EP0041776B1 - Verfahren zur Herstellung einer Halbleiteranordnung mit einer Isolationsstruktur - Google Patents

Verfahren zur Herstellung einer Halbleiteranordnung mit einer Isolationsstruktur Download PDF

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Publication number
EP0041776B1
EP0041776B1 EP81302078A EP81302078A EP0041776B1 EP 0041776 B1 EP0041776 B1 EP 0041776B1 EP 81302078 A EP81302078 A EP 81302078A EP 81302078 A EP81302078 A EP 81302078A EP 0041776 B1 EP0041776 B1 EP 0041776B1
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Prior art keywords
layer
groove
substrate
silicon
forming
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EP81302078A
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French (fr)
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EP0041776B2 (de
EP0041776A2 (de
EP0041776A3 (en
Inventor
Junji Sakurai
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Fujitsu Ltd
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Fujitsu Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials

Definitions

  • This invention relates to a method for manufacturing a semiconductor device having a semiconductor substrate, a plurality of active elements such as bipolar transistors or Metal-Insulator-Semiconductor (MIS) type transistors formed in the substrate and an isolation region formed on the substrate for isolating the active elements from one another. More particularly, the invention relates to a method for forming a minute field isolation structure on a semiconductor substrate for an integrated circuit device.
  • active elements such as bipolar transistors or Metal-Insulator-Semiconductor (MIS) type transistors
  • a plurality of active elements or functional elements formed in a semiconductor substrate are electrically isolated from one another by a field isolation system.
  • the region for the field isolation is comprised of a deep impurity diffusion region or a thermally grown thick oxide film in conventional devices.
  • Such a conventional field isolation structure has problems that a high temperature process hours long is necessary for its formation and the fine patterning of the field region is difficult. The latter problem is difficult because it results from the fact that either impurity diffusion or thermal oxidation for forming the field region is controlled by a diffusion phenomenon and accordingly the width of the region can not be narrower than its depth. In order to solve.
  • insulator isolation structures in which a groove is formed on a surface of a substrate where the isolation region is to be formed and an insulator or semiconductor material is filled therein have been proposed.
  • Such a groove if formed by a conventional anisotropic etchings technique or a dry etching technique, can have a smaller width than its depth. This means that the isolation structure can be miniaturized to achieve a high integration density.
  • CVD chemical vapor deposition
  • DE-A-2 408 402 discloses a method of manufacturing a semiconductor device having a semiconductor substrate, a plurality of elements formed in the substrate, an isolation region formed in the substrate for isolating the elements from one another, the method comprising the steps of:-
  • the further insulating material is deposited so as to extend also on the surface at which the mouth of the groove opens, beyond the groove. This material is removed substantially down to that surface, leaving the further insulating material in the groove.
  • An embodiment of this invention can provide a method for forming a field isolation structure having a minute width thereby to improve the integration density of an integrated circuit device.
  • An embodiment of this invention can provide a method for forming a field isolation structure without a heat treatment involving a high temperature for a long time.
  • An embodiment of this invention can provide a method for forming a field isolation structure by which the surface of the substrate can be made flat without any polishing or lapping process.
  • An embodiment of this invention can provide a method for forming a field isolation structure on a substrate which does not cause any thermal damage due to a high temperature process to active elements formed in the substrate.
  • An embodiment of the present invention provides a method for manufacturing a semiconductor device having a semiconductor substrate, a plurality of active elements formed in the substrate and a field isolation region formed on the substrate for isolating the active elements from one another, the method comprising the steps of:
  • the groove for forming the field isolation region may preferably be formed by an anisotropic etching technique or a dry etching technique as is well known in the art so that the groove has a small width relative to its depth thereby to lessen the area for the field isolation structure.
  • a conventional plasma etching, reactive sputter etching or ion beam etching technique is particularly preferable for this purpose.
  • a sufficiently thin insulating layer relative to the depth and width of the groove is formed on the substrate to cover the surface of the substrate at least in the groove. Thereafter, the abovementioned layer of the material is formed on the substrate preferably by a conventional CVD technique. The thickness of this layer is preferably selected to be less than the depth and half of the width of the groove. This layer may be formed only in and round the groove.
  • an impurity containing glass particularly phosphorous silicate glass (PSG), or silicon is preferable.
  • PSG phosphorous silicate glass
  • a laser beam generated from, for example, a YAG laser or argon laser may be used to heat the silicon layer in the groove.
  • the silicon layer can be melted without substantially heating the silicon substrate thereunder.
  • the insulating layer formed under the glass layer or silicon layer is useful to prevent the substrate from contacting with the melted glass or silicon so that any thermal damage to the substrate or active elements formed therein is avoided. Moreover, this insulating layer prevents the substrate from being diffused with an impurity contained in the glass layer which would otherwise produce an undesirable impurity diffusion region in the substrate.
  • the underlying insulating layer is also useful to electrically isolate the silicon layer from the substrate so that the isolation is achieved.
  • This insulating layer may be a thermally grown silicon dioxide formed on the silicon substrate and have a thickness more than 50 nm which is sufficient to prevent the thermal damage, and to block the impurity diffusion from the glass layer in the step of fluidifying or melting the glass layer by the irradiation of a high energy beam such as a laser beam because the melting lasts only a very short period of time, for example, less than 10 micro-seconds.
  • a silicon dioxide film having a thickness more than 50 nm is also sufficient to assure the isolation between the substrate and the silicon layer in the groove.
  • the layer in the groove is selectively heated up to a sufficiently high temperature to fluidify or melt the glass or silicon, the layer begins to flow into the groove and ultimately fills up the same to make the surface flat and smooth.
  • the surface tension of the molten layer rather than gravity is dominant for the flow of the material so that the surface becomes flat and smooth very quickly. Therefore, it is sufficient to melt the layer for several micro-seconds in order to obtain a desirable flat surface.
  • a flat and smooth surface suitable for forming a wiring layer for integrated circuit thereon without a risk of disconnection of the layer is obtained without a grinding or lapping process.
  • the formation of the field isolation region in accordance with the present invention may be carried out even after active regions for active elements have already been formed in the substrate because these regions are not thermally damaged even in the melting step described above.
  • the material filled in the groove has an excellent isolation property because it consists of a CVD insulator or silicon and is sufficiently annealed in the melting step to become dense.
  • the isolation structure by the present invention is applicable not only to bipolar type integrated circuit devices but also to MIS type devices.
  • a silicon substrate 1 is prepared and a photoresist layer 2 having a predetermined pattern for forming a groove is formed thereon by a conventional photolithography technique.
  • the groove 3 is formed by, for example, a conventional reactive sputter etching technique, with the photoresist layer 2 used as an etching mask as shown in Fig. 1.
  • the dimension of the groove depends on the type of the device to be manufactured as in the case of the conventional isolation structure.
  • the substrate is subject to a thermal oxidation treatment to form a silicon dioxide film 4 having a thickness of 50 to 100 Ilm on the surface of the substrate 1 as shown in Fig.
  • This oxide film 4 in the groove 3 functions as a blocking film to prevent any undesirable thermal damage or impurity diffusion in the later process steps.
  • a PSG layer 5 is formed on the substrate by a convetional CVD techique.
  • the thickness of this layer 5 should be less than the depth of the groove 3 and also less than half of its width as shown in Fig. 3 so that the layer 5 does not completely fill up the groove at this stage. Unnecessary portions of layer 5 may be selectively removed so as to remain only in the groove 3 and at its fringe.
  • a laser beam such as a carbon dioxide laser beam having a wavelength of 10.6 um is irradiated from above onto the PSG layer 5 to melt and fluidify the PSG layer 5.
  • the optimum condition of the irradiation energy depends on the thickness of the layer 5. However, this condition is not critical because the laser beam is not substantially absorbed in the substrate but in the PSG layer 5 to selectively heat the same. Moreover, the PSG layer 5 tends to preferentially melt at the thick portion that is in the groove 3 where the fluidifying of the layer 5 is necessary because the absorption of the beam is large at this portion. Thus the PSG layer 5 is fluidified and flows into the groove 3 due to its surface tension and its surface becomes smooth and flat as shown in Fig. 4. In this melting step, the thermally grown oxide film 4 prevents the diffusion of phosphorus which is an n type impurity into the substrate 1 from the PSG layer 5. In addition, any substantial thermal damage to the substrate or active elements therein by the molten PSG layer is prevented by this blocking film 4.
  • a preferred embodiment of the present invention for manufacturing a bipolar type integrated circuit device is hereinafter described with reference to Fig. 5 to Fig. 12.
  • a P type silicon substrate 11 having a specific resistivity of 0.1 to 0.01 ohm-cm an N type layer 12 having an impurity concentration of 5 x 1011 - 1 x 1 0 20 cm- 3 is formed by a conventional process for diffusing antimony.
  • This layer 12 becomes a so- called buried diffusion layer.
  • this buried diffusion layer 12 may be formed continuously on the entire surface of the substrate 11.
  • an N type silicon epitaxial layer 13 containing phosphorus as the N type impurity in the concentration of 5 x 10" cm- 3 is formed on the substrate by an ordinary epitaxial growth process.
  • the resultant cross section of the substrate is shown in Fig. 1.
  • isolation regions are formed in the substrate as explained below.
  • a groove 19 is formed in the substrate at a portion where the isolation region is to be formed as shown in Fig. 8 by a conventional reactive sputter etching technique with a photoresist film used as a mask.
  • the groove 19 should be deep enough to penetrate the buried diffusion layer 12 so as to completely isolate island-shaped N type collector regions from one another.
  • the substrate is subjected to a thermal oxidation treatment to form a silicon dioxide film 20 having a thickness of 50 to 100 nm on the exposed silicon surface in the groove 19 as shown in Fig. 9.
  • a PSG layer 21 is formed on the substrate by a conventional CVD method.
  • This PSG layer 21 should have a thickness less than the depth of the groove 19 and also less than half of the width of the groove 19.
  • the groove 19 in a bipolar type device as in this embodiment is relatively deep, for example as deep as 5 to 10 pm. On the other hand, it may be made sufficiently narrow to save area. Assuming that the width of the groove 19 is 4 pm, the appropriate thickness of the PSG layer 21 is about 1.5 ⁇ m.
  • a laser beam generated by a carbon dioxide pulse laser is irradiated onto the PSG layer 21 from above to melt or fluidify the layer 21.
  • the irradiation energy is 4 to 5 joule/cm 2 with the pulse width of 5 micro sec. and the diameter of the laser spot of 1 mm.
  • the beam is preferably scanned with a pitch of 0.5 mm so that adjacent spots partially overlap one another.
  • the PSG layer 21 is melted instantaneously by the irradiation of the laser beam and immediately flows into the groove 19 due to the surface tension.
  • the blocking oxide film 20 prevents any substantial diffusion of phosphorus from the PSG layer into the substrate because the heating by the beam lasts only a very short period of time.
  • a smooth and flat surface as shown in Fig. 11 is obtained on the substrate.
  • the formation of the isolation region is completed.
  • the succeeding process steps are the same as those in the conventional process, in which electrode windows are formed in the insulator layers on the substrate, a polycrystal silicon layer of about 40 nm and an aluminium layer of 500 to 1000 nm are successively formed thereon, and patterning of the silicon and aluminium layers is carried out to form electrodes or wirings for the integrated circuit.
  • the resultant structure is shown in Fig. 12 in which 22 is the silicon layer and 23 is the aluminium layer.
  • the wiring comprised of the both layers though not shown in the Figure, extends over the groove 19 on the PSG layer 21 without a potential risk of disconnection due to steep steps which would otherwise exist on the isolation region, i.e. on the groove 19.
  • a groove 32 having a depth of, for example, 1 to 2 um is formed in a P type silicon substrate 31 at a portion where a field isolation region is to be formed with a photoresist film 33 used as an etching mask.
  • the substrate has a crystallographic surface orientation of (100) on its major surface and the abovementioned etching may be carried out by a well known uniso- tropic etching method so that (111) surface is exposed and the width of the groove 32 relative to its depth can be made small.
  • other etching techniques may be employed as well for the formation of the groove 32.
  • the photoresist film 33 is also used as a mask thereafter in the ion implantation process for forming a channel stop or channel cut region 34 in the substrate 31 at the portion under the groove 32.
  • the channel cut region 34 is formed as shown in Fig. 13.
  • the substrate After removing the photoresist film, the substrate is subjected to a thermal oxidation treatment to form a silicon dioxide film 35 having a thickness of 50 to 100 nm on the entire surface of the substrate. Then, a polycrystal silicon layer 36 is formed on the substrate as shown in Fig. 14.
  • the silicon layer 36 has a thickness of, for example, 0.5 to 1 pm which is preferably less than half of the width of the groove 32 as in the case of the preceding embodiment.
  • a laser beam from a CW argon laser is irradiated to selectively heat and melt the same.
  • An example of the optimum irradiation condition is as follows: the output power of the argon laser is 10 to 15 W, the diameter of the beam spot 50 microns, the scanning speed 10 cm/sec, the scanning pitch 25 microns.
  • the oxide film 35 thermally insulates the substrate 31 from the molten silicon layer thereon so that not part of the substrate is melted.
  • the molten silicon flows into the groove due to surface tension so as to make its surface smooth and flat as shown in Fig. 15.
  • the silicon layer 36 is etched until the underlying oxide film 35 is exposed except in the groove as shown in Fig. 16.
  • the exposed oxide film is also etched off and then the substrate is subjected to a thermal oxidation treatment to form again a silicon dioxide film 37 for a gate oxide film.
  • the surface of the remaining silicon layer 36 in the groove is also oxidized so that the silicon layer 36 is completely surrounded by the oxide films 35 and 37.
  • An implantation of boron ions into the substrate through the oxide film 37 may be executed at this stage to adjust threshold voltage of MIS transistors to be manufactured.
  • Another polycrystal silicon layer for forming gate electrodes 38 is formed by an ordinary CVD technique on the oxide film 37 and its patterning is carried out by a conventional photo-etching technique to form gate electrodes 38 as shown in Fig. 17. Then, phosphorus ions are implanted through the oxide film 37 to form phosphorus containing regions 39 for source or drain regions with the polycrystal silicon layer 38 for gate used as a mask for blocking the ions. The implanted ions into the silicon layer 38 is useful to render the layer 38 more conductive.
  • a PSG layer 40 is formed on the substrate and contact windows 41 for source and drain are formed through the PSG layer 40 and the oxide film 37 as shown in Fig. 18.
  • the substrate is then subjected to an annealing treatment to activate the implanted phosphorus ions to form N type source and drain regions 42.
  • aluminium electrodes 43 are formed and cover PSG layer 44 is formed thereon as in the conventional device.
  • the integrated circuit device including MIS type transistors each isolated by the field isolation structure is completed as shown in Fig. 19.
  • An embodiment of the present invention provides a method for forming a field isolation structure for a semiconductor device, particularly for an integrated circuit device, in which a groove is formed in a semiconductor substrate, an insulating layer is formed on the substrate at least in the groove, a glass layer or a silicon layer is formed thereon, and thereafter a high energy beam such as a laser beam is irradiated onto the glass or silicon layer to selectively heat the same thereby to melt or fluidify the layer and let the same flow into the groove.
  • a smooth and flat surface is obtained through the above melting process, being effective for preventing any disconnection of wiring layers formed thereon.
  • the method is particularly useful to obtain a minute field isolation structure effective to improve the integration density of the device.

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Claims (10)

1. Verfahren zur Herstellung einer Halbleitervorrichtung mit einem Halbleitersubstrat (1; 11, 12, 13; 31), einer Vielzahl von aktiven Elementen, die in dem genannten Substrat (1; 11, 12, 13; 31) gebildet sind, und einem Isolationsbereich, der in dem genannten Substrat (1; 11, 12, 13; 31) gebildet ist, um die genannten aktiven Elemente voneinander zu isolieren, welches Verfahren die folgenden Schritte umfaßt:
Bildung einer Nut (3; 19; 32), um den genannten Isolationsbereich in dem genannten Substrat (1; 11, 12, 13; 31) zu bilden,
Bedecken der Oberfläche der Nut (3; 19; 32) mit einer Isolationsschicht (4; 20; 35),
Bildung einer Schicht (5; 21; 36) aus einem Material, welches durch Erhitzung verflüssigt werden kann, auf der genannten Isolierschicht (4; 20; 35) wenigstens in der genannten Nut (3; 19; 32), und
Bestrahlung der genannten Schicht (5; 21; 36) aus dem genannten Material mit einem Engergiestrahl, um wahlweise die genannte Schicht (5; 21; 36) aus dem genannten Material zu erhitzen und dasselbe in die genannte Nut (3; 19; 32) fliessen zu lassen, um dadurch die Nut (3; 19; 32) mit dem genannten Material aufzufüllen.
2. Verfahren nach Anspruch 1, bei welchem der gennannte Energiestrahl ein Laserstrahl ist.
3. Verfahren nach Anspruch 1 oder 2, bei welchem das genannte Material aus einem Glas besteht.
4. Verfahren nach Anspruch 1, 2 oder 3, bei welchem das genannte Material aus Phosphorsilikatglas besteht.
5. Verfahren nach Anspruch 4, bei welchem der genannte Energiestrahl ein Kohlenstoffdioxydgaslaserstrahl ist.
6. Verfahren nach Anspruch 1 oder 2, bei welchem das genannte Material aus Silizium besteht.
7. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die genannte Isolierschicht (4; 20; 35) aus Siliziumdioxyd besteht.
8. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die Dicke der genannten Schicht (5; 21; 36) des genannten Materials geringer als die Tiefe der genannten Nut (3; 19; 32) ist.
9. Verfahren nach einem der vorhergehenden Ansprüche bei welchem die Dicke der genannten Schicht (5; 21; 36) aus dem genannten Material geringer also die Hälfte der Breite der genannten Nut (3; 19; 32) ist.
10. Halbleitervorrichtung, hergestellt nach einem Verfahren nach einem der vorhergehenden Ansprüche.
EP81302078A 1980-05-14 1981-05-11 Verfahren zur Herstellung einer Halbleiteranordnung mit einer Isolationsstruktur Expired - Lifetime EP0041776B2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63573/80 1980-05-14
JP6357380A JPS56160050A (en) 1980-05-14 1980-05-14 Semiconductor device and manufacture thereof

Publications (4)

Publication Number Publication Date
EP0041776A2 EP0041776A2 (de) 1981-12-16
EP0041776A3 EP0041776A3 (en) 1983-12-21
EP0041776B1 true EP0041776B1 (de) 1986-04-16
EP0041776B2 EP0041776B2 (de) 1990-03-14

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US (1) US4404735A (de)
EP (1) EP0041776B2 (de)
JP (1) JPS56160050A (de)
DE (1) DE3174383D1 (de)
IE (1) IE51992B1 (de)

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DE3174383D1 (en) 1986-05-22
JPS56160050A (en) 1981-12-09
EP0041776B2 (de) 1990-03-14
JPH0210575B2 (de) 1990-03-08
US4404735A (en) 1983-09-20
IE811040L (en) 1981-11-14
EP0041776A2 (de) 1981-12-16
IE51992B1 (en) 1987-05-13
EP0041776A3 (en) 1983-12-21

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