EP0710861A1 - Circuit imprimé pour module optique avec structure flexible - Google Patents
Circuit imprimé pour module optique avec structure flexible Download PDFInfo
- Publication number
- EP0710861A1 EP0710861A1 EP95117258A EP95117258A EP0710861A1 EP 0710861 A1 EP0710861 A1 EP 0710861A1 EP 95117258 A EP95117258 A EP 95117258A EP 95117258 A EP95117258 A EP 95117258A EP 0710861 A1 EP0710861 A1 EP 0710861A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- auxiliary plate
- head portion
- main body
- circuit board
- extending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 130
- 239000003990 capacitor Substances 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 230000006355 external stress Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 43
- 230000035882 stress Effects 0.000 description 11
- 239000004642 Polyimide Substances 0.000 description 7
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to an optical module circuit board used for an optical communication system such as an optical local area network (LAN) or an optical data link using light as an information transmission medium.
- an optical communication system such as an optical local area network (LAN) or an optical data link using light as an information transmission medium.
- LAN optical local area network
- optical data link using light as an information transmission medium.
- Japanese Patent Laid-Open No. 2-271308 discloses a conventional optical module.
- This conventional optical module comprises a cylindrical sleeve.
- the sleeve consists of a metal such as stainless steel.
- One end of the sleeve has an opening for storing an optical operation element.
- the other end of the sleeve also has an opening capable of accommodating at least a part of an optical fiber positioning ferrule arranged at the distal end of a connector plug.
- the optical operation element is fixed in this sleeve with an adhesive or the like.
- the outer wall of the sleeve has a flange for fixing the sleeve.
- the conventional optical module further includes a package body for supporting a circuit board.
- a support plate for fixing a sleeve is fixed in the package body with an adhesive or the like.
- the flange of the sleeve which receives the optical operation element is adhered and fixed to the support plate. Terminals extending from the bottom portion of the optical operation element is electrically connected to a constituent element (an electronic component such as a resistor, bare chip IC, etc.) of the circuit board mounted on the package body.
- An electrical signal output from this electronic circuit is extracted outside the optical module through a plurality of lead pins.
- U.S.P. No. 4,979,787 discloses another optical module.
- part of a flexible printed circuit (FPC) of a circuit board on which electronic components are mounted is bent at a right angle, and an optical operation element is directly mounted on this bent portion.
- FPC flexible printed circuit
- the inventors discovered the following undesirable structures of the conventional optical module.
- an optical module disclosed in Japanese Patent Laid-Open No. 2-2713008 the terminal of an optical operation element is formed and connected to a circuit board.
- the manufacturing process is difficult because the setting position of the optical operation element itself varies owing to a stress applied to the terminal in forming, and the like.
- the impedance of the terminal is high, so that the structure of this optical module is easily affected by external noise.
- a sufficient strength can be obtained with respect to a stress in the bending direction.
- a sufficient strength cannot be obtained with respect to a stress except for that in the bending direction, e.g., a stress in a direction to twist part (rising portion) of the flexible printed circuit.
- the rising portion may be cut off from the main body portion of the flexible printed circuit.
- the optical module circuit board comprises a flexible printed circuit, in which a neck portion for absorbing an unexpected stress is formed, between a main body portion for mounting an electronic component and a head portion for mounting an optical operation element.
- a bypass capacitor for removing noise of a driving power supply for an optical operation element is mounted on the main body portion (flat portion) of a flexible printed circuit, the optical operation element is spaced apart from the bypass capacitor. For this reason, a sufficient bypass effect cannot be obtained even with an arrangement in which the optical operation element is mounted on a rising portion (head portion).
- a power supply filter circuit including a bypass capacitor is mounted on a head portion for mounting an optical operation element, thereby obtaining a general-purpose optical module circuit board while maintaining high reliability.
- an optical module circuit board comprises a flexible printed circuit having at least a multilayered structure in which a layer containing a conductive metal interconnection is sandwiched between insulating layers (e.g., a structure in which a layer containing a conductive metal interconnection is sandwiched between insulating materials such as polyimide).
- This flexible printed circuit is constituted by: a main body portion having the multilayered structure, having a first surface mounted with an electronic component, and a second surface opposite to the first surface; a neck portion having the multilayered structure, extending from one end of the main body portion, and having a first surface continuously extending from the first surface of the main body portion, and a second surface continuously extending from the second surface of the main body portion; and a head portion positioned at a distal end of the neck portion extending from the one end of the main body portion, having the multilayered structure, and mounted with an optical operation element and a power supply filter circuit including a bypass capacitor, the head portion having a first surface continuously extending from the first surface of the neck portion, and a second surface continuously extending from the second surface of the neck portion.
- the second surface of the head portion is backed with an auxiliary plate to reinforce the head portion, while the second surface of the main body portion is backed with a base plate to reinforce the main body portion.
- the first and second surfaces of the neck portion are exposed to absorb an unexpected stress, thereby maintaining flexibility.
- the neck portion holds the head portion so as to set the first surface of the head portion on a plane different from a plane coplanar with the first surface of the main body portion.
- a barycenter in a region of the head portion for mounting an optical operation is offset in a direction perpendicular to a direction H of the neck portion extending from the main body portion and a direction D to bend the neck portion.
- the barycenter of the element mounting region is obtained by drawing a polygon using, as vertices, the centers of through holes which are formed in the head portion and receive the terminals of the optical operation element. That is, the barycenter in the mounting region of the head portion for mounting the optical operation element means the barycenter of the polygon.
- Various bases are employed for the optical operation element which is to be mounted on the head portion.
- the bottom portion (portion for extracting a lead pin to the outside) of an optical operation element has the projection or a solder used for welding a ground terminal.
- a load is undesirably applied to the flexible printed circuit itself, as in the conventional optical module. For this reason, it is difficult to mount the optical operation element by an automatic assembly machine.
- the auxiliary plate having the first surface adhered to the second surface of the head portion comprises a recess which has a predetermined diameter and is formed in a surface (the second surface opposite to the first surface) facing the optical operation element.
- the diameter of this recess is larger than that of the through hole extending from the second surface or the auxiliary plate to the first surface of the head portion.
- the main body portion of the flexible printed circuit on the optical module circuit board according to the present invention can be replaced with a general printed wiring board, of all the optical module circuit boards of the present invention, on which various electronic components are mounted. That is, this circuit board comprises a flexible printed circuit having at least a multilayered structure in which a layer containing a conductive metal interconnection is sandwiched between insulating layers (e.g., a structure in which a layer containing a conductive metal interconnection is sandwiched between insulating materials such as polyimide), wherein the flexible printed circuit is constituted by: a head portion having the multilayered structure, a power supply filter circuit with a bypass capacitor mounted on a first surface, and an optical operation element mounted on a second surface opposite to the first surface; and a terminal portion having the multilayered structure, extending from one end of the head portion, and having a first surface continuously extending from the first surface of the head portion, and a second surface continuously extending from the second surface of the head portion.
- insulating layers e.g
- This terminal portion functions as a neck portion for holding the head portion on a plane different from a plane coplanar with the component mounting surface of the printed wiring board, when the terminal portion is electrically connected and fixed to the general printed wiring board.
- an auxiliary plate having a first surface being in contact with the second surface of the head portion to entirely cover the second surface, and a second surface opposite to the first surface and facing the optical operation element be arranged on the second surface of the head portion.
- a recess having a predetermined diameter is formed at the opening portion of a through hole, in the second surface of the auxiliary plate, which receives a ground pin of an optical operation element, in correspondence with various optical operation elements. The diameter of this recess is larger than that of the through hole extending from the second surface of the auxiliary plate to the first surface of the head portion.
- the optical module circuit board of the present invention comprises the flexible printed circuit having the neck portion for coupling the head portion on which the optical operation element is mounted to the main body portion on which an electronic component is mounted. Therefore, a structure in which the neck portion absorbs an unexpected stress except for that in the bending direction can be realized.
- the auxiliary plate is fixed to the optical operation element mounting surface (second surface) of the head portion.
- the recess for storing the projection formed on the bottom portion of the optical operation element is formed in the surface of the auxiliary plate facing the optical operation element.
- the power supply filter circuit including the bypass capacitor for removing noise of a driving power supply for the optical operation element is mounted on the head portion together with the optical operation element.
- the neck portion coupling the head portion to the main body portion is used as the terminal tortion of the head portion on which the optical operation element and the power supply filter circuit are mounted. Therefore, a general-purpose structure capable of being mounted on various main body portions (general printed wiring boards) can be realized.
- Figs. 1 and 2 show a transceiver optical module 1 to which a circuit board 8 of the present invention is applicable.
- This optical module 1 integrally incorporates a transmission optical operation element (e.g., a semiconductor laser) 3 and a reception optical operation element (e.g., a photodiode) 2.
- the optical module 1 has a housing 4 consisting of PPS (polyphenylene sulfide) and having a U-shaped section.
- the housing 4 incorporates resin sleeves 5 and 6 which accommodate the optical operation elements 2 and 3, a resin sleeve holder 7 for fixing the sleeves 5 and 6 at predetermined positions in the housing 4, and a circuit board 8 which is electrically connected to a plurality of terminals 2a and 3a extending from the optical operation elements 2 and 3, and has a flexible printed circuit 46 fixed on the surface thereof.
- a flange 12 for fixing the sleeve 5 (6) itself in the housing 4 is formed on the outer circumferential surface of the sleeve 5.
- a ferrule holding portion 10 having a ferrule insertion port 10a which receives an optical fiber positioning ferrule arranged at the distal end of a connector plug, and an element holding portion 11 having an element insertion port 11a which receives the optical operation element 2 (3) and is fixed with an adhesive (e.g., an ultraviolet-curing resin) are provided on both the sides of the flange 12, respectively.
- the sleeve 5 (6) is fixed by being urged against a support portion 31 (32) projecting from the inner wall of the housing 4 by a spring piece 35 arranged on the inner wall of the housing 4, a spring piece 26 (27) arranged on the sleeve holder 7, and the like.
- the circuit board 8 of the present invention is mounted in the opening portion of the housing 4, while a first surface 8a on which electronic components are mounted opposes the inner wall of the housing 4. More specifically, as shown in Fig. 2, a base plate 45 fixed to the second surface of a main body portion 46a of the flexible printed circuit 46 is mounted in the opening portion of the housing 4 to accommodate a neck portion 46e (46c) and a head portion 46d (46b) having an auxiliary plate 48 (47) fixed on the head portion 40d(40b) to the cavity of the housing 4.
- the main body portion 46a of the flexible printed circuit 46 is supported by a member 100.
- a plurality of openings 30 and 30a are formed in the side walls and the like of the housing 4 which cover the main body portion 46a so as to efficiently drain the cleaning solution from the cavity of the housing 4 in cleaning the optical module 1.
- the circuit board 8 has the flexible printed circuit (FPC) 46.
- the FPC 46 comprises the main body portion 46a on which circuit elements 801 are mounted, the head portion 46b (46d) connected, by soldering or the like, to the terminals 2a (3a) of the optical operation element 2 (3) adhered and fixed to the sleeve 5 (6), and the neck portion 46c (46e) coupling the main body portion 46a to the head portion 46b (46d).
- the head portion 46b (46d) has the reinforcing plate 47 (48) as a backing plate, and the main body portion 46a has the base plate 45 as a backing plate to obtain a desired strength.
- the circuit board 8 is bent at the neck portion 46c (46e) in a direction indicated by an arrow D.
- each sleeve 5 (6) is accommodated to the cavity of the housing 4.
- Each lead pin 43 has a lock portion 43a so as to mount the circuit board 8 from the second side. This lock portion 43a is continuous to a straight extraction portion 43b.
- the sectional structure of the FPC 46 is a multilayered structure in which a plurality of metal interconnections (e.g., a signal line for transmitting an electrical signal and a ground line) are formed in different layers through an insulating layer, as shown in Fig. 4. More specifically, the FPC 46 is constituted as follows.
- the epoxy layer 800b (20 ⁇ m) as an adhesive layer for adhering layers, a copper layer 810 (18 ⁇ m) as a metal wiring layer, the epoxy layer 800e (20 ⁇ m) as an adhesive layer for adhering layers, and a polyimide layer 800f (25 ⁇ m) as a cover layer for the FPC are sequentially formed on one surface of the polyimide layer 800a (25 ⁇ m) as a base.
- an epoxy layer 801b (20 ⁇ m) as an adhesive layer for adhering layers, a metal wiring layer 811 (18 ⁇ m), an epoxy layer 801e (20 ⁇ m) as an adhesive layer for adhering layers, and a polyimide layer 801f (25 ⁇ m) as a cover layer for the FPC are sequentially formed on the other surface of the polyimide layer 800a (25 ⁇ m) as the base.
- a polyimide layer 801f 25 ⁇ m
- the metal wiring layer 810 (811) is constituted by stacking, on the metal wiring layer 810 (811), the first copper layer 800c (801c) as a conductive layer, and the second copper layer 800d (801d) as a conductive layer for a through hole 820 as shown in Fig. 4.
- the FPC 46 comprises the rectangular main body portion 46a fixed to the base plate 45, the head portion 46b (46d) electrically connected directly to the terminal 2a of the optical operation element 2, and the neck portion 46c (46e) extending from the main body portion 46a to electrically connect the main body portion 46a to the head portion 46b (46d).
- the head portion 46b is formed at a position having a predetermined angle ⁇ with respect to a perpendicular (a dashed line in Fig. 5; this dashed line coincides with the direction of the neck portion 46c extending from the main body portion 46a) which is drawn from a coupling position between the neck portion 46c and the main body portion 46a with respect to the coupling surface (a chain line S in Fig. 5) of the neck portion 46c.
- the head portion 46b has the degree of three-dimensional freedom. With this arrangement, a structure having a high resistance to stress in a direction to twist the neck portion 46c can be realized. In addition, the degree of bending freedom can be greatly increased, thereby preventing the neck portion 46c from cutting.
- the neck portion 46c has no member for supporting the second surface of the neck portion 46c. Therefore, the head portion 46b can be easily raised from the main body portion 46a, and the positional relationship between the circuit board 8 and the optical operation element 2 can be freely set.
- the flexible printed circuit 46 may have a structure shown in Fig. 6. That is, the neck portion 46c may extend perpendicularly to the main body portion 46a. By bending this neck portion 46c at almost a right angle, the head portion 46b can be formed at the position having the angle ⁇ with respect to a perpendicular (a dashed line in Fig. 6) which is drawn from the coupling position between the neck portion 46c and the main body portion 46a with respect to the coupling surface of the neck portion 46c. A structure having a high resistance to stress in the direction to twist the neck portion 46c can be realized. Furthermore, the neck portion 46c may be formed into a spiral shape and given with spring properties. With this arrangement, the same effect as described above can be obtained.
- the barycenter in a region of the head portion 46b (46d) for mounting the optical operation element 2 (3) is offset in a direction perpendicular to a direction H of the neck portion 46c (46e) extending from the main body portion 46a and a direction D to bend the neck portion 46c (46e) (Fig. 3).
- a polygon (triangle in this embodiment) is drawn using, as vertices, centers 401a, 401b, and 401c of three through holes 400a, 400b, and 400c (which receive the terminals 2a (3a) extending from the bottom portion of the optical operation element 2 (3)) in the head portion 46b (46d), as shown in Fig. 7.
- a barycenter G obtained from this polygon is defined as the barycenter in the element mounting region.
- Fig. 8 is a schematic view showing a state in which the optical operation element 2 (3) is mounted on the head portion 46b (46d) of the FPC 46.
- the auxiliary plate 47 (48) having a predetermined thickness and a proper bending strength is fixed to the head portion 46b (46d).
- a recess 47a is formed in a mounting surface 202 of the auxiliary plate 47.
- the recess 47a stores a projection 2d formed of a solder in joining a ground terminal 2e of the optical operation element 2 (3) to a bottom surface 2A of the optical operation element 2 by soldering. No excess load is applied to the head portion 46b of the FPC 46 in surface-mounting the optical operation element 2 (3) on the FPC 46 because this recess 47a stores the projection 2d, unlike a state shown in Fig. 9.
- a diameter D2 of the recess 47a is larger than a diameter D1 of each of through holes 203a, 203b, and 203c which receive the terminals 2a and 2e.
- the main body portion of the optical module circuit board is coupled to the head portion through the neck portion.
- the flexible neck portion can absorb a stress in the twist direction to prevent cutting and disconnection between the main body portion and the neck portion and between the neck portion and the head portion.
- the reinforcing plate having the recess for storing the projection formed on the bottom surface of the optical operation element is fixed to the optical operation element mounting surface of the flexible head portion. With this structure, when the optical operation element is mounted, the projection formed on the bottom surface of the optical operation element can be stored in the recess of the reinforcing plate. No excess load is applied to the flexible head portion in mounting (see Fig. 9).
- Fig. 10 shows a pattern on the FPC 46.
- a power supply filter circuit 470 including a bypass capacitor 60 is mounted on the head portion 46b.
- the optical operation element 2 is mounted on a surface opposite to this pattern mounting surface. Therefore, the optical operation element 2 can be set near the bypass capacitor 60.
- LSI chips 801 are mounted on regions 460a and 460b defined on the main body portion 46a, as shown in Fig. 10.
- Figs. 11 and 12 are sectional views showing a structure for connecting a ground pattern on the head portion 46b (46d) to the ground terminal 2e of the optical operation element 2 (3).
- the layer 900a includes the layers 800e and 800f of Fig. 4
- the layer 900b includes the layers 800c and 800d of Fig. 4
- the layer 900c includes the layers 800a, 800b and 801b of Fig. 4
- the layer 900d includes the layers 801c and 801d of Fig. 4
- the layer 900e includes the layers 801e and 801f of the Fig. 4.
- a ground pattern in the FPC 46 electrically contacts the ground wiring layer 900d in the through hole 400a.
- the ground terminal 2e of the optical operation element 2 inserted in the through hole 400a is electrically connected to the ground pattern through a solder 204.
- the head portion 46b (46d) Since the optical operation element and the power supply filter circuit are mounted close to each other on the head Portion 46b (46d), a sufficient bypass effect can be obtained.
- the head portion 46b and the neck portion 46c of the FPC 46 are separated from the main body portion 46a.
- the power supply filter circuit such as the bypass capacitor 60 and a peripheral circuit 61 are mounted on the head portion 46b near a position at which the optical operation element 2 is mounted.
- the optical module is constituted by the head portion 46b, the neck portion 46c, the bypass capacitor 60, and the peripheral circuit 61.
- the end portion of the neck portion 46c is electrically coupled to the main body portion 46a by soldering, welding, thermal compression, or the like.
- the versatility of the board itself can be improved by employing the board structure which integrally incorporates the head portion 46b, the neck portion 46c, the bypass capacitor 60, and the peripheral circuit 61.
- the neck portion 46c may be connected to the board 460 by connecting a wiring pattern 803 formed on the first surface of the neck portion 46c to a connection pin 461 arranged on the board 460 through a solder 462, as shown in Fig. 15. Further, as shown in Fig. 16, the end portion of the neck portion 46c may be exposed by stripping the polyimide layer and the like. Moreover, as shown in Fig. 17, the end portion of the neck portion 46c may be shaped to be inserted in a socket 480 arranged on the printed wiring board 460.
- Fig. 18 is a perspective view showing the optical module 1 when viewed from the housing 4 side.
- the sleeves 5 and 6 to which the optical operation elements 2 and 3 are adhered and fixed by the element holding portions 11 are held by electrically connecting and fixing the optical operation elements 2 and 3 to part of the circuit board 8.
- the sleeves 5 and 6 are accommodated to the housing 4.
- First latch portions 28 extending from a base portion 15 of the sleeve holder 7 are engaged with second latch portions 40 formed on the side walls of the housing 4 to attach the sleeve holder 7 to the housing 4. More specifically, projections 28a of the first latch portions 28 are fitted in openings 40a of the second latch portions 40 to attach the sleeve holder 7 at the opening portion of the housing 4.
- the sleeves 5 and 6 already accommodated to the housing 4 are automatically set at predetermined positions in accordance with a special structure shown in Figs. 2, 18, and 19.
- a protective plate 50 covers the opening portion of the housing 4 to hide the optical sleeves 5 and 6 in the housing 4. More specifically, projections 50a and 50b are formed at both the ends of the plate 50. When the projections 50a and 50b are fitted in grooves 50c and 50d formed in the inner walls of the housing 4, the plate 50 is automatically attached at the opening portion of the housing 4.
- spring pieces 24A and 24B (25A and 25B) and the spring piece 26 (27) arranged on the sleeve holder 7 urge the flange 12 of the sleeve 5 (6) against the support portion 31 (32) in the housing 4 to fix the sleeve 5 (6) at the predetermined position in the cavity of the housing 4.
- Fig. 19 shows a structure in which the circuit board 8 having each sleeve 5 (6) thereon and the neck portions 46c and 46e bent in a predetermined shape is attached at the opening portion of the housing 4.
- a plurality of board support portions 42 are formed inside the housing 4, and a first surface 8a (i.e., a surface on which the circuit elements 801 are mounted) of the circuit board 8 abuts against surfaces 42a and 42b of the board support portions 42.
- a plurality of hook pieces 41 are formed on the inner walls of the housing 4, and the edge portion of the circuit board 8 is clamped between lock portions 41a of the hook pieces 41 and the board support portions 42 to attach the circuit board 8 at the opening portion of the housing 4.
- the openings (openings of the insertion holes) of the ferrule holding portions 10 of the sleeves 5 and 6 accommodated to the cavity of the housing 4 respectively face the openings 400a and 400b (openings for externally inserting ferrules 9a into the housing 4) formed in the front surface of the housing 4.
- the sleeve holder 7 and the protective plate 50 are sequentially attached at the opening portion of the housing 4, as shown in Fig. 20.
- first latch portions 28 are formed at both the sides of the base portion 15 of the sleeve holder 7, and the second latch portions 40 engaged with the first latch portions 28 are formed on the side walls of the housing 4.
- the sleeve holder 7 is automatically attached at the opening portion of the housing 4. At this time, the sleeves 5 and 6 are automatically fixed at the predetermined positions in the housing 4.
- the projections 50a and 50b are formed at both the ends of the protective plate 50, and the grooves 50c and 50d corresponding to the projections 50a and 50b are formed in the inner walls of the housing 4.
- the protective plate 50 is automatically attached at the opening portion of the housing 4.
- the second opening i.e., the opening for receiving each sleeve 5 (6)
- the housing 4 is covered with the circuit board 8, the base portion 15 of the sleeve holder 7, and the protective plate 50.
- auxiliary plate 47 (48) has a structure shown in Figs. 21 and 22.
- Fig. 23 is a sectional view showing the auxiliary plate 47 (48) shown in Fig. 22 along the line B -B.
- a first embodiment of the auxiliary plate 47 (48), as shown in Fig. 21, has a first surface 470b being in contact with the second surface of the FPC 46, a second surface 470a opposite to the first surface 470b, and a plurality of through holes 471a and 471b extending from the second surface 470a to the first surface 470b.
- the plurality of through holes 471a and 471b respectively have tapered openings 472a and 472b.
- a second embodiment of an auxiliary plate 47 (48), as shown in Figs. 22 and 23, also has a plurality of slotted holes 473a and 473b extending from the second surface 470a to the first surface 470b.
- the slotted holes 473a and 473b, as shown in Fig. 23, respectively have tapered openings 474a and 474b. Even if the intervals between the ground terminal 2e and the other terminals 2a surrounding the terminal 2e are varied, each of the terminals 2a can be inserted the corresponded slotted holes.
- the varied types of optical elements can be inserted one kind of the auxiliary plate 47 (48) shown in Figs. 22 and 23.
- the slotted holes 473a and 473b respectively have tapered openings 474a and 474b.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP269870/94 | 1994-11-02 | ||
JP26987094 | 1994-11-02 | ||
JP6269870A JPH08136765A (ja) | 1994-11-02 | 1994-11-02 | 光モジュールの基板構造 |
JP6275099A JPH08136767A (ja) | 1994-11-09 | 1994-11-09 | 光モジュール |
JP275099/94 | 1994-11-09 | ||
JP27509994 | 1994-11-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0710861A1 true EP0710861A1 (fr) | 1996-05-08 |
EP0710861B1 EP0710861B1 (fr) | 2003-02-19 |
Family
ID=26548953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95117258A Expired - Lifetime EP0710861B1 (fr) | 1994-11-02 | 1995-11-02 | Circuit imprimé pour module optique avec structure flexible |
Country Status (6)
Country | Link |
---|---|
US (1) | US5742480A (fr) |
EP (1) | EP0710861B1 (fr) |
KR (1) | KR100357987B1 (fr) |
CA (1) | CA2161915A1 (fr) |
DE (1) | DE69529653T2 (fr) |
TW (1) | TW353853B (fr) |
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WO1998014813A1 (fr) * | 1996-09-30 | 1998-04-09 | The Whitaker Corporation | Emetteur/recepteur a matrice de fibres optiques utilisant la technologie des circuits flexibles |
WO2000045207A1 (fr) * | 1999-01-28 | 2000-08-03 | Marconi Caswell Limited | Systeme d'interface optique |
US6234686B1 (en) | 1997-12-03 | 2001-05-22 | Sumitomo Electric Industries, Ltd. | Optical data link |
NL1014313C2 (nl) * | 2000-02-08 | 2001-08-13 | Fci S Hertogenbosch B V | Elektro-optische connector module. |
DE10029289A1 (de) * | 2000-06-14 | 2002-01-03 | Infineon Technologies Ag | Verbindungsanordnung aus elektrischen/elektronischen Bauelementeträgern |
EP1202095A1 (fr) * | 2000-10-26 | 2002-05-02 | Fci | Module de connexion électro-optique |
WO2002052909A2 (fr) * | 2000-12-26 | 2002-07-04 | Emcore Corporation | Carte de circuit imprime souple |
WO2002103427A2 (fr) * | 2000-12-26 | 2002-12-27 | Emcore Corporation | Structure de montage optoelectronique |
WO2004061506A1 (fr) | 2002-12-30 | 2004-07-22 | General Electric Company | Banc micro-optique integre a substrat dielectrique flexible |
EP1875504A2 (fr) * | 2005-04-29 | 2008-01-09 | Finisar Corporation | Connecteur de chassis de brochage moule comprenant un ou plusieurs constituants passifs |
WO2009117991A1 (fr) * | 2008-03-26 | 2009-10-01 | Kiekert Aktiengesellschaft | Support pour composants électriques/électroniques et procédé de fabrication correspondant |
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US7153043B1 (en) * | 2006-01-19 | 2006-12-26 | Fiberxon, Inc. | Optical transceiver having improved printed circuit board |
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US9223094B2 (en) | 2012-10-05 | 2015-12-29 | Tyco Electronics Nederland Bv | Flexible optical circuit, cassettes, and methods |
US9435975B2 (en) | 2013-03-15 | 2016-09-06 | Commscope Technologies Llc | Modular high density telecommunications frame and chassis system |
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TWI607677B (zh) | 2016-11-21 | 2017-12-01 | 同泰電子科技股份有限公司 | 可撓性線路板結構 |
CN111164479B (zh) | 2017-10-02 | 2021-11-19 | 康普技术有限责任公司 | 光纤光学电路和制备方法 |
US10754111B1 (en) * | 2019-04-22 | 2020-08-25 | The Boeing Company | Method for modifying small form factor pluggable transceiver for avionics applications |
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- 1995-11-02 DE DE69529653T patent/DE69529653T2/de not_active Expired - Fee Related
- 1995-11-02 EP EP95117258A patent/EP0710861B1/fr not_active Expired - Lifetime
- 1995-11-02 KR KR1019950039328A patent/KR100357987B1/ko not_active IP Right Cessation
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Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998014813A1 (fr) * | 1996-09-30 | 1998-04-09 | The Whitaker Corporation | Emetteur/recepteur a matrice de fibres optiques utilisant la technologie des circuits flexibles |
US6234686B1 (en) | 1997-12-03 | 2001-05-22 | Sumitomo Electric Industries, Ltd. | Optical data link |
US6487087B1 (en) | 1999-01-28 | 2002-11-26 | Bookham Technology Plc | Optical interface arrangement |
WO2000045207A1 (fr) * | 1999-01-28 | 2000-08-03 | Marconi Caswell Limited | Systeme d'interface optique |
NL1014313C2 (nl) * | 2000-02-08 | 2001-08-13 | Fci S Hertogenbosch B V | Elektro-optische connector module. |
EP1146372A2 (fr) * | 2000-02-08 | 2001-10-17 | F.C.I. - Framatome Connectors International | Module opto-électronique de connexion basé sur des circuits électroniques flexibles |
EP1146372A3 (fr) * | 2000-02-08 | 2001-10-24 | F.C.I. - Framatome Connectors International | Module opto-électronique de connexion basé sur des circuits électroniques flexibles |
US7088926B2 (en) | 2000-02-08 | 2006-08-08 | Framatome Connectors International | Electro-optical connector module |
DE10029289A1 (de) * | 2000-06-14 | 2002-01-03 | Infineon Technologies Ag | Verbindungsanordnung aus elektrischen/elektronischen Bauelementeträgern |
US6565384B2 (en) | 2000-10-26 | 2003-05-20 | Framatome Connectors International | Electro-optical connector with flexible circuit |
FR2816066A1 (fr) * | 2000-10-26 | 2002-05-03 | Framatome Connectors Int | Module de connexion electro-optique |
EP1202095A1 (fr) * | 2000-10-26 | 2002-05-02 | Fci | Module de connexion électro-optique |
WO2002103427A2 (fr) * | 2000-12-26 | 2002-12-27 | Emcore Corporation | Structure de montage optoelectronique |
WO2002052909A3 (fr) * | 2000-12-26 | 2003-10-09 | Emcore Corp | Carte de circuit imprime souple |
WO2002103427A3 (fr) * | 2000-12-26 | 2003-10-30 | Emcore Corp | Structure de montage optoelectronique |
US6799902B2 (en) | 2000-12-26 | 2004-10-05 | Emcore Corporation | Optoelectronic mounting structure |
WO2002052909A2 (fr) * | 2000-12-26 | 2002-07-04 | Emcore Corporation | Carte de circuit imprime souple |
CN100409053C (zh) * | 2002-12-30 | 2008-08-06 | 通用电气公司 | 用于光电互连的组装、连接和耦合的微光学系统 |
WO2004061506A1 (fr) | 2002-12-30 | 2004-07-22 | General Electric Company | Banc micro-optique integre a substrat dielectrique flexible |
EP1875504A2 (fr) * | 2005-04-29 | 2008-01-09 | Finisar Corporation | Connecteur de chassis de brochage moule comprenant un ou plusieurs constituants passifs |
EP1875504A4 (fr) * | 2005-04-29 | 2010-01-06 | Finisar Corp | Connecteur de chassis de brochage moule comprenant un ou plusieurs constituants passifs |
EP2458635A1 (fr) * | 2005-04-29 | 2012-05-30 | Finisar Corporation | Connecteur de cadre de plomb moulé avec un ou plusieurs composants passifs |
WO2009117991A1 (fr) * | 2008-03-26 | 2009-10-01 | Kiekert Aktiengesellschaft | Support pour composants électriques/électroniques et procédé de fabrication correspondant |
CN112105137A (zh) * | 2019-06-17 | 2020-12-18 | 矢崎总业株式会社 | 电路体、板与电路体的连接结构和汇流条模块 |
EP3755129A1 (fr) * | 2019-06-17 | 2020-12-23 | Yazaki Corporation | Corps de circuit, structure de connexion d'une carte et d'un corps de circuit et module de barre de bus |
ES2950294A1 (es) * | 2022-03-04 | 2023-10-06 | Satel Spain S L | Sonda de medición |
Also Published As
Publication number | Publication date |
---|---|
KR100357987B1 (ko) | 2003-01-24 |
DE69529653T2 (de) | 2003-10-23 |
DE69529653D1 (de) | 2003-03-27 |
CA2161915A1 (fr) | 1996-05-03 |
KR960018636A (ko) | 1996-06-17 |
US5742480A (en) | 1998-04-21 |
EP0710861B1 (fr) | 2003-02-19 |
TW353853B (en) | 1999-03-01 |
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