DK1682841T3 - Flowfordelingsenhed og köleenhed - Google Patents
Flowfordelingsenhed og köleenhedInfo
- Publication number
- DK1682841T3 DK1682841T3 DK04762953T DK04762953T DK1682841T3 DK 1682841 T3 DK1682841 T3 DK 1682841T3 DK 04762953 T DK04762953 T DK 04762953T DK 04762953 T DK04762953 T DK 04762953T DK 1682841 T3 DK1682841 T3 DK 1682841T3
- Authority
- DK
- Denmark
- Prior art keywords
- unit
- flow distribution
- cooling
- cooling unit
- distribution unit
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
- F28F9/0268—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK200301577A DK200301577A (da) | 2003-10-27 | 2003-10-27 | Flowfordelingsenhed og köleenhed |
PCT/DK2004/000735 WO2005040709A1 (en) | 2003-10-27 | 2004-10-26 | Flow distributing unit and cooling unit |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1682841T3 true DK1682841T3 (da) | 2008-03-31 |
Family
ID=34485964
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK200301577A DK200301577A (da) | 2003-10-27 | 2003-10-27 | Flowfordelingsenhed og köleenhed |
DK04762953T DK1682841T3 (da) | 2003-10-27 | 2004-10-26 | Flowfordelingsenhed og köleenhed |
DK07106498.4T DK1804014T3 (da) | 2003-10-27 | 2004-10-26 | Flowfordelingsenhed og køleenhed |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK200301577A DK200301577A (da) | 2003-10-27 | 2003-10-27 | Flowfordelingsenhed og köleenhed |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK07106498.4T DK1804014T3 (da) | 2003-10-27 | 2004-10-26 | Flowfordelingsenhed og køleenhed |
Country Status (7)
Country | Link |
---|---|
US (1) | US8066057B2 (da) |
EP (2) | EP1804014B1 (da) |
CN (1) | CN1875238B (da) |
DE (1) | DE602004010422T2 (da) |
DK (3) | DK200301577A (da) |
ES (1) | ES2395209T3 (da) |
WO (1) | WO2005040709A1 (da) |
Families Citing this family (63)
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EP2172731A3 (en) * | 2008-10-03 | 2013-08-21 | Danfoss Drives A/S | A flow distributor assembly and a cooling unit with a flow distributor assembly |
DE102008051268A1 (de) * | 2008-10-10 | 2010-04-15 | Mahle International Gmbh | Kühleinrichtung |
US20100175857A1 (en) * | 2009-01-15 | 2010-07-15 | General Electric Company | Millichannel heat sink, and stack and apparatus using the same |
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DE102009051864B4 (de) * | 2009-11-04 | 2023-07-13 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Kühlvorrichtung für eine elektrische Einrichtung |
DE102010007086B4 (de) * | 2010-02-06 | 2013-04-11 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung |
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KR101156903B1 (ko) * | 2010-10-28 | 2012-06-21 | 삼성전기주식회사 | 전력변환모듈의 방열장치 |
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CN102039441B (zh) * | 2010-12-28 | 2012-05-23 | 宁波君灵模具技术有限公司 | 一种机械加工辅助冷却装置 |
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US9158348B2 (en) | 2012-06-29 | 2015-10-13 | Asetek Danmark A/S | Server memory cooling apparatus |
US8937810B2 (en) | 2012-09-14 | 2015-01-20 | International Business Machines Corporation | Electronic assembly with detachable coolant manifold and coolant-cooled electronic module |
EP2719985B1 (en) * | 2012-10-09 | 2015-08-26 | Danfoss Silicon Power GmbH | A flow distribution module with a patterned cover plate |
US9335800B2 (en) * | 2012-10-26 | 2016-05-10 | ZAO “RSC Technologies” | Cooler for computing modules of a computer |
US9066460B2 (en) | 2013-01-17 | 2015-06-23 | International Business Machines Corporation | Disassemblable electronic assembly with leak-inhibiting coolant capillaries |
US9042100B2 (en) * | 2013-03-14 | 2015-05-26 | Aavid Thermalloy, Llc | System and method for cooling heat generating components |
TWI531795B (zh) | 2013-03-15 | 2016-05-01 | 水冷系統公司 | 感測器、多工通信技術及相關系統 |
US9282650B2 (en) * | 2013-12-18 | 2016-03-08 | Intel Corporation | Thermal compression bonding process cooling manifold |
KR20150111422A (ko) * | 2014-03-21 | 2015-10-06 | 엘에스산전 주식회사 | 자동차용 전장 부품 케이스 |
US20160025426A1 (en) * | 2014-07-22 | 2016-01-28 | Hamilton Sundstrand Space Systems International, Inc. | Heat transfer plate |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US9721870B2 (en) * | 2014-12-05 | 2017-08-01 | International Business Machines Corporation | Cooling structure for electronic boards |
DE202014106063U1 (de) * | 2014-12-16 | 2015-02-12 | Danfoss Silicon Power Gmbh | Kühlwanne, Kühler und Leistungsmodulbaugruppe |
US9674990B2 (en) * | 2015-01-23 | 2017-06-06 | Rockwell Automation Technoloies, Inc. | Devices and methods for cooling bus capacitors |
US9920829B2 (en) * | 2015-03-10 | 2018-03-20 | Zf Friedrichshafen Ag | Cooler for a marine transmission gearbox |
US9622377B2 (en) | 2015-03-13 | 2017-04-11 | Lear Corporation | Cold plate having separable flow directing baffle |
US9564385B2 (en) * | 2015-04-30 | 2017-02-07 | Deere & Company | Package for a semiconductor device |
US9559038B2 (en) * | 2015-04-30 | 2017-01-31 | Deere & Company | Package for a semiconductor device |
US20160377658A1 (en) * | 2015-06-24 | 2016-12-29 | Intel Corporation | Fluid flow in a temperature control actuator for semiconductor device test |
KR101835954B1 (ko) * | 2016-02-24 | 2018-04-19 | 엘에스산전 주식회사 | 전동기 구동 장치 |
USD800674S1 (en) | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Cooling plate row for in-line memory |
US10021811B2 (en) | 2016-05-24 | 2018-07-10 | Asetek Danmark A/S | Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
USD800675S1 (en) | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Set of cooling plate rows for in-line memory |
DE102017101126B4 (de) | 2017-01-20 | 2021-08-19 | Danfoss Silicon Power Gmbh | Leistungselektroniksystem und Verfahren zu dessen Herstellung |
DE102017109890A1 (de) * | 2017-05-09 | 2018-11-15 | Danfoss Silicon Power Gmbh | Strömungsverteiler und Fluidverteilungssystem |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
US10533809B1 (en) | 2018-07-06 | 2020-01-14 | Keysight Technologies, Inc. | Cooling apparatus and methods of use |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
CN110377130B (zh) * | 2019-07-04 | 2024-04-26 | 东莞市冰点智能科技有限公司 | 一种新型水冷散热器 |
TWI708038B (zh) * | 2019-08-27 | 2020-10-21 | 邁萪科技股份有限公司 | 利用相變化傳熱的散熱裝置 |
US11125507B2 (en) | 2019-11-21 | 2021-09-21 | Taiwan Microloops Corp. | Heat dissipating apparatus using phase change heat transfer |
EP3893274A1 (en) * | 2020-04-07 | 2021-10-13 | ABB Schweiz AG | Cooling element and method of manufacturing a cooling element |
WO2021229365A1 (en) | 2020-05-11 | 2021-11-18 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US20220099389A1 (en) * | 2020-09-25 | 2022-03-31 | Abb Power Electronics Inc. | Systems and methods for thermal management using matrix coldplates |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
GB2608996A (en) * | 2021-07-15 | 2023-01-25 | Yasa Ltd | Cooling apparatus |
CN115076178A (zh) * | 2022-06-14 | 2022-09-20 | 青岛盘古智能制造股份有限公司 | 一种带有自清理装置的液压分配器及湍流产生装置 |
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US7044199B2 (en) * | 2003-10-20 | 2006-05-16 | Thermal Corp. | Porous media cold plate |
US7017655B2 (en) * | 2003-12-18 | 2006-03-28 | Modine Manufacturing Co. | Forced fluid heat sink |
US7243706B2 (en) * | 2004-05-28 | 2007-07-17 | Ixys Corporation | Heatsink for power devices |
US7173823B1 (en) * | 2004-12-18 | 2007-02-06 | Rinehart Motion Systems, Llc | Fluid cooled electrical assembly |
-
2003
- 2003-10-27 DK DK200301577A patent/DK200301577A/da not_active Application Discontinuation
-
2004
- 2004-10-26 US US10/577,140 patent/US8066057B2/en active Active
- 2004-10-26 WO PCT/DK2004/000735 patent/WO2005040709A1/en active IP Right Grant
- 2004-10-26 DK DK04762953T patent/DK1682841T3/da active
- 2004-10-26 EP EP07106498A patent/EP1804014B1/en active Active
- 2004-10-26 CN CN2004800318362A patent/CN1875238B/zh active Active
- 2004-10-26 EP EP04762953A patent/EP1682841B1/en not_active Not-in-force
- 2004-10-26 DE DE602004010422T patent/DE602004010422T2/de active Active
- 2004-10-26 DK DK07106498.4T patent/DK1804014T3/da active
- 2004-10-26 ES ES07106498T patent/ES2395209T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
DE602004010422D1 (de) | 2008-01-10 |
WO2005040709A1 (en) | 2005-05-06 |
CN1875238A (zh) | 2006-12-06 |
EP1804014A2 (en) | 2007-07-04 |
US8066057B2 (en) | 2011-11-29 |
US20070062673A1 (en) | 2007-03-22 |
EP1804014B1 (en) | 2012-08-29 |
ES2395209T3 (es) | 2013-02-11 |
DK1804014T3 (da) | 2012-12-10 |
CN1875238B (zh) | 2010-06-16 |
DE602004010422T2 (de) | 2008-10-16 |
DK200301577A (da) | 2005-04-28 |
EP1682841A1 (en) | 2006-07-26 |
EP1804014A3 (en) | 2008-03-05 |
EP1682841B1 (en) | 2007-11-28 |
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