DK1682841T3 - Flowfordelingsenhed og köleenhed - Google Patents

Flowfordelingsenhed og köleenhed

Info

Publication number
DK1682841T3
DK1682841T3 DK04762953T DK04762953T DK1682841T3 DK 1682841 T3 DK1682841 T3 DK 1682841T3 DK 04762953 T DK04762953 T DK 04762953T DK 04762953 T DK04762953 T DK 04762953T DK 1682841 T3 DK1682841 T3 DK 1682841T3
Authority
DK
Denmark
Prior art keywords
unit
flow distribution
cooling
cooling unit
distribution unit
Prior art date
Application number
DK04762953T
Other languages
English (en)
Inventor
Klaus Kristen Olesen
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Application granted granted Critical
Publication of DK1682841T3 publication Critical patent/DK1682841T3/da

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • F28F9/026Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
    • F28F9/0268Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DK04762953T 2003-10-27 2004-10-26 Flowfordelingsenhed og köleenhed DK1682841T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK200301577A DK200301577A (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed
PCT/DK2004/000735 WO2005040709A1 (en) 2003-10-27 2004-10-26 Flow distributing unit and cooling unit

Publications (1)

Publication Number Publication Date
DK1682841T3 true DK1682841T3 (da) 2008-03-31

Family

ID=34485964

Family Applications (3)

Application Number Title Priority Date Filing Date
DK200301577A DK200301577A (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed
DK04762953T DK1682841T3 (da) 2003-10-27 2004-10-26 Flowfordelingsenhed og köleenhed
DK07106498.4T DK1804014T3 (da) 2003-10-27 2004-10-26 Flowfordelingsenhed og køleenhed

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DK200301577A DK200301577A (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed

Family Applications After (1)

Application Number Title Priority Date Filing Date
DK07106498.4T DK1804014T3 (da) 2003-10-27 2004-10-26 Flowfordelingsenhed og køleenhed

Country Status (7)

Country Link
US (1) US8066057B2 (da)
EP (2) EP1804014B1 (da)
CN (1) CN1875238B (da)
DE (1) DE602004010422T2 (da)
DK (3) DK200301577A (da)
ES (1) ES2395209T3 (da)
WO (1) WO2005040709A1 (da)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4581964B2 (ja) * 2005-02-14 2010-11-17 セイコーエプソン株式会社 マイクロチャンネル構造体の製造方法
EP1742264A3 (en) * 2005-07-05 2008-05-28 Danfoss Silicon Power GmbH A monolithic fluid cooled power module and a method of forming the power module
DE102005058782A1 (de) * 2005-12-09 2007-08-30 Danfoss Silicon Power Gmbh Kühleinrichtung für Halbleiterbauelemente
US20070139888A1 (en) * 2005-12-19 2007-06-21 Qnx Cooling Systems, Inc. Heat transfer system
US7901131B2 (en) * 2006-12-22 2011-03-08 Hewlett-Packard Development Company, L.P. Apparatus state determination method and system
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8746330B2 (en) * 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9453691B2 (en) * 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
JP5412511B2 (ja) * 2008-06-18 2014-02-12 ブルサ エレクトロニック アーゲー 電子素子用の冷却装置
EP2172731A3 (en) * 2008-10-03 2013-08-21 Danfoss Drives A/S A flow distributor assembly and a cooling unit with a flow distributor assembly
DE102008051268A1 (de) * 2008-10-10 2010-04-15 Mahle International Gmbh Kühleinrichtung
US20100175857A1 (en) * 2009-01-15 2010-07-15 General Electric Company Millichannel heat sink, and stack and apparatus using the same
US20100296249A1 (en) * 2009-05-19 2010-11-25 Beijing AVC Technology Research Center Co., Ltd. Micro passage cold plate device for a liquid cooling radiator
DE102009051864B4 (de) * 2009-11-04 2023-07-13 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlvorrichtung für eine elektrische Einrichtung
DE102010007086B4 (de) * 2010-02-06 2013-04-11 Semikron Elektronik Gmbh & Co. Kg Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung
US8218320B2 (en) * 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling
KR101156903B1 (ko) * 2010-10-28 2012-06-21 삼성전기주식회사 전력변환모듈의 방열장치
TW201228570A (en) * 2010-12-17 2012-07-01 Hon Hai Prec Ind Co Ltd Liquid heat dissipation device
CN102039441B (zh) * 2010-12-28 2012-05-23 宁波君灵模具技术有限公司 一种机械加工辅助冷却装置
US8897013B2 (en) * 2011-02-17 2014-11-25 Lear Corporation Sealed battery charger housing
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US9158348B2 (en) 2012-06-29 2015-10-13 Asetek Danmark A/S Server memory cooling apparatus
US8937810B2 (en) 2012-09-14 2015-01-20 International Business Machines Corporation Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
EP2719985B1 (en) * 2012-10-09 2015-08-26 Danfoss Silicon Power GmbH A flow distribution module with a patterned cover plate
US9335800B2 (en) * 2012-10-26 2016-05-10 ZAO “RSC Technologies” Cooler for computing modules of a computer
US9066460B2 (en) 2013-01-17 2015-06-23 International Business Machines Corporation Disassemblable electronic assembly with leak-inhibiting coolant capillaries
US9042100B2 (en) * 2013-03-14 2015-05-26 Aavid Thermalloy, Llc System and method for cooling heat generating components
TWI531795B (zh) 2013-03-15 2016-05-01 水冷系統公司 感測器、多工通信技術及相關系統
US9282650B2 (en) * 2013-12-18 2016-03-08 Intel Corporation Thermal compression bonding process cooling manifold
KR20150111422A (ko) * 2014-03-21 2015-10-06 엘에스산전 주식회사 자동차용 전장 부품 케이스
US20160025426A1 (en) * 2014-07-22 2016-01-28 Hamilton Sundstrand Space Systems International, Inc. Heat transfer plate
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
US9721870B2 (en) * 2014-12-05 2017-08-01 International Business Machines Corporation Cooling structure for electronic boards
DE202014106063U1 (de) * 2014-12-16 2015-02-12 Danfoss Silicon Power Gmbh Kühlwanne, Kühler und Leistungsmodulbaugruppe
US9674990B2 (en) * 2015-01-23 2017-06-06 Rockwell Automation Technoloies, Inc. Devices and methods for cooling bus capacitors
US9920829B2 (en) * 2015-03-10 2018-03-20 Zf Friedrichshafen Ag Cooler for a marine transmission gearbox
US9622377B2 (en) 2015-03-13 2017-04-11 Lear Corporation Cold plate having separable flow directing baffle
US9564385B2 (en) * 2015-04-30 2017-02-07 Deere & Company Package for a semiconductor device
US9559038B2 (en) * 2015-04-30 2017-01-31 Deere & Company Package for a semiconductor device
US20160377658A1 (en) * 2015-06-24 2016-12-29 Intel Corporation Fluid flow in a temperature control actuator for semiconductor device test
KR101835954B1 (ko) * 2016-02-24 2018-04-19 엘에스산전 주식회사 전동기 구동 장치
USD800674S1 (en) 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
USD800675S1 (en) 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
DE102017101126B4 (de) 2017-01-20 2021-08-19 Danfoss Silicon Power Gmbh Leistungselektroniksystem und Verfahren zu dessen Herstellung
DE102017109890A1 (de) * 2017-05-09 2018-11-15 Danfoss Silicon Power Gmbh Strömungsverteiler und Fluidverteilungssystem
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US10533809B1 (en) 2018-07-06 2020-01-14 Keysight Technologies, Inc. Cooling apparatus and methods of use
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
CN110377130B (zh) * 2019-07-04 2024-04-26 东莞市冰点智能科技有限公司 一种新型水冷散热器
TWI708038B (zh) * 2019-08-27 2020-10-21 邁萪科技股份有限公司 利用相變化傳熱的散熱裝置
US11125507B2 (en) 2019-11-21 2021-09-21 Taiwan Microloops Corp. Heat dissipating apparatus using phase change heat transfer
EP3893274A1 (en) * 2020-04-07 2021-10-13 ABB Schweiz AG Cooling element and method of manufacturing a cooling element
WO2021229365A1 (en) 2020-05-11 2021-11-18 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US20220099389A1 (en) * 2020-09-25 2022-03-31 Abb Power Electronics Inc. Systems and methods for thermal management using matrix coldplates
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
GB2608996A (en) * 2021-07-15 2023-01-25 Yasa Ltd Cooling apparatus
CN115076178A (zh) * 2022-06-14 2022-09-20 青岛盘古智能制造股份有限公司 一种带有自清理装置的液压分配器及湍流产生装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2021995A (en) * 1931-04-11 1935-11-26 Delos P Heath Heat exchanger
US3141500A (en) * 1962-02-14 1964-07-21 Dean Products Inc Heat exchanger coils of the panel type
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US4444851A (en) * 1982-06-28 1984-04-24 Energy Research Corporation Fuel cell stack
US5016090A (en) 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
JPH06104358A (ja) 1992-09-04 1994-04-15 Hitachi Ltd 液体により冷却される電子装置
JPH07211832A (ja) * 1994-01-03 1995-08-11 Motorola Inc 電力放散装置とその製造方法
TW278225B (da) 1994-10-31 1996-06-11 At & T Corp
DE19514548C1 (de) 1995-04-20 1996-10-02 Daimler Benz Ag Verfahren zur Herstellung einer Mikrokühleinrichtung
US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
CN1057424C (zh) * 1996-02-29 2000-10-11 中国科学院上海光学精密机械研究所 微通道冷却热沉
FR2748800A1 (fr) * 1996-05-15 1997-11-21 Ferraz Echangeur de chaleur pour composants electroniques et autres appareillages electro-techniques
MY115676A (en) 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
DE59706596D1 (de) 1996-08-30 2002-04-18 Volkswagen Ag Einrichtung zur Kühlung des einem Verbrennungsmotor zugeführten Kraftstoffes
US5835345A (en) 1996-10-02 1998-11-10 Sdl, Inc. Cooler for removing heat from a heated region
US5841634A (en) * 1997-03-12 1998-11-24 Delco Electronics Corporation Liquid-cooled baffle series/parallel heat sink
US5954127A (en) 1997-07-16 1999-09-21 International Business Machines Corporation Cold plate for dual refrigeration system
JP3394521B2 (ja) * 1997-09-19 2003-04-07 ミリポア・コーポレイション 熱交換装置
FR2774462B1 (fr) 1998-01-30 2000-04-14 Peugeot Echangeur refroidisseur de fluide
WO2002055942A2 (en) 2000-06-08 2002-07-18 Mikros Manufacturing, Inc. Normal-flow heat exchanger
US6935411B2 (en) 2000-06-08 2005-08-30 Mikros Manufacturing, Inc. Normal-flow heat exchanger
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US6367543B1 (en) * 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
CA2329408C (en) * 2000-12-21 2007-12-04 Long Manufacturing Ltd. Finned plate heat exchanger
JP2003060371A (ja) * 2001-08-16 2003-02-28 Nec Corp 通信機器筐体の放熱構造
DE20208106U1 (de) 2002-05-24 2002-10-10 Danfoss Silicon Power GmbH, 24837 Schleswig Kühlgerät für Halbleiter mit mehreren Kühlzellen
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
US7017655B2 (en) * 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US7243706B2 (en) * 2004-05-28 2007-07-17 Ixys Corporation Heatsink for power devices
US7173823B1 (en) * 2004-12-18 2007-02-06 Rinehart Motion Systems, Llc Fluid cooled electrical assembly

Also Published As

Publication number Publication date
DE602004010422D1 (de) 2008-01-10
WO2005040709A1 (en) 2005-05-06
CN1875238A (zh) 2006-12-06
EP1804014A2 (en) 2007-07-04
US8066057B2 (en) 2011-11-29
US20070062673A1 (en) 2007-03-22
EP1804014B1 (en) 2012-08-29
ES2395209T3 (es) 2013-02-11
DK1804014T3 (da) 2012-12-10
CN1875238B (zh) 2010-06-16
DE602004010422T2 (de) 2008-10-16
DK200301577A (da) 2005-04-28
EP1682841A1 (en) 2006-07-26
EP1804014A3 (en) 2008-03-05
EP1682841B1 (en) 2007-11-28

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