EP0140832B1 - Galvanisches Bad für das elekrolytische Absetzen einer Goldlegierung und galvanisches Verfahren für die Verwendung dieses Bads - Google Patents

Galvanisches Bad für das elekrolytische Absetzen einer Goldlegierung und galvanisches Verfahren für die Verwendung dieses Bads Download PDF

Info

Publication number
EP0140832B1
EP0140832B1 EP19840810428 EP84810428A EP0140832B1 EP 0140832 B1 EP0140832 B1 EP 0140832B1 EP 19840810428 EP19840810428 EP 19840810428 EP 84810428 A EP84810428 A EP 84810428A EP 0140832 B1 EP0140832 B1 EP 0140832B1
Authority
EP
European Patent Office
Prior art keywords
cyanide
zinc
copper
gold
cadmium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP19840810428
Other languages
English (en)
French (fr)
Other versions
EP0140832A3 (en
EP0140832A2 (de
Inventor
Heinz Emmenegger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
H E Finishing SA
Original Assignee
H E Finishing SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by H E Finishing SA filed Critical H E Finishing SA
Publication of EP0140832A2 publication Critical patent/EP0140832A2/de
Publication of EP0140832A3 publication Critical patent/EP0140832A3/fr
Application granted granted Critical
Publication of EP0140832B1 publication Critical patent/EP0140832B1/de
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Definitions

  • the present invention relates to an electrolysis bath allowing the deposition of a gold-copper-cadmium-zinc alloy and to its use in electroplating.
  • the present invention aims to provide a bath allowing the deposition of a gold-copper-cadmium-zinc alloy from the cyanide complexes of these four metals and providing brilliant deposits ranging from pink to yellow.
  • the object of the present invention is the galvanic bath defined in claim 1 and the galvanic process using this bath according to claim 6.
  • Such a bath must contain the metals of the alloy deposited, preferably within the limits of the following concentrations: from 1 to 20 g / I of gold, from 6 to 70 g / I of copper, from 0.1 to 5 g / I of cadmium and from 1 to 50 g / I of zinc.
  • These various metals must be introduced into the bath in the form of soluble salts, more precisely in the form of cyanide complexes, but without an excess of potassium or sodium cyanide, that is to say without free cyanide according to the definition given in the US Patent 2660554, according to which the free cyanide is the portion of cyanide of alkali metal theoretically not combined with the other metals present in the form of complex salts.
  • the bath must preferably contain from 1 to 50 g / 1 of copper cyanide CuCN or zinc cyanide Zn (CN) 2 which, during the preparation of the bath or during electrolysis, make it possible to avoid the formation of free cyanide by hydrolysis.
  • the deposition bath of the gold-copper-cadmium-zinc alloy which is the subject of the present invention it is no longer copper, but zinc which plays the main role in the balance of different ions present, allowing to obtain the desired deposit.
  • the cyanide complex of zinc can play the role held by free cyanide in baths of gold-copper-cadmium alloy.
  • the cyanide groups linked to zinc or cadmium can, under certain conditions, be released into the bath according to the balance which governs the concentrations of the different ions.
  • the concentration of total cyanide (bound to zinc and cadmium) must be of the order of one to four times the value of the zinc concentration, this zinc cyanide concentration being controlled by the amount of copper cyanide or zinc cyanide involved in the preparation of the bath.
  • composition of the gold-copper-cadmium-zinc alloy bath allows in the practice of electrolysis a much greater margin of concentration of the various constituents than the bath bath formulations.
  • gold-copper-cadmium alloy known so far.
  • a bath containing 4 g / l of gold, 0.8 g / l of cadmium, 35 g / l of copper and 10 g / l of zinc has a total cyanide content of 30 to 40 g / l, which which gives a ratio of 1/1 of the total copper / cyanide concentrations. It provides good deposits.
  • the bath of gold-copper-cadmium-zinc alloy which is the subject of the present invention allows the deposition of a correct alloy from the point of view of the titer and the texture, at a speed greater than that allowed by conventional baths, ie 1 ⁇ m per minute, while a speed of 0.5 ⁇ m per minute is generally considered to be relatively high.
  • methyl phosphonic acids whose molecule contains one or more nitrogen atoms which can be used are for example amino-tri- (methylene-phosphonic), 1-hydroxy-ethylidene 1.1 diphosphonic, ethylene-diamine tetra- (methylene -phosphinic), hexamethylene-diamine-tetra (methylene-phosphonic) or methylene-triamine-penta- (methylene-phosphonic).
  • R represents an alkylene group in which the number of carbon atoms is campris between 1 and 4, or again nitri-10-triacetic acids (NTA) or oxycarbonyl-ethyl-amino-diacetic.
  • NTA nitri-10-triacetic acids
  • All these acids are preferably used in the form of soluble salts, that is to say in the form of potassium, sodium, ammonium or amine salts. To be effective, all of these compounds must be able to complex cadmium ions in a solution free of free potassium or sodium cyanides.
  • amido-propyl-dimethyl-aminooxides of saturated fatty acids of general formula dimethylamino-oxides of saturated fatty acids, of general formula dimethyl-alkyl-amino-oxides, of general formula and bis- (2 hydroxyethyl) -alkyl-amino-oxides, of general formula where n always represents a number between 11 and 20.
  • the fatty acid or alkyl groups can also be ethoxylated.
  • phosphorus-containing esters of ethylene oxide chains linked to an aliphatic chain of general formula monoester, or diester.
  • n represents a number between 8 and 18
  • x represents a number between 6 and 15
  • M represents a sodium or potassium ion.
  • concentrations of these various organic adducts can vary within a relatively large range, from 20 to 200 g / l for the complexing agents and from 0.1 to 50 ml / l for the surfactants.
  • the electrolytic bath which is the subject of the present invention is preferably used at a pH of 9 to 11, with a current density of 0.6 to 2.5 A / dm 2 and at a temperature of 50 ° to 75 ° C.
  • Zinc (as zinc cyanide Zn (CN) 2 and double zinc cyanide and potassium K 2 Zn (CN) 4 )] 10 g / 1
  • wetting agent (amid propyl-dimethyl-amino-oxide of fatty acids from 11 to 17 carbons) 9% solution 2 ml / l
  • the mixture of zinc cyanide and double cyanide of zinc and potassium was composed so that the total cyanide content, determined by a solution of silver nitrate 0.1 N, in the presence of NaOH and KI, gives a value of 30 g / I of KCN linked to zinc.
  • zinc in this bath composition, only in the form of double cyanide of zinc and potassium, we would find 40 g / I of total KCN, ie four times the concentration of zinc.
  • a steel plate 5 cm long and 2 cm wide was subjected to electrolysis, in this bath, at a current density of 0.75 A / dm 2 at the temperature of 60 ° C.
  • the deposit obtained is uniform and bright, pale yellow in color and the title of the deposited alloy is 18 carats.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Claims (6)

1. Galvanisches Bad für die elektrolytische Ablagerung einer Gold-Kupfer-Cadmium-Zink-Legierung, dadurch gekennzeichnet, dass es einen Goldcyanid-Komplex, einen Kupfercyanid-Komplex, einen Cadmiumcyanid-Komplex, ein organisches Komplexierungsmittel, welches fähig ist, die Cadmiumionen in Abwesenheit von freiem Cyanid zu komplexieren, ein oberflächenaktives Mittel und eine Mischunq von Zinkcyanid oder Kupfercyanid und einem Zink- und Kaliumcyanid-Doppelsalz enthält, in solcher Weise zusammengesetzt ist, dass die Konzentration des gesamten Cyanides, welches an Zink gebunden ist, gleich eins- bis viermal derjenigen des Zinks beträgt.
2. Bad gemäss Anspruch 1, dadurch gekennzeichnet, dass das organische Komplexierungsmittel ein alkalisches Salz einer Säure ist, dessen Molekül ein oder mehrere gebundene Stickstoffatome aufweist, die an eine oder mehrere Methylen-phosphon-Gruppen gebunden sind.
3. Galvanisches Bad gemäss Anspruch 1, dadurch gekennzeichnet, dass das organische Komplexierungsmittel ein Natrium-, Kalium-, Ammonium- oder Aminsalz von Hydroxy-ethyl-iminodiessigsäure, Nitrilo-triessigsäure oder Oxy-carbonyl-ethyl amino-diessigsäure ist.
4. Galvanisches Bad gemäss Anspruch 1, dadurch gekennzeichnet, dass das oberflächenaktive Mittel in Form von Amidopropyl-dimethyl-amino-oxiden oder Dimethyl-amino-oxiden von gesättigten Fettsäuren, von Dimethyl-alkyl-amino-oxiden oder bis-(2-Hydroxy-ethyl)-alkyl-amino-oxiden, in deren Molekül die Alkylgruppe 10 bis 18 Kohlenstoffatome aufweist, vorliegt.
5. Galvanisches Bad nach den Ansprüchen 1 - 4, dadurch gekennzeichnet, dass es 1 bis 20 g/I Gold, 6 bis 70 g/I Kupfer, 0,1 bis 5,0 g/I Cadmium, 1 - 50 g/I Zink, 1 bis 200 g/I Cyanide, die an Zink gebunden sind, 20 bis 200 g/1 Komplexiermittel und 0,1 bis 50 g/I oberflächenaktives Mittel enthält.
6. Galvanisches Verfahren zur Beschichtung mit einer Gold-Kupfer-Cadmium-Zink-Legierung, welche 50 bis 92 % Gold, bezogen auf das Gewicht der Legierung enthält, dadurch gekennzeichnet, dass man das galvanische Bad gemäss einen der Ansprüche 1 - 5 verwendet.
EP19840810428 1983-09-01 1984-08-30 Galvanisches Bad für das elekrolytische Absetzen einer Goldlegierung und galvanisches Verfahren für die Verwendung dieses Bads Expired EP0140832B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH4812/83 1983-09-01
CH481283 1983-09-01

Publications (3)

Publication Number Publication Date
EP0140832A2 EP0140832A2 (de) 1985-05-08
EP0140832A3 EP0140832A3 (en) 1985-06-12
EP0140832B1 true EP0140832B1 (de) 1988-01-13

Family

ID=4282973

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19840810428 Expired EP0140832B1 (de) 1983-09-01 1984-08-30 Galvanisches Bad für das elekrolytische Absetzen einer Goldlegierung und galvanisches Verfahren für die Verwendung dieses Bads

Country Status (2)

Country Link
EP (1) EP0140832B1 (de)
DE (1) DE3468704D1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH662583A5 (fr) * 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
CN1200774A (zh) 1995-11-03 1998-12-02 恩索恩Omi公司 电镀方法、组合物和沉积物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4012294A (en) * 1972-08-10 1977-03-15 Oxy Metal Industries Corporation Gold sulfite baths containing organophosphorous compounds
DE3020765A1 (de) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten

Also Published As

Publication number Publication date
DE3468704D1 (en) 1988-02-18
EP0140832A3 (en) 1985-06-12
EP0140832A2 (de) 1985-05-08

Similar Documents

Publication Publication Date Title
EP0193848B1 (de) Galvanisches Bad für das Elektroplattieren von Goldlegierungen
FR2502184A1 (fr) Bain de revetement non-electrolytique en or
FR2516930A1 (fr) Compositions chimiques pour l'enlevement d'etain et d'alliage d'etain-plomb a partir de substrats metallises
JP2007537358A (ja) 金−スズ共晶合金のための電気めっき用溶液
CH622829A5 (de)
EP1423557B1 (de) Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen
JP7352515B2 (ja) 電解金合金めっき浴及び電解金合金めっき方法
EP1272691A1 (de) Elektrolytische lösung zur elektrochemischen abscheidung von palladium oder dessen legierungen
EP0140832B1 (de) Galvanisches Bad für das elekrolytische Absetzen einer Goldlegierung und galvanisches Verfahren für die Verwendung dieses Bads
FR2551078A1 (fr) Perfectionnements aux compositions pour la dissolution de metaux et procede de dissolution
EP0180523A1 (de) Verfahren zur Beschichtung mit Zinkphosphaten, Aktivierungs- und Schichtverfeinerungsbad für dieses Verfahren und Konzentrat dafür
US4366035A (en) Electrodeposition of gold alloys
WO2017021916A2 (en) Tin/copper alloys containing palladium, method for their preparation and use thereof
FR2528073A1 (fr) Bains aqueux de revetement non electrolytique d'or comprenant un composant d'or trivalent, un aurocyanure de metal alcalin et un reducteur
EP0304315A1 (de) Bad für das Elektroplattieren einer Gold-Kupfer-Zink-Legierung
EP2730682B1 (de) Alkalische, cyanidfreie lösung zur elektroplattierung von goldlegierungen, verfahren zur elektroplattierung und substrat mit einer heller, korrosionsfreien ablagerung einer goldlegierung
EP0121492B1 (de) Galvanisches Bad für das Elektroplattieren einer Gold-Kupfer-Cadmiumlegierung, Verfahren zur Verwendung dieses Bades und aus diesem Verfahren resultierender Gegenstand
FR2461024A1 (fr) Procedes et compositions de depot electrolytique d'argent, utilisant des composes d'argent, des electrolytes sans cyanure et des composes de phosphonate organique
JP2008174795A (ja) 金メッキ液および金メッキ方法
EP0227518A1 (de) Hydrazin enthaltendes Bad zum stromlosen Abscheiden von Nickel und/oder Kobalt und Verfahren zu dessen Herstellung
CH621367A5 (en) Electrolytic bath for plating gold-copper-cadmium alloys and its use in galvanoplasty
EP0480876A2 (de) Elektrolytisch erzeugter Überzug in Form einer Kupfer und Zink enthaltender Goldlegierung sowie Verfahren zu dessen Herstellung
EP0384679B1 (de) Elektroplattierung von Gold enthaltenden Legierungen
FR2551080A1 (fr) Ameliorations aux compositions pour la dissolution de metaux et procede de dissolution
EP2312021A1 (de) Verfahren zum Erhalten einer gelben Goldlegierungsablagerung durch Galvanoplastik ohne Verwendung von giftigen Metallen

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Designated state(s): CH DE FR GB LI

AK Designated contracting states

Designated state(s): CH DE FR GB LI

17P Request for examination filed

Effective date: 19851123

17Q First examination report despatched

Effective date: 19860714

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): CH DE FR GB LI

REF Corresponds to:

Ref document number: 3468704

Country of ref document: DE

Date of ref document: 19880218

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)
R20 Corrections of a patent specification

Effective date: 19880317

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20030715

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20030717

Year of fee payment: 20

Ref country code: DE

Payment date: 20030717

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20030813

Year of fee payment: 20

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20040829

Ref country code: GB

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20040829

Ref country code: CH

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20040829

REG Reference to a national code

Ref country code: GB

Ref legal event code: PE20

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL