DK1216419T3 - Måleprobe til höjfrekvensmåling - Google Patents

Måleprobe til höjfrekvensmåling

Info

Publication number
DK1216419T3
DK1216419T3 DK00978936T DK00978936T DK1216419T3 DK 1216419 T3 DK1216419 T3 DK 1216419T3 DK 00978936 T DK00978936 T DK 00978936T DK 00978936 T DK00978936 T DK 00978936T DK 1216419 T3 DK1216419 T3 DK 1216419T3
Authority
DK
Denmark
Prior art keywords
measuring probe
coaxial
conductor structure
contact end
coplanar conductor
Prior art date
Application number
DK00978936T
Other languages
Danish (da)
English (en)
Inventor
Michael Wollitzer
Original Assignee
Rosenberger Hochfrequenztech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztech filed Critical Rosenberger Hochfrequenztech
Application granted granted Critical
Publication of DK1216419T3 publication Critical patent/DK1216419T3/da

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DK00978936T 1999-09-21 2000-09-18 Måleprobe til höjfrekvensmåling DK1216419T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19945178A DE19945178C2 (de) 1999-09-21 1999-09-21 Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung
PCT/DE2000/003231 WO2001022097A1 (fr) 1999-09-21 2000-09-18 Pointe de mesure pour mesure de hautes frequences et procede de realisation

Publications (1)

Publication Number Publication Date
DK1216419T3 true DK1216419T3 (da) 2004-07-12

Family

ID=7922746

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00978936T DK1216419T3 (da) 1999-09-21 2000-09-18 Måleprobe til höjfrekvensmåling

Country Status (11)

Country Link
US (1) US7042236B1 (fr)
EP (1) EP1216419B1 (fr)
JP (1) JP2003510574A (fr)
CN (1) CN1162707C (fr)
AT (1) ATE261585T1 (fr)
CA (1) CA2385337C (fr)
DE (2) DE19945178C2 (fr)
DK (1) DK1216419T3 (fr)
ES (1) ES2214335T3 (fr)
PT (1) PT1216419E (fr)
WO (1) WO2001022097A1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1095282B1 (fr) * 1998-07-08 2007-09-19 Capres Aps Sonde a plusieurs points
JP4678993B2 (ja) * 2001-06-19 2011-04-27 日置電機株式会社 高周波プローブおよび高周波プローブの製造方法
DE10136726A1 (de) * 2001-07-27 2003-04-03 Connexion Rosenberger Gmbh Meßanordnung für Hochfrequenzmessungen mit mehreren Meßsonden und ein Verfahren zur Herstellung derselben
DE10201491C1 (de) * 2002-01-16 2003-08-28 Gfd Ges Fuer Diamantprodukte M Meßspitzensystem und Verfahren zu dessen Herstellung
DE10229038B4 (de) * 2002-06-28 2013-08-14 Robert Bosch Gmbh Verkapptes Mikrostrukturbauelement mit Hochfrequenzdurchführung
GB2425844B (en) * 2003-12-24 2007-07-11 Cascade Microtech Inc Active wafer probe
DE202004019636U1 (de) 2004-12-20 2005-03-03 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Meßspitze für HF-Messung
JP4679244B2 (ja) * 2005-05-26 2011-04-27 株式会社アドバンテスト 測定用コンタクト端子、測定装置、プローブカードセット、およびウエハプローバ装置
DE202006006359U1 (de) * 2006-04-20 2006-07-13 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Potentialfreie Gehäusedurchführung
DE102007006195A1 (de) * 2007-02-07 2008-08-14 Infineon Technologies Ag Kontaktelement, Kontakteinheit, Verfahren zur Herstellung einer Kontakteinheit und Verfahren zur Inbetriebnahme für Fine-Pitch Bauteile
US7982480B2 (en) * 2008-08-01 2011-07-19 Aes Technologies, Inc. Calibrated wideband high frequency passive impedance probe
DE202008010533U1 (de) * 2008-08-07 2008-10-30 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktlose Schleifensonde
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
DE202009003966U1 (de) * 2009-03-20 2009-06-04 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messspitzen
DE202012002391U1 (de) 2012-03-08 2013-06-10 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Vorrichtung zur Messung elektronischer Bauteile
DE102012107556A1 (de) * 2012-08-17 2014-02-20 HARTING Electronics GmbH Vorrichtung und Verfahren zur reversiblen, mechanischen Fixierung und elektrischen Kontaktierung elektrischer Leiter
DE202014002841U1 (de) 2014-04-01 2014-06-25 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktieranordnung, insbesondere HF-Messspitze
CN105092975B (zh) * 2015-09-23 2017-11-03 广州兴森快捷电路科技有限公司 Pcb板内单端阻抗测试头
US11041880B2 (en) * 2017-12-01 2021-06-22 Tektronix, Inc. Contactless coupling between test and measurement system and a device under test
DE102018104264A1 (de) * 2018-02-26 2019-08-29 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Verfahren zur herstellung von mindestens einem hochfrequenz-kontaktelement oder einer hochfrequenz-kontaktelement-anordnung sowie zugehörige vorrichtung
CN112771387A (zh) * 2018-07-27 2021-05-07 日置电机株式会社 测量装置
JP7387285B2 (ja) * 2019-04-26 2023-11-28 日置電機株式会社 プローブ装置
TW202212836A (zh) * 2020-06-11 2022-04-01 美商鋒法特股份有限公司 多導體傳輸線探針
CN112993058B (zh) * 2021-02-03 2023-11-24 中国电子科技集团公司第四十三研究所 一种基于混合集成工艺的光电微系统封装结构

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4697143A (en) * 1984-04-30 1987-09-29 Cascade Microtech, Inc. Wafer probe
US4894612A (en) 1987-08-13 1990-01-16 Hypres, Incorporated Soft probe for providing high speed on-wafer connections to a circuit
US4871964A (en) * 1988-04-12 1989-10-03 G. G. B. Industries, Inc. Integrated circuit probing apparatus
US5512838A (en) * 1992-09-03 1996-04-30 Hewlett-Packard Company Probe with reduced input capacitance
US5373231A (en) * 1993-06-10 1994-12-13 G. G. B. Industries, Inc. Integrated circuit probing apparatus including a capacitor bypass structure
US5561378A (en) * 1994-07-05 1996-10-01 Motorola, Inc. Circuit probe for measuring a differential circuit
US5506515A (en) * 1994-07-20 1996-04-09 Cascade Microtech, Inc. High-frequency probe tip assembly
US5565788A (en) * 1994-07-20 1996-10-15 Cascade Microtech, Inc. Coaxial wafer probe with tip shielding
US5508630A (en) * 1994-09-09 1996-04-16 Board Of Regents, University Of Texas Systems Probe having a power detector for use with microwave or millimeter wave device
DE19641880A1 (de) * 1996-10-10 1998-04-16 Rosenberger Hochfrequenztech Meßspitzeneinheit zum Kontaktieren von planaren Mikrowellenschaltungen
JP3100930B2 (ja) * 1997-09-10 2000-10-23 株式会社双晶テック コンタクトプローブ
US6118287A (en) * 1997-12-09 2000-09-12 Boll; Gregory George Probe tip structure

Also Published As

Publication number Publication date
CA2385337A1 (fr) 2001-03-29
EP1216419A1 (fr) 2002-06-26
JP2003510574A (ja) 2003-03-18
ES2214335T3 (es) 2004-09-16
PT1216419E (pt) 2004-07-30
EP1216419B1 (fr) 2004-03-10
US7042236B1 (en) 2006-05-09
ATE261585T1 (de) 2004-03-15
CN1162707C (zh) 2004-08-18
DE50005616D1 (de) 2004-04-15
WO2001022097A1 (fr) 2001-03-29
CN1373853A (zh) 2002-10-09
CA2385337C (fr) 2010-01-12
DE19945178A1 (de) 2001-08-02
DE19945178C2 (de) 2003-05-28

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