DK200301577A - Flowfordelingsenhed og köleenhed - Google Patents
Flowfordelingsenhed og köleenhed Download PDFInfo
- Publication number
- DK200301577A DK200301577A DK200301577A DKPA200301577A DK200301577A DK 200301577 A DK200301577 A DK 200301577A DK 200301577 A DK200301577 A DK 200301577A DK PA200301577 A DKPA200301577 A DK PA200301577A DK 200301577 A DK200301577 A DK 200301577A
- Authority
- DK
- Denmark
- Prior art keywords
- unit
- outlet
- flow
- inlet
- distributor
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 description 6
- 239000012530 fluid Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
- F28F9/0268—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK200301577A DK200301577A (da) | 2003-10-27 | 2003-10-27 | Flowfordelingsenhed og köleenhed |
EP07106498A EP1804014B1 (fr) | 2003-10-27 | 2004-10-26 | Unité de distribution d'écoulement et unité de refroidissement |
ES07106498T ES2395209T3 (es) | 2003-10-27 | 2004-10-26 | Unidad de distribución de flujo y unidad de refrigeración |
EP04762953A EP1682841B1 (fr) | 2003-10-27 | 2004-10-26 | Unite de distribution d'ecoulement et unite de refroidissement |
DK04762953T DK1682841T3 (da) | 2003-10-27 | 2004-10-26 | Flowfordelingsenhed og köleenhed |
DE602004010422T DE602004010422T2 (de) | 2003-10-27 | 2004-10-26 | Strömungsverteilungseinheit und kühleinheit |
US10/577,140 US8066057B2 (en) | 2003-10-27 | 2004-10-26 | Flow distributing unit and cooling unit |
DK07106498.4T DK1804014T3 (da) | 2003-10-27 | 2004-10-26 | Flowfordelingsenhed og køleenhed |
PCT/DK2004/000735 WO2005040709A1 (fr) | 2003-10-27 | 2004-10-26 | Unite de distribution d'ecoulement et unite de refroidissement |
CN2004800318362A CN1875238B (zh) | 2003-10-27 | 2004-10-26 | 流量分配装置和冷却单元 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK200301577A DK200301577A (da) | 2003-10-27 | 2003-10-27 | Flowfordelingsenhed og köleenhed |
Publications (1)
Publication Number | Publication Date |
---|---|
DK200301577A true DK200301577A (da) | 2005-04-28 |
Family
ID=34485964
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK200301577A DK200301577A (da) | 2003-10-27 | 2003-10-27 | Flowfordelingsenhed og köleenhed |
DK04762953T DK1682841T3 (da) | 2003-10-27 | 2004-10-26 | Flowfordelingsenhed og köleenhed |
DK07106498.4T DK1804014T3 (da) | 2003-10-27 | 2004-10-26 | Flowfordelingsenhed og køleenhed |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK04762953T DK1682841T3 (da) | 2003-10-27 | 2004-10-26 | Flowfordelingsenhed og köleenhed |
DK07106498.4T DK1804014T3 (da) | 2003-10-27 | 2004-10-26 | Flowfordelingsenhed og køleenhed |
Country Status (7)
Country | Link |
---|---|
US (1) | US8066057B2 (fr) |
EP (2) | EP1804014B1 (fr) |
CN (1) | CN1875238B (fr) |
DE (1) | DE602004010422T2 (fr) |
DK (3) | DK200301577A (fr) |
ES (1) | ES2395209T3 (fr) |
WO (1) | WO2005040709A1 (fr) |
Families Citing this family (65)
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JP4581964B2 (ja) * | 2005-02-14 | 2010-11-17 | セイコーエプソン株式会社 | マイクロチャンネル構造体の製造方法 |
EP1742264A3 (fr) * | 2005-07-05 | 2008-05-28 | Danfoss Silicon Power GmbH | Module monolithique de puissance refroidi par fluide et méthode de fabrication |
DE102005058782A1 (de) * | 2005-12-09 | 2007-08-30 | Danfoss Silicon Power Gmbh | Kühleinrichtung für Halbleiterbauelemente |
US20070139888A1 (en) * | 2005-12-19 | 2007-06-21 | Qnx Cooling Systems, Inc. | Heat transfer system |
US7901131B2 (en) * | 2006-12-22 | 2011-03-08 | Hewlett-Packard Development Company, L.P. | Apparatus state determination method and system |
US8746330B2 (en) * | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US9453691B2 (en) * | 2007-08-09 | 2016-09-27 | Coolit Systems, Inc. | Fluid heat exchange systems |
US20090154091A1 (en) | 2007-12-17 | 2009-06-18 | Yatskov Alexander I | Cooling systems and heat exchangers for cooling computer components |
US8170724B2 (en) | 2008-02-11 | 2012-05-01 | Cray Inc. | Systems and associated methods for controllably cooling computer components |
KR101446828B1 (ko) * | 2008-06-18 | 2014-10-30 | 브루사 일렉트로닉 아게 | 전자소자용의 냉각장치 |
EP2172731A3 (fr) * | 2008-10-03 | 2013-08-21 | Danfoss Drives A/S | Distributeur et unité de refroidissement avec distributeur |
DE102008051268A1 (de) * | 2008-10-10 | 2010-04-15 | Mahle International Gmbh | Kühleinrichtung |
US20100175857A1 (en) * | 2009-01-15 | 2010-07-15 | General Electric Company | Millichannel heat sink, and stack and apparatus using the same |
US20100296249A1 (en) * | 2009-05-19 | 2010-11-25 | Beijing AVC Technology Research Center Co., Ltd. | Micro passage cold plate device for a liquid cooling radiator |
DE102009051864B4 (de) * | 2009-11-04 | 2023-07-13 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Kühlvorrichtung für eine elektrische Einrichtung |
DE102010007086B4 (de) * | 2010-02-06 | 2013-04-11 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung |
US8218320B2 (en) * | 2010-06-29 | 2012-07-10 | General Electric Company | Heat sinks with C-shaped manifolds and millichannel cooling |
KR101156903B1 (ko) * | 2010-10-28 | 2012-06-21 | 삼성전기주식회사 | 전력변환모듈의 방열장치 |
TW201228570A (en) * | 2010-12-17 | 2012-07-01 | Hon Hai Prec Ind Co Ltd | Liquid heat dissipation device |
CN102039441B (zh) * | 2010-12-28 | 2012-05-23 | 宁波君灵模具技术有限公司 | 一种机械加工辅助冷却装置 |
US8897013B2 (en) * | 2011-02-17 | 2014-11-25 | Lear Corporation | Sealed battery charger housing |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US9158348B2 (en) | 2012-06-29 | 2015-10-13 | Asetek Danmark A/S | Server memory cooling apparatus |
US8937810B2 (en) | 2012-09-14 | 2015-01-20 | International Business Machines Corporation | Electronic assembly with detachable coolant manifold and coolant-cooled electronic module |
EP2719985B1 (fr) * | 2012-10-09 | 2015-08-26 | Danfoss Silicon Power GmbH | Module de distribution de flux avec plaque de couverture à motifs |
KR20150002626U (ko) * | 2012-10-26 | 2015-07-06 | 자크리토에 아크트시오너노에 오브스체스트보 “알에스씨 테크놀로지스” | 컴퓨터 프로세싱 유닛용 냉각 장치 |
US9066460B2 (en) | 2013-01-17 | 2015-06-23 | International Business Machines Corporation | Disassemblable electronic assembly with leak-inhibiting coolant capillaries |
US9042100B2 (en) * | 2013-03-14 | 2015-05-26 | Aavid Thermalloy, Llc | System and method for cooling heat generating components |
US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US9282650B2 (en) * | 2013-12-18 | 2016-03-08 | Intel Corporation | Thermal compression bonding process cooling manifold |
KR20150111422A (ko) * | 2014-03-21 | 2015-10-06 | 엘에스산전 주식회사 | 자동차용 전장 부품 케이스 |
US20160025426A1 (en) * | 2014-07-22 | 2016-01-28 | Hamilton Sundstrand Space Systems International, Inc. | Heat transfer plate |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US9721870B2 (en) | 2014-12-05 | 2017-08-01 | International Business Machines Corporation | Cooling structure for electronic boards |
DE202014106063U1 (de) * | 2014-12-16 | 2015-02-12 | Danfoss Silicon Power Gmbh | Kühlwanne, Kühler und Leistungsmodulbaugruppe |
US9674990B2 (en) * | 2015-01-23 | 2017-06-06 | Rockwell Automation Technoloies, Inc. | Devices and methods for cooling bus capacitors |
US9920829B2 (en) * | 2015-03-10 | 2018-03-20 | Zf Friedrichshafen Ag | Cooler for a marine transmission gearbox |
US9622377B2 (en) | 2015-03-13 | 2017-04-11 | Lear Corporation | Cold plate having separable flow directing baffle |
US9559038B2 (en) * | 2015-04-30 | 2017-01-31 | Deere & Company | Package for a semiconductor device |
US9564385B2 (en) * | 2015-04-30 | 2017-02-07 | Deere & Company | Package for a semiconductor device |
US20160377658A1 (en) * | 2015-06-24 | 2016-12-29 | Intel Corporation | Fluid flow in a temperature control actuator for semiconductor device test |
KR101835954B1 (ko) * | 2016-02-24 | 2018-04-19 | 엘에스산전 주식회사 | 전동기 구동 장치 |
US10021811B2 (en) | 2016-05-24 | 2018-07-10 | Asetek Danmark A/S | Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
USD800675S1 (en) | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Set of cooling plate rows for in-line memory |
USD800674S1 (en) | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Cooling plate row for in-line memory |
DE102017101126B4 (de) | 2017-01-20 | 2021-08-19 | Danfoss Silicon Power Gmbh | Leistungselektroniksystem und Verfahren zu dessen Herstellung |
DE102017109890A1 (de) * | 2017-05-09 | 2018-11-15 | Danfoss Silicon Power Gmbh | Strömungsverteiler und Fluidverteilungssystem |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
US10533809B1 (en) | 2018-07-06 | 2020-01-14 | Keysight Technologies, Inc. | Cooling apparatus and methods of use |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
CN110377130B (zh) * | 2019-07-04 | 2024-04-26 | 东莞市冰点智能科技有限公司 | 一种新型水冷散热器 |
TWI708038B (zh) * | 2019-08-27 | 2020-10-21 | 邁萪科技股份有限公司 | 利用相變化傳熱的散熱裝置 |
US11125507B2 (en) | 2019-11-21 | 2021-09-21 | Taiwan Microloops Corp. | Heat dissipating apparatus using phase change heat transfer |
EP3893274A1 (fr) * | 2020-04-07 | 2021-10-13 | ABB Schweiz AG | Élément de refroidissement et procédé de fabrication d'un élément de refroidissement |
WO2021229365A1 (fr) | 2020-05-11 | 2021-11-18 | Coolit Systems, Inc. | Unités de pompage de liquide, et systèmes et procédés associés |
US20220099389A1 (en) * | 2020-09-25 | 2022-03-31 | Abb Power Electronics Inc. | Systems and methods for thermal management using matrix coldplates |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
GB2608996A (en) * | 2021-07-15 | 2023-01-25 | Yasa Ltd | Cooling apparatus |
CN113887148A (zh) * | 2021-09-02 | 2022-01-04 | 华南理工大学 | 一种并行流道冷却系统结构优化方法 |
CN115076178A (zh) * | 2022-06-14 | 2022-09-20 | 青岛盘古智能制造股份有限公司 | 一种带有自清理装置的液压分配器及湍流产生装置 |
TWI844943B (zh) * | 2022-09-06 | 2024-06-11 | 英業達股份有限公司 | 可運用於不同水冷模組的水冷模組上蓋 |
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US7017655B2 (en) * | 2003-12-18 | 2006-03-28 | Modine Manufacturing Co. | Forced fluid heat sink |
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US7173823B1 (en) * | 2004-12-18 | 2007-02-06 | Rinehart Motion Systems, Llc | Fluid cooled electrical assembly |
-
2003
- 2003-10-27 DK DK200301577A patent/DK200301577A/da not_active Application Discontinuation
-
2004
- 2004-10-26 EP EP07106498A patent/EP1804014B1/fr not_active Expired - Lifetime
- 2004-10-26 EP EP04762953A patent/EP1682841B1/fr not_active Expired - Lifetime
- 2004-10-26 ES ES07106498T patent/ES2395209T3/es not_active Expired - Lifetime
- 2004-10-26 DE DE602004010422T patent/DE602004010422T2/de not_active Expired - Lifetime
- 2004-10-26 CN CN2004800318362A patent/CN1875238B/zh not_active Expired - Lifetime
- 2004-10-26 US US10/577,140 patent/US8066057B2/en active Active
- 2004-10-26 WO PCT/DK2004/000735 patent/WO2005040709A1/fr active IP Right Grant
- 2004-10-26 DK DK04762953T patent/DK1682841T3/da active
- 2004-10-26 DK DK07106498.4T patent/DK1804014T3/da active
Also Published As
Publication number | Publication date |
---|---|
EP1682841A1 (fr) | 2006-07-26 |
EP1804014A3 (fr) | 2008-03-05 |
DK1804014T3 (da) | 2012-12-10 |
ES2395209T3 (es) | 2013-02-11 |
DE602004010422D1 (de) | 2008-01-10 |
WO2005040709A1 (fr) | 2005-05-06 |
CN1875238A (zh) | 2006-12-06 |
EP1804014B1 (fr) | 2012-08-29 |
DE602004010422T2 (de) | 2008-10-16 |
EP1804014A2 (fr) | 2007-07-04 |
CN1875238B (zh) | 2010-06-16 |
EP1682841B1 (fr) | 2007-11-28 |
US8066057B2 (en) | 2011-11-29 |
DK1682841T3 (da) | 2008-03-31 |
US20070062673A1 (en) | 2007-03-22 |
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AHS | Application shelved for other reasons than non-payment |