KR880008033A - Ic 칩 테스트 장치 - Google Patents

Ic 칩 테스트 장치 Download PDF

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Publication number
KR880008033A
KR880008033A KR870014358A KR870014358A KR880008033A KR 880008033 A KR880008033 A KR 880008033A KR 870014358 A KR870014358 A KR 870014358A KR 870014358 A KR870014358 A KR 870014358A KR 880008033 A KR880008033 A KR 880008033A
Authority
KR
South Korea
Prior art keywords
chip
coaxial cable
insulation plate
circuit board
test
Prior art date
Application number
KR870014358A
Other languages
English (en)
Other versions
KR910004624B1 (ko
Inventor
스몰리 로버트
Original Assignee
로버트 더블유.워딩
티 알 더블유 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 로버트 더블유.워딩, 티 알 더블유 인코포레이티드 filed Critical 로버트 더블유.워딩
Publication of KR880008033A publication Critical patent/KR880008033A/ko
Application granted granted Critical
Publication of KR910004624B1 publication Critical patent/KR910004624B1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

내용 없음.

Description

IC 칩 테스트 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 개선된 테스트 탐침 카드 투시도,
제2도는 본 발명의 개선된 테스트 탐침 카드의 부분 단면도.

Claims (9)

  1. 복수의 접촉 영역을 가지는 IC칩을 테스트하기 위한 장치에 있어서, IC칩 접촉 영역에 대응하는 위치에서 관통하는 다수의 개구를 가진 칩 절연판과, 칩 절연판내의 다수의 개구에 대응하는 위치에서 내부 접촉 영역을 가지며, 내부 접촉 영역을 테스트회로 기판주위에 배치되는 복수의 외부 접촉 영역에 전기적 접속시키는 테스트 회로기판의 최소한 한편상의 복수의 전기 도전 트레이스를 가지는 테스트 회로 기판과 칩과 내부 접촉 영역사이에 전기적 접속을 하기 위해 칩 절연판내의 선택된 한 개구내에 배치되는 복수의 도전 케넥터 소자를 구비하는 것을 특징으로 하는 IC칩 테스트 장치.
  2. 제1항에 있어서, 각각의 커넥터 소자는 압축될때 변형되는 도전 와이어의 충진 스트랜드를 포함하며 칩 및 내부접촉 영역과 다중 전기 접촉을 하는것을 특징으로하는 IC칩 테스트 장치.
  3. 제 1항에 있어서, 외부접촉 영역을 테스팅 장치에 전기적으로 접속시키기 위한 수단은 외부 접촉영역을 동축 케이블을 사용하는 테스팅 장치에 접속시키기 위한 동축케이블 접속판을 포함하는 것을 특징으로하는 IC칩 테스트 장치.
  4. 제3항에 있어서, 동축 케이블 접속판은, 외부 회로기판 접촉 영역에 대응하는 위치에서 관통하는 최소한 다수의 개구를 가지는 동축 케이블절연판과, 동축 케이블 절연판내의 다수의 개구에 대응하는 위치에서 동축 케이블을 지지하기 위한 동축 케이블 지지 프레임과, 외부 접촉 영역과 동축 케이블의 종단사이에 전기적 접속을 되게하기 위해 동축 케이블 절연판내의 선택된 한 개구 내에 배치되는 복수의 도전 커넥터 소자를 포함하는 것을 특징으로 하는 IC칩 테스트 장치.
  5. 제4항에 있어서, 각각의 커넥터 소자는 압출될때 변형되는 도전 와이어의 충진 스트랜드를 포함하며, 외부 접촉영역 및 동축 케이블의 종단과 다중 전기 접촉을 하는 것을 특징으로 하는 IC칩 테스트 장치.
  6. 제1항에 있어서, 칩 절연판은 플렉시블 지지 프레임의 내부 표면에 부착되는 것을 특징으로 하는 IC칩 테스트 장치.
  7. 제6항에 있어서, 플렉시블 지지 프레임은 디스크의 중앙부내에 뻗어 있는 복수의 리브를 가지는 환형 디스크이며, 칩 절연판을 유연하게 지지하는 것을 특징으로 하는 IC칩 테스트 장치.
  8. 제1항에 있어서, 칩 절연판 및 테스트 회로 기판을 지지하기 위한 외부 환형부 및 IC칩을 장착시키기 위한 중앙부를 가지는 테스트 스탠드를 더 포함하는 것을 특징으로 하는 IC칩 테스트 장치.
  9. 제1항에 있어서, 테스트 회로 기판을 IC칩으로 압축시켜서, 커넥터 소자를 압축시키며 칩과 내부 접촉 영역사이에 전기적 접촉이 되게 하는 것을 특징으로 하는 IC칩 테스트 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870014358A 1986-12-15 1987-12-15 Ic 칩 테스트 장치 KR910004624B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/941,907 US4733172A (en) 1986-03-08 1986-12-15 Apparatus for testing I.C. chip
US941907 1986-12-15

Publications (2)

Publication Number Publication Date
KR880008033A true KR880008033A (ko) 1988-08-30
KR910004624B1 KR910004624B1 (ko) 1991-07-08

Family

ID=25477264

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870014358A KR910004624B1 (ko) 1986-12-15 1987-12-15 Ic 칩 테스트 장치

Country Status (4)

Country Link
US (1) US4733172A (ko)
EP (1) EP0275634A1 (ko)
JP (1) JPS63245931A (ko)
KR (1) KR910004624B1 (ko)

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Also Published As

Publication number Publication date
JPS63245931A (ja) 1988-10-13
KR910004624B1 (ko) 1991-07-08
EP0275634A1 (en) 1988-07-27
US4733172A (en) 1988-03-22

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