DE69430159T2 - Umwandelbares Modul zur Luft- oder Wasser-Kühlung von elektronischen Bauelementen - Google Patents

Umwandelbares Modul zur Luft- oder Wasser-Kühlung von elektronischen Bauelementen

Info

Publication number
DE69430159T2
DE69430159T2 DE69430159T DE69430159T DE69430159T2 DE 69430159 T2 DE69430159 T2 DE 69430159T2 DE 69430159 T DE69430159 T DE 69430159T DE 69430159 T DE69430159 T DE 69430159T DE 69430159 T2 DE69430159 T2 DE 69430159T2
Authority
DE
Germany
Prior art keywords
air
electronic components
water cooling
convertible module
convertible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69430159T
Other languages
English (en)
Other versions
DE69430159D1 (de
Inventor
Dereje Agonafer
Timothy Merrill Anderson
Gregory Martin Chrysler
Richard Chao-Fan Chu
Robert Edwards Simons
David Theodore Vader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69430159D1 publication Critical patent/DE69430159D1/de
Publication of DE69430159T2 publication Critical patent/DE69430159T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69430159T 1993-08-25 1994-07-14 Umwandelbares Modul zur Luft- oder Wasser-Kühlung von elektronischen Bauelementen Expired - Fee Related DE69430159T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/111,675 US5370178A (en) 1993-08-25 1993-08-25 Convertible cooling module for air or water cooling of electronic circuit components

Publications (2)

Publication Number Publication Date
DE69430159D1 DE69430159D1 (de) 2002-04-25
DE69430159T2 true DE69430159T2 (de) 2003-01-02

Family

ID=22339845

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69430159T Expired - Fee Related DE69430159T2 (de) 1993-08-25 1994-07-14 Umwandelbares Modul zur Luft- oder Wasser-Kühlung von elektronischen Bauelementen

Country Status (4)

Country Link
US (1) US5370178A (de)
EP (1) EP0641023B1 (de)
JP (1) JP3085438B2 (de)
DE (1) DE69430159T2 (de)

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* Cited by examiner, † Cited by third party
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DE102007010958A1 (de) * 2007-03-05 2008-09-11 Danfoss A/S Heizölvorwärmer
DE102009056290A1 (de) 2009-11-30 2011-06-09 Alphacool Gmbh Vorrichtung zur Kühlung von auf einer Leiterplatte angeordneten elektronischen Bauteilen

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US6313990B1 (en) 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
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US6714412B1 (en) * 2002-09-13 2004-03-30 International Business Machines Corporation Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use
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US8100956B2 (en) 2006-05-09 2012-01-24 Thermotek, Inc. Method of and system for thermally augmented wound care oxygenation
US8574278B2 (en) 2006-05-09 2013-11-05 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US8778005B2 (en) 2003-07-18 2014-07-15 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
US8128672B2 (en) 2006-05-09 2012-03-06 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
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US7011143B2 (en) * 2004-05-04 2006-03-14 International Business Machines Corporation Method and apparatus for cooling electronic components
US10016583B2 (en) 2013-03-11 2018-07-10 Thermotek, Inc. Wound care and infusion method and system utilizing a thermally-treated therapeutic agent
USD679023S1 (en) 2004-07-19 2013-03-26 Thermotek, Inc. Foot wrap
US10765785B2 (en) 2004-07-19 2020-09-08 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
US20060034053A1 (en) 2004-08-12 2006-02-16 Thermotek, Inc. Thermal control system for rack mounting
US20060048932A1 (en) * 2004-09-09 2006-03-09 Brandon Rubenstein Configurable heat sink
US20060081357A1 (en) * 2004-10-20 2006-04-20 Wen-Hao Liu Radiation module
JP4333587B2 (ja) * 2005-01-14 2009-09-16 三菱電機株式会社 ヒートシンクおよび冷却ユニット
JP4551261B2 (ja) 2005-04-01 2010-09-22 株式会社日立製作所 冷却ジャケット
US7909861B2 (en) 2005-10-14 2011-03-22 Thermotek, Inc. Critical care thermal therapy method and system
US20070119583A1 (en) * 2005-11-29 2007-05-31 Foster Jimmy G Sr Heat sink for distributing a thermal load
US7347251B2 (en) 2005-12-21 2008-03-25 International Business Machines Corporation Heat sink for distributing a thermal load
US8230908B2 (en) * 2006-01-05 2012-07-31 International Business Machines Corporation Heat sink for dissipating a thermal load
US20070151712A1 (en) * 2006-01-05 2007-07-05 Foster Jimmy G Sr Heat sink for distributing a thermal load
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US7719839B2 (en) * 2007-02-19 2010-05-18 Dell Products L.P. Heat conduction apparatus providing for selective configuration for heat conduction
USD664260S1 (en) 2007-04-10 2012-07-24 Thermotek, Inc. Calf wrap
US8758419B1 (en) 2008-01-31 2014-06-24 Thermotek, Inc. Contact cooler for skin cooling applications
DE102009019868B4 (de) * 2009-05-06 2015-10-22 Hosokawa Alpine Ag Verfahrenstechnische Anlage für den Laborbetrieb
US8191343B1 (en) 2009-06-26 2012-06-05 Hydro-Gear Limited Partnership Systems and methods for cooling a controller assembly
US8459334B2 (en) * 2009-07-31 2013-06-11 International Business Machines Corporation Containment for a patterned metal thermal interface
US8776868B2 (en) 2009-08-28 2014-07-15 International Business Machines Corporation Thermal ground plane for cooling a computer
US10512587B2 (en) 2011-07-27 2019-12-24 Thermotek, Inc. Method and apparatus for scalp thermal treatment
FR2979720B1 (fr) * 2011-09-01 2013-08-23 Ovh Sas Conteneur amenage en une infrastructure technique
US8787013B1 (en) * 2011-09-19 2014-07-22 Amazon Technologies, Inc. Carrier with adjustable heat removal elements
US8922998B2 (en) * 2011-10-26 2014-12-30 International Business Machines Corporation Coolant manifold with separately rotatable manifold section(s)
US20130168068A1 (en) * 2011-12-29 2013-07-04 International Business Machines Corporation Thermally enhanced cold plate having high conductivity thermal transfer paths
EP2812769B1 (de) * 2012-02-09 2018-11-07 Hewlett-Packard Enterprise Development LP Wärmeableitungssystem
US9529395B2 (en) 2012-03-12 2016-12-27 Hewlett Packard Enterprise Development Lp Liquid temperature control cooling
EP2841121B1 (de) 2012-04-24 2020-12-02 Thermotek, Inc. System zur therapeutischen verwendung von ultraviolettem licht
US9927187B2 (en) 2012-09-28 2018-03-27 Hewlett Packard Enterprise Development Lp Cooling assembly
US11026347B2 (en) * 2012-12-21 2021-06-01 Smart Embedded Computing, Inc. Configurable cooling for rugged environments
US9252074B2 (en) * 2013-01-23 2016-02-02 Amtek Semiconductors Co., Ltd. Heat dissipating device
JP6082479B2 (ja) 2013-01-31 2017-02-15 ヒューレット パッカード エンタープライズ デベロップメント エル ピーＨｅｗｌｅｔｔ Ｐａｃｋａｒｄ Ｅｎｔｅｒｐｒｉｓｅ Ｄｅｖｅｌｏｐｍｅｎｔ ＬＰ 液体冷却
US10300180B1 (en) 2013-03-11 2019-05-28 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
EP3068481B1 (de) 2013-11-11 2020-01-01 Thermotek, Inc. System zur wundbehandlung
CN104682493A (zh) * 2015-02-09 2015-06-03 洛阳嘉盛电源科技有限公司 2u散热结构
US20160286688A1 (en) * 2015-03-26 2016-09-29 Banqiu Wu Cooling Method for Computer System
US9480187B2 (en) * 2015-03-29 2016-10-25 Banqiu Wu Cooling method for a 3D IC computer system
US9655281B2 (en) 2015-06-26 2017-05-16 Seagate Technology Llc Modular cooling system
US10672683B2 (en) * 2016-01-28 2020-06-02 Hewlett Packard Enterprise Development Lp Heat transfer adapter plate
EP3550244B1 (de) 2018-04-06 2023-03-01 Ovh Kühlanordnung und verfahren zu deren einbau
PL3550245T3 (pl) 2018-04-06 2020-11-02 Ovh Zespół wymiennika ciepła
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JP7245870B2 (ja) * 2021-06-22 2023-03-24 システムインテリジェント株式会社 コンピュータ用ケース、コンピュータ用ラック、及びコンピュータ用ケースの使用方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007010958A1 (de) * 2007-03-05 2008-09-11 Danfoss A/S Heizölvorwärmer
DE102009056290A1 (de) 2009-11-30 2011-06-09 Alphacool Gmbh Vorrichtung zur Kühlung von auf einer Leiterplatte angeordneten elektronischen Bauteilen

Also Published As

Publication number Publication date
JP3085438B2 (ja) 2000-09-11
US5370178A (en) 1994-12-06
JPH0798195A (ja) 1995-04-11
DE69430159D1 (de) 2002-04-25
EP0641023B1 (de) 2002-03-20
EP0641023A1 (de) 1995-03-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee