CN1282406C - 冷却设备 - Google Patents
冷却设备 Download PDFInfo
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- CN1282406C CN1282406C CNB038013029A CN03801302A CN1282406C CN 1282406 C CN1282406 C CN 1282406C CN B038013029 A CNB038013029 A CN B038013029A CN 03801302 A CN03801302 A CN 03801302A CN 1282406 C CN1282406 C CN 1282406C
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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Abstract
本发明公开了一种具有一容纳内置式电器件的壳体和一空调装置的冷却设备,所述空调装置通过一导引冷却介质的送进管路和一返回管路与所述内置式电器件的热源相连。为了能够以简单的方式对具有大量的内置式电器件的复杂系统进行空气调节,按照本发明,从所述送进管路分出多条通往器件的管路以及从所述返回管路分出从器件上回流的管路,并且为所述至少一个内置式电器件至少配设一条通往器件的管路和一条从器件上回流的管路。
Description
本发明涉及一种具有一容纳多个内置式电器件的壳体和一空调装置的冷却设备,所述空调装置通过一导引冷却介质的送进管路和一返回管路与所述内置式电器件的热源相连。
在这类冷却设备中有针对性地冷却例如Computon公司的CPU等内置式电器件。为此在相应的热源上安置一灌装流体的冷却体。该冷却体通过一送进管路和一返回管路连接到一空调装置上。
这些已知的系统大多属于个别解决方案,它们只能有限地获得商业应用。
本发明所要解决的技术问题是提供一种说明书前言所述类型的冷却设备,其中能够与所述内置式电器件各自对应地配设所述冷却体以及在极微小的冷却介质需求量的情况下也足以接通所述冷却介质回路并且能够进行空气调节。
上述技术问题是通过一种用于冷却上下相叠地安置在一壳体中的发热内置式电器件的冷却设备来解决的,与所述内置式电器件对应地配设各自的通过一送进管路和一返回管路衔接到一冷却介质回路中的冷却体,其中,所述冷却体通过各自的通往器件的管路和从器件上回流的管路与所述送进管路和返回管路连接,按照本发明,所述壳体在后面区域内具有一用于所述竖直延伸的送进管路和返回管路的安装空间,所述送进管路和所述返回管路在所述壳体的顶部区域内通过一连接管路与一排气通风装置相互连接,将限流器集成组合到所述通往器件的管路或从器件上回流的管路中,以用于调控向所述冷却体导送的冷却介质量。
所述冷却介质回路通过所述连接管路与排气通风装置始终充分地连通并且可以被通风。因此可以持续地通过冷却介质回路将由内置式电器件产生的热量散发掉。可以相宜地选择在所述各通往器件的管路中或从器件上回流的管路中的限流器以及根据需要对其进行调节,使得所述冷却设备能够适应于各种具有不同的发热内构件的壳体结构。
通过这种冷却设备可以从一壳体中有针对性地排出许多内置式电器件的大量热量。同时将排出的热量集中在返回管路中。其中,所述各内置式电器件可分别与一通往器件的管路和一从器件上回流的管路连接。当一内置式器件内的多个热源需要冷却时,也可以连接多条通往器件的管路和多条从器件上回流的管路。由此获得高度的灵活性。
所述送进管路和返回管路被引向一空调装置。该空调装置可以是一以蒸发器原理工作的设备。所述空调装置由于空间位置的原因优选设置在所述壳体之外。该空调装置与外部环境交换从所述壳体吸收的热量。在此所述系统的一个优点是,可以从一壳体中导出极高的热量。这允许以非常紧凑的方式实现壳体内腔的配置。
按照本发明的一扩展设计,所述通往器件的管路和从器件上回流的管路分别在其末端具有接合件,这些接合件可与相应构造的对接接合件接合而形成耦合连接。这样就为用户提供了一些转接点。用户可以借助于所述耦合连接实现所述冷却设备与各内置式电器件的连接。
所述冷却设备的一种可行的扩展结构是这样的,即,从所述空调装置分出一连接到所述送进管路上的出流管路和一连接到所述返回管路上的回流管路,以及所述连接通过耦合连接实现。这样一来,所述壳体就可作为一个系统来安装并且能简单、快速地连到所述空调装置上。
为了避免在所述安装工作中在所述耦合连接处送往所述内置式电器件的水流出,可以规定,所述耦合连接设计为可无滴漏的离合式连接。这类耦合连接也可以实现在一运行的冷却系统中事后进行改变。据此所述内置式电器件也可以在所述冷却装置工作运行期间顺利地连接或断开。
本发明的一个可行的扩展设计方案的特征是,所述壳体是一开关柜,该开关柜在其背侧区域内构成一用于所述竖直延伸的送进管路和返回管路的安装空间。
为了在这种结构中实现无问题的排气通风,可以规定,所述送进管路在所述壳体的顶部区域内通过一连接管路过渡到所述返回管路,以及在该连接管路中装入一排气通风装置。
如果导向所述内置式电器件的冷却介质量可借助于一装入所述通往器件的管路或从器件上回流的管路中的限流器来调节,就可以以简单的方式改变在各内置式电器件处可利用的冷却效率。
按照一优选的变型方案,所述送进管路和/或返回管路设计为刚性的型材条,该型材条构成一用于所述冷却流体、例如水的导流通道。所述型材条例如设计为挤压型材。
按照本发明的一优选设计方案,所述壳体具有一带有一些竖直框架型材的支撑框架,以及在至少一个框架型材中集成组合有所述送进管路和/或返回管路。
下面借助于一在附图中所示出的实施方式对本发明予以详细说明。
附图以简略示意图表示一冷却设备。其中在一壳体10中安置一竖直延伸的送进管路22和一返回管路26。在该壳体10内也安装了一些内置式电器件11。这些内置式器件具有待冷却的热源。为此对应于每个器件从所述送进管路22上都各分出一条通往该器件的管路23以及从所述返回管路26都各分出一条从该器件上回流的管路27。其中这些内置式电器件11彼此并联地连接在所述送进管路22和返回管路26上。所述内置式电器件11与所述冷却介质导引系统的连接借助于可无滴漏的离合式耦合连接28实现。
为了调节每个内置式电器件11的冷却效率在从各器件上回流的管路27中集成组装有一个限流器30。该限流器用于调节冷却介质流量。
所述送进管路22和返回管路26通过耦合连接21连接到一出流管路20及回流管路29上。该出流管路20及回流管路29通向一在图中未示出的空调装置。在该空调装置中冷却介质(优选水)中的热量通过热交换被排出。
为了能够实现对所述系统的排气通风,在一连接管路25的区域内装入一排气通风装置24。所述连接管路25设置在所述壳体顶部的区域内。
Claims (9)
1.一种用于冷却上下相叠地安置在一壳体(10)中的发热内置式电器件(11)的冷却设备,与所述内置式电器件(11)对应地配设各自的通过一送进管路(22)和一返回管路(26)衔接到一冷却介质回路中的冷却体,其中,所述冷却体通过各自的通往器件的管路(23)和从器件上回流的管路(27)与所述送进管路(22)和返回管路(26)连接,其特征在于,所述壳体(10)在后面区域内具有一用于所述竖直延伸的送进管路(22)和返回管路(26)的安装空间,所述送进管路(22)和所述返回管路(26)在所述壳体(10)的顶部区域内通过一连接管路(25)与一排气通风装置(24)相互连接,将限流器(30)集成组合到所述通往器件的管路(23)或从器件上回流的管路(27)中,以用于调控向所述冷却体导送的冷却介质量。
2.如权利要求1所述的冷却设备,其特征在于,所述通往器件的管路(23)和从器件上回流的管路(27)借助于由接合件和对接接合件组成的耦合连接与所述送进管路(22)和所述返回管路(26)形成可拆卸式的连接。
3.如权利要求2所述的冷却设备,其特征在于,所述耦合连接设计为可无滴漏的离合式连接。
4.如权利要求1或2所述的冷却设备,其特征在于,所述壳体(10)设计为一开关柜,其中在后壁与所述内置式电器件(11)之间的区域内构成所述用于竖直延伸的送进管路(22)和返回管路(26)的安装空间。
5.如权利要求1或2所述的冷却设备,其特征在于,所述送进管路(22)和/或返回管路(26)设计为刚性的型材段,该型材段构成一用于所述冷却流体的导流通道。
6.如权利要求5所述的冷却设备,其特征在于,所述冷却流体是水。
7.如权利要求5所述的冷却设备,其特征在于,所述型材段设计为挤压型材。
8.如权利要求5所述的冷却设备,其特征在于,所述壳体(10)具有一带有一些竖直的框架型材的支撑框架,以及在至少一个框架型材中集成组合有所述送进管路(22)和/或返回管路(26)。
9.如权利要求1或2所述的冷却设备,其特征在于,所述送进管路(22)和/或返回管路(26)在所述壳体(10)的底部区域内与一空调装置的出流管路(20)及回流管路(29)相连。
Applications Claiming Priority (2)
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DE10210480.8 | 2002-03-11 | ||
DE10210480A DE10210480B4 (de) | 2002-03-11 | 2002-03-11 | Kühlanordnung |
Publications (2)
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CN1572130A CN1572130A (zh) | 2005-01-26 |
CN1282406C true CN1282406C (zh) | 2006-10-25 |
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CNB038013029A Expired - Lifetime CN1282406C (zh) | 2002-03-11 | 2003-01-11 | 冷却设备 |
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US (1) | US7057893B2 (zh) |
EP (1) | EP1486106B1 (zh) |
JP (1) | JP4058003B2 (zh) |
CN (1) | CN1282406C (zh) |
AT (1) | ATE308871T1 (zh) |
DE (2) | DE10210480B4 (zh) |
WO (1) | WO2003077625A1 (zh) |
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2002
- 2002-03-11 DE DE10210480A patent/DE10210480B4/de not_active Expired - Fee Related
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2003
- 2003-01-11 EP EP03704379A patent/EP1486106B1/de not_active Expired - Lifetime
- 2003-01-11 AT AT03704379T patent/ATE308871T1/de active
- 2003-01-11 US US10/500,733 patent/US7057893B2/en not_active Expired - Fee Related
- 2003-01-11 CN CNB038013029A patent/CN1282406C/zh not_active Expired - Lifetime
- 2003-01-11 DE DE50301552T patent/DE50301552D1/de not_active Expired - Lifetime
- 2003-01-11 JP JP2003575686A patent/JP4058003B2/ja not_active Expired - Lifetime
- 2003-01-11 WO PCT/EP2003/000212 patent/WO2003077625A1/de active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103687437A (zh) * | 2012-09-07 | 2014-03-26 | 富士通株式会社 | 冷却单元和电子设备 |
Also Published As
Publication number | Publication date |
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US7057893B2 (en) | 2006-06-06 |
DE50301552D1 (de) | 2005-12-08 |
ATE308871T1 (de) | 2005-11-15 |
WO2003077625A1 (de) | 2003-09-18 |
CN1572130A (zh) | 2005-01-26 |
DE10210480B4 (de) | 2005-07-21 |
EP1486106B1 (de) | 2005-11-02 |
DE10210480A1 (de) | 2003-10-09 |
EP1486106A1 (de) | 2004-12-15 |
JP4058003B2 (ja) | 2008-03-05 |
US20050117297A1 (en) | 2005-06-02 |
JP2005527109A (ja) | 2005-09-08 |
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