EP0110135B1 - Procédé pour la fabrication d'un tube à propagation d'ondes comportant une ligne à retard maintenue par des barreaux en matière diélectrique - Google Patents
Procédé pour la fabrication d'un tube à propagation d'ondes comportant une ligne à retard maintenue par des barreaux en matière diélectrique Download PDFInfo
- Publication number
- EP0110135B1 EP0110135B1 EP83110711A EP83110711A EP0110135B1 EP 0110135 B1 EP0110135 B1 EP 0110135B1 EP 83110711 A EP83110711 A EP 83110711A EP 83110711 A EP83110711 A EP 83110711A EP 0110135 B1 EP0110135 B1 EP 0110135B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- support rods
- delay line
- vacuum
- line
- tight sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 14
- 238000005476 soldering Methods 0.000 claims description 10
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 230000004308 accommodation Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009760 electrical discharge machining Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 241000289669 Erinaceus europaeus Species 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
- H01J23/16—Circuit elements, having distributed capacitance and inductance, structurally associated with the tube and interacting with the discharge
- H01J23/24—Slow-wave structures, e.g. delay systems
- H01J23/26—Helical slow-wave structures; Adjustment therefor
Definitions
- the invention relates to a method for producing a traveling wave tube according to the preamble of claim 1.
- DE-A-1 937 704 discloses a traveling wave tube with a helical delay line accommodated within a metallized vacuum tube of the tube and a number of support rods arranged parallel to one another along surface lines of the line and fixed in position in the inner cross section of the vacuum tube.
- DE-A-2 137 795 discloses a traveling field klystron and a method for producing the traveling field klystron as known.
- delay structures are provided in the resonator chambers, with at least the delay coils of the output-side line chambers being soldered to solid screws of good thermal conductivity on screws inserted into continuous threaded holes in the chamber walls.
- the helix with the insulating elements soldered to it is centered by means of a centering mandrel to the axis of the resonator chamber in such a way that the insulating elements are aligned with the axes of the threaded bores, the screws with the solder rings used being in contact with the free ones in the threaded bores from the outside
- the ends of the insulating elements are screwed in and solder material is provided at the contact points.
- the invention has for its object to provide a less complex and easy to implement method for producing a traveling wave tube in order to optimally dissipate the heat occurring in the delay line in this tube via the mounting rods on the massive vacuum envelope.
- Holes are made in the vacuum envelope, for. B. by drilling, punching, spark erosion or etching.
- the diameter of the support rods which are preferably matched to the width of the ring or coil, can be inserted into the bores directly or after they have been extended by a good heat-conducting material, pushed in as far as they will go and fastened into the vacuum envelope with tension wire. Optimal heat dissipation from the delay line to the vacuum envelope is achieved.
- the thermal expansion differences between the support rods and the vacuum envelope in contrast to known arrangements with support rods running along the delay line, cannot take effect. In addition, a better coupling resistance is achieved.
- the delay line can be in the form of a spiral, ring-bridge or other line structure.
- the optimal heat dissipation from the delay line to the vacuum envelope is made possible by a perfect connection, preferably a soldered connection, being carried out between the delay line and the support rods or between the support rods and the vacuum envelope. This is achieved by holding rods (insulating rods) leading radially to the delay line (so-called hedgehog technology). Depending on the performance occurring, a division of three or four can be selected.
- the z. B. existing copper vacuum sheath (jacket tube) is pierced according to the line pitch (e.g. spiral pitch) in a three or four division.
- the bore diameter depends on the diameter of the support rods or their extensions.
- the holes can be made by other methods besides drilling, e.g. B. by punching, spark erosion or etching. Depending on the slope of the holes, a recess (groove) is then inserted along the vacuum envelope.
- the mounting rods which are preferably made of aluminum oxide, beryllium oxide or diamond, are matched in diameter to the ring or spiral width of the delay line.
- the support rods can be soldered into the vacuum sleeve directly or after they have been extended by a good heat-conducting material (e.g. copper).
- the support rods are metallized on both sides. Mo Mg Si, TiMoCu or any other metallization process can be used for this.
- On the metallization z. B. approximately 10 ⁇ rn copper and gold or nickel and gold, which serves as a solder.
- the application of this layer can e.g. B. galvanically, by sputtering or another method.
- the delay line itself can be made of tungsten, molybdenum or copper. If the delay line is made of molybdenum or tungsten, it is covered with a copper layer.
- the delay line is expediently installed in an assembly soldering gauge. During assembly, the vacuum envelope with the centrally held delay line is vertical. Then the support rods or the support rods with extension are inserted into the holes in the vacuum envelope. If all support rods (insulating rods) are pushed up to the line stop, they should be approx. 0.1 mm above the core diameter of the threaded groove of the jacket tube (vacuum sleeve). Then at the beginning Attached tension wire with a diameter of approx. 0.2 mm is wound into the thread groove via the protruding support rods.
- a gold-plated or copper-plated wire which has a high melting point and above all a low coefficient of expansion, ie preferably molybdenum or molybdenum alloys. Make sure that the wire is correctly pretensioned. As at the beginning, the wire is also fixed at the end. According to the tension wire, a solder wire is now wrapped in the groove. Gold-copper or gold-nickel is preferably used as the solder. The solder between the delay line and the support rod forms the gold lying between the two copper or nickel layers.
- connection flanges and coupling and decoupling After the installation of connection flanges and coupling and decoupling, the entire structure is heated to approx. 960 ° C in the soldering furnace. Due to the small expansion of the tension wire compared to the delay line and the support rods, the system is held together during the soldering process and the soldering takes place under a certain pressure. If the amount of solder is dimensioned correctly, a slight solder fillet is formed between the delay line and the support rods, and the support rods are washed in with solder on the casing tube within the groove, including the tensioning wire.
- This jacket tube which is soldered in a vacuum-tight manner, provides the tube shell, i.e. the vacuum envelope.
- the jacket vacuum sleeve
- This line tube can then be shrunk or soldered into a thin jacket tube or a line sleeve integrated into a pole piece.
- a delay line 1 is shown, which is arranged within a solid metallic vacuum envelope 3 and is fixed by a number of dielectric support rods 2 along the central axis of the vacuum envelope 3.
- the support rods 2 run radially to the delay line 1 and are fastened to this and to the vacuum envelope 3, preferably by soldering.
- the support rods 2 are inserted through holes 4 in the vacuum envelope.
- a simple support rod is designated 2a.
- a support rod with a metallic extension is designated.
- 2c denotes a support rod which is bluntly elongated, the metallic extension having a larger diameter.
- the metallic extension has the same diameter as the support rod.
- the tension wire used in the soldering process is provided with the reference number 5.
- Fig. 2 shows a helical delay line 1, which is fixed with the radially arranged support rods 2.
- the support rods 2, which correspond to the embodiment 2d according to FIG. 1 in this exemplary embodiment, are soldered to both the delay line 1 and the vacuum envelope 3.
- holes 4 are provided for inserting and soldering the support rods.
- the tension wire 5 used for the soldering process is wound in a groove provided in the vacuum envelope 3 around the outer ends of the holding rods 2.
Landscapes
- Microwave Tubes (AREA)
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3240195 | 1982-10-29 | ||
DE19823240195 DE3240195A1 (de) | 1982-10-29 | 1982-10-29 | Wanderfeldroehre mit einer durch halterungsstaebe aus dielektrischem material fixierten verzoegerungsleitung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0110135A1 EP0110135A1 (fr) | 1984-06-13 |
EP0110135B1 true EP0110135B1 (fr) | 1988-01-27 |
Family
ID=6176965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP83110711A Expired EP0110135B1 (fr) | 1982-10-29 | 1983-10-26 | Procédé pour la fabrication d'un tube à propagation d'ondes comportant une ligne à retard maintenue par des barreaux en matière diélectrique |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0110135B1 (fr) |
DE (2) | DE3240195A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106206218A (zh) * | 2016-07-14 | 2016-12-07 | 中国电子科技集团公司第十二研究所 | 一种角向非对称螺旋线慢波结构及该慢波结构的制造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3053831B1 (fr) * | 2016-07-07 | 2018-07-06 | Thales | Ligne de tube a ondes progressives |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE841311C (de) * | 1950-05-06 | 1952-06-13 | Telefunken Gmbh | Wanderfeldroehre mit einer von der Gefaesswand distanzierten Wendel |
DE845220C (de) * | 1951-02-09 | 1952-07-31 | Hellmuth Mohr | Punktweise gehalterter wendelfoermiger Wellenleiter |
FR1432503A (fr) * | 1958-11-18 | 1966-03-25 | Thomson Houston Comp Francaise | Structure de ligne à retard |
NL285205A (fr) * | 1961-11-10 | |||
DE1491407A1 (de) * | 1963-07-31 | 1970-01-15 | Siemens Ag | Lauffeldroehre mit einer Wendel als Verzoegerungsleitung |
US3519964A (en) * | 1968-07-26 | 1970-07-07 | Microwave Ass | High power slow wave circuit |
DE2137795A1 (de) * | 1971-07-28 | 1973-02-01 | Siemens Ag | Wanderfeldklystron |
US3949263A (en) * | 1974-12-20 | 1976-04-06 | Raytheon Company | Diamond brazing method for slow wave energy propagating structures |
US4278914A (en) * | 1979-10-18 | 1981-07-14 | The United States Of America As Represented By The Secretary Of The Navy | Diamond supported helix assembly and method |
-
1982
- 1982-10-29 DE DE19823240195 patent/DE3240195A1/de not_active Withdrawn
-
1983
- 1983-10-26 EP EP83110711A patent/EP0110135B1/fr not_active Expired
- 1983-10-26 DE DE8383110711T patent/DE3375536D1/de not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106206218A (zh) * | 2016-07-14 | 2016-12-07 | 中国电子科技集团公司第十二研究所 | 一种角向非对称螺旋线慢波结构及该慢波结构的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE3375536D1 (en) | 1988-03-03 |
DE3240195A1 (de) | 1984-05-03 |
EP0110135A1 (fr) | 1984-06-13 |
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