JP2005527109A - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- JP2005527109A JP2005527109A JP2003575686A JP2003575686A JP2005527109A JP 2005527109 A JP2005527109 A JP 2005527109A JP 2003575686 A JP2003575686 A JP 2003575686A JP 2003575686 A JP2003575686 A JP 2003575686A JP 2005527109 A JP2005527109 A JP 2005527109A
- Authority
- JP
- Japan
- Prior art keywords
- cooling device
- component
- line
- return
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
Claims (10)
- 電気的な組込み構成部品(11)を収容するケーシング(10)及び空気調和装置から成っている冷却装置であって、空気調和装置が冷却媒体案内の供給管路(22)及び戻し管路(26)を介して電気的な組込み構成部品の熱源に接続されている形式のものにおいて、供給管路(22)から複数の構成部品用送り管路(23)を分岐させ、かつ戻し管路(26)から複数の構成部品用戻り管路(27)を分岐させてあり、電気的な各組込み構成部品(11)に対応してそれぞれ少なくとも1つの構成部品用送り管路(23)及びそれぞれ少なくとも1つの構成部品用戻り管路(27)を配置してあることを特徴とする冷却装置。
- 構成部品用送り管路(23)及び構成部品用戻り管路(27)が端部側に連結片を有しており、連結片が、連結継ぎ手(28)の適切に形成された対応連結片に接合可能である請求項1記載の冷却装置。
- 空気調和装置から送り管路(20)及び戻し管路(29)を分岐してあり、該送り管路(20)及び戻し管路(29)が供給管路(22)及び戻し管路(26)に接続してあり、該接続部が連結継ぎ手(21)によって形成されている請求項1又は2記載の冷却装置。
- 連結継ぎ手が、漏れ出しなく分離及び接続可能な継ぎ手として形成されている請求項2又は3記載の冷却装置。
- ケーシング(10)が配電盤キャビネットであり、配電盤キャビネットが背面の領域に、鉛直に延びる供給管路(22)及び戻し管路(26)のための受容室を形成している請求項1から4のいずれか1項記載の冷却装置。
- 供給管路(22)がケーシング(10)の天井領域で結合管路(25)を介して戻し管路(26)に移行しており、結合管路(25)内に脱気器(24)を組み込んである請求項5記載の冷却装置。
- 電気的な組込み構成部品(11)へ供給される冷却媒体量が、構成部品用送り管路(23)若しくは構成部品用戻り管路(27)内に組み込まれた制限器(30)を用いて制御されるようになっている請求項1から6のいずれか1項記載の冷却装置。
- 供給管路(22)及び/又は戻し管路(26)が剛性の成形片として形成されており、該成形片が冷却流体、例えば水のための案内通路を形成している請求項1から7のいずれか1項記載の冷却装置。
- 成形片が押し出し成形片として形成されている請求項8記載の冷却装置。
- ケーシング(10)が、鉛直なフレーム成形体を備えた支持フレームを有しており、少なくとも1つのフレーム成形体内に供給管路(22)及び/又は戻し管路(26)が組み込まれている請求項8又は9記載の冷却装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10210480A DE10210480B4 (de) | 2002-03-11 | 2002-03-11 | Kühlanordnung |
PCT/EP2003/000212 WO2003077625A1 (de) | 2002-03-11 | 2003-01-11 | Kühlanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005527109A true JP2005527109A (ja) | 2005-09-08 |
JP4058003B2 JP4058003B2 (ja) | 2008-03-05 |
Family
ID=27797642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003575686A Expired - Lifetime JP4058003B2 (ja) | 2002-03-11 | 2003-01-11 | 冷却装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7057893B2 (ja) |
EP (1) | EP1486106B1 (ja) |
JP (1) | JP4058003B2 (ja) |
CN (1) | CN1282406C (ja) |
AT (1) | ATE308871T1 (ja) |
DE (2) | DE10210480B4 (ja) |
WO (1) | WO2003077625A1 (ja) |
Families Citing this family (39)
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US20080066889A1 (en) * | 2003-02-19 | 2008-03-20 | Isothermal Systems Research | Heat exchanging fluid return manifold for a liquid cooling system |
DE102004008461A1 (de) | 2004-02-17 | 2005-10-06 | Rittal Gmbh & Co. Kg | Gehäuseanordnung |
DE102004013312B4 (de) * | 2004-03-17 | 2010-11-25 | Rittal Gmbh & Co. Kg | Vorrichtung zum Kühlen von in einem Baugruppenträger oder Aufnahmegehäuse übereinander angeordneten Steckeinschüben |
DE102004020642A1 (de) * | 2004-04-22 | 2005-11-10 | Höhne, Sven, Dipl.-Ing (FH) | Schwerkraftkühlung für elektronische Bauteile |
US20060256526A1 (en) * | 2004-10-13 | 2006-11-16 | Qnx Cooling Systems Inc. | Liquid cooling system |
FI122185B (fi) * | 2005-09-05 | 2011-09-30 | Vacon Oyj | Järjestely nestejäähdytteisten sähkölaitteiden jäähdytystä varten |
DE202006007275U1 (de) * | 2006-05-06 | 2006-09-07 | Schroff Gmbh | Baugruppenträger mit einem Gehäuse zur Aufnahme von Steckbaugruppen |
US20070291452A1 (en) * | 2006-06-14 | 2007-12-20 | Gilliland Don A | Heat Transfer Systems for Dissipating Thermal Loads From a Computer Rack |
EP1967938B1 (de) * | 2007-01-23 | 2009-07-29 | Schroff GmbH | Schaltschrank zur Aufnahme elektronischer Steckbaugruppen mit einem Wärmetauscher |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
KR101188550B1 (ko) * | 2007-10-29 | 2012-10-09 | 인터디지탈 패튼 홀딩스, 인크 | Lte에서의 시스템 정보 업데이트 |
US8164901B2 (en) * | 2008-04-16 | 2012-04-24 | Julius Neudorfer | High efficiency heat removal system for rack mounted computer equipment |
US7639499B1 (en) * | 2008-07-07 | 2009-12-29 | International Business Machines Corporation | Liquid cooling apparatus and method for facilitating cooling of an electronics system |
US7885070B2 (en) | 2008-10-23 | 2011-02-08 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
US7961475B2 (en) | 2008-10-23 | 2011-06-14 | International Business Machines Corporation | Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
US7983040B2 (en) * | 2008-10-23 | 2011-07-19 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
US7916483B2 (en) | 2008-10-23 | 2011-03-29 | International Business Machines Corporation | Open flow cold plate for liquid cooled electronic packages |
US7944694B2 (en) | 2008-10-23 | 2011-05-17 | International Business Machines Corporation | Liquid cooling apparatus and method for cooling blades of an electronic system chassis |
CN102575906B (zh) * | 2009-10-30 | 2013-09-25 | 惠普发展公司,有限责任合伙企业 | 用于刀片外壳的热汇流条 |
US8351206B2 (en) | 2010-06-29 | 2013-01-08 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit |
US8184436B2 (en) | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
US8345423B2 (en) | 2010-06-29 | 2013-01-01 | International Business Machines Corporation | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems |
US8369091B2 (en) | 2010-06-29 | 2013-02-05 | International Business Machines Corporation | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
US8179677B2 (en) | 2010-06-29 | 2012-05-15 | International Business Machines Corporation | Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
TWI445289B (zh) * | 2011-08-19 | 2014-07-11 | Inventec Corp | 伺服器機櫃之冷卻流管 |
WO2013119243A1 (en) | 2012-02-09 | 2013-08-15 | Hewlett-Packard Development Company, L.P. | Heat dissipating system |
CN104094682B (zh) * | 2012-03-12 | 2017-01-18 | 慧与发展有限责任合伙企业 | 一种用于电子器件机架的液体冷却系统及液体冷却方法 |
US9016352B2 (en) | 2012-05-21 | 2015-04-28 | Calvary Applied Technologies, LLC | Apparatus and methods for cooling rejected heat from server racks |
JP6003423B2 (ja) * | 2012-09-07 | 2016-10-05 | 富士通株式会社 | 冷却ユニット及び電子装置 |
EP2901828A4 (en) | 2012-09-28 | 2016-06-01 | Hewlett Packard Development Co | COOLING ASSEMBLY |
US8436246B1 (en) | 2012-10-19 | 2013-05-07 | Calvary Applied Technologies, LLC | Refrigerant line electrical ground isolation device for data center cooling applications |
US9803937B2 (en) | 2013-01-31 | 2017-10-31 | Hewlett Packard Enterprise Development Lp | Liquid cooling |
TWI531795B (zh) | 2013-03-15 | 2016-05-01 | 水冷系統公司 | 感測器、多工通信技術及相關系統 |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
WO2021229365A1 (en) | 2020-05-11 | 2021-11-18 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
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DE2102254B2 (de) * | 1971-01-19 | 1973-05-30 | Robert Bosch Gmbh, 7000 Stuttgart | Kuehlvorrichtung fuer leistungshalbleiterbauelemente |
US3774677A (en) * | 1971-02-26 | 1973-11-27 | Ibm | Cooling system providing spray type condensation |
DE2138376C3 (de) * | 1971-07-31 | 1978-05-24 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kühlsystem für in Schränken untergebrachte elektronische Geräte |
DE7500696U (de) | 1974-12-06 | 1976-11-04 | Bbc Ag Brown, Boveri & Cie, Baden (Schweiz) | Vorrichtung zur Kühlung von auf verschiedenen elektrischen Potentialen liegenden elektrischen Einrichtungen mittels eines strömenden Mediums |
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US6970355B2 (en) * | 2002-11-20 | 2005-11-29 | International Business Machines Corporation | Frame level partial cooling boost for drawer and/or node level processors |
-
2002
- 2002-03-11 DE DE10210480A patent/DE10210480B4/de not_active Expired - Fee Related
-
2003
- 2003-01-11 AT AT03704379T patent/ATE308871T1/de active
- 2003-01-11 EP EP03704379A patent/EP1486106B1/de not_active Expired - Lifetime
- 2003-01-11 US US10/500,733 patent/US7057893B2/en not_active Expired - Fee Related
- 2003-01-11 WO PCT/EP2003/000212 patent/WO2003077625A1/de active IP Right Grant
- 2003-01-11 DE DE50301552T patent/DE50301552D1/de not_active Expired - Lifetime
- 2003-01-11 CN CNB038013029A patent/CN1282406C/zh not_active Expired - Lifetime
- 2003-01-11 JP JP2003575686A patent/JP4058003B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE308871T1 (de) | 2005-11-15 |
WO2003077625A1 (de) | 2003-09-18 |
EP1486106B1 (de) | 2005-11-02 |
JP4058003B2 (ja) | 2008-03-05 |
US7057893B2 (en) | 2006-06-06 |
DE10210480A1 (de) | 2003-10-09 |
CN1572130A (zh) | 2005-01-26 |
DE10210480B4 (de) | 2005-07-21 |
CN1282406C (zh) | 2006-10-25 |
EP1486106A1 (de) | 2004-12-15 |
DE50301552D1 (de) | 2005-12-08 |
US20050117297A1 (en) | 2005-06-02 |
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