EP0157927A1 - Composante électronique, en particulier une micro-inductance - Google Patents

Composante électronique, en particulier une micro-inductance Download PDF

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Publication number
EP0157927A1
EP0157927A1 EP84115156A EP84115156A EP0157927A1 EP 0157927 A1 EP0157927 A1 EP 0157927A1 EP 84115156 A EP84115156 A EP 84115156A EP 84115156 A EP84115156 A EP 84115156A EP 0157927 A1 EP0157927 A1 EP 0157927A1
Authority
EP
European Patent Office
Prior art keywords
electronic component
component according
core part
contact surfaces
electrical contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP84115156A
Other languages
German (de)
English (en)
Other versions
EP0157927B1 (fr
Inventor
Lothar Ingenieur Grad. Autenrieth
Kurt Dilp.-Physiker Marth
Josef Ingenieur Schindler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0157927A1 publication Critical patent/EP0157927A1/fr
Application granted granted Critical
Publication of EP0157927B1 publication Critical patent/EP0157927B1/fr
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/02—Fixed inductances of the signal type  without magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F2017/048—Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder

Definitions

  • the present invention relates to an electronic component, in particular for a chip inductance, e.g. RF choke coil, transformer or the like.
  • a chip inductance e.g. RF choke coil, transformer or the like.
  • Chip inductors are smaller than conventional wired inductors, can be manufactured with less effort and are more suitable for use in automatic assembly machines for printed circuit boards.
  • the known chip inductors are partly manufactured using layer technology or equipped with rectangular or cylindrical wire-wound magnetic cores.
  • a carrier is coated with a magnetic layer and a conductor track formed into a coil is applied to this layer, the partial inductance produced in this way being combined with further partial inductances to form a stack, depending on the desired inductance.
  • Numerous methods are known for through-contacting the ends of the coils.
  • chip inductors are characterized by their space-saving design, can be soldered directly to printed circuit boards and do not require any additional wires as connection elements.
  • a disadvantage is their complicated manufacture due to the layering technique. Variations in the thickness of the magnetic layer that are unavoidable in production cause undesirable fluctuations in the L and Q values of inductors. Silver or a silver-Paladiua alloy, for example, must be used as the material for the coil conductor tracks and a high ohmic resistance of the conductor tracks must be accepted. Since the conductor tracks are embedded in the magnetic layer, magnetic saturation occurs due to the closed magnetic circuit, even at low values; the DC bias properties of the chip inductance are consequently deteriorated. In addition, the number of coil turns cannot be selected to any desired height, and therefore an inductance of any desired height cannot be set.
  • a likewise known chip inductor has a rectangular magnetic core with a rectangular or cylindrical central part as a winding support and flanges integrally formed on this support, which also have a rectangular cross section.
  • the winding ends are contacted by means of electrically conductive layers on the flanges on which the winding ends are soldered.
  • the winding is embedded in resin, which forms a cuboid together with the flanges.
  • the outer connection elements require two additional processing steps interrupted by a casting process, namely first the contacting with the outer end faces of the ferrite roller core and finally, after the casting has been carried out, the final flanging in the direction parallel to the corresponding end faces of the Potting created cuboid.
  • the present invention has for its object to provide an electronic component for a chip inductor, which can be produced with little effort and the manufacture of chip inductors, e.g. HF chokes permitted, which can be largely shielded, can be contacted without impairing the quality and i.ü. Optionally enable both small and large inductors with high quality.
  • the invention provides an electronic component which has a solid core part with a vertical prismatic spatial shape, in particular a cuboid or cube, consisting of ferromagnetic or electrically non-conductive material, in particular ferrite, ceramic or plastic, with a blind hole-like serving as a winding space Recess and with electrical contact surfaces on preferably separate side surfaces of the core part.
  • the solid core part is made of electrically non-conductive material such as ceramic or plastic, it is suitable e.g. for the production of so-called air coils in chip design.
  • air coils in chip design When using ferromagnetic materials for the core part, this is preferably used to create RF choke chips, transformer chips, etc.
  • the electronic component can also be regarded as a half of the shell core, which can be combined with a second, usually identically configured component to form a magnetically closed core.
  • a magnetic circuit can also be brought about by covers made of ferromagnetic material which are applied to the side surface of the component which is formed with the recess.
  • the cutout is a hollow cylindrical one, which surrounds a slug serving as a winding support and is connected to contact surfaces on opposite side surfaces of the core part via open-edge channels for the Vickel ends.
  • this component e.g. for an electrical coil
  • the electrical winding is pushed onto the slug and the Vickel ends are led through the channels to the electrical contact surfaces and contacted with them.
  • the required magnetic connection can - as already mentioned - be effected by a cover made of ferromagnetic material or by casting resin mixed with carbonyl iron or ferrite powder, which fills the free space in the channels and the recess.
  • the component for a chip inductance e.g. HF choke or transformer has a solid core part 1, which, depending on the inductance to be created, is made of a ferromagnetic material, in particular ferrite, or, if e.g. an air coil in chip design is to be made of electrically non-conductive material, in particular ceramic or plastic.
  • the core part 1 itself has a vertical prismatic spatial shape, preferably a cube or cuboid shape. Vertical prismatic spatial shapes with pentagonal and polygonal floor plans are also conceivable.
  • a winding 16 shown in FIG. 2 serves a hollow cylindrical recess 2 which does not close a slug 10.
  • the hollow cylindrical recess 2 can be replaced by a slot-free, exclusively blind hole-like recess.
  • Opposing side surfaces of the core part 1 are covered with electrically conductive contact surfaces 3, which are deposited on these side surfaces, for example in the so-called nickel-carbonyl process, and are coated with high-melting solder.
  • electrically conductive contact surfaces 3 which are deposited on these side surfaces, for example in the so-called nickel-carbonyl process, and are coated with high-melting solder.
  • channels 4, 5 leading from the contact surfaces 3 to the recess 2 are provided.
  • corresponding end edges 12, 13 of the core part 1 are chamfered. This enables reliable detection of the chip direction and positioning of the connections in relation to the printed circuit board.
  • the end face 11 of the slug 10 can, according to FIGS. 1 to 3, be flat with the recessed side face of the core part 1 or, as shown in FIGS. 4 and 6, set back with respect to the end edge of the recess 2.
  • the component also has one For example, circular disk-shaped cover 14 (see FIG. 4) or the rectangular cover 15 shown in FIG. 5.
  • the free end faces, the covers 14 and 15 are preferably flat to the recessed side face of the core part 1.
  • the side face carrying the cover 15 together with the end face 11 of the slug 10 can be opposite the edge regions 21 of this side surface to be set back by the amount of the cover thickness.
  • the core parts 1 can be designed as so-called shell core halves, which, depending on the desired air gap, have slug end faces 11 which are set back accordingly. Arranged in pairs and mirror images one above the other, cores with an excellent magnetic connection are obtained.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
EP84115156A 1984-03-23 1984-12-11 Composante électronique, en particulier une micro-inductance Expired EP0157927B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3410811 1984-03-23
DE3410811 1984-03-23

Publications (2)

Publication Number Publication Date
EP0157927A1 true EP0157927A1 (fr) 1985-10-16
EP0157927B1 EP0157927B1 (fr) 1989-03-22

Family

ID=6231462

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84115156A Expired EP0157927B1 (fr) 1984-03-23 1984-12-11 Composante électronique, en particulier une micro-inductance

Country Status (4)

Country Link
US (1) US4717901A (fr)
EP (1) EP0157927B1 (fr)
JP (1) JPS60214510A (fr)
DE (1) DE3477438D1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3817890A1 (de) * 1987-05-27 1988-12-15 Murata Manufacturing Co Spule
WO1997020327A1 (fr) * 1995-11-27 1997-06-05 Matsushita Electric Industrial Co., Ltd. Composant de type bobine et son procede de fabrication
CN112002515A (zh) * 2019-05-27 2020-11-27 三星电机株式会社 线圈组件

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729612Y2 (ja) * 1988-06-23 1995-07-05 株式会社村田製作所 ノイズ除去用インダクタ
US5192832A (en) * 1990-08-31 1993-03-09 Amp Incorporated Electromagnet insert for data current coupler
WO1992005568A1 (fr) * 1990-09-21 1992-04-02 Coilcraft, Inc. Dispositif inductif et procede de fabrication
US5294749A (en) * 1991-09-23 1994-03-15 Motorola, Inc. Surface mountable molded electronic component
US5572180A (en) * 1995-11-16 1996-11-05 Motorola, Inc. Surface mountable inductor
DE19615185C1 (de) * 1996-04-17 1997-06-19 Siemens Ag Elektromagnetisches Relais
US5877667A (en) * 1996-08-01 1999-03-02 Advanced Micro Devices, Inc. On-chip transformers
US6198373B1 (en) * 1997-08-19 2001-03-06 Taiyo Yuden Co., Ltd. Wire wound electronic component
JP4216917B2 (ja) * 1997-11-21 2009-01-28 Ｔｄｋ株式会社 チップビーズ素子およびその製造方法
JP3449222B2 (ja) * 1998-06-23 2003-09-22 株式会社村田製作所 ビーズインダクタの製造方法及びビーズインダクタ
JP2000040626A (ja) * 1998-07-24 2000-02-08 Matsushita Electric Ind Co Ltd チョークコイル
US6285272B1 (en) 1999-10-28 2001-09-04 Coilcraft, Incorporated Low profile inductive component
JP2007067177A (ja) * 2005-08-31 2007-03-15 Nec Tokin Corp 線輪部品
DE102006058336A1 (de) * 2006-12-11 2008-06-19 Vacuumschmelze Gmbh & Co. Kg Induktives SMD-Bauteil
US9636741B2 (en) * 2007-04-19 2017-05-02 Indimet, Inc. Solenoid housing and method of providing a solenoid housing
JP6072443B2 (ja) * 2011-08-04 2017-02-01 アルプス電気株式会社 インダクタの製造方法
JP6451081B2 (ja) * 2014-05-16 2019-01-16 Tdk株式会社 コイル装置
DE102019204950A1 (de) * 2019-04-08 2020-10-08 Robert Bosch Gmbh Induktives Bauelement und Verfahren zur Herstellung eines induktiven Bauelements

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB567963A (en) * 1943-10-18 1945-03-09 Neosid Ltd An improved iron dust core for variable inductances
US3287678A (en) * 1962-11-17 1966-11-22 Fujitsu Ltd Miniature magnetic cores having perpendicular annular recesses
GB1055808A (en) * 1964-08-20 1967-01-18 Cole E K Ltd Improvements in or relating to inductance coil assemblies
US3585553A (en) * 1970-04-16 1971-06-15 Us Army Microminiature leadless inductance element
EP0025605A1 (fr) * 1979-09-17 1981-03-25 TDK Corporation Dispositif d'inductance
DE3225782A1 (de) * 1981-07-09 1983-02-10 TDK Electronics Co., Ltd., Tokyo Elektronisches bauteil

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB694559A (en) * 1951-04-17 1953-07-22 Philips Electrical Ind Ltd Improvements in or relating to coils comprising a core of ferromagnetic material
US3201729A (en) * 1960-02-26 1965-08-17 Blanchi Serge Electromagnetic device with potted coil
DE1907881U (de) * 1963-06-20 1965-01-07 Fujitsu Ltd Magnetisierbarer, im wesentlichen quaderfoermiger schalenkern.
US3325760A (en) * 1965-10-01 1967-06-13 Gen Motors Corp Electromagnet with resinous ferromagnetic cladding
US3663913A (en) * 1967-12-22 1972-05-16 Tohoku Metal Ind Ltd Core coil having a improved temperature characteristic
US3750069A (en) * 1972-02-22 1973-07-31 Coilcraft Inc Low reluctance inductor
DE2452252A1 (de) * 1974-11-04 1976-05-06 Standard Elektrik Lorenz Ag Drosselspule
US4245207A (en) * 1977-05-20 1981-01-13 Toko, Inc. Miniature high frequency coil assembly or transformer
JPS5851412U (ja) * 1981-10-02 1983-04-07 東光株式会社 高周波コイル
NL8105195A (nl) * 1981-11-17 1983-06-16 Philips Nv Inductieve inrichting.
JPH114716A (ja) * 1997-06-17 1999-01-12 Mitsubishi Heavy Ind Ltd グリップ部材ならびにこれを利用した歯ブラシおよび洋食器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB567963A (en) * 1943-10-18 1945-03-09 Neosid Ltd An improved iron dust core for variable inductances
US3287678A (en) * 1962-11-17 1966-11-22 Fujitsu Ltd Miniature magnetic cores having perpendicular annular recesses
GB1055808A (en) * 1964-08-20 1967-01-18 Cole E K Ltd Improvements in or relating to inductance coil assemblies
US3585553A (en) * 1970-04-16 1971-06-15 Us Army Microminiature leadless inductance element
EP0025605A1 (fr) * 1979-09-17 1981-03-25 TDK Corporation Dispositif d'inductance
DE3225782A1 (de) * 1981-07-09 1983-02-10 TDK Electronics Co., Ltd., Tokyo Elektronisches bauteil

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3817890A1 (de) * 1987-05-27 1988-12-15 Murata Manufacturing Co Spule
WO1997020327A1 (fr) * 1995-11-27 1997-06-05 Matsushita Electric Industrial Co., Ltd. Composant de type bobine et son procede de fabrication
US6169470B1 (en) 1995-11-27 2001-01-02 Matsushita Electric Industrial Co., Ltd. Coiled component and its production method
CN112002515A (zh) * 2019-05-27 2020-11-27 三星电机株式会社 线圈组件

Also Published As

Publication number Publication date
EP0157927B1 (fr) 1989-03-22
US4717901A (en) 1988-01-05
JPH0449763B2 (fr) 1992-08-12
DE3477438D1 (en) 1989-04-27
JPS60214510A (ja) 1985-10-26

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