EG24529A - Microsphere-filled sealant materials - Google Patents

Microsphere-filled sealant materials

Info

Publication number
EG24529A
EG24529A EGNA2006000235D EG24529A EG 24529 A EG24529 A EG 24529A EG NA2006000235 D EGNA2006000235 D EG NA2006000235D EG 24529 A EG24529 A EG 24529A
Authority
EG
Egypt
Prior art keywords
microsphere
sealant materials
filled sealant
filled
materials
Prior art date
Application number
Other languages
English (en)
Inventor
Carole Jego Stora
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34808251&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EG24529(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of EG24529A publication Critical patent/EG24529A/xx

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/003—Filling materials, e.g. solid or fluid insulation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/013—Sealing means for cable inlets
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/08—Cable junctions
    • H02G15/10—Cable junctions protected by boxes, e.g. by distribution, connection or junction boxes
    • H02G15/113—Boxes split longitudinally in main cable direction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
EGNA2006000235 2004-02-02 2006-08-02 Microsphere-filled sealant materials EG24529A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/770,095 US7214735B2 (en) 2004-02-02 2004-02-02 Microsphere-filled sealant materials
PCT/US2005/000106 WO2005076426A1 (en) 2004-02-02 2005-01-04 Microsphere-filled sealant materials

Publications (1)

Publication Number Publication Date
EG24529A true EG24529A (en) 2009-08-30

Family

ID=34808251

Family Applications (1)

Application Number Title Priority Date Filing Date
EGNA2006000235 EG24529A (en) 2004-02-02 2006-08-02 Microsphere-filled sealant materials

Country Status (9)

Country Link
US (1) US7214735B2 (ru)
EP (1) EP1714365A1 (ru)
CN (1) CN1926737B (ru)
BR (2) BRPI0507337B1 (ru)
CA (1) CA2554957A1 (ru)
EG (1) EG24529A (ru)
RU (1) RU2365012C2 (ru)
TW (1) TWI372157B (ru)
WO (1) WO2005076426A1 (ru)

Families Citing this family (24)

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DE202006006019U1 (de) * 2006-04-11 2006-06-14 CCS Technology, Inc., Wilmington Dichtungskörper einer Kabelmuffe
DE202006006020U1 (de) * 2006-04-11 2006-06-14 CCS Technology, Inc., Wilmington Dichtungskörper einer Kabelmuffe
CN101170247B (zh) * 2006-10-27 2010-05-19 3M新设资产公司 可再进入的接头围罩
US7477826B2 (en) * 2007-01-16 2009-01-13 Tyco Electronics Corporation Cable enclosure assemblies and methods for using the same
CL2008003653A1 (es) 2008-01-17 2010-03-05 Mitsubishi Tanabe Pharma Corp Uso de un inhibidor de sglt derivado de glucopiranosilo y un inhibidor de dppiv seleccionado para tratar la diabetes; y composicion farmaceutica.
JP5804684B2 (ja) * 2009-10-09 2015-11-04 株式会社ビスキャス 電気ケーブル終端接続部の組立方法
NL2004694C2 (en) * 2010-05-10 2011-11-14 Draka Comteq Bv An assembly comprising at least one duct and at least one distribution box, and a method of mounting a distribution box to a duct.
CN201829633U (zh) * 2010-08-18 2011-05-11 泰科电子(上海)有限公司 密封接线盒
JP5600521B2 (ja) 2010-08-25 2014-10-01 パナソニック株式会社 給電制御装置
EP2597744B1 (en) * 2011-11-24 2015-01-07 CCS Technology, Inc. Cable closure
EP2808966B1 (en) * 2013-05-28 2018-05-09 CCS Technology, Inc. Cable closure
WO2015106075A1 (en) 2014-01-10 2015-07-16 Tyco Electronics Raychem Bvba Thermoplastic gel compositions and their methods of making
JP6433723B2 (ja) * 2014-08-26 2018-12-05 オーム電機株式会社 中継コネクタ用防水カバー
EP3204462B1 (de) * 2014-10-08 2021-03-24 Vitesco Technologies GmbH Dichtmasse, gehäuse und elektronisches steuergerät
GB2538966B (en) * 2015-06-01 2019-10-23 Aubin Ltd Pipeline Pig
RU2611420C1 (ru) * 2015-07-30 2017-02-22 Сергей Иванович Титков Устройство для герметизации соединителя и способ герметизации разъёмной камеры
US10283954B2 (en) * 2017-07-28 2019-05-07 Nicholas T. Tavare Connection shield for power distribution networks
CA3099706A1 (en) 2018-05-09 2019-11-14 Afl Telecommunications Llc Butt closures and bases therefor
CN108711799B (zh) * 2018-06-06 2020-03-24 合肥博恒电气科技有限公司 一种适用于多尺寸接线管的接线盒
US20230092698A1 (en) * 2019-12-27 2023-03-23 3M Innovative Properties Company Two-part siliconecomposition and sealant and assembly made therefrom
US10996414B1 (en) 2020-03-23 2021-05-04 Afl Telecommunications Llc Butt closures and bases therefor
US12078846B2 (en) 2020-11-30 2024-09-03 Afl Telecommunications Llc Butt closures and bases therefor
RU2760565C1 (ru) * 2021-03-23 2021-11-29 Акционерное общество "Государственный Рязанский приборный завод" Способ герметизации низкочастотных разъемов электрических жгутов и кабелей
RU205309U1 (ru) * 2021-04-29 2021-07-08 Тайко Электроникс Райхем Гмбх Клеммная колодка

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JPS63191841A (ja) 1987-02-04 1988-08-09 Toray Silicone Co Ltd 目地用定形シ−ル材
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JPH08115338A (ja) * 1994-10-14 1996-05-07 Fuji Xerox Co Ltd マルチメディア文書編集装置
ATE157685T1 (de) 1995-03-22 1997-09-15 Sonderhoff Ernst Fa Verfahren zum herstellen eines geschäumten oder ungeschäumten weich-elastischen silikonelastomers, insbesondere für dichtungszwecke
US5763835A (en) * 1995-11-01 1998-06-09 Raychem Corporation Gel-filled closure
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US6081252A (en) * 1997-07-11 2000-06-27 National Semiconductor Corporation Dispersion-based technique for performing spacial dithering for a digital display system
FR2770048B1 (fr) 1997-10-16 1999-12-31 Rxs Morel Accessoires De Cable Dispositif de protection d'epissure ainsi que procede permettant la mise en place d'un tel dispositif
TR200003133T2 (tr) * 1998-04-28 2001-03-21 Tyco Electronics Raychem N.V. Kapak tertibatı
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US6169250B1 (en) * 1999-04-29 2001-01-02 3M Innovative Properties Company Low voltage re-enterable splice enclosure
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Also Published As

Publication number Publication date
WO2005076426A1 (en) 2005-08-18
BRPI0507337A (pt) 2007-07-03
TW200536880A (en) 2005-11-16
TWI372157B (en) 2012-09-11
CN1926737A (zh) 2007-03-07
RU2006128073A (ru) 2008-03-10
RU2365012C2 (ru) 2009-08-20
BRPI0507337B1 (pt) 2018-07-31
US7214735B2 (en) 2007-05-08
CN1926737B (zh) 2010-10-13
CA2554957A1 (en) 2005-08-18
BR122018003849B1 (pt) 2019-03-19
US20050167431A1 (en) 2005-08-04
EP1714365A1 (en) 2006-10-25

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