EP0331953B1 - Leiterplatte mit einer Kühlvorrichtung - Google Patents

Leiterplatte mit einer Kühlvorrichtung Download PDF

Info

Publication number
EP0331953B1
EP0331953B1 EP89102856A EP89102856A EP0331953B1 EP 0331953 B1 EP0331953 B1 EP 0331953B1 EP 89102856 A EP89102856 A EP 89102856A EP 89102856 A EP89102856 A EP 89102856A EP 0331953 B1 EP0331953 B1 EP 0331953B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed
printed circuit
cooling
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP89102856A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0331953A1 (de
Inventor
Gerhard Seibold
Stauros Dr. Smernos
Matjaz Dr. Florjancic
Otto Thaidigsmann
Horst Dr. Richter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Alcatel Lucent NV
Original Assignee
Alcatel SEL AG
Alcatel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel SEL AG, Alcatel NV filed Critical Alcatel SEL AG
Priority to AT89102856T priority Critical patent/ATE83885T1/de
Publication of EP0331953A1 publication Critical patent/EP0331953A1/de
Application granted granted Critical
Publication of EP0331953B1 publication Critical patent/EP0331953B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes

Definitions

  • the invention relates to a printed circuit board with a cooling device which has channels through which a cooling medium flows.
  • the power loss per unit area or volume also increases. They are effectively dissipated, for example by transferring them to the printed circuit board via the connecting wires or the contact surface of the component, and distributing and dissipating them on the printed circuit board.
  • the heat must be dissipated so quickly that no overheated points form which, in the worst case, can lead to failure of the semiconductor components.
  • printed circuit boards that are densely populated with components, in which a lot of waste heat is generated, such a distribution and dissipation of the heat is no longer sufficient; they must be provided with an additional cooling device.
  • a known cooling device consists of a hollow copper plate which is provided on the inside with partitions which form cooling channels (EP 0 083 538 B1).
  • a printed circuit board is glued onto one or both surfaces of the hollow copper plate, onto which semiconductor components are soldered either directly or via connecting wires.
  • a model is made from wax or another low-melting material, into which the copper partition walls are embedded or recesses for inserting the connecting wires are machined.
  • the model is then electroplated on all sides with a copper layer.
  • the copper plating is then machined on two end faces.
  • the wax or the like is removed by melting, after which the cavities which have become free can serve as cooling channels.
  • the invention has for its object to provide a circuit board which is easy to manufacture and which, even if it is packed very densely with components, effectively dissipates the heat.
  • the layers forming the printed circuit board can expediently be glued to one another or connected to one another using adhesive films. They are then permanently connected to one another under the influence of pressure and / or temperature.
  • the cooling channels can easily be guided so that they run directly under the semiconductor components. This allows the heat to be dissipated directly and effectively at the point at which it is generated.
  • the circuit board maintains its dimensions, additional space for a cooling device is not required.
  • the circuit board can also be provided with plated-through holes for receiving wired components.
  • the materials required to manufacture the printed circuit board according to the invention - e.g. FR4 glass fiber reinforced epoxy resins and devices - e.g. Hot presses - are required anyway for the production of so-called multilayer printed circuit boards. The production of the cooled printed circuit boards according to the invention therefore does not require any additional materials or devices.
  • the cooling channels can be prepared by simply milling, punching or cutting the inner layer of the circuit board.
  • a semiconductor component 1 is attached to the printed circuit board, only a section of which is shown.
  • the printed circuit board itself consists of two outer layers or cover layers 2, on which conductor tracks 3 made of copper are attached, and an inner layer or spacer layer 4.
  • the channels 5 are shown in dashed lines in the top view (FIG. 2). Depending on the thermal and structural conditions of the circuit board, they can be guided individually (compare on the right) or bundled (compare on the left).
  • the component 1 is provided on its left side with connecting wires 6 which are inserted through the circuit board and soldered to it.
  • the component 1 lies with a large contact surface 7 on the outer layer 2, so that a perfect heat transfer is ensured.
  • the component 1 On the right side of FIG. 1, the component 1 is shown as a surface-mounted component which is connected to the printed circuit board 3 via an unwired connection 8. Both types of connection are shown here only for clarification on a component, normally, a component will be connected to the printed circuit board's conductor tracks either with or without connecting wires.
  • the outer layers 2 and the inner layer 4 can be connected to one another by adhesive bonding, the adhesive layer being able to be cured acceleratedly if necessary under the action of heat.
  • Layers 2 and 4, or at least two of them, can also be connected by means of a prepreg.
  • a prepreg is a glass fiber reinforced adhesive film made of a polymerized synthetic resin. The synthetic resin made of polyester or epoxy is polymerized and solidified by hot pressing and then results in a perfect connection of the individual layers.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
EP89102856A 1988-02-25 1989-02-18 Leiterplatte mit einer Kühlvorrichtung Expired - Lifetime EP0331953B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT89102856T ATE83885T1 (de) 1988-02-25 1989-02-18 Leiterplatte mit einer kuehlvorrichtung.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3805851 1988-02-25
DE3805851A DE3805851A1 (de) 1988-02-25 1988-02-25 Leiterplatte mit einer kuehlvorrichtung

Publications (2)

Publication Number Publication Date
EP0331953A1 EP0331953A1 (de) 1989-09-13
EP0331953B1 true EP0331953B1 (de) 1992-12-23

Family

ID=6348107

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89102856A Expired - Lifetime EP0331953B1 (de) 1988-02-25 1989-02-18 Leiterplatte mit einer Kühlvorrichtung

Country Status (7)

Country Link
US (1) US5142441A (enrdf_load_stackoverflow)
EP (1) EP0331953B1 (enrdf_load_stackoverflow)
JP (1) JPH01289297A (enrdf_load_stackoverflow)
AT (1) ATE83885T1 (enrdf_load_stackoverflow)
CA (1) CA1315013C (enrdf_load_stackoverflow)
DE (2) DE3805851A1 (enrdf_load_stackoverflow)
ES (1) ES2038349T3 (enrdf_load_stackoverflow)

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DE4012100A1 (de) * 1990-04-14 1991-10-17 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung und verfahren zur herstellung derselben
JP3254001B2 (ja) * 1991-04-08 2002-02-04 ゼネラル・エレクトリック・カンパニイ 半導体モジュール用の一体化放熱器
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
DE19711533C2 (de) * 1997-03-20 1999-10-28 Abb Daimler Benz Transp Leiterplattenanordnung mit Wärmeaustauscher
US5818692A (en) * 1997-05-30 1998-10-06 Motorola, Inc. Apparatus and method for cooling an electrical component
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
JP2000216550A (ja) * 1999-01-25 2000-08-04 Oki Electric Ind Co Ltd 積層プリント配線基板
FR2798036B1 (fr) * 1999-08-26 2002-01-18 Sagem Module electronique et procede de fabrication d'un tel module
DE10023736A1 (de) * 2000-05-15 2001-11-22 Harting Elektrooptische Bauteile Gmbh & Co Kg Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte
US20020163781A1 (en) * 2001-05-01 2002-11-07 Ericsson Inc. Integrated cooling of a printed circuit board structure
US6529377B1 (en) 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system
US6988531B2 (en) * 2002-01-11 2006-01-24 Intel Corporation Micro-chimney and thermosiphon die-level cooling
JP2003329379A (ja) * 2002-05-10 2003-11-19 Furukawa Electric Co Ltd:The ヒートパイプ回路基板
DE102004006533A1 (de) * 2004-02-11 2005-09-01 Conti Temic Microelectronic Gmbh Elektrisch leitfähiger Kontaktstift zum Einpressen in eine Öffnung einer Leiterplatte sowie elektrische Baugruppe mit einem solchen Kontaktstift
US7121998B1 (en) * 2004-06-08 2006-10-17 Eurica Califorrniaa Vented microcradle for prenidial incubator
DE102004062441B3 (de) * 2004-12-16 2006-07-20 Schweizer Electronic Ag Mehrschichtaufbau mit Temperierfluidkanal und Herstellungsverfahren
DE202005018284U1 (de) * 2005-04-08 2006-02-02 Rittal Gmbh & Co. Kg Kühleinheit
JP4710460B2 (ja) * 2005-07-20 2011-06-29 株式会社村田製作所 セラミック多層基板、その製造方法、およびパワー半導体モジュール
EP1761114A3 (en) * 2005-08-31 2009-09-16 Kabushiki Kaisha Toyota Jidoshokki Circuit board
US7298623B1 (en) * 2006-06-29 2007-11-20 International Business Machines Corporation Organic substrate with integral thermal dissipation channels, and method for producing same
US7679916B2 (en) * 2006-12-08 2010-03-16 GE Intelligent Platforms Embedded Systems, Inc. Method and system for extracting heat from electrical components
US8919426B2 (en) * 2007-10-22 2014-12-30 The Peregrine Falcon Corporation Micro-channel pulsating heat pipe
US7738249B2 (en) * 2007-10-25 2010-06-15 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal cooling structure and electrical assembly utilizing same
US20090194831A1 (en) * 2008-02-01 2009-08-06 Custom Sensors & Technologies, Inc. Integrated cavity in pcb pressure sensor
US8472193B2 (en) * 2008-07-04 2013-06-25 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
DE102009000514A1 (de) * 2009-01-30 2010-08-26 Robert Bosch Gmbh Verbundbauteil sowie Verfahren zum Herstellen eines Verbundbauteil
US7898807B2 (en) * 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
DE202010017772U1 (de) 2010-12-30 2012-10-22 Schweizer Electronic Ag Leiterplatte mit Kühlfluidkanal
DE102015118146B4 (de) 2015-10-23 2017-06-08 Schweizer Electronic Ag Kühlmittelanschlusselement und Leiterplatte mit Kühlkanal
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
US11406010B2 (en) * 2019-05-21 2022-08-02 Benchmark Electronics, Inc. Thermal management system and method therefor
US10772188B1 (en) 2019-06-11 2020-09-08 International Business Machines Corporation Stiffener cooling structure
CN112638029B (zh) 2020-12-23 2022-07-22 华为数字能源技术有限公司 电路板
US12363864B2 (en) 2022-06-25 2025-07-15 EvansWerks, Inc. Cooling system and methods
US12133365B2 (en) 2022-06-25 2024-10-29 EvansWerks, Inc. Cooling system and methods
US12101909B2 (en) 2022-06-25 2024-09-24 EvansWerks, Inc. Cooling system and methods
US12200908B2 (en) 2022-06-25 2025-01-14 EvansWerks, Inc. Cooling system and methods
EP4376214A1 (en) * 2022-11-25 2024-05-29 HENSOLDT Sensors GmbH An electronic circuitry for an active phased array radar system

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DE1930642A1 (de) * 1969-06-18 1971-01-07 Siemens Ag Leiterplatte zum Aufnehmen und Verbinden elektrischer Bauelemente
GB1477780A (en) * 1974-08-14 1977-06-29 Seikosha Kk Assembly incorporating electrically conductive adhesive
FR2285955A1 (fr) * 1974-09-27 1976-04-23 Inst Elektroswarki Patona Procede de reglage de la vitesse de fusion de pieces a souder au cours d'un soudage en bout par resistance et etincelage, et dispositif pour la mise en oeuvre de ce procede
JPS5162901A (en) * 1974-11-25 1976-05-31 Sandosutorando Hiito Toransufu Denshisochonetsudentatsukozobutsu
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FR2519508A1 (fr) * 1981-12-31 1983-07-08 Thomson Csf Dispositif de refroidissement pour carte de circuit imprime et procede de fabrication d'un tel dispositif
DE3321321A1 (de) * 1982-06-19 1983-12-22 Ferranti plc, Gatley, Cheadle, Cheshire Elektrische schaltungsanordnung
DE3329325A1 (de) * 1982-09-03 1984-03-08 Peter 2563 Ipsach Herren Kuehlkoerper zur fluessigkeitskuehlung wenigstens eines elektrischen leistungselementes
FR2538989B1 (fr) * 1982-12-30 1985-10-04 Thomson Csf Structure d'assemblage de circuits electroniques complexes, et procede d'amelioration de la fiabilite d'un tel assemblage
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EP0204568A3 (en) * 1985-06-05 1988-07-27 Harry Arthur Hele Spence-Bate Low power circuitry components
US4739443A (en) * 1985-12-30 1988-04-19 Olin Corporation Thermally conductive module
DE3601140A1 (de) * 1986-01-16 1987-07-23 Siemens Ag Vorrichtung fuer eine fluessigkeitskuehlung eines elektrischen bauelementes, insbesondere halbleiter-bauelementes

Also Published As

Publication number Publication date
ES2038349T3 (es) 1993-07-16
CA1315013C (en) 1993-03-23
DE3805851C2 (enrdf_load_stackoverflow) 1990-10-04
US5142441A (en) 1992-08-25
JPH01289297A (ja) 1989-11-21
ATE83885T1 (de) 1993-01-15
DE58903063D1 (de) 1993-02-04
EP0331953A1 (de) 1989-09-13
DE3805851A1 (de) 1989-08-31

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