JP5412511B2 - 電子素子用の冷却装置 - Google Patents
電子素子用の冷却装置 Download PDFInfo
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- JP5412511B2 JP5412511B2 JP2011514177A JP2011514177A JP5412511B2 JP 5412511 B2 JP5412511 B2 JP 5412511B2 JP 2011514177 A JP2011514177 A JP 2011514177A JP 2011514177 A JP2011514177 A JP 2011514177A JP 5412511 B2 JP5412511 B2 JP 5412511B2
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- cooling
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- cooling device
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- refrigerant
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- 238000001816 cooling Methods 0.000 title claims description 98
- 239000003507 refrigerant Substances 0.000 claims description 47
- 238000012546 transfer Methods 0.000 claims description 38
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 230000008719 thickening Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 9
- 239000002826 coolant Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- XFBXDGLHUSUNMG-UHFFFAOYSA-N alumane;hydrate Chemical compound O.[AlH3] XFBXDGLHUSUNMG-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007528 sand casting Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
−冷却力の均一な分散
−目的指向型冷却構造、すなわち発熱量が高いところにより効果的な冷却をするようにする
−横方向熱流可能
−冷却用熱伝達壁を補強しなくても十分な孔を確保
−射出成形のような鋳造法により、「大きい」構造(例;5.2mm程度)が実現可能
−経済的なプラスチック部品が可能
−(流入量と偏向なしで)水だけで5hPa程度のサイフォン(siphon)式圧力降下が可能
−冷媒と半導体間の間隔を減らして冷媒と半導体との間の熱伝達効果を改善
−有効アルミニウム断面積の増加
−アルミニウム−水作用面のサイズ増加
−冷却チャネルの流れない水区域(dead water zone)の防止
−たるみに対する高い機械的強度
Claims (8)
- 冷媒が流れる少なくとも1つの冷却チャネル(6)がハウジング(3)内部に形成され、前記ハウジング(3)の冷却用熱伝達壁に冷却する電子素子(2)が接していながら、前記冷却チャネル(6)の熱伝達壁(7)に沿って冷媒がガイドされる冷却装置であって、
冷媒案内器(11)は複数の溝(12)と複数のインサート(13)とからなり、前記各溝(12)は前記冷却チャネル(6)を横切る方向に前記熱伝達壁(7)に分散され、入口が前記冷却チャネル(6)に向かっており、
前記各インサート(13)は、前記各溝(12)に1つずつ挿入され、冷媒が流れる各内部チャネル(14)を有し、
前記各溝(12)の内壁面と前記各インサート(13)の外壁面との間には前記各内部チャネル(14)と通じながら冷媒が流れる各外部チャネル(15)が形成され、
前記各内部チャネル(14)と通じる前記各インサート(13)の各入口(20)がそれぞれ傾斜した引き込み面(19)をなし、前記各傾斜した引き込み面(19)は、集まって前記冷却チャネル(6)の長さ方向に共通の連続的な1つの傾斜面をなし、
前記傾斜面は、前記冷却チャネル(6)を上流側と下流側とに分離し、
前記各内部チャネル(14)は、前記傾斜面の上流側の前記冷却チャネル(6)から冷媒が流入し、
前記各外部チャネル(15)は、前記傾斜面の下流側の前記冷却チャネル(6)に冷媒が流出すること、
を特徴とする冷却装置。 - 請求項1に記載の冷却装置であって、
隣接する前記インサート(13)の前記入口(20)を有する傾斜した前記引き込み面(19)が互いにずれるように千鳥状に配置され、冷媒流れ方向に行くほど前記冷却チャネル(6)の壁面が次第に厚くなることを特徴とする冷却装置。 - 請求項1または2に記載の冷却装置であって、
前記熱伝達壁(7)に形成された前記溝(12)が熱伝達壁面に垂直であり、一方が塞がったブラインドホール形態であることを特徴とする冷却装置。 - 請求項1から3のいずれか1項に記載の冷却装置であって、
前記インサート(13)は管状要素であることを特徴とする冷却装置。 - 請求項1から4のいずれか1項に記載の冷却装置であって、
前記溝(12)と前記インサート(13)との間の前記外部チャネル(15)が環状間隙形態を有することを特徴とする冷却装置。 - 請求項1から5のいずれか1項に記載の冷却装置であって、
前記複数のインサート(13)がプラスチック材料で一体に製作され、複数の前記インサート(13)の傾斜した前記引き込み面(19)が結合されて共通の傾斜板(21)を提供し、隣接する前記インサート(13)が前記溝(12)の外部にあるリブ(22)によって互いに連結されることを特徴とする冷却装置。 - 請求項1から6のいずれか1項に記載の冷却装置であって、
前記外部チャネル(15)の断面積が前記内部チャネル(14)の断面積と同じであるか小さいことを特徴とする冷却装置。 - 請求項1から7のいずれか1項に記載の冷却装置であって、
冷媒の流れ方向(10)から見た時の最初の前記インサート(13)の前記傾斜引き込み面(19)の前に冷媒の流れをより均一に分散させるためのステップとしてベベル面(25)が形成されることを特徴とする冷却装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CHCH0932/2008 | 2008-06-18 | ||
CH9322008 | 2008-06-18 | ||
US7406308P | 2008-06-19 | 2008-06-19 | |
US61/074,063 | 2008-06-19 | ||
PCT/IB2009/052559 WO2009153735A1 (en) | 2008-06-18 | 2009-06-16 | Cooling system, in particular for electronic structural units |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011525051A JP2011525051A (ja) | 2011-09-08 |
JP5412511B2 true JP5412511B2 (ja) | 2014-02-12 |
Family
ID=39764666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011514177A Active JP5412511B2 (ja) | 2008-06-18 | 2009-06-16 | 電子素子用の冷却装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7940527B2 (ja) |
EP (1) | EP2291859B1 (ja) |
JP (1) | JP5412511B2 (ja) |
KR (1) | KR101446828B1 (ja) |
CN (1) | CN102067304B (ja) |
WO (1) | WO2009153735A1 (ja) |
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TWI411389B (zh) * | 2010-05-18 | 2013-10-01 | Ckm Building Material Corp | 利用微孔板體散熱之方法 |
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CN103477432B (zh) * | 2011-05-16 | 2017-06-20 | 富士电机株式会社 | 半导体模块冷却器 |
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JP6529512B2 (ja) * | 2014-11-12 | 2019-06-12 | 東京エレクトロン株式会社 | ステージ及び基板処理装置 |
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DE102016214959B4 (de) * | 2016-08-11 | 2018-06-28 | Siemens Healthcare Gmbh | Temperiereinheit für ein elektronisches Bauelement und Verfahren zu dessen Herstellung |
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2009
- 2009-06-16 CN CN2009801224149A patent/CN102067304B/zh active Active
- 2009-06-16 EP EP09766272.0A patent/EP2291859B1/en active Active
- 2009-06-16 JP JP2011514177A patent/JP5412511B2/ja active Active
- 2009-06-16 KR KR1020107025538A patent/KR101446828B1/ko active IP Right Grant
- 2009-06-16 WO PCT/IB2009/052559 patent/WO2009153735A1/en active Application Filing
- 2009-12-18 US US12/642,756 patent/US7940527B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101446828B1 (ko) | 2014-10-30 |
EP2291859A1 (en) | 2011-03-09 |
EP2291859B1 (en) | 2016-03-30 |
JP2011525051A (ja) | 2011-09-08 |
CN102067304A (zh) | 2011-05-18 |
CN102067304B (zh) | 2013-01-09 |
WO2009153735A1 (en) | 2009-12-23 |
KR20110043524A (ko) | 2011-04-27 |
US20100091457A1 (en) | 2010-04-15 |
US7940527B2 (en) | 2011-05-10 |
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