DE602004010422D1 - Strömungsverteilungseinheit und kühleinheit - Google Patents

Strömungsverteilungseinheit und kühleinheit

Info

Publication number
DE602004010422D1
DE602004010422D1 DE602004010422T DE602004010422T DE602004010422D1 DE 602004010422 D1 DE602004010422 D1 DE 602004010422D1 DE 602004010422 T DE602004010422 T DE 602004010422T DE 602004010422 T DE602004010422 T DE 602004010422T DE 602004010422 D1 DE602004010422 D1 DE 602004010422D1
Authority
DE
Germany
Prior art keywords
unit
flow distribution
cooling
cooling unit
distribution unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004010422T
Other languages
English (en)
Other versions
DE602004010422T2 (de
Inventor
Klaus Kristen Olesen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Danfoss Silicon Power GmbH
Original Assignee
Danfoss Silicon Power GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power GmbH filed Critical Danfoss Silicon Power GmbH
Publication of DE602004010422D1 publication Critical patent/DE602004010422D1/de
Application granted granted Critical
Publication of DE602004010422T2 publication Critical patent/DE602004010422T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
    • F28F9/0268—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE602004010422T 2003-10-27 2004-10-26 Strömungsverteilungseinheit und kühleinheit Active DE602004010422T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DK200301577 2003-10-27
DK200301577A DK200301577A (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed
PCT/DK2004/000735 WO2005040709A1 (en) 2003-10-27 2004-10-26 Flow distributing unit and cooling unit

Publications (2)

Publication Number Publication Date
DE602004010422D1 true DE602004010422D1 (de) 2008-01-10
DE602004010422T2 DE602004010422T2 (de) 2008-10-16

Family

ID=34485964

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004010422T Active DE602004010422T2 (de) 2003-10-27 2004-10-26 Strömungsverteilungseinheit und kühleinheit

Country Status (7)

Country Link
US (1) US8066057B2 (de)
EP (2) EP1682841B1 (de)
CN (1) CN1875238B (de)
DE (1) DE602004010422T2 (de)
DK (3) DK200301577A (de)
ES (1) ES2395209T3 (de)
WO (1) WO2005040709A1 (de)

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DE102010007086A1 (de) * 2010-02-06 2011-08-11 SEMIKRON Elektronik GmbH & Co. KG, 90431 Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung

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DE102017101126B4 (de) 2017-01-20 2021-08-19 Danfoss Silicon Power Gmbh Leistungselektroniksystem und Verfahren zu dessen Herstellung
DE102017109890A1 (de) * 2017-05-09 2018-11-15 Danfoss Silicon Power Gmbh Strömungsverteiler und Fluidverteilungssystem
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010007086A1 (de) * 2010-02-06 2011-08-11 SEMIKRON Elektronik GmbH & Co. KG, 90431 Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung

Also Published As

Publication number Publication date
DE602004010422T2 (de) 2008-10-16
EP1682841B1 (de) 2007-11-28
US20070062673A1 (en) 2007-03-22
CN1875238B (zh) 2010-06-16
DK1682841T3 (da) 2008-03-31
EP1804014A3 (de) 2008-03-05
CN1875238A (zh) 2006-12-06
EP1804014B1 (de) 2012-08-29
DK1804014T3 (da) 2012-12-10
EP1804014A2 (de) 2007-07-04
US8066057B2 (en) 2011-11-29
ES2395209T3 (es) 2013-02-11
WO2005040709A1 (en) 2005-05-06
EP1682841A1 (de) 2006-07-26
DK200301577A (da) 2005-04-28

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Legal Events

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