EP0149830A2 - Elekrolytisches Bad für das Abscheiden dünner Schichten reinen Goldes - Google Patents

Elekrolytisches Bad für das Abscheiden dünner Schichten reinen Goldes Download PDF

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Publication number
EP0149830A2
EP0149830A2 EP84115879A EP84115879A EP0149830A2 EP 0149830 A2 EP0149830 A2 EP 0149830A2 EP 84115879 A EP84115879 A EP 84115879A EP 84115879 A EP84115879 A EP 84115879A EP 0149830 A2 EP0149830 A2 EP 0149830A2
Authority
EP
European Patent Office
Prior art keywords
acid
bath
gold
bath according
phosphonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP84115879A
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English (en)
French (fr)
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EP0149830A3 (en
EP0149830B2 (de
EP0149830B1 (de
Inventor
Heinz Emmenegger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
H E Finishing SA
Original Assignee
H E Finishing SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by H E Finishing SA filed Critical H E Finishing SA
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Publication of EP0149830A3 publication Critical patent/EP0149830A3/fr
Application granted granted Critical
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Publication of EP0149830B2 publication Critical patent/EP0149830B2/de
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Definitions

  • the present invention relates to an electrolytic bath for depositing thin layers (of the order of at least 0.5 p) of pure gold on passive surfaces (for example stainless steel, Ti, Mo, alloys based on Cr and Ni, etc.).
  • passive surfaces for example stainless steel, Ti, Mo, alloys based on Cr and Ni, etc.
  • the baths used for the galvanic deposition of gold are generally prepared from potassium auricyanide solutions KAu (CN) 2 , to which various salts, acids or alkaline products are added, according to the methods, to improve the electrical conductivity. of the bath and the conditions of crystallization of the metal.
  • the aurocyanide is only stable up to a pH of around 3 and, below this value, it decomposes into insoluble and yellow AuCN gold cyanide. HCN hydrocyanic acid.
  • baths with very low pH is especially essential to deposit a thin layer of adherent pure gold on objects whose surface is highly passive, that is to say for example stainless steel, alloys containing a high proportion of chromium and nickel, in titanium, in molybdenum, or on surfaces having previously undergone galvanic chromium plating, chemical nickel plating or a coating of molybdenum-manganese alloy.
  • the object of this invention therefore consists in providing an electrolytic bath for the deposition of thin layers (of the order of ⁇ C, 5 p) of pure gold (24cts) on passive surfaces, which adhere perfectly to said passive surfaces and can serve as a bonding layer for the subsequent deposition of thicker layers of a gold alloy.
  • the electrolytic bath according to the invention aimed at achieving the above-mentioned aim, is characterized in that it contains from 0.5 to 20 g / 1 of gold in the form of the auricyanide of an alkali metal and at least one acid. present in sufficient concentration for the pH of this bath to be at most 0.4.
  • this bath can contain the auricocyanide in the form of potassium auricyanide KAu (CN) 4 or sodium auricyanide NaAu (CN) 4 , and its pH is preferably between 0.1 and 0, 3.
  • the acid concentration being relatively high, it does not prove necessary to add conductive salts, the solution being sufficiently electrically conductive.
  • These acids can be used either alone or mixed with each other, in concentrations of 40 to 500 g / l, except for sulfamic acid, the solubility of which in water is limited and which can be present in 100 g / 1 at saturation, which is reached for a concentration of approximately 150 g / 1 at room temperature.
  • organic complexing agents for example sodium, potassium, ammonium or amine salts, diethylene-triamine-penta (methylene-phosphonic), ethylene- diamine-tetra (methylene-phosphonic) and ethylene-diamine-tetra-acetic (EDTA), which are preferably used in concentrations of 1 to 20 g / l.
  • complexing agents as well as other complexing agents such as amino-carbonic acids (see for example DE 3,012,999), cannot be used in large quantities because they risk precipitating.
  • other compounds mentioned below can be introduced into the electrolytic bath according to the invention, therefore having a pH of less than 0.4, as complexing agents and without precipitating, in quantities at least greater than 20 g / 1.
  • These compounds are N-carboxymethyl-aspartic acids and N, N-bis (carboxymethyl) aspartic having the formulas following:
  • R is an alkyl or alkylene group having 1 to 5 C atoms, or the salts thereof.
  • the baths are generally used at room temperature, with platinum titanium or g phite anodes.
  • platinum titanium or g phite anodes For certain applications, in particular for coating particularly passive surfaces, it is possible to raise the working temperature of these baths up to 80 o C.
  • the chemicals that go into their composition are not volatile, and having perfect stability at this temperature, there does not result any loss or any change in the behavior of the bath during electrolysis.
  • a stainless steel wafer was treated in the bath, at room temperature, with a current density of 3 A / dm 2 for 5 minutes.
  • the pure gold deposit obtained is both perfectly adherent to the substrate and brilliant.
  • a stainless steel plate was treated in this bath, at room temperature, with a current density of 4 A / dm 2 for 4 minutes.
  • the deposit obtained is both perfectly adherent and shiny.
  • the deposit obtained is both perfectly adherent and shiny.
  • a stainless steel plate was treated in this bath, at room temperature, with a density current of 4 A / dm 2 for 3 minutes.
  • the deposit obtained is both perfectly adherent and shiny.
  • This bath was intentionally polluted with 50 mg / 1 of iron.
  • the addition of 4 g / 1 of EDTA makes it possible to obtain, under the same electrolysis conditions, a deposit of pure yellow and shiny gold.
  • the stainless steel wafer treated in this bath at a current density of 5 A / dm 2 for 5 minutes, had an adherent and shiny gold layer of 0.2 to 0.3 p.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP19840115879 1983-12-29 1984-12-20 Elekrolytisches Bad für das Abscheiden dünner Schichten reinen Goldes Expired - Lifetime EP0149830B2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH6961/83 1983-12-29
CH696183A CH665656A5 (fr) 1983-12-29 1983-12-29 Bain d'or acide et utilisation de ce bain en electroplastie.

Publications (4)

Publication Number Publication Date
EP0149830A2 true EP0149830A2 (de) 1985-07-31
EP0149830A3 EP0149830A3 (en) 1986-10-15
EP0149830B1 EP0149830B1 (de) 1989-04-05
EP0149830B2 EP0149830B2 (de) 1992-05-13

Family

ID=4317752

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19840115879 Expired - Lifetime EP0149830B2 (de) 1983-12-29 1984-12-20 Elekrolytisches Bad für das Abscheiden dünner Schichten reinen Goldes

Country Status (3)

Country Link
EP (1) EP0149830B2 (de)
CH (1) CH665656A5 (de)
DE (2) DE149830T1 (de)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2254658A1 (de) * 1973-12-13 1975-07-11 Engelhard Min & Chem
US4168214A (en) * 1978-06-14 1979-09-18 American Chemical And Refining Company, Inc. Gold electroplating bath and method of making the same
AT353071B (de) * 1977-10-06 1979-10-25 Oxy Metal Industries Corp Cyanidfreies, basisches sulfitbad zur elektrolytischen faellung von gold-zink- legierungen
GB2038361A (en) * 1978-11-11 1980-07-23 Ibm Trivalent chromium plating bath
EP0037535A2 (de) * 1980-04-03 1981-10-14 Degussa Aktiengesellschaft Galvanisches Bad zur Abscheidung von Gold- und Goldlegierungsüberzügen
GB2077763A (en) * 1980-06-10 1981-12-23 Degussa Strongly acidic gold alloy electroplating bath

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2254658A1 (de) * 1973-12-13 1975-07-11 Engelhard Min & Chem
AT353071B (de) * 1977-10-06 1979-10-25 Oxy Metal Industries Corp Cyanidfreies, basisches sulfitbad zur elektrolytischen faellung von gold-zink- legierungen
US4168214A (en) * 1978-06-14 1979-09-18 American Chemical And Refining Company, Inc. Gold electroplating bath and method of making the same
GB2038361A (en) * 1978-11-11 1980-07-23 Ibm Trivalent chromium plating bath
EP0037535A2 (de) * 1980-04-03 1981-10-14 Degussa Aktiengesellschaft Galvanisches Bad zur Abscheidung von Gold- und Goldlegierungsüberzügen
GB2077763A (en) * 1980-06-10 1981-12-23 Degussa Strongly acidic gold alloy electroplating bath

Also Published As

Publication number Publication date
DE149830T1 (de) 1985-10-24
DE3477588D1 (en) 1989-05-11
EP0149830A3 (en) 1986-10-15
EP0149830B2 (de) 1992-05-13
EP0149830B1 (de) 1989-04-05
CH665656A5 (fr) 1988-05-31

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