ATE166182T1 - Kuehlkoerper- montagevorrichtung fuer ein halbleiterbauteil - Google Patents

Kuehlkoerper- montagevorrichtung fuer ein halbleiterbauteil

Info

Publication number
ATE166182T1
ATE166182T1 AT94908029T AT94908029T ATE166182T1 AT E166182 T1 ATE166182 T1 AT E166182T1 AT 94908029 T AT94908029 T AT 94908029T AT 94908029 T AT94908029 T AT 94908029T AT E166182 T1 ATE166182 T1 AT E166182T1
Authority
AT
Austria
Prior art keywords
heat sink
adaptor
mounting device
semiconductor component
microprocessor
Prior art date
Application number
AT94908029T
Other languages
English (en)
Inventor
Peter D Tata
William B Rife
Original Assignee
Chip Coolers Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/026,515 external-priority patent/US5313099A/en
Application filed by Chip Coolers Inc filed Critical Chip Coolers Inc
Application granted granted Critical
Publication of ATE166182T1 publication Critical patent/ATE166182T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
AT94908029T 1993-03-04 1994-02-14 Kuehlkoerper- montagevorrichtung fuer ein halbleiterbauteil ATE166182T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/026,515 US5313099A (en) 1993-03-04 1993-03-04 Heat sink assembly for solid state devices
US08/097,483 US5397919A (en) 1993-03-04 1993-07-26 Heat sink assembly for solid state devices

Publications (1)

Publication Number Publication Date
ATE166182T1 true ATE166182T1 (de) 1998-05-15

Family

ID=26701349

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94908029T ATE166182T1 (de) 1993-03-04 1994-02-14 Kuehlkoerper- montagevorrichtung fuer ein halbleiterbauteil

Country Status (11)

Country Link
US (1) US5397919A (de)
EP (1) EP0687383B1 (de)
JP (1) JP2971578B2 (de)
KR (1) KR100262045B1 (de)
AT (1) ATE166182T1 (de)
AU (1) AU673056B2 (de)
BR (1) BR9405732A (de)
CA (1) CA2143105C (de)
DE (1) DE69410245T2 (de)
DK (1) DK0687383T3 (de)
WO (1) WO1994020987A1 (de)

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US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
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US8464781B2 (en) * 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
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Also Published As

Publication number Publication date
JP2971578B2 (ja) 1999-11-08
DK0687383T3 (da) 1998-06-02
BR9405732A (pt) 1995-12-05
EP0687383A1 (de) 1995-12-20
AU673056B2 (en) 1996-10-24
US5397919A (en) 1995-03-14
EP0687383B1 (de) 1998-05-13
JPH08507655A (ja) 1996-08-13
DE69410245D1 (de) 1998-06-18
AU6137494A (en) 1994-09-26
CA2143105C (en) 1996-12-31
KR960701469A (ko) 1996-02-24
DE69410245T2 (de) 1998-09-03
WO1994020987A1 (en) 1994-09-15
CA2143105A1 (en) 1994-09-15
KR100262045B1 (ko) 2000-07-15
EP0687383A4 (de) 1995-10-26

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