EP0355852A3 - Einrichtung zum Überführen von leitendem Rahmen - Google Patents

Einrichtung zum Überführen von leitendem Rahmen Download PDF

Info

Publication number
EP0355852A3
EP0355852A3 EP19890115745 EP89115745A EP0355852A3 EP 0355852 A3 EP0355852 A3 EP 0355852A3 EP 19890115745 EP19890115745 EP 19890115745 EP 89115745 A EP89115745 A EP 89115745A EP 0355852 A3 EP0355852 A3 EP 0355852A3
Authority
EP
European Patent Office
Prior art keywords
guide rail
lead frame
widthwise direction
biasing mechanism
transfer apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19890115745
Other languages
English (en)
French (fr)
Other versions
EP0355852A2 (de
EP0355852B1 (de
Inventor
Hiroaki Kobayashi
Kenji Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Publication of EP0355852A2 publication Critical patent/EP0355852A2/de
Publication of EP0355852A3 publication Critical patent/EP0355852A3/de
Application granted granted Critical
Publication of EP0355852B1 publication Critical patent/EP0355852B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Reciprocating Conveyors (AREA)
EP89115745A 1988-08-25 1989-08-25 Einrichtung zum Überführen von leitendem Rahmen Expired - Lifetime EP0355852B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP211422/88 1988-08-25
JP63211422A JPH0646645B2 (ja) 1988-08-25 1988-08-25 リードフレーム搬送装置

Publications (3)

Publication Number Publication Date
EP0355852A2 EP0355852A2 (de) 1990-02-28
EP0355852A3 true EP0355852A3 (de) 1991-12-11
EP0355852B1 EP0355852B1 (de) 1994-06-01

Family

ID=16605695

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89115745A Expired - Lifetime EP0355852B1 (de) 1988-08-25 1989-08-25 Einrichtung zum Überführen von leitendem Rahmen

Country Status (5)

Country Link
US (1) US4958722A (de)
EP (1) EP0355852B1 (de)
JP (1) JPH0646645B2 (de)
KR (1) KR920005860B1 (de)
DE (1) DE68915645T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1242532B (it) * 1990-06-07 1994-05-16 Ima Spa Dispositivo per il trasferimento di blister da una stazione di recisione ad una linea di ricevimento di tali blister.
DE4106425C2 (de) * 1991-02-26 1994-04-14 Mannesmann Ag Transportband in Baukastenweise
US5173338A (en) * 1991-04-04 1992-12-22 Ak Technology, Inc. Lead frame workholder and transport apparatus and method
JPH0728002B2 (ja) * 1991-06-20 1995-03-29 株式会社石井表記 Ｉｃフレームのブラスイング方法及びその装置
JP2596217Y2 (ja) * 1991-06-21 1999-06-07 山形日本電気株式会社 切断成形装置
JP3147451B2 (ja) * 1991-12-04 2001-03-19 株式会社石井工作研究所 Ｉｃストッカ、ｉｃ取出位置決め装置及びｉｃ供給システム
JP2878899B2 (ja) * 1992-05-07 1999-04-05 三菱電機株式会社 薄板フレームの搬送及び位置決め方法、並びにその装置
JP2798237B2 (ja) * 1994-06-15 1998-09-17 株式会社石井工作研究所 Ｉｃリードフレーム幅寄せ装置
SG65603A1 (en) * 1996-04-24 1999-06-22 Advanced Systems Automation Modularized in-line trim and form system
JPH10107128A (ja) * 1996-10-01 1998-04-24 Shinkawa Ltd ウェーハリングの供給装置
DE19822757C2 (de) * 1998-05-20 2000-04-13 Siemens Ag Vorrichtung zum Bearbeiten von elektrischen Bauelementeträgern
US6581928B1 (en) * 1999-10-20 2003-06-24 Heidelberger Druckmaschinen Ag Sheet guide device for sheet-processing machine
JP3967648B2 (ja) * 2002-08-28 2007-08-29 株式会社新川 板状部材の搬送装置
DE102005017660A1 (de) * 2005-04-13 2006-10-26 Otto Leiritz Synchrone Breitenverstellung über Zugbänder z.B. für mehrspurige Förderbandanlagen
KR100588420B1 (ko) * 2005-04-26 2006-06-09 (주)에이에스티 유동레일을 구비한 롤러형 이송장치
US20080003084A1 (en) * 2006-06-30 2008-01-03 Behnke Merlin E High speed tray transfer system
CN103373699B (zh) * 2012-04-28 2016-06-15 无锡华润安盛科技有限公司 用于传送带预塑封体的引线框的导轨及系统
CN104681473B (zh) * 2013-12-02 2018-07-06 无锡华润安盛科技有限公司 半导体封装设备的输送轨道及其应用的半导体封装设备
CN105059968B (zh) * 2015-08-09 2017-05-03 新乡医学院 一种互联网式同步搬板装置
CN106783152B (zh) * 2017-03-06 2018-06-19 海安县申菱电器制造有限公司 小型变压器挡墙粘结装置
JP7316979B2 (ja) * 2020-07-07 2023-07-28 三菱電機株式会社 半導体製造装置および半導体装置の製造方法
CN117718653B (zh) * 2024-02-18 2024-06-14 佛山市蓝箭电子股份有限公司 一种引线框架输送装置及焊线机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3408368A1 (de) * 1983-03-07 1984-10-04 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Foerdervorrichtung fuer gefuehrte rahmen
US4516318A (en) * 1983-04-26 1985-05-14 At&T Technologies, Inc. Methods of processing substrates
EP0189290A2 (de) * 1985-01-21 1986-07-30 FUJI MACHINE Mfg. Co., Ltd. Vorrichtung zum Positionieren von Substraten verschiedener Grösse von gedruckten Schaltungen
US4674238A (en) * 1984-10-03 1987-06-23 Fuji Seiki Machine Works, Ltd. Lead frame handling apparatus for blasting machine

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2851145A (en) * 1956-03-26 1958-09-09 Admiral Corp Electronic component attaching machine
US2857035A (en) * 1957-01-18 1958-10-21 Admiral Corp Electronic component attaching mechanism
JPS5144064A (ja) * 1974-10-11 1976-04-15 Myuki Shoji Kk Biizushugeihoho
US4202092A (en) * 1976-09-17 1980-05-13 Matsushita Electric Industrial Co., Ltd. Automatic part insertion machine
EP0040317B1 (de) * 1980-05-16 1985-11-06 Kurt Held Maschinenstruktur mit Führungsvorrichtung für numerisch gesteuerte Werkzeugträger an Bearbeitungsmaschinen für die Möbelherstellung
JPS5890732A (ja) * 1981-11-25 1983-05-30 Toshiba Corp 搬送装置
JPS58157620A (ja) * 1982-03-11 1983-09-19 Mitsubishi Electric Corp フレ−ム送り機構用レ−ル間隔変更装置
JPS59172731A (ja) * 1983-03-22 1984-09-29 Toshiba Corp リ−ドフレ−ム搬送装置
JPS61168299A (ja) * 1985-01-21 1986-07-29 富士機械製造株式会社 プリント基板搬送位置決め装置
US4754867A (en) * 1986-09-19 1988-07-05 Zenith Electronics Corporation Automated belt drive for PC board feed apparatus
US4819326A (en) * 1988-06-16 1989-04-11 Stannek Karl H Method for robotic placement of electronic parts on a circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3408368A1 (de) * 1983-03-07 1984-10-04 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Foerdervorrichtung fuer gefuehrte rahmen
US4516318A (en) * 1983-04-26 1985-05-14 At&T Technologies, Inc. Methods of processing substrates
US4674238A (en) * 1984-10-03 1987-06-23 Fuji Seiki Machine Works, Ltd. Lead frame handling apparatus for blasting machine
EP0189290A2 (de) * 1985-01-21 1986-07-30 FUJI MACHINE Mfg. Co., Ltd. Vorrichtung zum Positionieren von Substraten verschiedener Grösse von gedruckten Schaltungen

Also Published As

Publication number Publication date
EP0355852A2 (de) 1990-02-28
KR920005860B1 (ko) 1992-07-23
JPH0646645B2 (ja) 1994-06-15
KR900004238A (ko) 1990-03-27
US4958722A (en) 1990-09-25
EP0355852B1 (de) 1994-06-01
JPH0258842A (ja) 1990-02-28
DE68915645D1 (de) 1994-07-07
DE68915645T2 (de) 1994-10-27

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