EP0446235A1 - Procede de fabrication et d'application de colles a fusion et/ou de matieres d'etancheification a reticulation ulterieure sous l'effet de l'humidite - Google Patents

Procede de fabrication et d'application de colles a fusion et/ou de matieres d'etancheification a reticulation ulterieure sous l'effet de l'humidite

Info

Publication number
EP0446235A1
EP0446235A1 EP89912960A EP89912960A EP0446235A1 EP 0446235 A1 EP0446235 A1 EP 0446235A1 EP 89912960 A EP89912960 A EP 89912960A EP 89912960 A EP89912960 A EP 89912960A EP 0446235 A1 EP0446235 A1 EP 0446235A1
Authority
EP
European Patent Office
Prior art keywords
water
groups
hot
sealing compounds
nco
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP89912960A
Other languages
German (de)
English (en)
Inventor
Heinz-Günther SCHULTE
Hans-Georg Kinzelmann
Herbert Fischer
Günter TAUBER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of EP0446235A1 publication Critical patent/EP0446235A1/fr
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/83—Chemically modified polymers
    • C08G18/831—Chemically modified polymers by oxygen-containing compounds inclusive of carbonic acid halogenides, carboxylic acid halogenides and epoxy halides
    • C08G18/832—Chemically modified polymers by oxygen-containing compounds inclusive of carbonic acid halogenides, carboxylic acid halogenides and epoxy halides by water acting as hydrolizing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/20—Compositions for hot melt adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints

Definitions

  • the invention relates to processes for the production and application of hot-melt adhesive and / or sealing compounds which crosslink under the action of moisture and which cure via terminal NCO and / or alkoxysilane groups.
  • Hot melt adhesives are becoming increasingly popular in adhesive technology because, owing to their absence of solvents, they do not cause any environmental problems during processing and are also suitable for production processes with short cycle times.
  • the original disadvantages of hot melt adhesives i.e. In recent developments, the low temperature resistance of the bonds could be remedied by using reactive systems as hot melt adhesives, which react when melted under molecular build-up and thereby lead to substances that cannot be melted a second time or only at a much higher temperature.
  • moisture-crosslinking hot melt adhesives are moisture-crosslinking hot melt adhesives. This is generally understood to mean solvent-free adhesives which, after being applied to a substrate, achieve their final strength and heat resistance by using water from the atmosphere or post cure the substrate.
  • the groups reacting with water are generally NCO groups, cf. DE-B 24 01 320, EP-B 00 19 159, DE-A 32 36 313, DE-A 33 39 981, US-B 3 991 025, US-B 3 931 077, US-B 4 166 873, EP -A 0 125 008 and EP-A 0 125 009.
  • Moisture-curing hot-melt adhesives can also be obtained if free NCO groups of prepolymers are reacted with aminoalkyl-trialkoxysilanes, the curing then taking place via Si (OR) 3 end groups, cf. HF Huber, H. Müller, 11th Kunststoff Adhesive and Finishing Seminar, October 1986.
  • This lecture also presented a moisture-curing hotmelt adhesive that was constructed from a polyester as a basic structure with free OH groups, in the manner that the OH groups were first reacted with polyfunctional isocyanates in excess. The then free NCO groups were then reacted with aminoalkyl trialkoxysilanes to give so-called silane hot melt adhesives.
  • Hotmelt adhesive systems based on this principle are furthermore known from DE-A 37 14 763 and from Japanese patent applications 80 160 074 (CA. 9 ⁇ , 15 79 29p (1981)), 59 24 767 (CA.. 1C, 73 931t) (1984)), 59 221 366 (CA.. 102., 150611p (1985)), 59 172 573 (CA.. 102., 96632f (1985)) and 59 174 674 (CA. 102, 6328q (1985)) known.
  • polyurethane prepolymers corresponds to those used for hot melt adhesives. Their composition is described in the specialist literature, cf. e.g. Römpp, Encyclopedia of Technical Chemistry, 4th Edition, Volume 14, pages 262-263.
  • the invention is directed to hotmelt adhesives and / or sealing compounds of the above-mentioned type or processes for their production and their application which crosslink under the influence of moisture and which enable effective, rapid and reproducible curing, in particular when bonding or sealing non-porous substrates.
  • de melt adhesive and / or sealing masses are admixed with water or a substance containing water which is reversible at working temperature or chemical or adsorptive bond immediately before application.
  • hot melt and / or sealing compounds and water are advantageously brought together in substances containing reversible chemical or adsorptive binding at working temperature in a two-component mixing and dosing system with a static mixing head immediately before application. Since hot melt adhesives enter large amounts of moisture, e.g. in the event of improper storage, in later application for
  • a TZ BLA TT If foaming tends to occur, the amount of water released can be minimized by means of the subject matter of the invention so that foaming is avoided, but the amount of water present is sufficient for crosslinking.
  • Working temperature is to be understood as the temperature at which the hot-melt adhesive or sealing compounds are present in a sufficiently liquid form so that they can be mixed and applied with the water-releasing substances.
  • Substances containing between 0.5 and 25% by weight, preferably between 1 and 10% by weight, are suitable as water in the case of substances which contain a chemical or adsorptive bond which is reversible at working temperature and are referred to below as "water-releasing substances”. can release bound water.
  • Both inorganic and organic substances can be used as water-releasing substances within the scope of the invention which contain water physically or chemically bound and release it again at ambient temperature or when heated.
  • Oxides, hydroxides and salts of alkali and alkaline earth metals, of metals of the third main group of the periodic system and of subgroup elements which are expediently used in air-dry state are preferred as inorganic water-releasing substances.
  • Another aspect for the selection of the water-releasing substances is their environmental compatibility.
  • Particularly preferred are iron sulfate (FeSO- x 7H 2 0), barium hydroxide (Ba (OH) 2 x 8H 2 0), calcium sulfate (CaS0 4 x 2H 2 0), copper sulfate (CuSO x 5H 2 0), magnesium phosphate ((Mg) 3 (P0 4 ) 2 x 4H 2 0), sodium silicate (Na 2 Si0 3 x 9H 2 0), copper acetate (Cu (CH 3 COO) 2 x 2H 2 0), sodium carbonate (Na 2 C0 3 x 12H 2 0) , Sodium phosphate (Na 3 P0 4 x 12H 2 0), sodium sulfate (Na 2 S0 4 x
  • Another class of substances which can be used as water-releasing substances in the context of the invention are inorganic compounds which form structures containing cavities or channels in which water is bound or embedded, the water essentially remaining there at room temperature and is released again only to a greater extent above the room temperature or in a vacuum.
  • examples of such compounds are zeolites.
  • water-laden, in particular air-dry, molecular sieves, polyamides, in particular polyacrylamides, polyvinylpyrrolidone, polyurethanes and hydrophilic polymers such as cellulose derivatives and starch derivatives can be used as water-releasing substances.
  • the water-releasing substances are added to the hot-melt adhesive and / or sealing compounds in an amount corresponding to a molar ratio of reversibly bound water to terminal NCO or alkoxysilane groups of 0.6: 1 to 10: 1, preferably 0.8: 1 to 3: 1.
  • the object of the invention is applicable to hot melt adhesives and / or sealing compounds based on polyurethane prepolymers which cure via terminal NCO groups.
  • Particularly preferred is the application to hot-melt adhesive and / or sealing compounds based on thermoplastic polymers with isocyanate or alkoxysilane end groups and curing via terminal alkoxysilane groups and / or NCO groups, in particular to thermoplastic polymers based on polyamides and / or polyurethanes, the alkoxysilane end groups of Formula I.
  • X is a group of the formula -S- or -NR 3-, where R3
  • n is a number from 1 to 4,
  • p is the number 0, 1 or 2
  • R is an alkyl group of 1 to 4 carbon atoms
  • 2 R is a residue of that formed from alkyl of 1 to 4 carbon atoms and alkoxyalkylene of 2 to 4 carbon atoms
  • water-releasing substances in a mixture with resins and / or plasticizers compatible with the hot-melt adhesive and / or sealing compounds.
  • resins and / or plasticizers compatible with the hot-melt adhesive and / or sealing compounds.
  • Typical examples of such resins are, in particular, hydrocarbon resins of the coumarone-indene resin type, terpene resins, vinylaromatic resins and rosin resins, including esters of the rosin resins.
  • the plasticizers that can be used are familiar to the person skilled in the art in the field of plastics; typical examples are esters of phthalic acid, sebacic acid, adipic acid, phosphoric acid and citric acid as well as fatty acid esters, epoxidized fatty acid esters, chlorinated paraffins and sulfonamides.
  • hot melt adhesives which crosslink by reaction of NCO groups with moisture can be found in the documents DE-B 24 01 320, EP-B 00 19 159, DE-A 32 36 313, DE-A 33 39 981, US-B 3 991 025, US-B 3 931 077, US-B 4 166 873, EP-A 0 125 008 and EP-A 0 125 009.
  • Such polyurethane hot-melt adhesives are usually produced by reacting polyols with an excess of diisocyanates with the exclusion of moisture. Aromatic diisocyanates are used in most cases as the diisocyanate component for the construction of polyurethanes.
  • Examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, isomer mixtures of 2,4- and 2,6-tolylene diisocyanate, diphenylmethane-4,4'-diisocyanate and 1,5-naphthylene diisocyanate.
  • aliphatic diisocyanates such as 1,6-hexane diisocyanate, play a significantly smaller role.
  • Substances such as triphenylmethane 4,4 ', 4''triisocyanate and tris (4-isocyanatophenyl) thiophosphate are used as polyisocyanates.
  • isocyanate components for polyurethane adhesives are commercially available.
  • Both low molecular weight compounds and products with a higher molecular weight can be used as polyols.
  • low molecular weight compounds are glycols, glycerol, butanediol and trimethylolpropane.
  • Polyethers or polyester polyols are usually used as the higher molecular weight polyols.
  • Starting substances for the preparation of crosslinked polyester polyols are, for example, adipic acid, phthalic acid, butylene glycol, glycerol and hexanetriol.
  • Linear polyester polyols can be prepared by reacting adipic acid with ethylene glycol.
  • Another class of polyester-based polyols is available based on hydroxyl-containing polyacrylate.
  • Polyether polyols can be prepared by reacting epoxides with alcohols.
  • alcohols which can be used are ethylene glycol, diethylene glycol, propylene glycol, glycerol, trimethylolpropane, pentaerythritol, sorbitol, mannitol, sucrose and alkyl glucosides.
  • Epoxides that can be used are, for example, ethylene oxide, propylene oxide, butylene oxide, styrene oxide, cyclohexene oxide, trichlorobutylene oxide and epichlorohydrin.
  • Tetrahydrofuran can be used instead of an epoxy Tetrahydrofuran can be used.
  • polyethers and polyesters natural substances, for example castor oil, can also be used as the polyol component.
  • castor oil A large number of polyether polyols and polyester polyols, also especially for the preparation of polyurethanes, are commercially available.
  • hotmelt adhesives or sealing compounds curing via alkoxysilane groups can be found in the above-mentioned report on the 11th Kunststoff Adhesive and Finishing Seminar as well as in DE-A 36 29 237 and also in the Japanese patent applications mentioned at the outset.
  • moisture-crosslinking hotmelt adhesives according to DE-A 37 14 763, which are silanized polyamides which can be obtained in the following way: by reacting a diisocyanate of the formula III
  • R is a C 1 -C 4 alkyl group, in particular a CC alkyl group,
  • R is a radical from the of - alkyl, in particular
  • n is a number from 1 to 4,
  • p is a number of 0.1 or 2
  • R is hydrogen, CC-alkyl, aryl, or a residue of
  • the polyamides used can be homopolyamides, copolyamides, polyamide alloys, so-called elastomeric polyamides and polyamides containing other thermoplastics.
  • these are the following basic types:
  • Suitable aliphatic polyamides are, for example, from amino acids, lactams or aliphatic dicarboxylic acids of the formula H00C- (CH 2 ) -COOH with diamines H 2 N (CH 2 ) n -NH 2 , where n is 4 to 13.
  • Suitable elastomeric polyamides can be composed of polyamide and polyether blocks, the polyamide and the polyether blocks being linked, for example, by esters or amine bonds or using a di-isocyanate or di-epoxide.
  • Amorphous polyamides should preferably have a glass transition point below 200 ° C.
  • the copolyamides can, for example, from aliphatic, aromatic and / or branched chain monomers and from monomers with additional heteroatoms, which none exercise polyamide-forming function, be built up.
  • the polyamides to be used as the starting material can contain free amino and / or carboxyl groups. They can also contain end groups that are polyamide-forming and, in addition to aliphatic chain links and amide groups, secondary amino groups and other groups with heteroatoms such as -O-, -S-, -S0 2 -, - NCH 3 - or -C0- in the chain.
  • PA polyamide
  • PA-6 PA-11, PA-12, PA-66, PA-69, PA-6.10, PA -6.12, PA-6.13, amorphous PA according to US-B 4,233,145 or US-B 4,268,661, amorphous PA from isophthalic acid, hexanediamine and optionally other polyamide monomers, transparent polyamide from trimethylhexamethylene diamine and terephthalic acid, further known transparent polyamides, elastomers
  • Polyamides with a portion of crystalline polyamide from, for example, PA-6, PA-11 or PA-12, which can be linked to a polyether block, for example via amide or ester compounds, the polyether block preferably having the structure - (0- (CH 2 ) .-), n 2-50, or where the oxygen atoms are linked by isopropyl groups.
  • Carboxyl-terminated polyamides of the formula (VIIIb) are prepared like amino-terminated polyamides, but with an excess of dicarboxylic acid, cf. Houben-Weyl, Vol. 14/2, Thieme-Verlag, and Ullmann's Encyclopedia of Technical Chemistry, Vol. 19, Verlag Chemie 1980.
  • the polyamide of the formula (via) has amine numbers between 5 and 50.
  • Polyamides of the formula (VIb) preferably have acid numbers between 5 and 50.
  • polyamides of the formula (Via) comprising fatty acids unsaturated by polymerization with 12 up to 22 carbon atoms or esters thereof
  • C1-C4 aliphatic alcohols produced dimeric fatty acids; these are polyamides, as described in EP-A 00 61
  • the trialkoxy-alkyleneaminosilanes of the general formula (IVa) are in particular those which have only one amino group.
  • Typical examples are gamma-aminopropyltrimethoxysilane, gamma-A inopropyltriethoxysilane,
  • Typical representatives of the mercaptosilane esters of the general formula (IVb) are mercaptopropyl-trimethoxysilane and mercaptopropyl-triethoxysilane.
  • alkoxy substituents in particular the monomethyl ethers of glycols, such as ethylene or diethylene glycol and the like, can also be used.
  • the moisture-crosslinking hotmelt adhesives according to DE-A 37 14 763 can contain acidic catalysts which are selected from the group formed by tin (II) octoate, dibutyltin dilaurate, tetrabutyl titanate, zinc acetate and zinc acetylacetonate.
  • acidic catalysts which are selected from the group formed by tin (II) octoate, dibutyltin dilaurate, tetrabutyl titanate, zinc acetate and zinc acetylacetonate.
  • Such catalysts are common, cf. eg Ulimann, Encyclopedia of Technical Chemistry, Vol. 21, page 523 ff or E. Skeist, Handbook of Adhesives, van Nostrand, 1976, page 630.
  • the moisture-crosslinking hotmelt adhesives according to DE-A 37 14 763 can have a content of 0 to 50% by weight, based on trialkoxysilane-terminated polyamide of the formulas (Va) or (Vb), of resins which are inert to the latter.
  • resins and plasticizers are also common, cf. B.E. Skeist, Handbook of Adhesives, van Nostrand, 1976.
  • Moisture-crosslinking hotmelt adhesives are also particularly preferred in the context of the invention.
  • hot melt adhesives from the older German application P 38 27 464 dated August 12, 1988, the content of which is expressly referred to here. It relates to alkoxysilane-terminated, moisture-crosslinking hot-melt adhesives, which are produced by the implementation of
  • R is an alkyl group with 1 to 4 carbon atoms
  • R is a radical from that of alkyl having 1 to 4 carbon atoms and alkoxyalkylene having 2 to 5 carbon atoms,
  • R and R are a radical from the group formed by acyclic or cyclic alkylene having 5 to 14 carbon atoms, arylene, diarylene alkane and dialkylene-substituted aryl, 7 R is an alkylene radical having 2 to 12 carbon atoms and
  • n is the number 0 or 1
  • n is a number from 1 to 4,
  • p is the number 0, 1 or 2 and o
  • X is a group of the formula -S- or -NR -, in which R is hydrogen, alkyl having 1 to 4 carbon atoms, aminoethylene, aryl or a radical of the formula
  • R 9 is defined as R5 and R6, or mixtures
  • the radicals R and R are derived from diisocyanates of the formulas OCN-R -NCO and OCN-R -NCO, where R and R can be identical or different.
  • diisocyanates are tolylene diisocyanates (TDI), especially technical mixtures of the 2,4- and 2,6-isomer, diphenylmethane diisocyanate (MDI), 1,6-hexamethylene diisocyanate, naphthylene diisocyanate, xylylene diisocyanate, isophorone diisocyanate (2,4,4-trimethyl -l, 6-diisocyanato-hexane, IPDI), dimeric
  • TDI tolylene diisocyanates
  • MDI diphenylmethane diisocyanate
  • IPDI isophorone diisocyanate
  • R 1 and R 3 are preferably
  • radicals R and R are derived from diisocyanates of the formula OCN-R -NCO or OCN-R -NCO, the isocyanate groups of which have different reactivities.
  • diisocyanates are isophoronylene and tolylene diisocyanate (including the technical mixtures rich in 2,4-isomer with the 2,6-1 isomer).
  • the group R of the general formula VIII is derived from an especially linear alkylene diol having 2 to 12 carbon atoms; in particular of ethylene glycol, 1,4-butanediol, 1,6-hexanediol, 1,8-octanediol, 1,10-decanediol and 1,12-dodecanediol.
  • the alkylene diols mentioned here with 2 to 6 carbon atoms are particularly preferred.
  • the group R can be a methyl, ethyl, propyl or butyl group; Methyl or ethyl groups are preferred here. 2
  • the group R can be a methyl, ethyl, propyl or
  • butyl group or an alkoxyalkylene group such as methoxymethylene, methoxyethylene or methoxypropylene group. Methyl or ethyl groups are preferred here.
  • the group R 9 can have the meanings given above for R5 and R6; a particularly preferred diisocyanate of the formula IX is diphenylmethane diisocyanate (4,4'-diisocyanatodiphenylmethane; MDI), which results in temperature-resistant "hard segments" in the hotmelt adhesives.
  • a particularly preferred diisocyanate of the formula IX is diphenylmethane diisocyanate (4,4'-diisocyanatodiphenylmethane; MDI), which results in temperature-resistant "hard segments" in the hotmelt adhesives.
  • the group X of the general formula VIII can have the abovementioned
  • NCO-terized silane compounds of the formula VIII can be obtained by using a silane compound of the general formula X
  • R 1, R2, X, n and p are as defined above, with
  • Typical examples of silane compounds of the general formula X are
  • gamma-aminopropyltrimethoxysilane gamma-aminopropyltriethoxysilane
  • N-methyl-gamma-aminopropyltrimethoxysilane N-phenyl-gamma-aminopropyltrimethoxysilane
  • linear OH and / or NH 2 -terminated polymers with OH or NH 2 numbers in the range from 6 to 20, in particular 8 to 15, intended for the reaction with the NCO-terminated silane compounds of the formula VIII can be obtained by Reaction of linear OH and / or H 2 -terminated polyesters, polyethers and / or polyurethanes with diisocyanates of the formula XI
  • Typical representatives for linear OH-terminated polyesters for the production of hotmelt adhesives according to P 38 27 464 are those which, by condensation of dicarboxylic acids from oxal, malon, dimethylmalon, amber, glutaric, adipic, tri ethyladipine, Pimelin, 2,2-dimethylglutar, azelaine, sebacin, fu ar, maleic, itacon, 1,3-cyclopentanedicarbon-, 1,2-cyclohexanedicarbon-, 1,3-cyclopentanedicarbon-, 1,4 -Cyclohexanedicarbon-, Phthal-, Terephthal-, Isophthal-, 2,5-Norbornandicarbon-, 1,4-Naphthalenedicarbon-, Diphen-, 4,4'-Oxydibenzoe-, Diglykol-, Thiodipropion-, 4,4'-sulfonyldibenzoe-, 2,5-naphthalened
  • Partially crystalline, liquid or amorphous polyesters including mixtures thereof based on terephthalic, isophthalic, malonic, succinic, glutaric and / or adipic acid on the one hand and ethylene glycol, diethylene glycol, propylene glycol, 1,4-butanediol, hexanediol, are particularly preferred here. 1,6 and / or neopentyl glycol, on the other hand, which have OH numbers between 5 to 200, preferably 10 to 100 and particularly preferably 15 to 60. These OH-terminated polyesters are commercially available.
  • the above-mentioned linear OH-terminated polyethers include in particular polyalkylene glycols such as polyethylene glycol, polypropylene glycol and polytetrahydrofuran with number average molecular weights between 400 and 5000.
  • NH 2 -terminated polyethers NH 2 -terminated polypropylene glycols with number average molecular weights between 200 and 3000 are preferred.
  • OH-terminated, linear polyurethanes can also be used here, which are obtainable from diisocyanates of the type mentioned above with an excess of diols of the type mentioned above.
  • Linear OH and / or NH 2 -terminated polymers with OH or H 2 numbers in the range from 6 to 20, in particular 8 to 15, are known products, the majority of which are commercially available. If they are used - which is preferred in many cases - in the form of mixtures, it is sufficient if the total weight has the abovementioned OH or NH 2 ⁇ numbers, so that certain proportions of OH and / or NH 2 ⁇ terminated
  • HE SAT Z B LATT Polymers can be added, the OH or NH 2 ⁇ numbers are outside the aforementioned ranges.
  • hotmelt adhesives according to P 38 37 464, as linear OH-terminated polymers, reaction products of isocyanates of the general formula IX with mixtures of
  • the hot-melt adhesives that are ultimately obtainable in this way have improved stretchability and adhesion in the hardened state.
  • the alkoxysilane-terminated moisture-crosslinking hotmelt adhesive according to P 38 37 464 can be prepared by introducing the linear OH and / or NH 2 -terminated polymers with OH or NH 2 numbers in the range from 6 to 20, in particular from 8 to 15 and adding the NCO-terminated silane compounds of the formula IX in the stated molar ratios of OH and / or NH "groups of the difunctional polymers to NCO groups of the silane compounds of the formula IX and reacting at elevated temperatures until the proportion of free NCO Groups in the reaction mixture has dropped to 0 or almost 0.
  • the resulting alkoxysilane-terminated moisture-crosslinking hotmelt adhesives according to P 38 27 464 invention can be mixed with customary acid catalysts which are selected, for example, from the group formed by tin-II-octoate, dibutyltin dilaurate, tetrabutyltitanate, zinc acetate and zinc acetylacetonate or the like ; catalysts of this type are familiar to the person skilled in the art, cf. eg Ullmann, encyclopedia der Technische Chemie, volume 21, page 523 ff. or E. Skeist, Handbook of Adhesives, van Nostrand, 1976, page 630.
  • customary acid catalysts which are selected, for example, from the group formed by tin-II-octoate, dibutyltin dilaurate, tetrabutyltitanate, zinc acetate and zinc acetylacetonate or the like ; catalysts of this
  • the invention relates, via terminal NCO and / or alkoxysilane groups, to hot-melt adhesives and / or sealing compounds which crosslink under the action of moisture and contain bound water-containing substances of the type described above.
  • Hardener 1 The constituents specified below were mixed mechanically. Hardener 1:
  • Hardener 6 35 g of zeolite according to hardener 1, completely saturated with water
  • the adhesives Nos. 1 to 3 were mixed with the above-mentioned hardeners Nos. 2 to 9 in the ratios shown in Table 1 in a 2-component mixing and metering system with a static mixing head immediately before application and applied to sandblasted aluminum substrates.
  • the heat resistance (in ° C) after 7 days and the tensile shear strength after 7 days according to DIN 54 283 at room temperature and 100 ° C were determined; the results are summarized in Table 1.

Abstract

Ces colles ou matières d'étanchéification durcissent par groupes terminaux alcoxysilane et/ou NCO. le procédé, qui consiste à ajouter auxdits produits, juste avant de les appliquer, une substance contenant de l'eau dans une liaison chimique ou par adsorption réversible à la température de travail, permet de coller ou d'étanchéifier les matériaux non-poreux en particulier.
EP89912960A 1988-11-29 1989-11-20 Procede de fabrication et d'application de colles a fusion et/ou de matieres d'etancheification a reticulation ulterieure sous l'effet de l'humidite Pending EP0446235A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3840220 1988-11-29
DE3840220A DE3840220A1 (de) 1988-11-29 1988-11-29 Verfahren zur herstellung und applikation von unter feuchtigkeitseinwirkung nachvernetzenden schmelzkleber- und/oder dichtmassen

Publications (1)

Publication Number Publication Date
EP0446235A1 true EP0446235A1 (fr) 1991-09-18

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Family Applications (2)

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EP89912960A Pending EP0446235A1 (fr) 1988-11-29 1989-11-20 Procede de fabrication et d'application de colles a fusion et/ou de matieres d'etancheification a reticulation ulterieure sous l'effet de l'humidite
EP89121475A Expired - Lifetime EP0371370B1 (fr) 1988-11-29 1989-11-20 Procédé de préparation et d'utilisation de masses adhésives thermofusibles durcissables par l'humidité

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Application Number Title Priority Date Filing Date
EP89121475A Expired - Lifetime EP0371370B1 (fr) 1988-11-29 1989-11-20 Procédé de préparation et d'utilisation de masses adhésives thermofusibles durcissables par l'humidité

Country Status (4)

Country Link
EP (2) EP0446235A1 (fr)
JP (1) JPH04502023A (fr)
DE (2) DE3840220A1 (fr)
WO (1) WO1990006332A1 (fr)

Cited By (1)

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EP0371370B1 (fr) 1993-09-01
DE3840220A1 (de) 1990-05-31
WO1990006332A1 (fr) 1990-06-14
JPH04502023A (ja) 1992-04-09
EP0371370A1 (fr) 1990-06-06
DE58905460D1 (de) 1993-10-07

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