EP0059787A1 - Appareil pour couvrir d'une couche mince des pièces électroconductrices composées de bandes, de rubans ou analogues pour un procédé éléctrolytrique en continu - Google Patents

Appareil pour couvrir d'une couche mince des pièces électroconductrices composées de bandes, de rubans ou analogues pour un procédé éléctrolytrique en continu Download PDF

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Publication number
EP0059787A1
EP0059787A1 EP81108594A EP81108594A EP0059787A1 EP 0059787 A1 EP0059787 A1 EP 0059787A1 EP 81108594 A EP81108594 A EP 81108594A EP 81108594 A EP81108594 A EP 81108594A EP 0059787 A1 EP0059787 A1 EP 0059787A1
Authority
EP
European Patent Office
Prior art keywords
belt
nozzles
spray nozzles
electrolyte
spray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP81108594A
Other languages
German (de)
English (en)
Other versions
EP0059787B1 (fr
Inventor
Heiner Ing.Grad. Bahnsen
Daniel Ing. Grad. Hosten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to AT81108594T priority Critical patent/ATE27974T1/de
Publication of EP0059787A1 publication Critical patent/EP0059787A1/fr
Application granted granted Critical
Publication of EP0059787B1 publication Critical patent/EP0059787B1/fr
Expired legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Definitions

  • the invention relates to a device for the partial electroplating of strips, strips or the like to be condensed parts in a continuous process, the cathodically connected strip, strip or the like being guided along an anodically connected spray nozzle.
  • a device of this type is known from US-PA 40 29 555.
  • an upright endless belt is passed through a kind of tunnel through a self-contained electroplating cell.
  • the tape in the tunnel is covered by masks so that only the area that is to be provided with a metal layer remains free.
  • a slot-shaped nozzle connected as an anode is arranged in such a way that the electrolyte is sprayed vertically against the strip.
  • the flowing electrolyte is collected below the slit-shaped nozzle and then reused.
  • the length of the slot-shaped nozzle extends practically over the entire width of the electroplating cell.
  • the electrolyte emerges relatively uniformly over the entire length of the nozzle.
  • the beginning and end of the strips have a thicker coating, since the current densities are concentrated at the ends of the strips.
  • a plurality of nozzles next to one another and opposite one another.
  • Such a nozzle arrangement is provided for the selective partial electroplating of fixed pin combs.
  • Each pin comb is attached and contacted using a bracket.
  • the nozzles are fastened in a preferably pivotable holder and directed against the pin E of the comb. Since the pins are fixed with respect to the nozzles, the distance between the nozzles must be equal to the distance between the pins on the comb. Since in practice it cannot be avoided that from the Electrolyte jets emerging from the nozzles are unequal to one another, inevitably there are deposits of different thicknesses. Furthermore, since the nozzles are also opposite one another in the case of opposing nozzle arrangements, a mutual hindrance of the opposing nozzles cannot be avoided.
  • a device for plating the connection pins of a printed circuit board has become known from US Pat. No. 4,186,062, the printed circuit boards being gripped by toothed belts arranged on both sides and being passed through an electrolyte cell.
  • the timing belts cover the areas of the circuit board that are not to be galvanized tightly.
  • the electroplating is carried out by supplying the electrolyte to the plate via holes directed upwards and arranged in a row. With the help of a curved foil, the electrolyte flow is deflected in a certain direction so that a kind of Venturi effect is created on the circuit board.
  • the invention has for its object to provide a device of the type described in such a way that not only tapes, but also strips, combs, plates or the like can be partially galvanized. It is ensured that not only a uniform layer thickness with little layer thickness scattering occurs , but also any desired layer thickness distribution can be achieved.
  • the continuous movement of the belt or the like along the nozzles produces a layer thickness which is always constant because the belt passes through each individual nozzle.
  • the thickness of the layer depends, among other things, on the speed at which the strip passes the individual nozzles.
  • galvanizing strips, combs, plates or the like have a thicker coating at the beginning and end than the middle part, since the current density along the nozzle arrangement remains practically constant, since each individual nozzle with the cathodic switched band or the like practically forms its own galvanic cell.
  • the distance between the individual spray nozzles can be selected so that the cells practically do not influence one another.
  • the diameter of the nozzles and the distance of the nozzles from the belt or the like are preferably such that a current density distribution corresponding to the desired layer thickness distribution is produced between the belt or strip and nozzles.
  • any layer thickness distribution can be achieved, so that, for example, in knife strips, the areas can be provided with a thicker coating that are subject to greater wear than other areas. This can save a lot of precious metal on precious metal contacts, as experience has shown.
  • the distance of the spray nozzles from one another is not the same or not equal to a multiple of the division of the parts combined in the band.
  • the device according to the invention differs significantly from the device according to DE-OS 25 51 988, in which the distance between the nozzles must be equal to the distance of the pins on the comb, since otherwise an uneven layer thickness distribution results. Because the distance between the spray nozzles from one another is not the same as the division of the parts combined in the belt or the like, the total dynamic pressure across all the nozzles is approximately the same, so that the strength of the individual spray jets is not subject to any fluctuations. This is particularly important when the nozzles are arranged close to the area to be galvanized on the belt.
  • Another possibility of a targeted layer thickness distribution results from the fact that the individual spray nozzles have a smaller diameter than the width of the areas to be galvanized on the strip and that the individual spray nozzles are not only arranged one behind the other in the direction of movement, but also perpendicularly to one another such that the in the order of the first spray nozzle the one (upper) and the last spray nozzle the other (lower) range limit.
  • this can be achieved in a simple manner by preferably grouping them together seized nozzles, which are used in a common container to form a spray cell, offset by tilting the container parallel to the belt. By appropriately tilting the spray cell, a more or less wide area on the strip can be partially galvanized. In accordance with this inclination, the belt speed must then be set accordingly in order to achieve a certain layer thickness.
  • the individual nozzles are positioned at an angle to the strip in such a way that the sprayed electrolyte flows out in a preferred direction.
  • the exit velocity of the electrolyte from the nozzles can be increased. The more this angle deviates from the perpendicular to the band, the better the flow distribution, so that at least partially sharply delimited areas of the coating result.
  • spray nozzles are arranged on both sides of the strip in a manner known per se which, according to the invention, are at a distance from one another so that the nozzles do not interfere with one another.
  • the electrolyte is sprayed at a very high speed, it is inevitable that electrolyte is also sprayed onto areas which are not to be galvanized and which may then have to be cleaned again later.
  • the spray nozzles arranged on at least one side of the belt are used to form a spray cell in a common container which is designed and held under pressure such that each of the electrolyte jets emerging from the individual spray nozzles has approximately the same strength.
  • a particularly simple construction of a spray cell results according to the invention in that it consists of one noble metal tube, e.g. Platinum, existing spray nozzles in a tubular container made of corrosion-resistant material, e.g. Titanium are used, which is preferably closed on one side and has a connecting piece for electrolyte liquid on the other side.
  • a preferably concentrically arranged distributor pipe is arranged in the interior of the tubular container, via which the electrolyte is supplied and in which holes are provided in a corresponding distribution on the side facing away from the spray nozzles are.
  • Such a container can be easily adjusted with respect to the belt or the like so that the distance of the spray nozzles from the belt and the direction of the spray nozzles to the belt can be changed.
  • the spray direction can be changed in a simple manner in that the container is designed to be pivotable about its longitudinal axis.
  • FIG. 1 shows, the parts 1 to be coated are combined to form a conductive tape 2.
  • the tape 2 is usually 'wound on a roll and is drawn off by an unwinding device not shown in the drawing and runs into the electroplating system. It travels through a number of pretreatment stations in a manner known per se and then finally runs into the actual electroplating cell 4, the principle of which is shown in FIG. Volume 2 is here in The direction of the arrow 3 is drawn into the electroplating cell 4.
  • a pair of contact rollers 5 are provided for contacting the belt 2, which also serve as a guide.
  • the band 2 is guided along a row of nozzles 7, which are inserted in a tubular container 8 designed as a spray cell. As indicated by an arrow 9, electrolyte is pumped into the tubular container 8, which then exits through the nozzles 7.
  • the nozzles 7 are directed against the area B to be coated, the diameter d of the nozzles 7 and the distance a from the strip 2 being matched to one another in such a way that the current density distribution corresponds approximately to the desired layer thickness distribution (FIG. 2).
  • Figure 2 shows. on an enlarged scale, the arrangement of the nozzles 7 with respect to the area B to be galvanized of the parts 1 on the strip 2.
  • the area B of the part 1 to be coated is curved.
  • the angle ⁇ between the nozzle axis 10 and the belt plane is made less than 90 °. This adjustment of the angle can be made in a simple manner so that the tubular container 8 is rotated about its longitudinal axis 11 accordingly.
  • the nozzles 7 used in the tubular container 8 are preferably arranged at the same distance D from one another, but the distance D is not equal to a multiple of the distance t of the components combined in the band 2.
  • the area of the strip 2 that is not to be galvanized can be covered.
  • the band consists of individual parts, for example contact pins, which are more or less free, there is a risk that these parts 1 will be bent and damaged.
  • the masks 12 and 13 move according to FIG. 1 with the belt in a speed-compatible manner. This can be achieved in a simple manner if circumferential belts are used as masks 12 and 13, as are also used, for example, in a device described in DE-OS 29 28 904.
  • partially galvanizing parts combined into strips, such as pin combs or the like, and also circuit boards.
  • FIGS. 3 and 4 show an exemplary embodiment with two spray cells, contact pins 14 being combined into a band to be galvanized at the lower free end, from both sides.
  • tubular containers 8 and 8 ' with spray nozzles 7 and 7' are provided, which are directed against the area to be plated on the contact pins 14.
  • the arrangement and configuration of the nozzles 7 and 7 ' essentially corresponds to the configuration according to FIG. 1, but in this case they are opposite one another the nozzles 7 and 7 'offset from one another to a gap, so that the electrolyte jets emerging from the individual nozzles 7 and 7' do not influence one another.
  • the two tubular containers 8 and 8 ' are arranged within an electrolyte trough 15, as shown in FIG. 4.
  • a uniform layer thickness distribution can only be achieved if the diameter d of the individual nozzles 7 is significantly smaller than that galvanizing area B of the connector pin 14 and when the nozzles 7A to 7N are also offset transversely to the direction of movement of the strip, in total by an amount c.
  • This can be achieved in a simple manner in the spray cells according to FIGS. 1 and 3 in that the container or containers 8 are inclined parallel to the belt by the amount c, so that, for example, the first spray nozzle 7A in the order the upper and the last spray nozzle 7N detected the lower range limit.
  • the amount c is chosen exaggerated. As already mentioned at the beginning, any desired layer thickness distribution can be achieved in this way.
  • FIG. 6 shows an advantageous embodiment of a spray cell, in particular for partial gold plating.
  • the cell consists of a tube 16 made of corrosion-resistant material, for example titanium, in which tubes 17 made of precious metal, for example platinum, are used as nozzles 7.
  • the tube 16 is provided with corresponding bores into which the tubes 17 are inserted, for example by pressing.
  • a plug 18 made of corrosion-resistant material, for example plastic is inserted, which Pipe 16 closes tightly.
  • the other end of the tube 1 6 has a connecting piece 19 for connection to an electrolyte supply, as indicated by an arrow 20.
  • a distributor tube 2 1 is arranged inside the tube 16, preferably concentrically thereto, one end of which is pushed over a molded part 22 of the stopper and the other end of which in a corresponding bore 23 of the connecting piece 19 is centered.
  • the distributor tube 21 is provided on the side facing away from the tube 17 with openings in the form of bores 24, through which the electrolyte exits and pours around the distributor tube 21 on both sides before it reaches the tube 17 and exits there.
  • the spray cells shown in FIGS. 1, 3 and 4 are preferably also designed in the same way as the spray cell according to FIG. 6.
  • Such a cell can be inserted into a simple holder which allows both rotation about its longitudinal axis 25 and adjustment of a certain one Inclined position C parallel to the strip for setting a defined coating width B and also setting an optimum distance for the galvanization of the nozzle ends from the areas to be galvanized is permitted.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP81108594A 1981-03-05 1981-10-20 Appareil pour couvrir d'une couche mince des pièces électroconductrices composées de bandes, de rubans ou analogues pour un procédé éléctrolytrique en continu Expired EP0059787B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT81108594T ATE27974T1 (de) 1981-03-05 1981-10-20 Vorrichtung zum partiellen galvanisieren von zu elektrisch leitenden baendern, streifen oder dgl. zusammengefassten teilen im durchlaufverfahren.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3108358 1981-03-05
DE3108358A DE3108358C2 (de) 1981-03-05 1981-03-05 Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefaßten Teilen im Durchlaufverfahren

Publications (2)

Publication Number Publication Date
EP0059787A1 true EP0059787A1 (fr) 1982-09-15
EP0059787B1 EP0059787B1 (fr) 1987-06-24

Family

ID=6126410

Family Applications (1)

Application Number Title Priority Date Filing Date
EP81108594A Expired EP0059787B1 (fr) 1981-03-05 1981-10-20 Appareil pour couvrir d'une couche mince des pièces électroconductrices composées de bandes, de rubans ou analogues pour un procédé éléctrolytrique en continu

Country Status (5)

Country Link
US (1) US4427520A (fr)
EP (1) EP0059787B1 (fr)
JP (1) JPS57161084A (fr)
AT (1) ATE27974T1 (fr)
DE (2) DE3108358C2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0081788A1 (fr) * 1981-12-09 1983-06-22 Siemens Aktiengesellschaft Bain de dépôt électrolytique rapide sans additifs
EP0140474A1 (fr) * 1983-10-07 1985-05-08 Kawasaki Steel Corporation Dispositif à contre-courant pour appareil galvanoplastique

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Publication number Priority date Publication date Assignee Title
DE3339328A1 (de) * 1982-11-01 1984-05-10 Omi International Corp., 48089 Warren, Mich. Anodenstruktur fuer eine plattierungszelle
JPS61250191A (ja) * 1985-04-26 1986-11-07 Electroplating Eng Of Japan Co コネクタ端子のブラシメツキ方法
JPH07116636B2 (ja) * 1986-09-26 1995-12-13 川崎製鉄株式会社 ラジアル型めつきセル
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
DE4116643C2 (de) * 1991-05-22 1994-06-09 Klaus Joergens Verfahren zum anodischen oder kathodischen Elektrolackieren von Band- oder Profilmaterial
US5242562A (en) * 1992-05-27 1993-09-07 Gould Inc. Method and apparatus for forming printed circuits
US5658441A (en) * 1995-12-18 1997-08-19 Cfc, Inc. Conveyorized spray plating machine
DE19758513C2 (de) * 1997-02-06 2000-07-13 Schempp & Decker Praezisionste Vorrichtung zum selektiven galvanischen Beschichten von elektrischen Kontaktelementen
EP1081252A1 (fr) * 1999-09-02 2001-03-07 Enthone-OMI (Benelux) B.V. Procédé de placage sélectif
DE10205586B4 (de) * 2002-02-09 2007-07-05 Degussa Galvanotechnik Gmbh Verfahren und Vorrichtung zur galvanischen Beschichtung von Endlosmaterial
JP5009972B2 (ja) * 2009-12-21 2012-08-29 日立オートモティブシステムズ株式会社 コネクタの製造方法
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
JP6341734B2 (ja) * 2014-04-09 2018-06-13 住友ゴム工業株式会社 タイヤ用カラーライン塗布装置および塗布方法
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
CN107937932A (zh) * 2017-12-12 2018-04-20 西安泰金工业电化学技术有限公司 一种生箔机组水洗喷淋装置
TWI831852B (zh) * 2019-10-24 2024-02-11 香港商亞洲電鍍器材有限公司 流體輸送系統及電鍍工件的方法
CN110846695A (zh) * 2019-12-06 2020-02-28 昆山一鼎工业科技有限公司 局部区域表面处理装置及其表面处理方法

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DE2644970A1 (de) * 1975-10-06 1977-04-14 Nat Semiconductor Corp Beschichtungseinrichtung und verfahren zur kontinuierlichen aufbringung einer streifenfoermigen beschichtung
DE2551988A1 (de) * 1975-11-17 1977-05-26 Schering Ag Verfahren zur selektiven galvanischen abscheidung von metallen sowie vorrichtung zur durchfuehrung des verfahrens
DE2620995B2 (de) * 1975-05-23 1979-09-13 Electroplating Engineers Of Japan, Ltd., Tokio Vorrichtung mit Elektrolytgewinnung zum kontinuierlichen, selektiven Hochgeschwindigkeitsgalvanisieren
US4240880A (en) * 1978-07-25 1980-12-23 Sumitomo Metal Mining Co., Ltd. Method and apparatus for selectively plating a material
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US4036725A (en) * 1975-11-21 1977-07-19 National Semiconductor Corporation Wheel selective jet plating system
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JPS6053119B2 (ja) * 1978-12-19 1985-11-22 富士通株式会社 接触子の部分めつきマスク装置

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DE2620995B2 (de) * 1975-05-23 1979-09-13 Electroplating Engineers Of Japan, Ltd., Tokio Vorrichtung mit Elektrolytgewinnung zum kontinuierlichen, selektiven Hochgeschwindigkeitsgalvanisieren
CH621825A5 (fr) * 1975-06-14 1981-02-27 Electroplating Eng
DE2644970A1 (de) * 1975-10-06 1977-04-14 Nat Semiconductor Corp Beschichtungseinrichtung und verfahren zur kontinuierlichen aufbringung einer streifenfoermigen beschichtung
DE2551988A1 (de) * 1975-11-17 1977-05-26 Schering Ag Verfahren zur selektiven galvanischen abscheidung von metallen sowie vorrichtung zur durchfuehrung des verfahrens
US4240880A (en) * 1978-07-25 1980-12-23 Sumitomo Metal Mining Co., Ltd. Method and apparatus for selectively plating a material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0081788A1 (fr) * 1981-12-09 1983-06-22 Siemens Aktiengesellschaft Bain de dépôt électrolytique rapide sans additifs
EP0140474A1 (fr) * 1983-10-07 1985-05-08 Kawasaki Steel Corporation Dispositif à contre-courant pour appareil galvanoplastique

Also Published As

Publication number Publication date
DE3108358C2 (de) 1985-08-29
JPH024678B2 (fr) 1990-01-30
ATE27974T1 (de) 1987-07-15
DE3176278D1 (en) 1987-07-30
DE3108358A1 (de) 1982-09-16
US4427520A (en) 1984-01-24
JPS57161084A (en) 1982-10-04
EP0059787B1 (fr) 1987-06-24

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