal type continuously variable, e.g. variometers
    • H01F21/06—Variable inductances or transformers of the signal type continuously variable, e.g. variometers by movement of core or part of core relative to the windings as a whole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core

Definitions

  • the invention relates to a planar inductance with at least one applied to a flat carrier, essentially spiral coil and with essentially arranged on this carrier layered, ferromagnetic material.
  • DE-OS 24 41 317 describes a method for inductance matching of flat coils known in the layering technique are manufactured. With this procedure each after the deviation of the actual inductance value from the setpoint a more or less large part of the flat coil with one Paste consisting of a mixed with a binder magnetizable powder, covered or the thickness the applied paste is increased. Thereby becomes Comparison of the inductance of the flat coil by one Covering angle defined part of the coil surface with the paste covered. The coverage angle should be linear with linked to the change in inductance; the layer thickness however, the paste has a non-linear influence on the change in inductance. The one through that Brush the flat coil with the paste made The adjustment process for the inductance can be automated specified.
  • EP-OS 310 396 describes a planar inductance spiral-shaped conductors known in the so-called sandwich construction between ferromagnetic layers with insulating layers arranged between them are used.
  • the spiral conductors form two coils of the same Contour that are in alignment with each other and close together are arranged. Furthermore, the two are spiral Coils electrically connected to each other in such a way that currents different directions through the individual coils flow.
  • the ferromagnetic layers have a surface area that is greater than the sum of the surfaces of the two conductor coils.
  • inductors shown in this document are made of numerous layered or cuboid Pieces of insulating material or ferromagnetic components in relatively complicated way. This on the one hand, considerably increases the cost of production and gives on the other hand no possibility to vary the magnetic coupling during manufacture, i.e. also not for a match.
  • the object of the invention is a planar inductance to design such that its inductance value with simple means precisely adjustable during production or is adjustable and / or that the magnetic Coupling of several coils or windings of an inductance can be set accordingly easily and precisely can.
  • This task is performed with a planar inductance Generic type solved in that the ferromagnetic Material within a fixed on the carrier Insulating windows in the coating process on the carrier is applied.
  • Planar inductors of the type according to the invention are advantageous in hybrid technology or multichip module technology can be used in which a plurality of electronic Components that in turn integrated Circuits can be on a flat carrier, for example, a circuit board.
  • This flat carrier is provided with a conductive layer, from the one which is preferably predetermined by etching technology Ladder structures have been worked out.
  • This (Electrically conductive) conductor structures serve the electrical Connection of the arranged on the carrier Building elements. From them can also preferably planar inductors that are simple, can be manufactured precisely and robustly.
  • the carrier becomes a so-called coating process applied a protective layer consisting of a curable masking compound through which the components and their connections are encased.
  • planar inductance over the coil or the coils also an insulating material window arranged.
  • This can affect the entire planar inductance delimit, but also only partially overlap them.
  • the height of the insulating material window perpendicular to The surface of the carrier can be chosen differently become; however, a height is preferably used for this, as they are for covering the rest of the above Components is used, so that simplification and Unification in manufacturing is achieved.
  • the dimensions of the insulating window parallel to the surface of the wearer and by positioning the Insulating window over a more or less large Share of the total of the planar inductance covered area of the carrier can be the inductance value or the coupling between several coils of the planar Inductance can be set.
  • the insulation window is in the coating process with ferromagnetic material replenished.
  • they become the same Manufacturing steps and systems as when covering the used in the above components, whereby the Manufacturing is very simplified.
  • These parameters can preferably to be determined in such a way that for a particular manufacturing planar inductance size, shape and location of the Insulation window and the composition of the ferromagnetic Materials are specified.
  • Dosage of the amount of ferromagnetic material at Apply to the carrier inside the insulating window can then adjust the exact setting to the desired values for the inductances or the coupling take place, possibly in the form of a comparison with during the Applying the ferromagnetic material electrical measurement.
  • the manufacturing process is mechanically very simple controllable, i.e. become very close with little effort Tolerances can be met.
  • the inventive design of the planar Inductance can - especially with complete Covering the coil (s) - with the ferromagnetic Material also mechanical protection of the conductor structures, especially of connecting wires become. Because the ferromagnetic material is preferably non-conductive can, if necessary, in one operation the planar inductance also neighboring electronic ones Components for mechanical protection are also covered. The influence of the ferromagnetic material on the Conductor structures and their transmission properties must then be taken into account accordingly.
  • the Reference numeral 1 a section of a flat carrier referred to as preferred in hybrid technology or Multichip module technology is used.
  • a flat carrier On this two-dimensional beams are essentially two-dimensional spiral coils 2 and 3 arranged, preferably in the form of a so-called printed conductor structure the flat carrier are applied. Bond wires 4 and 5 form bridges between pads 6, 7 and 8, 9 and thus establish a conductive connection between the Coil ends in the centers of the spirals and outside of the Spiral arranged conductor structures 10 and 11 forth.
  • the flat carrier 1 are not shown in FIG. 1 -
  • the coils 2 and 3 partially covering - an insulating material window 12 applied and glued to the carrier 1.
  • Assembling this Insulating material window 12 can preferably be used in the work step the assembly of the other mentioned, not shown Components are included.
  • the one from the insulation window 12 bordered part of the surface of the carrier 1 is covered with a ferromagnetic material 13, a Mixture of a covering compound (coating material) with ferromagnetic admixture, which is in the liquid state is insertable into the insulating window and then in this hardens.
  • Fig. 2 shows the planar inductance on the flat Beam in longitudinal section along the section line Z - Z. This representation also gives the material thicknesses in particular only schematically again.
  • the ferromagnetic Material 13 is only part of the planar inductance covered; in particular, the bond wires 4 remain 5 unprotected. It is for their mechanical protection advantageous that insulating window 12 in its Form dimensions such that the entire planar inductance including the associated Bond wires and connectors are surrounded and with ferromagnetic Material can be covered.
  • FIG. 3 for example Top view, in which a modified shape with one another nested spiral coils is selected.
  • a first coil 20 surrounds between pads A and B a second coil 21 between pads C and D.
  • bond wires 22, 23 connect the Pads B and C and D with conductor structures 24 for Connection of the inner coil connections of the planar Inductance to external, not in Fig. 3 shown parts of a located on the carrier 1 Circuit arrangement.
  • the ferromagnetic material 13 then covers the entire planar inductance.
  • the arrangement of the coils 20 and 21 for different Functions or dimensions are used.
  • the bond wires 22, 23 accordingly can either the first coil 20 or the second Coil 21 alone, a coiled series connection of the coils 20, 21 or one in opposite directions coiled series connection of the coils 20, 21 the Form the desired inductance.
  • This can therefore at unchanged geometry of the planar inductors only with differently routed bond wires for different Applications experience different dimensions, whereby in cooperation with the ferromagnetic Material larger value ranges for the inductance values can be developed.
  • the one shown in Fig. 3 Arrangement of the bond wires 22, 23 shows another Possibility of wiring the coils 20, 21, namely a transformer.
  • the pads A to D separately from each other with external Components connected, especially with electronic Switches through which these different Interconnections can be made optionally.
  • the examples shown in the figures can be found in be modified in many ways. So on the Back of the carrier 1 further conductor structures or Components are arranged. It can also be flat Carriers are used that have a multilayer Structure consisting of alternating one ladder structure and one Have insulation layer. The surfaces of the carrier 1 outside the insulating material window 12 can with masking compound or coating material that is not ferromagnetic Contains admixture. In any case, are yourself complicated circuit arrangements with simple manufacturing steps producible. In addition to the for hybrid technology or multichip module technology Manufacturing arrangements already used no further Machines, devices or devices needed because Production and adjustment of the planar according to the invention Inductors immediately within the usual manufacturing steps for hybrid technology or multichip module technology can be done.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Claims (5)

  1. Inductivité plane avec au moins une bobine (23, 20, 21) essentiellement spiralée et appliquée sur un support plan (1) et avec une matière ferromagnétique (13) essentiellement en forme de couche, disposée sur ce support (1),
    caractérisée en ce que la matière ferromagnétique (13) est appliquée sur le support (1) dans un procédé de coating dans une fenêtre de matière isolante (12) fixée sur le support (1).
  2. Inductivité plane selon la revendication 1,
    caractérisée en ce que la fenêtre de matière isolante (12) est collée avec le support (1).
  3. Inductivité plane selon l'une des revendications 1 ou 2,
    caractérisée en ce que la matière ferromagnétique (13) se compose essentiellement d'une matière de coating mélangée à un additif ferromagnétique.
  4. Inductivité plane selon la revendication 3,
    caractérisée en ce que l'additif ferromagnétique se compose essentiellement d'une poudre de ferrite.
  5. Inductivité plane selon l'une des revendications précédentes,
    caractérisée en ce que la taille de la ou des valeurs d'inductivité de la ou des bobines (2, 3 ; 20, 21) et/ou l'accouplement entre les bobines (2,3 ; 20, 21) est déterminée par l'orientation et/ou le contour de la fenêtre de matière isolante (12) et/ou par la hauteur de la couche et/ou par la composition de la matière ferromagnétique (13).
EP95203290A 1994-12-02 1995-11-29 Inductivité plane Expired - Lifetime EP0716432B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4442994A DE4442994A1 (de) 1994-12-02 1994-12-02 Planare Induktivität
DE4442994 1994-12-02

Publications (2)

Publication Number Publication Date
EP0716432A1 EP0716432A1 (fr) 1996-06-12
EP0716432B1 true EP0716432B1 (fr) 2000-02-23

Family

ID=6534783

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95203290A Expired - Lifetime EP0716432B1 (fr) 1994-12-02 1995-11-29 Inductivité plane

Country Status (4)

Country Link
US (2) US6600403B1 (fr)
EP (1) EP0716432B1 (fr)
JP (1) JP3548643B2 (fr)
DE (2) DE4442994A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19639650A1 (de) * 1996-09-26 1998-04-02 Sican Gmbh Integrierte Schaltung mit einem induktiven Bauelement und Verfahren zur Herstellung hierzu
DE19730694A1 (de) * 1997-07-17 1999-01-21 Meto International Gmbh Sicherungselement für die elektronische Artikelsicherung
DE19854234C1 (de) * 1998-11-24 2000-06-21 Bosch Gmbh Robert Induktives Bauelement mit planarer Leitungsstruktur und Verfahren zur Herstellung desselben
JP4789348B2 (ja) * 2001-05-31 2011-10-12 リンテック株式会社 面状コイル部品、面状コイル部品の特性調整方法、ｉｄタグ、及び、ｉｄタグの共振周波数の調整方法
EP1410228B1 (fr) * 2001-06-22 2016-03-23 Wonderware Corporation Telesurveillance/telediagnostic centralises de composants repartis d'une application de commande de processus de controle et d'informations de fabrication
KR100469248B1 (ko) * 2001-12-24 2005-02-02 엘지전자 주식회사 무선통신 모듈용 마이크로 인덕터
US20050077992A1 (en) * 2002-09-20 2005-04-14 Gopal Raghavan Symmetric planar inductor
DE10362165A1 (de) * 2003-04-23 2006-12-28 Werner Turck Gmbh & Co. Kg Induktiver Näherungsschalter
JP4802697B2 (ja) * 2005-12-16 2011-10-26 カシオ計算機株式会社 半導体装置
JP5658429B2 (ja) * 2008-07-03 2015-01-28 ルネサスエレクトロニクス株式会社 回路装置
NL1036082C (nl) * 2008-10-16 2010-04-19 Cooeperatieve Vereniging Easymeasure U A Werkwijze en inrichting voor een regelbare spoel en/of condensator en/of kring en/of transformator.
JP2010160142A (ja) * 2008-12-09 2010-07-22 Renesas Electronics Corp 信号送受信方法、半導体装置の製造方法、半導体装置、およびテスタ装置
US20110109415A1 (en) * 2009-11-12 2011-05-12 Jenq-Gong Duh Inductor structure
US9793352B1 (en) * 2011-06-02 2017-10-17 Ixys Corporation IGBT assembly having saturable inductor for soft landing a diode recovery current
US8717136B2 (en) 2012-01-10 2014-05-06 International Business Machines Corporation Inductor with laminated yoke
US9064628B2 (en) 2012-05-22 2015-06-23 International Business Machines Corporation Inductor with stacked conductors
JP6503264B2 (ja) * 2015-08-27 2019-04-17 ルネサスエレクトロニクス株式会社 半導体装置

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Also Published As

Publication number Publication date
US6722017B2 (en) 2004-04-20
US20040004525A1 (en) 2004-01-08
US6600403B1 (en) 2003-07-29
DE4442994A1 (de) 1996-06-05
EP0716432A1 (fr) 1996-06-12
JPH08222437A (ja) 1996-08-30
DE59507840D1 (de) 2000-03-30
JP3548643B2 (ja) 2004-07-28

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