JP4778837B2 - 電気接続箱 - Google Patents
電気接続箱 Download PDFInfo
- Publication number
- JP4778837B2 JP4778837B2 JP2006149983A JP2006149983A JP4778837B2 JP 4778837 B2 JP4778837 B2 JP 4778837B2 JP 2006149983 A JP2006149983 A JP 2006149983A JP 2006149983 A JP2006149983 A JP 2006149983A JP 4778837 B2 JP4778837 B2 JP 4778837B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electrical component
- heat
- metal core
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 18
- 230000005855 radiation Effects 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000009365 direct transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Connection Or Junction Boxes (AREA)
Description
(1)板状のメタルコアの表面を絶縁部によって覆ったメタルコア基板からなりかつ表裏に貫通する取付孔が形成された回路基板と、該回路基板に実装される電気部品と、前記電気部品からの発熱を放熱する放熱部材と、前記電気部品が挿通可能な孔部を有する保持板部および該保持板部の両側部に形成された側板部とを有してなる支持部材と、を備えた電気接続箱であって、
前記電気部品は前記回路基板の前記取付孔に挿通された状態で、その挿通された一端が前記回路基板の裏面側におよび非挿通側の他端が前記回路基板の表面側にそれぞれ突出した状態に実装される形状を有しており、
前記回路基板の前記取付孔に前記電気部品の前記一端が挿通され、前記他端を前記保持板部の前記孔部に挿通させて前記側板部を前記回路基板に固定することで前記電気部品の前記一端を保持し、かつ前記電気部品の前記他端に放熱フィンが直接取り付けられることにより、前記電気部品の熱を、前記放熱フィンから放出させると共に、前記メタルコアの前記取付孔を挿通する電気部品の側面から前記メタルコアへ直接伝達させること。
また、回路基板の挿通孔に電気部品を挿通したので、電気部品からの熱を回路基板に効果的に放出することができ、基板に金属柱を埋め込む構造と比較して、製造コストの低減およびリサイクル性の向上を図ることができる。
さらに、電気部品に放熱部材を直接取り付けたので、電気部品に直接取り付けられた放熱部材から効果的に放熱することができ、基板に金属柱を埋め込む構造と比較して、製造コストの低減およびリサイクル性の向上を図ることができる。
そして、電気部品の熱を回路基板のメタルコアへ伝達させて効果的に放出させることができる。
まず、第1実施形態に係る電気接続箱について説明する。
次に、第2実施形態に係る電気接続箱について図面を参照しながら説明する。尚、第1実施形態と同一構造および同一構成部分には、同一符号を付して説明を省略する。
12:上ケース(ケース)
13:下ケース(ケース)
14:回路基板
20:電気部品
24:メタルコア
25:絶縁部
30、52:放熱部材
32、54:フィン
51:取付孔
Claims (1)
- 板状のメタルコアの表面を絶縁部によって覆ったメタルコア基板からなりかつ表裏に貫通する取付孔が形成された回路基板と、該回路基板に実装される電気部品と、前記電気部品からの発熱を放熱する放熱部材と、前記電気部品が挿通可能な孔部を有する保持板部および該保持板部の両側部に形成された側板部とを有してなる支持部材と、を備えた電気接続箱であって、
前記電気部品は前記回路基板の前記取付孔に挿通された状態で、その挿通された一端が前記回路基板の裏面側におよび非挿通側の他端が前記回路基板の表面側にそれぞれ突出した状態に実装される形状を有しており、
前記回路基板の前記取付孔に前記電気部品の前記一端が挿通され、前記他端を前記保持板部の前記孔部に挿通させて前記側板部を前記回路基板に固定することで前記電気部品の前記一端を保持し、かつ前記電気部品の前記他端に放熱フィンが直接取り付けられることにより、前記電気部品の熱を、前記放熱フィンから放出させると共に、前記メタルコアの前記取付孔を挿通する電気部品の側面から前記メタルコアへ直接伝達させることを特徴とする電気接続箱。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006149983A JP4778837B2 (ja) | 2006-05-30 | 2006-05-30 | 電気接続箱 |
US11/755,020 US20070279842A1 (en) | 2006-05-30 | 2007-05-30 | Electrical connection box |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006149983A JP4778837B2 (ja) | 2006-05-30 | 2006-05-30 | 電気接続箱 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007325345A JP2007325345A (ja) | 2007-12-13 |
JP4778837B2 true JP4778837B2 (ja) | 2011-09-21 |
Family
ID=38789823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006149983A Expired - Fee Related JP4778837B2 (ja) | 2006-05-30 | 2006-05-30 | 電気接続箱 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070279842A1 (ja) |
JP (1) | JP4778837B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7983024B2 (en) * | 2007-04-24 | 2011-07-19 | Littelfuse, Inc. | Fuse card system for automotive circuit protection |
JP5634822B2 (ja) | 2010-10-20 | 2014-12-03 | 矢崎総業株式会社 | 電気接続箱 |
JP5634823B2 (ja) | 2010-10-20 | 2014-12-03 | 矢崎総業株式会社 | メタルコア基板、それを備えた電気接続箱 |
WO2012166028A1 (en) * | 2011-06-01 | 2012-12-06 | Telefonaktiebolaget L M Ericsson (Publ) | Thermo/electrical conductor arrangement for multilayer printed circuit boards |
WO2017150567A1 (ja) * | 2016-03-01 | 2017-09-08 | 矢崎総業株式会社 | 端子収容体及びワイヤハーネス |
US10720391B1 (en) * | 2019-01-04 | 2020-07-21 | Globalfoundries Inc. | Method of forming a buried interconnect and the resulting devices |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5014904A (en) * | 1990-01-16 | 1991-05-14 | Cray Research, Inc. | Board-mounted thermal path connector and cold plate |
JP3278832B2 (ja) * | 1991-04-15 | 2002-04-30 | アンデン株式会社 | 回路基板 |
US5172301A (en) * | 1991-10-08 | 1992-12-15 | Lsi Logic Corporation | Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same |
US5313099A (en) * | 1993-03-04 | 1994-05-17 | Square Head, Inc. | Heat sink assembly for solid state devices |
US5397919A (en) * | 1993-03-04 | 1995-03-14 | Square Head, Inc. | Heat sink assembly for solid state devices |
WO1994029900A1 (en) * | 1993-06-09 | 1994-12-22 | Lykat Corporation | Heat dissipative means for integrated circuit chip package |
JP3855306B2 (ja) * | 1996-05-30 | 2006-12-06 | 松下電器産業株式会社 | 電子部品搭載用放熱基板及びその製造方法 |
JPH10126963A (ja) * | 1996-10-14 | 1998-05-15 | Yazaki Corp | 車両用電源分配装置 |
US5920458A (en) * | 1997-05-28 | 1999-07-06 | Lucent Technologies Inc. | Enhanced cooling of a heat dissipating circuit element |
US6075699A (en) * | 1999-01-29 | 2000-06-13 | Chip Coolers, Inc. | Heat sink assembly with snap-in legs |
US6304451B1 (en) * | 1999-12-01 | 2001-10-16 | Tyco Electronics Logistics Ag | Reverse mount heat sink assembly |
JP2002271944A (ja) * | 2001-03-09 | 2002-09-20 | Auto Network Gijutsu Kenkyusho:Kk | 電気接続箱 |
US6999317B2 (en) * | 2003-08-12 | 2006-02-14 | Delphi Technologies, Inc. | Thermally enhanced electronic module with self-aligning heat sink |
JP4079080B2 (ja) * | 2003-12-03 | 2008-04-23 | 松下電器産業株式会社 | 電子制御装置 |
JP4460061B2 (ja) * | 2004-06-03 | 2010-05-12 | 古河電気工業株式会社 | 電気接続箱 |
US7235880B2 (en) * | 2004-09-01 | 2007-06-26 | Intel Corporation | IC package with power and signal lines on opposing sides |
US7345885B2 (en) * | 2004-12-22 | 2008-03-18 | Hewlett-Packard Development Company, L.P. | Heat spreader with multiple stacked printed circuit boards |
JP4686218B2 (ja) * | 2005-03-11 | 2011-05-25 | 矢崎総業株式会社 | メタルコア基板及びこれを利用した車載システム |
JP2006339223A (ja) * | 2005-05-31 | 2006-12-14 | Toshiba Tec Corp | Cpuの放熱構造 |
-
2006
- 2006-05-30 JP JP2006149983A patent/JP4778837B2/ja not_active Expired - Fee Related
-
2007
- 2007-05-30 US US11/755,020 patent/US20070279842A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20070279842A1 (en) | 2007-12-06 |
JP2007325345A (ja) | 2007-12-13 |
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