DK1804014T3 - Flowfordelingsenhed og køleenhed - Google Patents

Flowfordelingsenhed og køleenhed

Info

Publication number
DK1804014T3
DK1804014T3 DK07106498.4T DK07106498T DK1804014T3 DK 1804014 T3 DK1804014 T3 DK 1804014T3 DK 07106498 T DK07106498 T DK 07106498T DK 1804014 T3 DK1804014 T3 DK 1804014T3
Authority
DK
Denmark
Prior art keywords
unit
flow distribution
cooling
cooling unit
distribution unit
Prior art date
Application number
DK07106498.4T
Other languages
English (en)
Inventor
Klaus Kristen Olesen
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Application granted granted Critical
Publication of DK1804014T3 publication Critical patent/DK1804014T3/da

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
    • F28F9/0268—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DK07106498.4T 2003-10-27 2004-10-26 Flowfordelingsenhed og køleenhed DK1804014T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK200301577A DK200301577A (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed
EP04762953A EP1682841B1 (en) 2003-10-27 2004-10-26 Flow distributing unit and cooling unit

Publications (1)

Publication Number Publication Date
DK1804014T3 true DK1804014T3 (da) 2012-12-10

Family

ID=34485964

Family Applications (3)

Application Number Title Priority Date Filing Date
DK200301577A DK200301577A (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed
DK04762953T DK1682841T3 (da) 2003-10-27 2004-10-26 Flowfordelingsenhed og köleenhed
DK07106498.4T DK1804014T3 (da) 2003-10-27 2004-10-26 Flowfordelingsenhed og køleenhed

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DK200301577A DK200301577A (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed
DK04762953T DK1682841T3 (da) 2003-10-27 2004-10-26 Flowfordelingsenhed og köleenhed

Country Status (7)

Country Link
US (1) US8066057B2 (da)
EP (2) EP1804014B1 (da)
CN (1) CN1875238B (da)
DE (1) DE602004010422T2 (da)
DK (3) DK200301577A (da)
ES (1) ES2395209T3 (da)
WO (1) WO2005040709A1 (da)

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Also Published As

Publication number Publication date
DK200301577A (da) 2005-04-28
EP1682841A1 (en) 2006-07-26
EP1804014A3 (en) 2008-03-05
ES2395209T3 (es) 2013-02-11
DE602004010422D1 (de) 2008-01-10
WO2005040709A1 (en) 2005-05-06
CN1875238A (zh) 2006-12-06
EP1804014B1 (en) 2012-08-29
DE602004010422T2 (de) 2008-10-16
EP1804014A2 (en) 2007-07-04
CN1875238B (zh) 2010-06-16
EP1682841B1 (en) 2007-11-28
US8066057B2 (en) 2011-11-29
DK1682841T3 (da) 2008-03-31
US20070062673A1 (en) 2007-03-22

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