DK0687383T3 - Kølelegemeanordning for halvlederindretninger - Google Patents

Kølelegemeanordning for halvlederindretninger

Info

Publication number
DK0687383T3
DK0687383T3 DK94908029.5T DK94908029T DK0687383T3 DK 0687383 T3 DK0687383 T3 DK 0687383T3 DK 94908029 T DK94908029 T DK 94908029T DK 0687383 T3 DK0687383 T3 DK 0687383T3
Authority
DK
Denmark
Prior art keywords
heat sink
adaptor
sink assembly
semiconductor devices
microprocessor
Prior art date
Application number
DK94908029.5T
Other languages
Danish (da)
English (en)
Inventor
Peter D Tata
William B Rife
Original Assignee
Chip Coolers Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/026,515 external-priority patent/US5313099A/en
Application filed by Chip Coolers Inc filed Critical Chip Coolers Inc
Application granted granted Critical
Publication of DK0687383T3 publication Critical patent/DK0687383T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DK94908029.5T 1993-03-04 1994-02-14 Kølelegemeanordning for halvlederindretninger DK0687383T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/026,515 US5313099A (en) 1993-03-04 1993-03-04 Heat sink assembly for solid state devices
US08/097,483 US5397919A (en) 1993-03-04 1993-07-26 Heat sink assembly for solid state devices

Publications (1)

Publication Number Publication Date
DK0687383T3 true DK0687383T3 (da) 1998-06-02

Family

ID=26701349

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94908029.5T DK0687383T3 (da) 1993-03-04 1994-02-14 Kølelegemeanordning for halvlederindretninger

Country Status (11)

Country Link
US (1) US5397919A (fr)
EP (1) EP0687383B1 (fr)
JP (1) JP2971578B2 (fr)
KR (1) KR100262045B1 (fr)
AT (1) ATE166182T1 (fr)
AU (1) AU673056B2 (fr)
BR (1) BR9405732A (fr)
CA (1) CA2143105C (fr)
DE (1) DE69410245T2 (fr)
DK (1) DK0687383T3 (fr)
WO (1) WO1994020987A1 (fr)

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US5653280A (en) * 1995-11-06 1997-08-05 Ncr Corporation Heat sink assembly and method of affixing the same to electronic devices
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US6944023B2 (en) * 2002-11-15 2005-09-13 Celestica International Inc. System and method for mounting a heat sink
WO2004055517A2 (fr) * 2002-12-13 2004-07-01 Aurelium Biopharma Inc. Methodes diagnostiques et therapeutiques par la mesure de l'expression de la nucleophosmine pour des maladies neoplasiques de multiresistance aux medicaments
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US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
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KR101296844B1 (ko) * 2010-11-11 2013-08-14 소닉스자펜 주식회사 대출력 엘이디 방열판 및 이를 포함하는 엘이디 조명기구
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US9263817B2 (en) 2013-06-12 2016-02-16 Ironwood Electronics, Inc. Adapter apparatus with suspended conductive elastomer interconnect
US9048565B2 (en) 2013-06-12 2015-06-02 Ironwood Electronics, Inc. Adapter apparatus with deflectable element socket contacts
JP2015170649A (ja) * 2014-03-05 2015-09-28 日本電気株式会社 ヒートシンク
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FR3103582B1 (fr) * 2019-11-21 2022-12-16 Safran Electronics & Defense Calculateur embarqué avec entreproseur sur la puce microprocesseur
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Also Published As

Publication number Publication date
AU673056B2 (en) 1996-10-24
CA2143105C (fr) 1996-12-31
BR9405732A (pt) 1995-12-05
KR960701469A (ko) 1996-02-24
CA2143105A1 (fr) 1994-09-15
EP0687383B1 (fr) 1998-05-13
AU6137494A (en) 1994-09-26
ATE166182T1 (de) 1998-05-15
KR100262045B1 (ko) 2000-07-15
EP0687383A4 (fr) 1995-10-26
US5397919A (en) 1995-03-14
JPH08507655A (ja) 1996-08-13
EP0687383A1 (fr) 1995-12-20
JP2971578B2 (ja) 1999-11-08
DE69410245D1 (de) 1998-06-18
WO1994020987A1 (fr) 1994-09-15
DE69410245T2 (de) 1998-09-03

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