EA031911B1 - Дисплейное устройство и способ восстановления его испытательной линии - Google Patents
Дисплейное устройство и способ восстановления его испытательной линии Download PDFInfo
- Publication number
- EA031911B1 EA031911B1 EA201690996A EA201690996A EA031911B1 EA 031911 B1 EA031911 B1 EA 031911B1 EA 201690996 A EA201690996 A EA 201690996A EA 201690996 A EA201690996 A EA 201690996A EA 031911 B1 EA031911 B1 EA 031911B1
- Authority
- EA
- Eurasian Patent Office
- Prior art keywords
- segment
- line
- display device
- film transistor
- tft
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 114
- 238000012360 testing method Methods 0.000 title claims abstract description 90
- 230000008439 repair process Effects 0.000 title description 4
- 238000003466 welding Methods 0.000 claims abstract description 37
- 239000010409 thin film Substances 0.000 claims abstract description 31
- 238000003698 laser cutting Methods 0.000 claims description 41
- 239000011159 matrix material Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000007257 malfunction Effects 0.000 abstract description 6
- 238000011084 recovery Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- RGOVYLWUIBMPGK-UHFFFAOYSA-N nonivamide Chemical compound CCCCCCCCC(=O)NCC1=CC=C(O)C(OC)=C1 RGOVYLWUIBMPGK-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/08—Fault-tolerant or redundant circuits, or circuits in which repair of defects is prepared
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/10—Dealing with defective pixels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Liquid Crystal Display Device Control (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310693323.9A CN103680370A (zh) | 2013-12-17 | 2013-12-17 | 显示装置及其测试线路修复方法 |
| PCT/CN2013/090821 WO2015089878A1 (zh) | 2013-12-17 | 2013-12-30 | 显示装置及其测试线路修复方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EA201690996A1 EA201690996A1 (ru) | 2016-10-31 |
| EA031911B1 true EA031911B1 (ru) | 2019-03-29 |
Family
ID=50317762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EA201690996A EA031911B1 (ru) | 2013-12-17 | 2013-12-30 | Дисплейное устройство и способ восстановления его испытательной линии |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP2016538590A (ko) |
| KR (1) | KR101894523B1 (ko) |
| CN (1) | CN103680370A (ko) |
| EA (1) | EA031911B1 (ko) |
| GB (1) | GB2534317B (ko) |
| WO (1) | WO2015089878A1 (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107884693A (zh) * | 2017-11-06 | 2018-04-06 | 武汉华星光电半导体显示技术有限公司 | 电气特性测试方法 |
| US10565912B2 (en) | 2017-11-06 | 2020-02-18 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Electrical characteristics inspection method |
| CN109741699B (zh) * | 2019-01-22 | 2022-03-08 | Tcl华星光电技术有限公司 | 用于显示面板的检测设备 |
| CN111798779B (zh) * | 2019-07-26 | 2022-07-29 | 友达光电股份有限公司 | 用于可挠性显示面板的备用线路系统及其自动切换方法 |
| CN111203631A (zh) * | 2020-03-12 | 2020-05-29 | 苏州晶振智能科技有限公司 | 一种显示屏智能检测激光修复方法 |
| CN114360439B (zh) | 2020-09-30 | 2022-12-20 | 荣耀终端有限公司 | 一种显示装置、驱动芯片及电子设备 |
| CN112289836B (zh) * | 2020-10-26 | 2023-05-02 | 武汉天马微电子有限公司 | 显示面板及显示装置 |
| CN113516917B (zh) * | 2021-05-26 | 2023-05-12 | 京东方科技集团股份有限公司 | 一种显示面板、显示装置及断线修复方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5102361A (en) * | 1989-01-23 | 1992-04-07 | Sharp Kabushiki Kaisha | Method for the manufacture of active matrix display apparatuses |
| CN101059636A (zh) * | 2006-04-21 | 2007-10-24 | 株式会社日立显示器 | 液晶显示装置 |
| JP2007292878A (ja) * | 2006-04-21 | 2007-11-08 | Hitachi Displays Ltd | 液晶表示装置及びその製造方法 |
| CN101191964A (zh) * | 2006-11-27 | 2008-06-04 | 中华映管股份有限公司 | 像素结构及其修补方法 |
| CN101382709A (zh) * | 2007-09-04 | 2009-03-11 | 上海广电Nec液晶显示器有限公司 | 一种液晶显示器薄膜晶体管结构 |
| CN102692774A (zh) * | 2012-05-23 | 2012-09-26 | 深圳市华星光电技术有限公司 | 液晶显示面板 |
| CN103345093A (zh) * | 2013-06-28 | 2013-10-09 | 京东方科技集团股份有限公司 | 像素单元、阵列基板及其制造、修复方法和显示装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8723845B2 (en) * | 2010-02-08 | 2014-05-13 | Sharp Kabushiki Kaisha | Display device |
-
2013
- 2013-12-17 CN CN201310693323.9A patent/CN103680370A/zh active Pending
- 2013-12-30 EA EA201690996A patent/EA031911B1/ru not_active IP Right Cessation
- 2013-12-30 GB GB1604875.3A patent/GB2534317B/en not_active Expired - Fee Related
- 2013-12-30 WO PCT/CN2013/090821 patent/WO2015089878A1/zh active Application Filing
- 2013-12-30 KR KR1020167010222A patent/KR101894523B1/ko active IP Right Grant
- 2013-12-30 JP JP2016526832A patent/JP2016538590A/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5102361A (en) * | 1989-01-23 | 1992-04-07 | Sharp Kabushiki Kaisha | Method for the manufacture of active matrix display apparatuses |
| CN101059636A (zh) * | 2006-04-21 | 2007-10-24 | 株式会社日立显示器 | 液晶显示装置 |
| JP2007292878A (ja) * | 2006-04-21 | 2007-11-08 | Hitachi Displays Ltd | 液晶表示装置及びその製造方法 |
| CN101191964A (zh) * | 2006-11-27 | 2008-06-04 | 中华映管股份有限公司 | 像素结构及其修补方法 |
| CN101382709A (zh) * | 2007-09-04 | 2009-03-11 | 上海广电Nec液晶显示器有限公司 | 一种液晶显示器薄膜晶体管结构 |
| CN102692774A (zh) * | 2012-05-23 | 2012-09-26 | 深圳市华星光电技术有限公司 | 液晶显示面板 |
| CN103345093A (zh) * | 2013-06-28 | 2013-10-09 | 京东方科技集团股份有限公司 | 像素单元、阵列基板及其制造、修复方法和显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201604875D0 (en) | 2016-05-04 |
| EA201690996A1 (ru) | 2016-10-31 |
| KR20160060106A (ko) | 2016-05-27 |
| GB2534317B (en) | 2020-12-09 |
| CN103680370A (zh) | 2014-03-26 |
| JP2016538590A (ja) | 2016-12-08 |
| KR101894523B1 (ko) | 2018-09-04 |
| GB2534317A (en) | 2016-07-20 |
| WO2015089878A1 (zh) | 2015-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s) |
Designated state(s): AM AZ BY KZ KG TJ TM |